CN107454382A - The test suite and method of testing of camera - Google Patents
The test suite and method of testing of camera Download PDFInfo
- Publication number
- CN107454382A CN107454382A CN201710449010.7A CN201710449010A CN107454382A CN 107454382 A CN107454382 A CN 107454382A CN 201710449010 A CN201710449010 A CN 201710449010A CN 107454382 A CN107454382 A CN 107454382A
- Authority
- CN
- China
- Prior art keywords
- interface
- converting interface
- converting
- camera
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
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- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The present invention discloses the test suite and method of testing of a kind of camera.The pinboard of the test suite includes the first converting interface, the second converting interface and test point, first converting interface is used for the first interface of camera module where connecting camera, second converting interface is used for the second interface for connecting mainboard, test point is connected between the first converting interface and the second converting interface and respectively with the first converting interface and the second converting interface, and test point is used to connect signal pickup assembly.Based on this, the present invention can avoid damaging mainboard, improve the reliability of test result.
Description
Technical field
The present invention relates to Camera Test technical field, and in particular to the test suite and method of testing of a kind of camera.
Background technology
In the production process of camera, it is essential that test is carried out to it.Currently, industry typically connects in camera
Mouth (Camera Serial Interface, CSI) connection has CPU (Central Processing Unit, central processing
Device) mainboard, realize that every test, such as test camera receive by gathering and analyzing the signal between CPU and camera
Signal whether meet MIPI (Mobile Industry Processor Interface, mobile Industry Processor Interface) associations
View requires.Due on mainboard and be not provided with for signal collecting device collection signal test point, therefore, needed before test in master
A fly line is drawn in welding on plate, and the fly line is connected with signal collecting device.But welding fly line is easily damaged mainboard,
So as to reduce the reliability of test result.
The content of the invention
In view of this, the present invention provides a kind of test suite and method of testing of camera, can avoid damaging mainboard, carry
The reliability of high test result.
The test suite of the camera of one embodiment of the invention, including mainboard, pinboard and signal pickup assembly, the master
Plate be provided with central processing unit and with central processing unit coupling second interface, the pinboard include the first converting interface, with
First converting interface connection the second converting interface and between the first converting interface and the second converting interface and with the first converting interface and
The test point of second converting interface connection, the first converting interface are used to be connected with first interface, and the second converting interface is used for and camera institute
Connected in the second interface of camera module, test point is used to connect signal pickup assembly.
The method of testing of the camera of one embodiment of the invention, including：
A test suite is provided, the test suite includes mainboard, pinboard and signal pickup assembly, during mainboard is provided with
Central processor and the second interface with central processing unit coupling, pinboard include the first converting interface, are connected with the first converting interface
The second converting interface and be connected between the first converting interface and the second converting interface and with the first converting interface and the second converting interface
Test point；
First converting interface is connected with the first interface of camera module where camera, the second converting interface and second interface connect
Connect, the first interface is connected with camera；
Signal pickup assembly is connected to test point, to gather the signal between mainboard and camera and be tested.
Beneficial effect：The present invention realizes the connection between mainboard and camera module by pinboard, will gather the survey of signal
Pilot is arranged on pinboard, rather than is arranged on mainboard, when test point is connected with signal pickup assembly, can avoid damaging
Mainboard, so as to improve the reliability of test result.
Brief description of the drawings
Fig. 1 is the structural representation of the test suite of the camera of one embodiment of the invention；
Fig. 2 is the schematic flow sheet of the method for testing of the camera of one embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, to the skill of each exemplary embodiment provided by the present invention
Art scheme is clearly and completely described.In the case where not conflicting, the feature in following each embodiments and embodiment can
To be mutually combined.
Referring to Fig. 1, the test suite of the camera for one embodiment of the invention.The test suite is used for camera
42 are tested, and camera 42 can be arranged on the camera module 40 with first interface 41, first interface 41 and camera
42 connections.The test suite of the camera includes mainboard 10, pinboard 20 and signal pickup assembly 30.
Mainboard 10 can be PCB (Printed circuit board, printed circuit board (PCB)), and it is provided with central processing unit
11 and second interface 12, second interface 12 coupled with central processing unit 11.Certainly, in order to filtering interference signals and ensure test knot
The reliability of fruit, mainboard 10 can also be provided with common mode inhibition device 13 between central processing unit 11 and second interface 12, and this is common
Mould suppressor 13 is connected with central processing unit 11, and second interface 12 is connected with common mode suppressor 13.Wherein, the He of common mode inhibition device 13
It can be realized and connected by the first PCB trace between central processing unit 11, can be between second interface 12 and common mode inhibition device 13
Realized and connected by the second PCB trace, first PCB trace and the second PCB trace be able to can also be differed with identical.
Pinboard 20 includes the first converting interface 21, the second converting interface 22 and test point 23, the first converting interface 21 and second
Converting interface 22 connects, and test point 23 is between the first converting interface 21 and the second converting interface 22, and the first converting interface 21 and second
Converting interface 22 is connected with test point 23 respectively.
In test process, the first converting interface 21 is used to be connected with the first interface 41 of camera module 40, the second converting interface
22 are used to be connected with the second interface 12 of mainboard 10, and test point 23 is used to connect signal pickup assembly 30, such as oscillograph.Signal
Harvester 30 gathers the signal between central processing unit 11 and the camera 42 of camera module 40, and the signal to collecting enters
Row analysis, so as to realize every test.
Prior art is compared to, the present embodiment realizes the connection between mainboard 10 and camera 42 by pinboard 20,
Therefore the first converting interface 21 of pinboard 20 can be identical with the first interface 41 of camera module 40, the second switching of pinboard 20
The second interface 12 of mouth 22 and mainboard 10 is identical.Due to the present embodiment by gather signal test point 23 be arranged at pinboard 20
On, rather than be arranged on the mainboard 10 with central processing unit 11, when test point 23 is connected with signal pickup assembly 30, without
A fly line is drawn in welding on mainboard 10, therefore can avoid the structural detail damaged on mainboard 10, so as to improve test knot
The reliability of fruit.
The test of the present embodiment includes verifying whether is signal that camera 42 received from the central processing unit 11 of mainboard 10
Meet MIPI protocol requirements.Based on this, the first converting interface 21 and the second converting interface 22 of pinboard 20 can be MIPI.In addition,
Test point 23 can be at least one in pad and metal probe, that is to say, that the present embodiment realizes test point 23 and letter
The mode that number harvester 30 connects can include：First, a fly line is drawn in welding on pinboard 20, and by fly line and signal
Harvester 30 connects.Metal probe (golden finger) the 2nd, is set on pinboard 20, and the metal probe and signal acquisition are filled
Put 30 golden finger connection.
Further, the pinboard 20 of the present embodiment can also include control circuit, and the control circuit is arranged at first turn
Between the converting interface 22 of interface 21 and second, the first converting interface 21 and the second converting interface 22 are connected with the control circuit respectively.Surveying
During examination, the control circuit is used to realize the impedance control between mainboard 10 and camera 42.Because fly line does not have impedance
Control function, therefore prior art is compared to, the present embodiment can realize the impedance control of signal transmission path, so as to enter one
Step improves the reliability of test result.
Referring to Fig. 2, the method for testing of the camera for one embodiment of the invention.The method of testing of the camera can be with
Including step S21~S23.
S21：A test suite is provided, test suite includes mainboard, pinboard and signal pickup assembly, during mainboard is provided with
Central processor and the first interface with central processing unit coupling, pinboard include the first converting interface, are connected with the first converting interface
The second converting interface and be connected between the first converting interface and the second converting interface and with the first converting interface and the second converting interface
Test point.
S22：First converting interface is connected with the first interface of camera module where camera, the second converting interface connects with second
Mouth connection, the first interface are connected with camera.
S23：Signal pickup assembly is connected to test point, to gather the signal between mainboard and camera and be surveyed
Examination.
Wherein, the first converting interface and the second converting interface can be MIPI.In addition, the first converting interface can be with second interface phase
Together, the second converting interface can be identical with first interface.The test point of pinboard can be included in pad and metal probe extremely
It is few one.
In an embodiment of the present invention, the pinboard in step S21 is also provided with control circuit, and the control circuit is set
It is placed between first converting interface and the second converting interface, the first converting interface and the second converting interface connect with the control circuit respectively
Connect.During step S23 is performed, the impedance control between mainboard and camera can be realized by the control circuit, from
And the impedance control of signal transmission path is realized, further improve the reliability of test result.
The method of testing of the present embodiment can each structural detail of the test suite of embodiment as described in Fig. 1 correspondingly hold
OK, therefore there is same technique effect.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, for example, between each embodiment technical characteristic it is mutual
With reference to, or other related technical areas are directly or indirectly used in, it is included within the scope of the present invention.
Claims (10)
1. a kind of test suite of camera, it is characterised in that the camera is positioned at a camera module with first interface
On, the first interface is connected with the camera, and the test suite includes mainboard, pinboard and signal pickup assembly, institute
State mainboard and be provided with central processing unit and the second interface with central processing unit coupling, the pinboard includes the first switching
Mouthful, the second converting interface for being connected with first converting interface and between the first converting interface and the second converting interface and with institute
The test point of the first converting interface and the connection of the second converting interface is stated, first converting interface is used to be connected with the first interface, institute
State the second converting interface to be used to be connected with the second interface, the test point is used to connect the signal pickup assembly.
2. test suite according to claim 1, it is characterised in that first converting interface and the second interface phase
Together, second converting interface is identical with the first interface.
3. test suite according to claim 2, it is characterised in that first converting interface and the second converting interface are movement
Industry Processor Interface MIPI.
4. test suite according to claim 1, it is characterised in that the test point is included in pad and metal probe
It is at least one.
5. test suite according to claim 1, it is characterised in that the pinboard also includes control circuit, the control
Circuit processed is arranged between first converting interface and the second converting interface, first converting interface and the second converting interface respectively with institute
Control circuit connection is stated, the control circuit is used to realize the impedance control between the mainboard and camera.
6. a kind of method of testing of camera, it is characterised in that the method for testing includes：
A test suite is provided, the test suite includes mainboard, pinboard and signal pickup assembly, during the mainboard is provided with
Central processor and the second interface with central processing unit coupling, the pinboard include the first converting interface, with described the
One converting interface connection the second converting interface and between first converting interface and the second converting interface and with described first turn
Interface and the test point of the second converting interface connection；
The first interface of camera module where first converting interface and camera be connected, second converting interface and described the
Two interfaces are connected, and the first interface is connected with the camera；
The signal pickup assembly is connected to the test point, to gather the signal between the mainboard and the camera simultaneously
Tested.
7. method of testing according to claim 6, it is characterised in that first converting interface and the second interface phase
Together, second converting interface is identical with the first interface.
8. method of testing according to claim 7, it is characterised in that the first converting interface and the second converting interface are mobile industry
Processor interface MIPI.
9. method of testing according to claim 6, it is characterised in that the test point is included in pad and metal probe
It is at least one.
10. method of testing according to claim 6, it is characterised in that the pinboard also includes control circuit, the control
Circuit processed is arranged between first converting interface and the second converting interface, first converting interface and the second converting interface respectively with institute
Control circuit connection is stated,
The signal pickup assembly is connected to the test point, to gather the signal between the mainboard and the camera module
And tested, including：
Impedance control between the mainboard and camera is realized by the control circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710449010.7A CN107454382A (en) | 2017-06-14 | 2017-06-14 | The test suite and method of testing of camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710449010.7A CN107454382A (en) | 2017-06-14 | 2017-06-14 | The test suite and method of testing of camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107454382A true CN107454382A (en) | 2017-12-08 |
Family
ID=60486988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710449010.7A Pending CN107454382A (en) | 2017-06-14 | 2017-06-14 | The test suite and method of testing of camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107454382A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437133A (en) * | 2007-11-15 | 2009-05-20 | 英业达股份有限公司 | Test switching device |
| CN103376340A (en) * | 2013-07-04 | 2013-10-30 | 曙光信息产业(北京)有限公司 | Adapter plate, a multi-platform serial test system and method |
| CN105677524A (en) * | 2016-01-07 | 2016-06-15 | 北京小米移动软件有限公司 | Test component, connector and test mainboard |
-
2017
- 2017-06-14 CN CN201710449010.7A patent/CN107454382A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101437133A (en) * | 2007-11-15 | 2009-05-20 | 英业达股份有限公司 | Test switching device |
| CN103376340A (en) * | 2013-07-04 | 2013-10-30 | 曙光信息产业(北京)有限公司 | Adapter plate, a multi-platform serial test system and method |
| CN105677524A (en) * | 2016-01-07 | 2016-06-15 | 北京小米移动软件有限公司 | Test component, connector and test mainboard |
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| PB01 | Publication | ||
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Application publication date: 20171208 |