CN107454291A - Camera module chip package base - Google Patents
Camera module chip package base Download PDFInfo
- Publication number
- CN107454291A CN107454291A CN201710698001.1A CN201710698001A CN107454291A CN 107454291 A CN107454291 A CN 107454291A CN 201710698001 A CN201710698001 A CN 201710698001A CN 107454291 A CN107454291 A CN 107454291A
- Authority
- CN
- China
- Prior art keywords
- supporting part
- camera module
- chip package
- module chip
- package base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The present invention relates to a kind of camera module chip package base assembly, including：Plastic base；And metalwork, be fixed together with the plastic base, including center to carry the first supporting part of optical filter and edge to carry the second supporting part of voice coil motor, the height of first supporting part is less than the second supporting part.Above-mentioned camera module chip package base, fixed metalwork provides the supporting part of optical filter and voice coil motor simultaneously on plastic base, so as to make plastic base do it is thin but the shortcomings that intensity deficiency is not present.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of camera module chip package base.
Background technology
Chip package base in mobile phone camera module group is the component in mobile phone camera module group, is used on pcb board
Between electronic component and voice coil motor.
Chip package base in mobile phone camera module group is the pure plastic parts obtained by injection molding.
It is also more next to the thickness requirement of the chip package base in mobile phone camera module group at present because mobile phone the more does the more thin
Thinner, available space is also just less and less for mobile phone camera module group, because electronic component is also more next on pcb board
It is more, this just the requirement to the chip package base space in mobile phone camera module group also with regard to more and more higher.
Pure plastic parts windowing patch smalt (optical filter) position of chip package base in mobile phone camera module group at present
Place influences because injection molding process and plastic cement material flow etc., and most thin meat thickness can only accomplish 0.15mm or so, if meat thickness is thin again,
Injection molding is difficult to process, i.e., enabled to process, and due to factors such as insufficient strengths, can not meet to paste smalt
Intensity requirement in the intensity requirement of (optical filter) and module use, this, which is just forced, seeks new technique to meet technical requirements.
The content of the invention
Based on this, it is necessary to propose a kind of chip package base, the chip package base in mobile phone camera module group can be made
Do it is thin, increase inner space, and solve chip package base do it is thin after intensity deficiency the shortcomings that.
A kind of camera module chip package base assembly, including：Plastic base；And metalwork, with the plastic base
Be fixed together, including center to carry the first supporting part of optical filter and edge carrying the second of voice coil motor
Supporting part, the height of first supporting part are less than the second supporting part.
Above-mentioned camera module chip package base, fixed metalwork provides optical filter and sound simultaneously on plastic base
The supporting part of coil motor, so as to make plastic base do it is thin but the shortcomings that intensity deficiency is not present.
In one of the embodiments, first supporting part is provided with transmittance section, and the transmittance section is through hole.
In one of the embodiments, the top surface of the plastic base is provided with opening, and first supporting part is located at institute
State in opening, second supporting part is then covered on the top surface of plastic base.
In one of the embodiments, the edge of second supporting part is provided with the back-off of the embedded plastic base.
In one of the embodiments, first supporting part and the second supporting part are the integral piece to link together.
In one of the embodiments, the metalwork is formed by burying forming mode with the plastic base and is integrated
Part.
In one of the embodiments, the thickness of the metalwork is 0.05~0.15 millimeter.
In one of the embodiments, formed with the sticking insulating barrier of tool on the surface of first supporting part.
In one of the embodiments, it is provided with the metalwork at two on the plastic base, the metal at two
Part is arranged side by side.
Brief description of the drawings
Fig. 1 is the schematic diagram of the camera module chip package base of one embodiment of the invention；
Fig. 2 is the side view of the camera module chip package base shown in Fig. 1；
Fig. 3 is the schematic diagram of the camera module chip package base of another embodiment.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Below in conjunction with the accompanying drawings, the better embodiment of camera module chip package base of the present invention is illustrated.
With reference to figure 1 and Fig. 2, the present invention provides a kind of camera module chip package base, including plastic base 10 and with
The metalwork 20 that plastic base 10 is fixed together.Wherein, metalwork 20 is used for supporting optical filter and voice coil motor simultaneously so that
Whole encapsulation base plate can do thin, increase inner space, the height of the component after being encapsulated with sensitive chip be reduced, simultaneously because golden
Category part 20 improves intensity, compensate for the shortcomings that plastic base 10 does thin rear intensity deficiency.
Metalwork 20 include center to carry the first supporting part 210 of optical filter and edge carrying voice coil loudspeaker voice coil horse
The second supporting part 220 reached, wherein the height of the first supporting part 210 is less than the second supporting part 220.
First supporting part 210 is provided with transmittance section 212, is used for optical filter.In the present embodiment, transmittance section 212 is logical
Hole.It can also be formed further with having sticking insulating barrier on the surface of first supporting part 21.During optical filter paster, pass through glue
Hydropexis on which insulating layer, improves cohesive reliability.
The edge of second supporting part 220 is provided with the back-off 222 of embedded plastic base 10, so that metalwork 20 and plastic cement
Base 10 is fixed together.
The thickness of metalwork 20 is 0.05~0.15 millimeter, has both ensured that encapsulation base plate had relatively low height, while protect again
Demonstrate,prove intensity.
The top surface of plastic base 10 is provided with opening.First supporting part 210 is located in opening.Second supporting part 22 then covers
Cover on the top surface of plastic base 10, to replace the top surface of plastic base 10 as the supporting surface of voice coil motor.
The first supporting part 210 and the second supporting part 220 of metalwork 20 are the integral piece to link together.Other real
Apply in example, the two can also be two elements, be individually fixed in plastic base 10, to provide optical filter and voice coil motor respectively
Binding face.
Metalwork 20 is formed as integral piece with plastic base 10 by burying forming mode.For example, following method can be taken.
1. first by metal (such as can be alloy, copper or other simple metal, stainless steel etc.) thick 0.05~0.15mm
Sheet material strikes out the shape for meeting client's function needs and shaping quantization and reel packaging by precise punching die.
2. metal (alloy, copper, stainless steel etc.) product of predetermined shape will be struck out and/or by special surface treatment
Mode is insulated and adhered to, and strong characteristic simultaneously pack by reel, obtains predetermined metal product.
3. predetermined metal product is continuously implanted into inside ready plastic mould die cavity by the form of material strip, pass through choosing
Fixed suitable injection machine again melts plastic grains, injects plastic mold die cavity by Shooting Technique, then through supercooling, eject, take off
Mould, the semi-finished product of the company's of obtaining material strip：Chip package base motor and optical filter attach face and are changed to metal deisgn product.
4. by the semi-finished product of even material strip：Chip package base motor and optical filter attach face and are changed to metal deisgn product process
Special guillotine, guillotine divide acupoints with severing material strip and more cave numbers.Cut rear product and meet customer drawings requirement
Finished product (such as Fig. 1), pass through automatic machine pull material strip, can be achieved fully-automatic production.
In camera module chip package base shown in Fig. 1, plastic base 10 sets metalwork at one singly to take the photograph base
20, an optical filter and a voice coil motor can be installed.
In addition, may also be the encapsulation base plate of double shootings as shown in Figure 3 in camera module chip package base, now mould
Glue base 10 takes the photograph base to be double, is provided with the metalwork 20 being arranged side by side at two, to install 2 optical filters and 2 voice coil loudspeaker voice coils
Motor.Further, when setting metalwork 20 at two, the second supporting part of volume 220 of metalwork 20 can connect together at two, be
Metalwork 20 at two is integrated part.
The processing mode of current pure plastic parts existing in the industry, can not meet the chip package in mobile phone dual camera module
Base windowing is pasted the thick technical requirements for being less than 0.15mm of meat at infrared fileter and plastic base and optical filter (H/R) component and taken the photograph
As the intensity requirement required for head mould group.
What the present invention obtained is plastic cement hardware integral piece, can break through the most thin limit of pure plastic cement, it is most thin accomplish 0.05~
0.15mm scope, vacateed to the encapsulation of mobile phone dual camera module chip and more use space.
In addition, in the case where filter thickness is fixed, electronic component is highly fixed, because plastic base is thinning, use
Space increases, and can effectively reduce the thickness of component.
What the present invention obtained is plastic cement hardware integral piece, because having embedment metal inside plastic cement, significantly increases intensity, energy
It is effective solve do pure plastic parts it is thin after intensity deficiency the shortcomings that.
The present invention can obtain plastic cement hardware integral piece by automatic drawstring quantity-produced manufacture method, can in high volume measure
Production.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
- A kind of 1. camera module chip package base, it is characterised in that including：Plastic base；AndMetalwork, be fixed together with the plastic base, including center carrying the first supporting part of optical filter and side Edge to carry the second supporting part of voice coil motor, the height of first supporting part is less than the second supporting part.
- 2. camera module chip package base according to claim 1, it is characterised in that set on first supporting part There is transmittance section, the transmittance section is through hole.
- 3. camera module chip package base according to claim 1, it is characterised in that the top surface of the plastic base Provided with opening, first supporting part is located in the opening, and second supporting part is then covered in the top of plastic base On face.
- 4. camera module chip package base according to claim 3, it is characterised in that the side of second supporting part Edge is provided with the back-off of the embedded plastic base.
- 5. camera module chip package base according to claim 1, it is characterised in that first supporting part and Two supporting parts are the integral piece to link together.
- 6. camera module chip package base according to claim 5, it is characterised in that the metalwork and the modeling Glue base is formed as integral piece by burying forming mode.
- 7. camera module chip package base according to claim 5, it is characterised in that the thickness of the metalwork is 0.05~0.15 millimeter.
- 8. camera module chip package base according to claim 1, it is characterised in that the table of first supporting part Formed with the sticking insulating barrier of tool on face.
- 9. camera module chip package base according to claim 1, it is characterised in that set on the plastic base There is a metalwork at two, the metalwork at two is arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698001.1A CN107454291A (en) | 2017-08-15 | 2017-08-15 | Camera module chip package base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710698001.1A CN107454291A (en) | 2017-08-15 | 2017-08-15 | Camera module chip package base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107454291A true CN107454291A (en) | 2017-12-08 |
Family
ID=60492155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710698001.1A Withdrawn CN107454291A (en) | 2017-08-15 | 2017-08-15 | Camera module chip package base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107454291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248070A (en) * | 2019-06-28 | 2019-09-17 | 信利光电股份有限公司 | A kind of camera module and terminal |
-
2017
- 2017-08-15 CN CN201710698001.1A patent/CN107454291A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248070A (en) * | 2019-06-28 | 2019-09-17 | 信利光电股份有限公司 | A kind of camera module and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215300 Songjiagang Road 269, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: Suzhou Yunzhong Electronic Technology Co., Ltd Address before: 215300, 144, Kang Zhuang Road, Zhou Town, Suzhou, Jiangsu, Kunshan Applicant before: SUZHOU YUNZHONG ELECTRONIC TECHNOLOGY CO., LTD. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171208 |