CN107454289A

CN107454289A - Optimization Design applied to industrial camera circuit board

Info

Publication number: CN107454289A
Application number: CN201710627090.0A
Authority: CN
Inventors: 冯汝鹏; 徐伟; 朴永杰; 章家保; 金光; 周美丽
Original assignee: Changchun Institute of Optics Fine Mechanics and Physics of CAS
Current assignee: Changchun Institute of Optics Fine Mechanics and Physics of CAS
Priority date: 2017-07-28
Filing date: 2017-07-28
Publication date: 2017-12-08

Abstract

Optimization Design applied to industrial camera circuit board, it is related to industrial camera design of circuit system field, solve existing industrial camera to be realized by two pieces of circuit boards, the problems such as size is big, production cost is high and utilization rate is poor be present, FPGA control chip and imaging sensor socket are laid out in the front center position of same circuit board and back side center respectively, described image sensor socket is by BGA package and middle hollow structure；Imaging sensor is inserted on described image sensor socket, and described image sensor is directly connected to FPGA control chip by circuit board；The filter capacitor of FPGA control chip is laid out in the hollow position of described image sensor socket.By imaging sensor and FPGA control chip by optimization design on one piece of circuit board, reduce the volume of one piece of circuit board while eliminate connector occupied area；The features such as the inventive method meets the small volume of industrial camera, in light weight, and cost is low, reliability improves and sensor is replaceable.

Description

Optimization Design applied to industrial camera circuit board

Technical field

The present invention relates to industrial camera design of circuit system field, and in particular to a kind of applied to industrial camera circuit board Optimization Design.

Background technology

Industrial camera is a key component in NI Vision Builder for Automated Inspection, and its most essential function exactly changes optical signal Into orderly electric signal, it is the important step in Machine Vision System Design to select suitable camera, and the selection of camera is not only straight Image resolution ratio, picture quality for determining to collect etc. is connect, at the same it is also directly related with the operational mode of whole system.

Along with the fast development of electronics industry, the industrial camera based on different images sensor obtains developing extensively and should With image quality, stability, reliability, weight, volume and the price of industrial camera turn into the good and bad key of its development prospect. Industrial camera also more develops towards miniaturization, multi-functional, light-weighted direction, and its update speed is more and more faster.It is domestic Industrial camera development is also in the relatively slow stage, and design level is limited, and cost is high, and external traditional industry camera has high frame Frequently, the features such as high s/n ratio, high-resolution, its electronics integrated design degree is high, inside chip is smaller, power consumption is lower, its function Mainly completed by two pieces of circuit boards, first piece of collection for being mainly used for imaging sensor, second piece of circuit board is mainly based upon FPGA image procossing, the transmission of signal and the fixation of circuit board are carried out between two pieces of circuit boards by two row's mother daughter board connectors, This method design is simple, scalability is strong, but for the relatively-stationary camera of function, it is reasonable that board area is not carried out Change and utilize, constrain the volume of industrial camera.For this inferior position, set forth herein a kind of imaging sensor and FPGA control chip Miniaturized circuit design method.

The content of the invention

The present invention realizes to solve existing industrial camera by two pieces of circuit boards, there is that size is big, production cost is high and sharp A kind of the problems such as with rate difference, there is provided Optimization Design applied to industrial camera circuit board.

Applied to the Optimization Design of industrial camera circuit board, FPGA control chip and imaging sensor socket are distinguished For layout in the front center position of same circuit board and back side center, described image sensor socket is to be sealed by BGA Fill and centre is leakage area；Imaging sensor is inserted on described image sensor socket, and described image sensor is controlled with FPGA Coremaking piece is directly connected to by circuit board；The filter capacitor of FPGA control chip is laid out in described image sensor socket leakage area Domain.

Beneficial effects of the present invention：

First, the present invention reduces one piece of circuit by imaging sensor and FPGA control chip design on one piece of circuit board The volume of plate eliminates connector occupied area simultaneously；FPGA selections meet the small minimum encapsulation model of functional requirement condition, subtract Small wiring complexity；

2nd, the imaging sensor in the present invention is not welded direct on circuit board, but is leaked by BGA package, middle Empty sensor socket is connected on circuit board, can so ensure to be easily changed during imaging sensor damage；FPGA controls core Piece is welded to behind sensor socket, because socket centre is hollow and has certain height, it is ensured that fpga chip is a large amount of Filter capacitor be laid out in hollow position, do not interfere with FPGA signal quality, while reasonably make use of circuit plate face Product；

3rd, the imaging sensor of the present invention signal wire all with FPGA is connected and no longer needs to connect by Additional connectors, But be joined directly together, reduce the transmission path of signal while ensure that the quality of signal, reduce what connector loosening belt came Destabilizing factor.

4th, using design method of the present invention, mitigate industrial camera weight, reduce industrial camera size, reduce phase It can ensure the good image quality of camera while machine production cost, raising camera reliability.

Brief description of the drawings

Fig. 1 is that imaging sensor and FPGA control chip optimize circuit diagram；

Fig. 2 is the position relationship schematic diagram of filter capacitor in FPGA control chip.

Embodiment

Embodiment one, with reference to Fig. 1 and Fig. 2 illustrate present embodiment, the optimization applied to industrial camera circuit board Design method, including imaging sensor, FPGA control chip.FPGA control chip and imaging sensor socket 2 are laid out respectively In the front center position of same circuit board and back side center, described image sensor socket 2 be by BGA package and Centre is leakage area 3；Imaging sensor is inserted on described image sensor socket 2, and described image sensor controls with FPGA Chip is directly connected to by circuit board；The filter capacitor 1 of FPGA control chip is laid out in described image sensor socket leakage area Domain 3.

FPGA control chip selection meets the minimum encapsulation model of functional requirement, the FPGAG controls in present embodiment The minimum encapsulation model XC6SLX100CSG484 models of chip model selection.A large amount of filter capacitors of FPGA control chip according to Actual height rational deployment is in the leakage area 3 of sensor socket, and the signal relation between imaging sensor and FPGA is in circuit It is directly connected on plate, is no longer pass through any mother daughter board connector, finally sensor is inserted in socket after circuit board machines.

By imaging sensor and FPGA control chip by designing on same circuit board in present embodiment, wherein Fpga chip layout in circuit board front center position, imaging sensor by hub layout in back of circuit board center, One piece of circuit board is occupied from traditional imaging sensor and fpga chip occupies the framework of one piece of circuit board and is changed into imaging sensor Take one piece of circuit board jointly with fpga chip, greatly reduce camera size.

Imaging sensor is not welded direct on circuit board in present embodiment, but will be BGA package, middle hollow Sensor socket is welded on circuit board, and ensureing that socket is hollow has certain altitude, and height value is inserted in socket in 2-3mm, sensor On, so it is also ensured that imaging sensor is easily changed when damaging.

FPGA control chip is welded to the sensor socket back side in present embodiment, due to hollow, Ke Yibao among socket The substantial amounts of filter capacitor layout of fpga chip is demonstrate,proved in the position of leakage area, FPGA signal quality is not interfered with, closes simultaneously Reason make use of board area.

The imaging sensor signal wire all with FPGA is connected and no longer needs to connect by mother daughter board connector in present embodiment Connect, but directly same circuit board wiring is connected, and reduces the transmission path of signal while ensure that the quality of signal, reduces The destabilizing factor that connector loosening belt comes, while can reduce circuit-board laying-out area.

Claims

1. applied to the Optimization Design of industrial camera circuit board, it is characterized in that, by FPGA control chip and imaging sensor It is logical that socket is laid out in the front center position of same circuit board and back side center, described image sensor socket respectively It is leakage area to cross BGA package and centre；Imaging sensor is inserted on described image sensor socket, described image sensor with FPGA control chip is directly connected to by circuit board；The filter capacitor of FPGA control chip is laid out in described image sensor socket Leakage area.

2. the Optimization Design according to claim 1 applied to industrial camera circuit board, it is characterised in that the leakage The height of dummy section is 2-3mm.

3. the Optimization Design according to claim 1 applied to industrial camera circuit board, it is characterised in that FPGA is selected Select minimum encapsulation model XC6SLX100CSG484 models.