CN107450134A - Optical module and communication equipment - Google Patents
Optical module and communication equipment Download PDFInfo
- Publication number
- CN107450134A CN107450134A CN201710848296.6A CN201710848296A CN107450134A CN 107450134 A CN107450134 A CN 107450134A CN 201710848296 A CN201710848296 A CN 201710848296A CN 107450134 A CN107450134 A CN 107450134A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- optical module
- circuit
- optical
- opto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 82
- 238000004891 communication Methods 0.000 title claims abstract description 16
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 230000005693 optoelectronics Effects 0.000 claims abstract description 21
- 238000005538 encapsulation Methods 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000005622 photoelectricity Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of optical module and communication equipment, the optical module includes first circuit board and the multiple second circuit boards electrically connected with the first circuit board, opto-electronic conversion engine chip is provided with the first circuit board, golden finger circuit, and each described second circuit board and the non-parallel setting of the first circuit board are provided with each described second circuit board.Optical module provided by the invention, its golden finger circuit is arranged on from opto-electronic conversion engine chip on different circuit boards, and golden finger circuit is set using multiple second circuit boards, each second circuit board and the non-parallel setting of first circuit board that opto-electronic conversion engine chip is set, so as to lift the bandwidth performance of optical module in the case where not changing light module package volume, the increase of light module package density is realized.
Description
Technical field
The present invention relates to technical field of photo communication, and in particular to a kind of optical module and communication equipment.
Background technology
Optic communication has been one of current most important communication mode, with the multiple light such as wavelength-division multiplex, EPON
The development of the communication technology, optical communication equipment gradually come into building and family, and optical fiber is also gradually routed to building and family by backbone
Front yard, as interface unit important in optical communication equipment, the research and development of optical module improve also to receive much concern always, and optical module is a kind of
Convert optical signals into electric signal and/or convert the electrical signal to a kind of integration module of optical signal, during optical-fibre communications
Play an important role.
With the development of optical communication technique, the bandwidth performance of optical module is obviously improved, however, for current
Optical module, its encapsulation volume can generally also increase with the increase of bandwidth performance, how not change light module package volume
In the case of lifted optical module bandwidth performance be current urgent problem to be solved.
The content of the invention
It is an object of the invention to provide a kind of optical module and communication equipment, can not change light module package volume
In the case of lifted optical module bandwidth performance.
To achieve the above object, technical scheme provides a kind of optical module, including first circuit board and with
Multiple second circuit boards of first circuit board electrical connection, opto-electronic conversion engine chip is provided with the first circuit board,
Golden finger circuit, and each described second circuit board and the first circuit board are provided with each described second circuit board
Non-parallel setting.
Further, each described second circuit board is electrically connected by flexible PCB with the first circuit board.
Further, each described second circuit board is vertically arranged with the first circuit board.
Further, the flexible PCB is curved shape.
Further, the first circuit board is pcb board.
Further, the second circuit board is pcb board.
Further, the optical module is following one kind：SFP optical modules, MINI SAS optical modules.
To achieve the above object, technical scheme additionally provides a kind of communication equipment, including above-mentioned optical module.
Optical module provided by the invention, its golden finger circuit are arranged on different circuit boards from opto-electronic conversion engine chip
On, and golden finger circuit is set using multiple second circuit boards, each second circuit board is with setting opto-electronic conversion engine chip
The non-parallel setting of first circuit board, so as in the case where not changing light module package volume lifted optical module bandwidth
Performance, realize the increase of light module package density.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram for optical module that embodiment of the present invention provides；
Fig. 2 is the side view of optical module shown in Fig. 1；
Fig. 3 is the top view of optical module shown in Fig. 1.
Embodiment
Face in conjunction with the accompanying drawings and embodiments, is described in further detail to the embodiment of the present invention.Following examples
For illustrating the present invention, but it is not limited to the scope of the present invention.
Embodiment of the present invention provides a kind of optical module, the optical module include first circuit board and with described first electricity
Multiple second circuit boards of road plate electrical connection, opto-electronic conversion engine chip is provided with the first circuit board, described in each
Be provided with golden finger circuit on second circuit board, and each described second circuit board with the first circuit board is non-parallel sets
Put.
The optical module that embodiment of the present invention provides, its golden finger circuit is arranged on different from opto-electronic conversion engine chip
On circuit board, and golden finger circuit is set using multiple second circuit boards, each second circuit board is with setting opto-electronic conversion to draw
The non-parallel setting of first circuit board of chip is held up, so as to lift optical module in the case where not changing light module package volume
Bandwidth performance, realize the increase of light module package density.
At present, optical module design key be opto-electronic conversion engine section, its must be fulfilled for corresponding optical property and
Bandwidth requirement, and under the standard-sized restriction of corresponding outline packages, it is difficult to again by reducing whole opto-electronic conversion engine
Volume to reach the purpose that higher packaging density and then realize increases bandwidth, the present invention is by using multiple second circuit boards
Golden finger circuit is set, and then the packaging density of optical module can be increased；
The golden finger circuit of optical module and opto-electronic conversion engine chip are usually located on same circuit board at present, for example,
The optical module of optical module and 20G bandwidth performances for current 10G bandwidth performances, the golden hand of the optical module of 20G bandwidth performances
Refer to circuit width be typically 10G bandwidth performances optical module golden finger circuit width twice (but both photoelectricity turn
The volume for changing engine chip is essentially identical), therefore, the encapsulation volume of the optical module of 20G bandwidth performances can be more than 10G bandwidth performances
Optical module encapsulation volume, the present invention is and each by the way that the golden finger circuit of optical module is arranged on into multiple second circuit boards
Individual second circuit board and the non-parallel setting of first circuit board that opto-electronic conversion engine chip is set, optical module envelope can not changed
The bandwidth performance of optical module is lifted in the case of filling volume.
Preferably, in embodiments of the present invention, each described second circuit board can pass through flexible PCB and institute
State first circuit board electrical connection.For example, the flexible PCB is curved shape.
For example, in embodiments of the present invention, each described second circuit board is vertically arranged with the first circuit board.
Wherein, in embodiments of the present invention, the first circuit board can be pcb board.
Wherein, in embodiments of the present invention, the second circuit board can be pcb board.
Wherein, in embodiments of the present invention, the optical module can be following one kind：SFP(Small Form-
Factor Pluggable, SFP) optical module, MINI SAS optical modules.For example, can be QSFP optical modules or MINI
SAS HD optical modules.
Need to illustrate, opto-electronic conversion engine chip is the photoelectric conversion section of optical module, for by optical signal
It is converted into electric signal and/or converts the electrical signal to optical signal, it can uses prior art to realize, just photoelectricity not turned here
The structure and operation principle for changing engine chip are described in detail.
Compared with prior art, the present invention by the whole circuit board of optical module by being separated into opto-electronic conversion (i.e. the first circuit
Plate) and two parts of equipment interconnection (i.e. multiple second circuit boards), centre is connected using flexible circuit, and each second circuit
Plate and the non-parallel setting of first circuit board, can realize encapsulation under the situation for not changing optical module outline packages size
Density and the increased purpose of transmission bandwidth.
Referring to Fig. 1, Fig. 1 is a kind of schematic diagram for optical module that embodiment of the present invention provides, and Fig. 2 and Fig. 3 are respectively Fig. 1
The side view and top view of shown optical module, the optical module include first circuit board 100 and two second circuit boards, respectively
For second circuit board 210 and second circuit board 220；
Wherein, opto-electronic conversion engine chip 101, second circuit board 210 and second circuit are provided with first circuit board 100
Golden finger circuit is provided with plate 220, second circuit board 210 is electrically connected by flexible PCB 310 and first circuit board 100
Connect, second circuit board 220 is electrically connected by flexible PCB 320 with first circuit board 100, flexible PCB 310 and flexibility
Circuit board 310 is curved shape, and second circuit board 210, second circuit board 220 are vertically arranged with first circuit board 100；
The optical module that embodiment of the present invention provides can be realized to be carried in the case where not changing the encapsulation volume of optical module
The purpose of bandwidth performance is risen, for example, opto-electronic conversion engine chip 101 is the opto-electronic conversion engine chip of 20G bandwidth performances, this hair
Optical module in bright embodiment can have identical encapsulation volume, but band compared to the optical module of current 10G bandwidth performances
Wide feature is twice as, that is to say, that its packaging density is doubled compared to the optical module of current 10G bandwidth performances.
Wherein, in embodiments of the present invention, first circuit board 100, second circuit board 210, second circuit board 220
Think pcb board.
Wherein, the optical module in embodiment of the present invention can be following any：SFP optical modules, MINI SAS light
Module, for example, can be QSFP optical modules, MINI SAS HD optical modules etc..
The optical module that embodiment of the present invention provides, its golden finger circuit is arranged on different from opto-electronic conversion engine chip
On circuit board, and golden finger circuit is set using multiple second circuit boards, each second circuit board is with setting opto-electronic conversion to draw
The first circuit board for holding up chip is vertically arranged, so as to lift optical module in the case where not changing light module package volume
Bandwidth performance, realize the increase of light module package density.
In addition, embodiment of the present invention additionally provides a kind of communication equipment, including above-mentioned optical module.
Although above with general explanation and specific embodiment, the present invention is described in detail, at this
On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore,
These modifications or improvements without departing from theon the basis of the spirit of the present invention, belong to the scope of protection of present invention.
Claims (8)
- A kind of 1. optical module, it is characterised in that multiple electrically connected including first circuit board and with the first circuit board Two circuit boards, opto-electronic conversion engine chip is provided with the first circuit board, is provided with each described second circuit board Golden finger circuit, and each described second circuit board and the non-parallel setting of the first circuit board.
- 2. optical module according to claim 1, it is characterised in that each described second circuit board passes through flexible PCB Electrically connected with the first circuit board.
- 3. optical module according to claim 2, it is characterised in that each described second circuit board and first circuit Plate is vertically arranged.
- 4. optical module according to claim 2, it is characterised in that the flexible PCB is curved shape.
- 5. optical module according to claim 1, it is characterised in that the first circuit board is pcb board.
- 6. optical module according to claim 1, it is characterised in that the second circuit board is pcb board.
- 7. optical module according to claim 1, it is characterised in that the optical module is following one kind：SFP optical modules, MINI SAS optical modules.
- 8. a kind of communication equipment, it is characterised in that including any described optical modules of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710848296.6A CN107450134A (en) | 2017-09-19 | 2017-09-19 | Optical module and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710848296.6A CN107450134A (en) | 2017-09-19 | 2017-09-19 | Optical module and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107450134A true CN107450134A (en) | 2017-12-08 |
Family
ID=60496918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710848296.6A Pending CN107450134A (en) | 2017-09-19 | 2017-09-19 | Optical module and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107450134A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110398806A (en) * | 2018-06-29 | 2019-11-01 | 中航光电科技股份有限公司 | Optical module |
| CN114371537A (en) * | 2022-02-17 | 2022-04-19 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102100010A (en) * | 2008-05-20 | 2011-06-15 | 菲尼萨公司 | Transceiver module with dual printed circuit boards |
| US20110228483A1 (en) * | 2009-05-19 | 2011-09-22 | Finisar Corporation | Communications module with a shell assembly having thermal mechanical features |
| US20120207427A1 (en) * | 2011-02-10 | 2012-08-16 | Yamaichi Electronics Co., Ltd. | Optical module connection device |
| US20130193304A1 (en) * | 2012-01-27 | 2013-08-01 | Hitachi Cable, Ltd. | Optical module |
| CN203551846U (en) * | 2013-04-02 | 2014-04-16 | 华星光通科技股份有限公司 | Optical connector packaging structure |
| CN103858040A (en) * | 2011-09-23 | 2014-06-11 | 泰科电子连接荷兰公司 | Optical interface for bidirectional communications |
| CN105549160A (en) * | 2015-11-27 | 2016-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN207133476U (en) * | 2017-09-19 | 2018-03-23 | 深圳市显洋光电有限公司 | Optical module and communication equipment |
-
2017
- 2017-09-19 CN CN201710848296.6A patent/CN107450134A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102100010A (en) * | 2008-05-20 | 2011-06-15 | 菲尼萨公司 | Transceiver module with dual printed circuit boards |
| US20110228483A1 (en) * | 2009-05-19 | 2011-09-22 | Finisar Corporation | Communications module with a shell assembly having thermal mechanical features |
| US20120207427A1 (en) * | 2011-02-10 | 2012-08-16 | Yamaichi Electronics Co., Ltd. | Optical module connection device |
| CN103858040A (en) * | 2011-09-23 | 2014-06-11 | 泰科电子连接荷兰公司 | Optical interface for bidirectional communications |
| US20130193304A1 (en) * | 2012-01-27 | 2013-08-01 | Hitachi Cable, Ltd. | Optical module |
| CN203551846U (en) * | 2013-04-02 | 2014-04-16 | 华星光通科技股份有限公司 | Optical connector packaging structure |
| CN105549160A (en) * | 2015-11-27 | 2016-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN207133476U (en) * | 2017-09-19 | 2018-03-23 | 深圳市显洋光电有限公司 | Optical module and communication equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110398806A (en) * | 2018-06-29 | 2019-11-01 | 中航光电科技股份有限公司 | Optical module |
| CN114371537A (en) * | 2022-02-17 | 2022-04-19 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171208 |