CN107446312A - Composition epoxy resin, epoxide resin material and preparation method thereof and packaging body - Google Patents
Composition epoxy resin, epoxide resin material and preparation method thereof and packaging body Download PDFInfo
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- CN107446312A CN107446312A CN201710723891.7A CN201710723891A CN107446312A CN 107446312 A CN107446312 A CN 107446312A CN 201710723891 A CN201710723891 A CN 201710723891A CN 107446312 A CN107446312 A CN 107446312A
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- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to encapsulation field, in particular to a kind of composition epoxy resin, epoxide resin material and preparation method thereof and packaging body.The composition epoxy resin, including：Epoxy resin 2~15%, curing agent 2~10% and inorganic filler 80~90%.Mutual compatibility produces synergy between each raw material so that the epoxide resin material being prepared also assigns epoxide resin material good heat resistance and mechanical property on the premise of with low-expansion coefficient.Compared with prior art epoxide resin material, the epoxide resin material has the features such as low warpage, heat resistance are good, pack completeness is high, good mechanical performance, can be widely used for integrated antenna package.And preparation method is simple and easy, feasibility is strong.
Description
Technical field
The present invention relates to encapsulation field, in particular to a kind of composition epoxy resin, epoxide resin material and its system
Preparation Method and packaging body.
Background technology
Conventional package is usually that plastic-sealed body all wraps up chip, is cooled at room temperature when from 175 DEG C of package temperatures
When, because upper lower package body molding shrinkage is identical, so the phenomenon to one side bending will not be produced.In recent years, semiconductor to
Highly integrated development, chip is bigger, and structure is more complicated, and wiring is thinner；Encapsulate accordingly slim to small, slim development, high density
Epoxy encapsulation is a side packing, when being cooled at room temperature from 175 DEG C of package temperatures, if the expansion of plastic-sealed body and substrate
Coefficient mismatches, and will produce warpage, and so as to influence the installation of soldered ball and surface mount, how to reduce angularity turns into wide at present
General focus of attention.
The content of the invention
The first object of the present invention is to provide a kind of composition epoxy resin solve easily to produce warpage in conventional package
The problem of.
The second object of the present invention is to provide a kind of preparation method of epoxide resin material, and preparation method is simple and easy,
Feasibility is high.
The third object of the present invention is to provide a kind of epoxide resin material solve easily to produce warpage in conventional package
Problem.
The fourth object of the present invention is to provide a kind of packaging body, and it does not allow to be also easy to produce warping phenomenon.
In order to realize the above-mentioned purpose of the present invention, spy uses following technical scheme：
A kind of composition epoxy resin, by percentage to the quality, including：Epoxy resin 2~15%；Curing agent 2~10%；
Inorganic filler 80~90%；Epoxy resin is the epoxy resin comprising structure formula (I) or formula (II)：
Wherein, n is 1-10 positive integer.
A kind of preparation method of epoxide resin material, comprises the following steps：
After epoxy resin, curing agent, inorganic filler are mixed, in 80-120 DEG C of mixing, wherein, by percentage to the quality,
Epoxy resin 2~15%；Curing agent 2~10%；Inorganic filler 80~90%, epoxy resin are selected from structure such as Formulas I or structure
Such as the epoxy resin of Formula II：
Wherein n is 1-10 positive integer.
A kind of epoxide resin material, it is prepared by the preparation method of above-mentioned epoxide resin material.
A kind of packaging body for including above-mentioned epoxide resin material.
Compared with prior art, beneficial effects of the present invention are：
Composition epoxy resin provided by the invention, including：Epoxy resin 2~15%, curing agent 2~10% and inorganic
Filler 80~90%.It is each using naphthalene type epoxy resin, polyfunctional group type epoxy resin and polyfunctional group type phenolic curing agent
Mutual compatibility produces synergy between raw material so that the epoxide resin material being prepared is with low-expansion premise
Under, also assign epoxide resin material good heat resistance and mechanical property.Compared with prior art epoxide resin material, the ring
Oxygen resin material has the features such as low warpage, heat resistance are good, pack completeness is high, good mechanical performance, can be widely used for integrating
Circuit package.
The preparation method of epoxide resin material provided by the invention, by 2~15% epoxy resin, 2~10% solidification
After agent and 80~90% inorganic filler mix, it is kneaded at 80-120 DEG C and epoxide resin material is made.Preparation method is simply easy
OK, feasibility is strong.
Embodiment
Embodiment of the present invention is described in detail below in conjunction with embodiment, but those skilled in the art will
Understand, the following example is merely to illustrate the present invention, and is not construed as limiting the scope of the present invention.It is unreceipted specific in embodiment
Condition person, the condition suggested according to normal condition or manufacturer are carried out.Agents useful for same or the unreceipted production firm person of instrument, it is
The conventional products that can be obtained by commercially available purchase.
The present embodiment provides a kind of composition epoxy resin：
The composition epoxy resin by percentage to the quality, including：Epoxy resin 2~15%；Curing agent 2~10%；Nothing
Machine filler 80~90%.
Further, above-mentioned epoxy resin is the epoxy resin comprising structure formula (I) or formula (II)：
Wherein, n is 1-10 positive integer.Epoxy resin shown in Formulas I and Formula II can be formed in any ratio applicatory
Mixture.
In an optional embodiment of the invention, above-mentioned epoxy resin includes naphthalene type epoxy resin and polyfunctional group type ring
Oxygen tree fat.Specifically, naphthalene type epoxy resin, by percentage to the quality, 2~10%；Polyfunctional group type epoxy resin, 0~5%.
Further, above-mentioned curing agent is the curing agent for including formula (III)：
Wherein, n is 1-10 positive integer；M is 1-10 positive integer.In formula III, hydroxyl equivalent 100g/eq.
Further, inorganic filler SiO2Powder.
In an optional embodiment of the invention, above-mentioned inorganic filler is selected from spherical fusion SiO2Micro mist, its middle position
Particle diameter (d50) is no more than 6um, and maximum particle diameter is no more than 25um.
Further, the composition epoxy resin, by percentage to the quality, in addition to：Low stress agent 0.01~0.5%；
Accelerator 0.01~0.5%；Coupling agent 0.1~1%；Releasing agent 0.1~1%；Colouring agent 0.1~1%；And ion capturing agent
0.1~1%.
Specifically, low stress agent is the stressed agent for including formula (IV)：
In an optional embodiment of the invention, low stress agent is selected from particle shape bridge formation modified rubber of the structure as shown in formula IV
Glue, particle diameter are no more than 100nm.
Further, accelerator includes glyoxaline compound and organic phosphine compound.
Specifically, glyoxaline compound includes 2-methylimidazole, 2- ethyl imidazol(e)s, 2-ethyl-4-methylimidazole, 2- benzene
At least one of base -4- methyl -5- hydroxyethyl imidazoles, preferably 2- phenyl -4- methyl -5- hydroxyethyl imidazoles.
Organic phosphine compound includes triphenylphosphine, tributylphosphine, three (p-methylphenyl) phosphines, three (nonyl phenyl) phosphines, four
At least one of Phenylphosphine-tetraphenylborate, triphenylphosphine -1,4-benzoquinone addition product, triphenylphosphine -1,4-benzoquinone addition
Thing.
, can be by when selecting above-mentioned a variety of, between multiple organic phosphine compounds it should be noted that organic phosphine compound
According to any ratio composition mixture applicatory.
Further, above-mentioned coupling agent be selected from γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane (KH-560),
At least one in γ aminopropyltriethoxy silane (KH-550), γ-mercaptan aminopropyl trimethoxysilane (KH-580)
Kind, preferably γ-(2,3- the third oxygen of epoxy) propyl trimethoxy silicane (KH-560).
It should be noted that when above-mentioned coupling agent selection is a variety of, can be by any applicatory between multiple compounds
Ratio composition mixture.
Further, releasing agent is selected from native paraffin (bar wax etc.), synthetic wax (Tissuemat E etc.), stearic acid, palmitic acid, hard
At least one of resin acid zinc, calcium stearate, lithium stearate and magnesium stearate.It is preferred that bar wax and Tissuemat E.
It should be noted that when above-mentioned releasing agent selection is a variety of, can be by any applicatory between multiple compounds
Ratio composition mixture.
Further, colouring agent is selected from carbon black.
It should be understood that above-mentioned colouring agent can select other common colorings applicatory of this area according to actual conditions
Agent.
Further, ion capturing agent can select existing common ion capturing agent.
In an optional embodiment of the invention, ion capturing agent used is purchased from Japanese Kyowa Chemical Industry Co., Ltd
(trade name：DHT-4A).
Some embodiments of the present invention also provide a kind of preparation method of epoxide resin material, comprise the following steps：
By 2~15% above-mentioned epoxy resin, 2~10% above-mentioned curing agent and 80~90% above-mentioned inorganic fillers
After mixing, it is kneaded and is made at 80-120 DEG C.
Further, melting temperature can select 80-100 DEG C, 90-110 DEG C or 100-120 DEG C, preferably 90-110 DEG C.
Specifically, above-mentioned each component is mixed in proportion, extrusion is kneaded in an extruder, obtains dispersed mix
Compound, cooling, after crushing, cake is bought on pancake making machine, obtain the epoxide resin material of required size.
Some embodiments of the present invention also provide a kind of epoxide resin material, its by above-mentioned epoxide resin material system
Preparation Method is prepared.
Some embodiments of the present invention also provide a kind of packaging body included such as above-mentioned epoxide resin material.
Specifically, the large scale integrated circuit above-mentioned epoxide resin material being applied to including WLCSP, FO-WLCSP etc.
(ULSI) in packaging body, the features such as low warpage, heat resistance are good, pack completeness is high, good mechanical performance are shown.
The feature and performance of the present invention are described in further detail with reference to embodiments：
Embodiment 1
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 2%；Solidification
Agent 3%；Inorganic filler 90%；Low stress agent 0.5%；Accelerator 0.5%；Coupling agent 1%；Releasing agent 1%；Colouring agent 1%；From
Sub- agent for capturing 1%.Wherein, epoxy resin, purchased from Japanese NIPPON KAYAKU (trade name NC-7000L, epoxide equivalent：232g/
eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).Inorganic filler, purchased from day
This TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is purchased from Japanese JSR companies (trade name：
XER-91).The choice of accelerator 2-methylimidazole, 2- ethyl imidazol(e)s and three (p-methylphenyl) phosphines.Coupling agent is selected from γ-(2,3-
The oxygen of epoxy third) propyl trimethoxy silicane (KH-560).Releasing agent selects Tissuemat E；Colouring agent selects carbon black；Ion-catching
Agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 80 DEG C, obtains dispersed epoxide resin material, cooling, crushes in an extruder.
Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 2
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 15%；Gu
Agent 4.58%；Inorganic filler 80%；Low stress agent 0.01%；Accelerator 0.01%；Coupling agent 0.1%；Releasing agent 0.1%；
Colouring agent 0.1%；Ion capturing agent 0.1%.Wherein, epoxy resin, purchased from Japanese NIPPON KAYAKU (trade name NC-
7000L, epoxide equivalent：232g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：
100g/eq).Inorganic filler, purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent
Purchased from Japanese JSR companies (trade name：XER-91).The choice of accelerator 2-ethyl-4-methylimidazole and three (nonyl phenyl) phosphines.It is even
Connection agent is selected from γ aminopropyltriethoxy silane.Releasing agent selects native paraffin；Colouring agent selects carbon black；Ion capturing agent is purchased
From Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 120 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 3
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 10.9%；
Curing agent 2%；Inorganic filler 85%；Low stress agent 0.05%；Accelerator 0.05%；Coupling agent 0.5%；Releasing agent 0.5%；
Toner 0.5%；Ion capturing agent 0.5%.Wherein, epoxy resin, purchased from Japanese NIPPON KAYAKU (trade name NC-7000L,
Epoxide equivalent：232g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).
Inorganic filler, purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is purchased from Japan
JSR companies (trade name：XER-91).The choice of accelerator triphenylphosphine and 2-methylimidazole.Coupling agent is selected from γ-mercaptan aminopropyl
Trimethoxy silane.Releasing agent selects stearic acid；Colouring agent selects carbon black；Ion capturing agent is purchased from Japan's consonance chemical industry strain
Formula commercial firm (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 100 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 4
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 4.82%；
Curing agent 10%；Inorganic filler 84%；Low stress agent 0.02%；Accelerator 0.06%；Coupling agent 0.2%；Releasing agent 0.3%；
Colouring agent 0.4%；Ion capturing agent 0.3%.Wherein, epoxy resin, purchased from Japanese NIPPON KAYAKU (trade name NC-
7000L, epoxide equivalent：232g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：
100g/eq).Inorganic filler, purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent
Purchased from Japanese JSR companies (trade name：XER-91).The choice of accelerator 2-ethyl-4-methylimidazole and tetraphenyl phosphine-tetraphenyl boron
Acid esters.Coupling agent is selected from γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane and γ aminopropyltriethoxy silane.It is de-
Mould agent selects palmitic acid；Colouring agent selects carbon black；Ion capturing agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：
DHT-4A)。
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 90 DEG C, obtains dispersed epoxide resin material, cooling, crushes in an extruder.
Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 5
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 9%；Solidification
Agent 5%；Inorganic filler 84.1%；Low stress agent 0.4%；Accelerator 0.1%；Coupling agent 0.6%；Releasing agent 0.4%；Colouring agent
0.2%；Ion capturing agent 0.2%.Wherein, epoxy resin, purchased from Japanese NIPPON KAYAKU (trade name NC-7000L, epoxy
Equivalent：232g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).It is inorganic
Filler, purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is public purchased from Japanese JSR
Take charge of (trade name：XER-91).The choice of accelerator triphenylphosphine -1,4-benzoquinone and 2- phenyl -4- methyl -5- hydroxyethyl imidazoles.Coupling
Agent is selected from γ aminopropyltriethoxy silane, γ-mercaptan aminopropyl trimethoxysilane.It is releasing agent selection Tissuemat E, hard
Resin acid；Colouring agent selects carbon black；Ion capturing agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 115 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 6
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 9.2%；Gu
Agent 4.3%；Inorganic filler 85%；Low stress agent 0.1%；Accelerator 0.3%；Coupling agent 0.5%；Releasing agent 0.2%；Coloring
Agent 0.3%；Ion capturing agent 0.1%.Wherein, epoxy resin includes 7.2% naphthalene type epoxy resin and 2% polyfunctional group type
Epoxy resin.Further, naphthalene type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name NC-7000L, epoxide equivalent：
232g/eq).Polyfunctional group type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name EPPN-502H, epoxide equivalent：
170g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).Inorganic filler,
Purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is purchased from Japanese JSR companies (business
The name of an article：XER-91).The choice of accelerator 2-ethyl-4-methylimidazole and tributylphosphine.Coupling agent is selected from γ-(2,3- epoxies third
Oxygen) propyl trimethoxy silicane (KH-560).Releasing agent selects bar wax and Tissuemat E；Colouring agent selects carbon black；Ion-catching
Agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 100 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 7
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 9.5%；Gu
Agent 4%；Inorganic filler 85%；Low stress agent 0.1%；Accelerator 0.3%；Coupling agent 0.5%；Releasing agent 0.2%；Colouring agent
0.3%；Ion capturing agent 0.1%.Wherein, epoxy resin includes 7.2% naphthalene type epoxy resin and 2.3% polyfunctional group type
Epoxy resin.Further, naphthalene type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name NC-7000L, epoxide equivalent：
232g/eq).Polyfunctional group type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name EPPN-502H, epoxide equivalent：
170g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).Inorganic filler,
Purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is purchased from Japanese JSR companies (business
The name of an article：XER-91).The choice of accelerator 2- phenyl -4- methyl -5- hydroxyethyl imidazoles and triphenylphosphine -1,4-benzoquinone addition product.Coupling
Agent is selected from γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane (KH-560).Releasing agent selects bar wax and Tissuemat E；Coloring
Carbon black is selected in agent；Ion capturing agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 100 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Embodiment 8
A kind of composition epoxy resin that the present embodiment provides.By percentage to the quality, including：Epoxy resin 8.9%；Gu
Agent 4.6%；Inorganic filler 85%；Low stress agent 0.1%；Accelerator 0.3%；Coupling agent 0.5%；Releasing agent 0.2%；Coloring
Agent 0.3%；Ion capturing agent 0.1%.Wherein, epoxy resin includes 6.9% naphthalene type epoxy resin and 2% polyfunctional group type
Epoxy resin.Further, naphthalene type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name NC-7000L, epoxide equivalent：
232g/eq).Polyfunctional group type epoxy resin is purchased from Japanese NIPPON KAYAKU (trade name EPPN-502H, epoxide equivalent：
170g/eq).Curing agent, purchased from Japanese AIR WATER (trade name HE910-10, hydroxyl equivalent：100g/eq).Inorganic filler,
Purchased from Japanese TATSUMORI companies (trade name：MUF-46V, median：5um).Low stress agent is purchased from Japanese JSR companies (business
The name of an article：XER-91).The choice of accelerator 2- phenyl -4- methyl -5- hydroxyethyl imidazoles and triphenylphosphine -1,4-benzoquinone addition product.Coupling
Agent is selected from γ-(oxygen of 2,3- epoxies third) propyl trimethoxy silicane (KH-560).Releasing agent selects bar wax and Tissuemat E；Coloring
Carbon black is selected in agent；Ion capturing agent is purchased from Japanese Kyowa Chemical Industry Co., Ltd's (trade name：DHT-4A).
A kind of epoxide resin material that the present embodiment provides is prepared：By above-mentioned raw materials according to above-mentioned quality percentage
After mixing, the mixing extrusion under the conditions of 100 DEG C, obtains dispersed epoxide resin material, cooling, powder in an extruder
It is broken.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Comparative example 1
The preparation of epoxide resin material, raw material are selected from the component of following percetage by weight：
Biphenyl aralkyl base epoxy (NC3000) 7.8%；Biphenyl aralkyl phenolic curing agent (MEH-7851SS)
5.7%；Low stress agent (XER-91) 0.1%；Spherical fusion silica flour (MUF-46V) 85%；Accelerator (TPP-BQ)
0.3%；Coupling agent (KH-560) 0.5%；Releasing agent (AC316A) 0.2%；Colouring agent (MA-600) 0.3%；Ion capturing agent
(DHT-4A) 0.1%.
By the said components mixing extrusion under the conditions of 100 DEG C in an extruder, dispersed epoxide resin material is obtained,
Cooling, crush.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Comparative example 2
The preparation of epoxide resin material, raw material are selected from the component of following percetage by weight：
O-cresol formaldehyde epoxy resin (N-665-EXP-S) 8.8%；Novolac curing agent (PF-8011) 4.7%；It is low to answer
Power agent (XER-91) 0.1%；Spherical fusion silica flour (MUF-46V) 85%.Accelerator (TPP-BQ) 0.3%；Coupling agent
(KH-560) 0.5%；Releasing agent (AC316A) 0.2%；Colouring agent (MA-600) 0.3%；Ion capturing agent (DHT-4A)
0.1%.
By the said components mixing extrusion under the conditions of 100 DEG C in an extruder, dispersed epoxide resin material is obtained,
Cooling, crush.Cake is bought on pancake making machine, obtains the epoxide resin material of required size.
Experimental example
The performance of the embodiment 1-8 and comparative example 1-2 epoxide resin materials provided is tested, detects whether it holds
Easy warpage.
Testing program：
Spiral flow length is tested：By the 5.2nd article of SJ/T 11197-1999 epoxy molding plastics, Spiral flow length enters
Row measure flow distance (cm).MUF materials are injected in mould using transfer moIding machine, injection temperature：175 DEG C, injection pressure：
7.0MPa, pressing time：120s, test MUF length of flow (cm).
Gel time：By the 5.3rd article of SJ/T 11197-1999 epoxy molding plastics, gelation time is measured gel
Change the time (s).Hot plate method, electric hot plate is heated to 175 ± 1 DEG C, takes 2-3g sample powders to be placed on electric hot plate, powder gradually by
It is terminal that fluid, which becomes during colloidal state, the time required to reading.
Molding shrinkage：Disk by sample preparation into φ 50mm, with a diameter of L1 when kind of calliper mold hot,
24H will be cooled down under the conditions of sample experiments room, with a diameter of L2 of kind of calliper sample, result of calculation：
Molding shrinkage=die size (heat) L1- sample sizes (natural cooling) L2/ die sizes (heat) L1*100%
MUF encapsulation angularity evaluation methods：Flip chip ball grid array encapsulation (FC-BGA) size of use is as follows：Chip
Size：5×5×0.2mm；Substrate size：20×20×0.24mm；Soldered ball spacing：80um；Slit spacing between chip and substrate：
60um, transfer modling technique is packaged at 175 DEG C, after the demoulding to packaged sample at 175 DEG C after solidify afterwards 6 hours.Make
Warpage test is carried out with Shadow Morrie equipment, and plastic-sealed body is face-up during test.
Experimental result see the table below：
The experimental result of table 1
It should be understood that although being illustrated with specific embodiment and being described the present invention, but will be appreciated that without departing substantially from this hair
Many other change and modification can be made in the case of bright spirit and scope.It is, therefore, intended that will in appended right
Ask including belonging to all such changes and modifications in the scope of the invention.
Claims (10)
- A kind of 1. composition epoxy resin, it is characterised in that by percentage to the quality, including：Epoxy resin 2~15%；Solidification Agent 2~10%；Inorganic filler 80~90%；The epoxy resin is the asphalt mixtures modified by epoxy resin described in comprising structure formula (I) or formula (II) Fat：Wherein, n is 1-10 positive integer.
- 2. composition epoxy resin according to claim 1, it is characterised in that by percentage to the quality, the asphalt mixtures modified by epoxy resin Oil/fat composition also includes：
- 3. composition epoxy resin according to claim 1, it is characterised in that the curing agent is includes the institute of formula (III) State curing agent：Wherein, n is 1-10 positive integer；M is 1-10 positive integer.
- 4. composition epoxy resin according to claim 2, it is characterised in that the low stress agent is to include formula (IV) The stressed agent：
- 5. composition epoxy resin according to claim 2, it is characterised in that the accelerator includes glyoxaline compound And organic phosphine compound.
- 6. composition epoxy resin according to claim 2, it is characterised in that the coupling agent includes γ-(2,3- epoxies Third oxygen) propyl trimethoxy silicane, γ aminopropyltriethoxy silane, in γ-mercaptan aminopropyl trimethoxysilane extremely Few one kind.
- 7. composition epoxy resin according to claim 2, it is characterised in that described releasing agent includes native paraffin, gathered At least one of ethylene waxes, stearic acid and palmitic acid.
- 8. a kind of preparation method of epoxide resin material, it is characterised in that comprise the following steps：After epoxy resin, curing agent, inorganic filler are mixed, in 80-120 DEG C of mixing, wherein, it is by percentage to the quality, described Epoxy resin 2~15%；The curing agent 2~10%；The inorganic filler 80~90%, the epoxy resin are selected from structure such as The epoxy resin of Formulas I or structure as described in Formula II：Wherein n is 1-10 positive integer.
- A kind of 9. epoxide resin material, it is characterised in that its by epoxide resin material as claimed in claim 8 preparation method It is prepared.
- A kind of 10. packaging body for including epoxide resin material as claimed in claim 9.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110194942A (en) * | 2019-06-20 | 2019-09-03 | 广州机械科学研究院有限公司 | A kind of low-temperature rapid thermal cured one-component epoxy adhesive and preparation method thereof |
| CN110483949A (en) * | 2019-08-19 | 2019-11-22 | 江苏华海诚科新材料股份有限公司 | A kind of composition epoxy resin and preparation method thereof suitable for BGA |
| CN112480847A (en) * | 2020-10-21 | 2021-03-12 | 江苏科化新材料科技有限公司 | High-heat-resistance low-stress epoxy plastic packaging material and preparation method thereof |
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| CN110194942A (en) * | 2019-06-20 | 2019-09-03 | 广州机械科学研究院有限公司 | A kind of low-temperature rapid thermal cured one-component epoxy adhesive and preparation method thereof |
| CN110483949A (en) * | 2019-08-19 | 2019-11-22 | 江苏华海诚科新材料股份有限公司 | A kind of composition epoxy resin and preparation method thereof suitable for BGA |
| CN112480847A (en) * | 2020-10-21 | 2021-03-12 | 江苏科化新材料科技有限公司 | High-heat-resistance low-stress epoxy plastic packaging material and preparation method thereof |
| CN112480847B (en) * | 2020-10-21 | 2022-10-14 | 江苏科化新材料科技有限公司 | High-heat-resistance low-stress epoxy plastic packaging material and preparation method thereof |
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Application publication date: 20171208 |