CN107443174B - The method for grinding abnormal wafer using grinder station - Google Patents
The method for grinding abnormal wafer using grinder station Download PDFInfo
- Publication number
- CN107443174B CN107443174B CN201610375178.3A CN201610375178A CN107443174B CN 107443174 B CN107443174 B CN 107443174B CN 201610375178 A CN201610375178 A CN 201610375178A CN 107443174 B CN107443174 B CN 107443174B
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- China
- Prior art keywords
- grinding
- wafer
- abnormal
- aligning platform
- abnormal wafer
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Abstract
The present invention relates to a kind of methods for grinding abnormal wafer using grinder station, comprising: is put into normal wafer in hopper, and starts grinding technics；Conveyer takes out the normal wafer out of hopper and is transferred on aligning platform；Hopper is returned in conveyer, and before wafer starts contraposition on aligning platform, suspends grinding technics；The normal wafer being located on aligning platform is replaced with into abnormal wafer；Restore the grinding technics of pause, aligning platform aligns abnormal wafer；After the completion of contraposition, abnormal wafer is transferred to grinding table and grind until terminating.Above method operation is simpler, and success rate is very high.
Description
Technical field
The present invention relates to semiconductor manufacturing facility technical fields, more particularly to a kind of abnormal brilliant using grinder station grinding
The method of disk.
Background technique
Grinder station is the equipment for implementing grinding technics to wafer, and grinding is typically used for the works such as being thinned, planarize
In skill.
In batch production process, batches of wafer is sequentially constantly ground in grinder station according to automatic process.
However in Manufacturing Automated process, the wafer of abnormal warpage or surface roughness exception is such as encountered, grinder station can be because brilliant
Round thickness abnormity and alarm and stop automatic process.
It is communicated at this time, it may be necessary to connect a manual control panel (handy panel) on grinder station with grinder station,
It is ground by manual setting relevant parameter.
Fig. 1 is the structure diagram of grinder station.The grinder station is set in milling zone there are two internal grinding component 3,4.
Such as grinding component 3 has a grinding shaft 1 (can be generally referred to as Z1 axis) that can be moved up and down.The milling zone of grinder station
Equipped with openable side lid 2,5, the convenient opening when carrying out repair and maintenance safeguards internal part, can also be in hand
It is opened when dynamic grinding.
The process that grinding is manually controlled below in conjunction with Fig. 1 simple declaration, generally comprises following steps:
Step S1: being connected to grinder station for manual control panel, and the order of grinding shaft is arranged.
Step S2: selection grinding mode (i.e. hand-ground) and relevant other parameters.
Step S3: opening the external structures such as the side lid 2,5 of milling zone, make internal grinding component 3,4 as it can be seen that and control grind
It grinds axis 1 to be lifted, then places wafer manually.
Step S4: vacuum suction is opened, side lid 2,5 is shut, manually boots process of lapping.
Step S5: after confirmation grinding, wafer is removed.
The process of above-mentioned hand-ground is very cumbersome, not only time-consuming, but also due to needing to place and take out wafer manually,
Easily lead to wafer fragmentation.
Summary of the invention
Based on this, it is necessary to a kind of method for grinding abnormal wafer using grinder station is provided, without artificial control manually
System grinding, greatly reduces operating quantity and improves success rate.
A method of abnormal wafer is ground using grinder station, comprising:
It is put into normal wafer in hopper, and starts grinding technics；
Conveyer takes out the normal wafer out of hopper and is transferred on aligning platform；
Hopper is returned in conveyer, and before wafer starts contraposition on aligning platform, suspends grinding technics；
The normal wafer being located on aligning platform is replaced with into abnormal wafer；
Restore the grinding technics of pause, aligning platform aligns abnormal wafer；
After the completion of contraposition, abnormal wafer is transferred to grinding table and grind until terminating.
In one of the embodiments, before starting grinding technics, setting grinding menu, for grinding table setting with
The adaptable original depth parameter of abnormal wafer.
The grinder station is equipped with milling zone in one of the embodiments, and the milling zone is equipped with the first grinding component
With the second grinding component；Menu is ground in the setting further include: whether the first grinding component of setting and the second grinding component participate in
Grinding.
In one of the embodiments, after suspending grinding technics, confirm that the association structure of all grinding process is temporary
Stop.
The association structure includes: in one of the embodiments,
Conveyer, aligning platform, incoming transferring arm, ground and cleaned device, grinding table, the first grinding component, the second grinding
Component, outflow transferring arm and rinsing table.
The grinder station is equipped with transmission area in one of the embodiments, and the transmission area is equipped with openable and closable side cover
Plate；
The described the step of normal wafer being located on aligning platform is replaced with abnormal wafer, specifically includes:
The side cover plate is opened, the normal wafer for being located at aligning platform is taken out；
Abnormal wafer is placed on aligning platform, and closes the side cover plate.
The method of the grinding technics for restoring pause includes: that sending continues grinding instruction in one of the embodiments,
Or starting clear instruction.
The above method, by using normal wafer make grinder station grinding process enter into aligning platform after suspend, then
Normal wafer is replaced with into abnormal wafer, and restores grinding process, at the grinding that abnormal wafer can be simply implemented
Reason.Compared to traditional connection manual control panel, then carries out a series of parameter setting and place and take out wafer manually
Way, greatly reduce operating quantity and artificial interference, simple and success rate is very high.
Detailed description of the invention
Fig. 1 is the structure diagram of grinder station；
Fig. 2 is the diagrammatic top view of each structure in grinder station；
Fig. 3 is the method flow diagram that abnormal wafer is ground using grinder station of an embodiment.
Fig. 4 is the overall structure schematic diagram of grinder station.
Specific embodiment
It is further described below in conjunction with drawings and examples.
Following embodiment provides the method for grinding abnormal wafer using grinder station.Abnormal wafer refers to improper
Warpage or the coarse wafer of surface abnormalities.This kind of wafer is taking when carrying out automatic grinding technique using grinder station
Can generally grinder station be caused to be alarmed when piece, cause subsequent technique that can not continue.However abnormal wafer referred herein is not
It cannot be used for normally producing, after grinding or other techniques can be normally carried out.
Therefore tradition is exactly by the way of hand-guided grinding come the grinding for completing wafer, time-consuming and laborious and success rate
It is difficult to ensure.The method of following embodiment then can solve the above problem.
For the automatic flow milled processed for realizing wafer, each structure in grinder station is arranged in a certain order
Column, and cooperate.Fig. 2 is the diagrammatic top view of each structure in grinder station, and the method for following embodiment is based on the grinder
The basic structure of platform.With reference to Fig. 2, wafer to be ground is totally placed in hopper (cassette) 101, in automation process
After starting, conveyer 102 takes out wafer piece from hopper 101, and is sent to aligning platform 103.Aligning platform 103 is by wafer
Piece the operation such as is rotated, is moved to good position.Wafer is transferred to grinding table using incoming transferring arm 104 later
On 105.It is then delivered to the first grinding component 106 and/or the second grinding component 107 is ground.After the completion of grinding, wafer by
Outflow transferring arm 108, which is sent on rinsing table 109, to be cleaned, another hopper 110 is finally sent into.So far, primary complete
Process of lapping terminates.
Fig. 3 is the method flow diagram that abnormal wafer is ground using grinder station of an embodiment.This method includes following
Step.
Step S101: it is put into normal wafer in hopper 101, and starts grinding technics.Normally wafer is
The wafer for the defects of referring to no improper warpage or coarse surface abnormalities.Normal wafer, can be certainly in grinder station
The dynamic process according to setting completes grinding.Although the method for the present embodiment is in order to grind abnormal wafer, but first in stocker
Normal wafer is placed in box 101.
Step S102: conveyer 102 takes out the normal wafer out of hopper 101 and is transferred on aligning platform 103.
This step is the normal flow of grinder station.
Step S103: hopper 101 is returned in conveyer 102, and wafer starts to align it on aligning platform 103
Before, suspend grinding technics.Conveyer 102 is a working in reciprocating mode device, is repeatedly transferred to the wafer in hopper 101 pair
Position platform 103.The pause grinding technics of this step stops entire grinding process, all association structure pause operatings, Wait-to-Restore.
That is, aligning platform 103 will not align normal wafer, and subsequent concerned process steps are all suspended.
The association structure includes: conveyer 102, aligning platform 103, incoming transferring arm 104, ground and cleaned device (positioned at grinding
Grind workbench in, it is not shown), grinding table 105, the first grinding component 106, the second grinding component 107, outflow transferring arm
108 and rinsing table 109.
Generally, before carrying out next step S104, confirm the association structure pause of all grinding process.
Step S104: the normal wafer being located on aligning platform 103 is replaced with into abnormal wafer.It will be normal
Wafer is removed from aligning platform, and abnormal wafer to be processed is placed on aligning platform later.
It is the overall structure schematic diagram about grinder station with reference to Fig. 4.Grinder station can substantially be divided into transmission Qu Heyan
Grind area.It transmits at relevant structure (such as conveyer 102, aligning platform 103, incoming transferring arm 104, outflow transferring arm 108 etc.)
In transmission area, grinds relevant structure (grinding table 105, the first grinding component 106, second grinding component 107 etc.) and be in
Milling zone.
It transmits area and is equipped with openable and closable side cover plate, and opening by the side cover plate in multiple cover plate switch 201 control transmission area
It closes.Milling zone also is provided with openable and closable side cover plate, and controls the side cover plate of milling zone by other multiple cover plate switch 202
Folding.
In this step, the side cover plate in transmission area is opened by controlling multiple cover plate switch 201, is taken out and is located at aligning platform 103
Normal wafer.Then abnormal wafer is placed on aligning platform 103, and closes the side cover plate in transmission area.Grinder station
On be additionally provided with the switch 204 in cover board sensor 203 and hopper area, be respectively used to hopper is closed and controlled to detection cover board whether
The folding in area.
Step S105: restoring the grinding technics of pause, and 103 pairs of aligning platform abnormal wafers align.Grinding technics is extensive
After multiple, all association structures are restored to run well.After restoring operating, aligning platform 103 first aligns abnormal wafer.
The method of the grinding technics for restoring pause includes: that sending continues to grind instruction or start cleaning (purge) to refer to
It enables.The difference of the two instructions is that continuing grinding instruction makes whole system all start running.When issuing clear instruction, pass
It send device not continue to run, namely does not have next wafer and be removed.But remaining association structure then continues to run.
Step S106: after the completion of contraposition, abnormal wafer is transferred to grinding table and grind until terminating.In step
After rapid S105, grinder station can complete the processing to abnormal wafer according to the process for handling normal wafer.
Further, before starting grinding technics, i.e. before step S101, setting grinding menu, is grinding table
The 105 settings original depth parameter adaptable with abnormal wafer.What it is due to processing is abnormal wafer, needs to be arranged for it and mutually fit
The original depth parameter answered, after otherwise grinding, it is also possible to can cause to alarm.
Further, menu is ground in the setting further include: the first grinding component 106 of setting and the second grinding component 107
Whether participation is ground.According to the needs of technique, may only need with the first grinding component 106 or the grinding of the second grinding component 107 i.e.
It can, it is also possible to while needing the first grinding component 106 or the grinding of the second grinding component 107.
The above method, by using normal wafer make grinder station grinding process enter into aligning platform after suspend, then
Normal wafer is replaced with into abnormal wafer, and restores grinding process, at the grinding that abnormal wafer can be simply implemented
Reason.Compared to traditional connection manual control panel, then carries out a series of parameter setting and place and take out wafer manually
Way, greatly reduce operating quantity and artificial interference, simple and success rate is very high.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of method for grinding abnormal wafer using grinder station, comprising:
It is put into normal wafer in hopper, and starts grinding technics；
Conveyer takes out the normal wafer out of hopper and is transferred on aligning platform；
Hopper is returned in conveyer, and before wafer starts contraposition on aligning platform, suspends grinding technics；
The normal wafer being located on aligning platform is replaced with into abnormal wafer；
Restore the grinding technics of pause, aligning platform aligns abnormal wafer；
After the completion of contraposition, abnormal wafer is transferred to grinding table and is ground, until terminating.
2. the method according to claim 1 for grinding abnormal wafer using grinder station, which is characterized in that ground in starting
Before grinding process, setting grinding menu, for the grinding table setting original depth parameter adaptable with abnormal wafer.
3. the method according to claim 2 for grinding abnormal wafer using grinder station, which is characterized in that the grinding
Board is equipped with milling zone, and the milling zone is equipped with the first grinding component and the second grinding component；The setting grinding menu also wraps
Include: whether the first grinding component of setting and the second grinding component participate in grinding.
4. the method according to claim 1 for grinding abnormal wafer using grinder station, which is characterized in that ground in pause
After grinding process, the association structure break-off of all grinding process is confirmed.
5. the method according to claim 4 for grinding abnormal wafer using grinder station, which is characterized in that the association
Structure includes:
Conveyer, aligning platform, incoming transferring arm, ground and cleaned device, grinding table, the first grinding component, the second grinding component,
Spread out of transferring arm and rinsing table.
6. the method according to claim 1 for grinding abnormal wafer using grinder station, which is characterized in that the grinding
Board is equipped with transmission area, and the transmission area is equipped with openable and closable side cover plate；
The described the step of normal wafer being located on aligning platform is replaced with abnormal wafer, specifically includes:
The side cover plate is opened, the normal wafer for being located at aligning platform is taken out；
Abnormal wafer is placed on aligning platform, and closes the side cover plate.
7. the method according to claim 1 for grinding abnormal wafer using grinder station, which is characterized in that the recovery
The method of the grinding technics of pause includes: that sending continues grinding instruction or starting clear instruction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375178.3A CN107443174B (en) | 2016-05-31 | 2016-05-31 | The method for grinding abnormal wafer using grinder station |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610375178.3A CN107443174B (en) | 2016-05-31 | 2016-05-31 | The method for grinding abnormal wafer using grinder station |
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| CN107443174A CN107443174A (en) | 2017-12-08 |
| CN107443174B true CN107443174B (en) | 2019-06-07 |
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|---|---|---|---|---|
| US6346033B1 (en) * | 1997-12-18 | 2002-02-12 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Method for polishing disk shaped workpieces and device for carrying out the method |
| WO2004091856A2 (en) * | 2003-04-04 | 2004-10-28 | Strasbaugh, Inc. | Grinding apparatus and method |
| CN1661780A (en) * | 2004-02-27 | 2005-08-31 | 台湾积体电路制造股份有限公司 | CMP apparatus and polishing method |
| CN101494164A (en) * | 2008-01-23 | 2009-07-29 | 株式会社荏原制作所 | Method of operating substrate processing apparatus and substrate processing apparatus |
| CN202088052U (en) * | 2011-04-25 | 2011-12-28 | 西安航天自动化股份有限公司 | Automatic lapping machine for glass edges and corners |
| CN102485424A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(北京)有限公司 | Polishing device and abnormality treatment method thereof |
-
2016
- 2016-05-31 CN CN201610375178.3A patent/CN107443174B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6346033B1 (en) * | 1997-12-18 | 2002-02-12 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Method for polishing disk shaped workpieces and device for carrying out the method |
| WO2004091856A2 (en) * | 2003-04-04 | 2004-10-28 | Strasbaugh, Inc. | Grinding apparatus and method |
| CN1661780A (en) * | 2004-02-27 | 2005-08-31 | 台湾积体电路制造股份有限公司 | CMP apparatus and polishing method |
| CN101494164A (en) * | 2008-01-23 | 2009-07-29 | 株式会社荏原制作所 | Method of operating substrate processing apparatus and substrate processing apparatus |
| CN102485424A (en) * | 2010-12-03 | 2012-06-06 | 中芯国际集成电路制造(北京)有限公司 | Polishing device and abnormality treatment method thereof |
| CN202088052U (en) * | 2011-04-25 | 2011-12-28 | 西安航天自动化股份有限公司 | Automatic lapping machine for glass edges and corners |
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| Publication number | Publication date |
|---|---|
| CN107443174A (en) | 2017-12-08 |
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