CN107426948A - A kind of electronic component with heat sinking function - Google Patents
A kind of electronic component with heat sinking function Download PDFInfo
- Publication number
- CN107426948A CN107426948A CN201710535733.9A CN201710535733A CN107426948A CN 107426948 A CN107426948 A CN 107426948A CN 201710535733 A CN201710535733 A CN 201710535733A CN 107426948 A CN107426948 A CN 107426948A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- coolant flow
- base
- installing plate
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of electronic component with heat sinking function, including electronic component installing plate, the both sides of the electronic component installing plate are fixedly mounted on base, the inside both sides of the base are provided with the holding tank being adapted with electronic component installing plate, side of two holding tanks at the top of electronic component installing plate is provided with the first coolant flow pipe, two holding tanks are provided with the second coolant flow pipe close to the side of electronic component installing plate bottom, two the second coolant flow pipe sides close to each other are connected with the 3rd coolant flow pipe being uniformly arranged, equally distributed through hole is provided with the electronic component installing plate, the bottom of the through hole is connected with heat-transfer pipe straight down.The both sides of base bottom of the present invention are provided with heat emission fan, and heat emission hole is provided between heat emission fan and chassis interior, are advantageous to accelerate the air flow of chassis interior, strengthen the efficiency of radiating.
Description
Technical field
The present invention relates to field of electrical components, more particularly to a kind of electronic component with heat sinking function.
Background technology
Electronic component is the basis for forming electronic product, understands the species of conventional electronic component, properity and can be just
Really selection is study, grasps the basic of electronic technology.Conventional electronic component has：Resistance, electric capacity, inductance, potentiometer, transformer
Deng for mounting means, conventional mounting can be divided at present（Also known as through hole dress is DIP）Two major classes are installed with surface（It is also known as
SMT or SMD）.Triode, diode are referred to as electronic device.
In the existing electronic component with heat sinking function, most electronic component generally carries out wind radiating, causes to dissipate
The relatively low phenomenon of the thermal efficiency, for this, we have devised a kind of electronic component with heat sinking function to solve problem above.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of electricity with heat sinking function proposed
Subcomponent.
To achieve these goals, present invention employs following technical scheme：
A kind of electronic component with heat sinking function, including electronic component installing plate, the both sides of the electronic component installing plate are fixed
On base, the inside both sides of the base are provided with the holding tank being adapted with electronic component installing plate, two institutes
State side of the holding tank at the top of electronic component installing plate and be provided with the first coolant flow pipe, two holding tanks lean on
The side of nearly electronic component installing plate bottom is provided with the second coolant flow pipe, two the second coolant flow pipe phases
Mutually close side is connected with the 3rd coolant flow pipe being uniformly arranged, and is provided with the electronic component installing plate and uniformly divides
The through hole of cloth, the bottom of the through hole are connected with heat-transfer pipe straight down, the bottom of the heat-transfer pipe and the 3rd cooling liquid stream
Dynamic pipe is fixedly connected, and the both ends of two the first coolant flow pipes are respectively connected with connecting tube straight down, the connection
The bottom of pipe is connected with the second coolant flow pipe, and the second coolant flow pipe of the chassis interior side is connected with output
Pipe, the other end of the efferent duct are connected with exhausted bath box, and the second coolant flow pipe of the chassis interior opposite side is connected with
Input pipe, the other end of the input pipe are connected with coolant storage case.
Preferably, the both sides of the base bottom are provided with heat emission fan, are set between the heat emission fan and chassis interior
There is heat emission hole.
Preferably, the 3rd coolant flow pipe is provided with three.
Preferably, it is provided with pulsating pump between the coolant storage case and input pipe.
Preferably, the side of the exhausted bath box is provided through the drainpipe of base.
Preferably, the inside of the base is hollow structure.
Compared with prior art, the beneficial effects of the invention are as follows：In the present invention, it is provided with electronic component installing plate uniformly
The design of the through hole of distribution, be advantageous to caused heat on electronic component and heat-transfer pipe is flowed to by through hole, and carry out being transmitted to
Radiating is cooled down on three coolant flow pipes, side of the holding tank at the top of electronic component installing plate is provided with the first coolant
Flow duct, holding tank are provided with the design of the second coolant flow pipe close to the side of electronic component installing plate bottom, are advantageous to
During coolant flow inside the first coolant flow pipe and the second coolant flow pipe, the both sides of electronic component installing plate are entered
Row radiating, the both sides of base bottom are provided with heat emission fan, and the design of heat emission hole is provided between heat emission fan and chassis interior,
Be advantageous to accelerate the air flow of chassis interior, strengthen the efficiency of radiating.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the electronic component with heat sinking function proposed by the present invention；
Fig. 2 is a kind of structural representation of 3rd coolant flow pipe of the electronic component with heat sinking function proposed by the present invention.
In figure：1 base, 2 electronic component installing plates, 3 first coolant flow pipes, 4 second coolant flow pipes, 5 outputs
Pipe, 6 input pipes, 7 exhausted bath box, 8 coolant storage cases, 9 through holes, 10 heat-transfer pipes, 11 the 3rd coolant flow pipes, 12 connecting tubes.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
Reference picture 1-2, a kind of electronic component with heat sinking function, including electronic component installing plate 2, electronic component installing plate
2 both sides are fixedly mounted on base 1, and the inside both sides of base 1 are provided with the receiving being adapted with electronic component installing plate 2
Groove, two holding tanks are provided with the first coolant flow pipe 3, two receivings close to the side at the top of electronic component installing plate 2
Groove is provided with the second coolant flow pipe 4, two the second coolant flow pipes close to the side of the bottom of electronic component installing plate 2
4 sides close to each other are connected with the 3rd coolant flow pipe 11 being uniformly arranged, and are provided with electronic component installing plate 2 uniformly
The through hole 9 of distribution, the bottom of through hole 9 are connected with heat-transfer pipe 10 straight down, the bottom of heat-transfer pipe 10 and the 3rd cooling liquid stream
Dynamic pipe 11 is fixedly connected, and the both ends of two the first coolant flow pipes 3 are respectively connected with connecting tube 12 straight down, connecting tube 12
Bottom be connected with the second coolant flow pipe 4, the second coolant flow pipe 4 of the interior side of base 1 is connected with efferent duct 5,
The other end of efferent duct 5 is connected with exhausted bath box 7, and the second coolant flow pipe 4 of the inside opposite side of base 1 is connected with input pipe 6,
The other end of input pipe 6 is connected with coolant storage case 8, and the both sides of the bottom of base 1 are provided with heat emission fan, heat emission fan and base
Heat emission hole is provided between 1 inside, the 3rd coolant flow pipe 11 is provided with three, between coolant storage case 8 and input pipe 6
Pulsating pump is provided with, the side of exhausted bath box 7 is provided through the drainpipe of base, and the inside of base 1 is hollow structure.
Operation principle：When in use, pulsating pump is allowed to be operated first, the coolant allowed inside coolant storage case 8 is flourish
Input pipe 6 enters the inside of the second coolant flow pipe 4, and enters the first coolant flow pipe 3 by connecting tube 12
Inside, the inside of the 3rd coolant flow pipe 11 is then entered from the second coolant flow pipe 4, passes through electronic component installing plate
The design of equally distributed through hole 9 is provided with 2, caused heat heat-transfer pipe can be flowed to by through hole 9 on electronic component
10, and be transmitted to and radiating is cooled down on the 3rd coolant flow pipe 11, holding tank close to the top of electronic component installing plate 2 one
Side is provided with the first coolant flow pipe 3, and it is cold that holding tank close to the side of the bottom of electronic component installing plate 2 is provided with second
But liquid flow duct 4 designs, can in the coolant flow inside the first coolant flow pipe 3 and the second coolant flow pipe 4,
The both sides of electronic component installing plate 2 are radiated, the both sides of the bottom of base 1 are provided with heat emission fan, and heat emission fan and base 1
The design of heat emission hole is provided between inside, is advantageous to accelerate the air flow inside base 1, strengthens the efficiency of radiating.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (6)
1. a kind of electronic component with heat sinking function, including electronic component installing plate（2）, it is characterised in that the electronic component
Installing plate（2）Both sides be fixedly mounted on base（1）On, the base（1）Inside both sides be provided with and electronic component pacify
Loading board（2）The holding tank being adapted, two holding tanks are close to electronic component installing plate（2）The side at top is provided with
One coolant flow pipe（3）, two holding tanks are close to electronic component installing plate（2）It is cold that the side of bottom is provided with second
But liquid flow duct（4）, two the second coolant flow pipes（4）It is cold that side close to each other is connected with the 3rd be uniformly arranged
But liquid flow duct（11）, the electronic component installing plate（2）On be provided with equally distributed through hole（9）, the through hole（9）Bottom
Portion is connected with heat-transfer pipe straight down（10）, the heat-transfer pipe（10）Bottom and the 3rd coolant flow pipe（11）It is fixed to connect
Connect, two the first coolant flow pipes（3）Both ends be respectively connected with connecting tube straight down（12）, the connecting tube
（12）Bottom and the second coolant flow pipe（4）Connection, the base（1）Second coolant flow pipe of interior side（4）
It is connected with efferent duct（5）, the efferent duct（5）The other end be connected with exhausted bath box（7）, the base（1）Internal opposite side
Second coolant flow pipe（4）It is connected with input pipe（6）, the input pipe（6）The other end be connected with coolant storage case
（8）.
A kind of 2. electronic component with heat sinking function according to claim 1, it is characterised in that the base（1）Bottom
Both sides be provided with heat emission fan, the heat emission fan and base（1）Heat emission hole is provided between inside.
A kind of 3. electronic component with heat sinking function according to claim 1, it is characterised in that the 3rd cooling liquid stream
Dynamic pipe（11）It is provided with three.
A kind of 4. electronic component with heat sinking function according to claim 1, it is characterised in that the coolant storage case
（8）With input pipe（6）Between be provided with pulsating pump.
A kind of 5. electronic component with heat sinking function according to claim 1, it is characterised in that the exhausted bath box（7）'s
Side is provided through the drainpipe of base.
A kind of 6. electronic component with heat sinking function according to claim 1, it is characterised in that the base（1）It is interior
Portion is hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710535733.9A CN107426948A (en) | 2017-07-04 | 2017-07-04 | A kind of electronic component with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710535733.9A CN107426948A (en) | 2017-07-04 | 2017-07-04 | A kind of electronic component with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107426948A true CN107426948A (en) | 2017-12-01 |
Family
ID=60426961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710535733.9A Pending CN107426948A (en) | 2017-07-04 | 2017-07-04 | A kind of electronic component with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107426948A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835623A (en) * | 2017-12-12 | 2018-03-23 | 梁玉燕 | A kind of electronic equipment heat abstractor |
| CN108922874A (en) * | 2018-06-26 | 2018-11-30 | 芜湖广智天和信息技术有限公司 | A kind of radiator of system integrated circuit plate |
-
2017
- 2017-07-04 CN CN201710535733.9A patent/CN107426948A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835623A (en) * | 2017-12-12 | 2018-03-23 | 梁玉燕 | A kind of electronic equipment heat abstractor |
| CN108922874A (en) * | 2018-06-26 | 2018-11-30 | 芜湖广智天和信息技术有限公司 | A kind of radiator of system integrated circuit plate |
| CN108922874B (en) * | 2018-06-26 | 2020-06-12 | 温州亚宣飞机械科技有限公司 | Heat radiator for system integrated circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM450187U (en) | Circulation type thermosyphon heat dissipation device | |
| CN206423035U (en) | A kind of strong charging pile Switching Power Supply of radiating effect | |
| CN107426948A (en) | A kind of electronic component with heat sinking function | |
| CN208093545U (en) | Large power heat pipe radiator | |
| CN104898812A (en) | Computer heat dissipation device | |
| CN107072126A (en) | A kind of radiator structure of electronic component | |
| CN204102056U (en) | A kind of VPX heat-sinking structure of chassis | |
| CN204014395U (en) | Heat radiation module | |
| CN203934247U (en) | Electronic equipment and liquid-cooling heat radiator thereof | |
| CN105101752A (en) | Charger heat dissipation device | |
| CN204084665U (en) | The off-premises station of air-conditioner and air-conditioner | |
| CN103456464A (en) | Transformer cooling device | |
| CN201119247Y (en) | Liquid cooling auxiliary heat radiation device | |
| CN207299509U (en) | A kind of radiator of quick heat radiating | |
| CN207097620U (en) | Transformer | |
| CN204697466U (en) | The assembling radiating structure of T/R assembly | |
| CN209151467U (en) | A kind of heat radiating type SVG cabinet | |
| CN103702546A (en) | Converter and radiating method | |
| CN203679492U (en) | Squirrelcage high-power IGBT (Insulated Gate Bipolar Translator) single-tube inverter welding machine | |
| CN204145275U (en) | A kind of water-cooling frequency converter | |
| CN107146687A (en) | A kind of transformer | |
| CN202975954U (en) | Dual phase changing circulating type water cooling module | |
| CN207638166U (en) | Power distribution cabinet water-cooling system | |
| CN207501738U (en) | A kind of energy conservation and environmental protection radiator | |
| CN207703030U (en) | A kind of electric power cabinet cooling tower |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171201 |