CN107425411A - Laser assembly, laser display projecting apparatus and laser assembly preparation method - Google Patents
Laser assembly, laser display projecting apparatus and laser assembly preparation method Download PDFInfo
- Publication number
- CN107425411A CN107425411A CN201710703347.6A CN201710703347A CN107425411A CN 107425411 A CN107425411 A CN 107425411A CN 201710703347 A CN201710703347 A CN 201710703347A CN 107425411 A CN107425411 A CN 107425411A
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- Prior art keywords
- laser
- gold
- bore
- laser assembly
- wall surface
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser assembly, laser display projecting apparatus and laser assembly preparation method, to reduce the cost of manufacture of laser display projecting apparatus.A kind of laser assembly, including：Base with least one installation bore, and the laser corresponding to each installation bore, wherein：The susceptor surface has antioxidation coating, and the bottom wall surface of the installation bore of the base has Gold plated Layer, and the laser welds in corresponding installation bore and with the bottom wall surface of the installation bore.
Description
Technical field
The present invention relates to laser display projection art, is projected more particularly to a kind of laser assembly, laser display
Instrument and laser assembly preparation method.
Background technology
Laser display projecting apparatus be it is a kind of can by the equipment on image or VIDEO PROJECTION to curtain, due to its size is big,
Long lifespan, not hinder the advantages that eyes very popular, but also allows many people to hang back because its price is high.Therefore,
How to reduce the cost of manufacture of laser display projecting apparatus is present invention technical problem urgently to be resolved hurrily.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of laser assembly, laser display projecting apparatus and laser assembly and made
Method, to reduce the cost of manufacture of laser display projecting apparatus.
The invention provides a kind of laser assembly, including：Base with least one installation bore, and each peace
The laser corresponding to bore is filled, wherein：
The susceptor surface has antioxidation coating, and the bottom wall surface of the installation bore of the base has Gold plated Layer, institute
Laser is stated in corresponding installation bore and is welded with the bottom wall surface of the installation bore.
Wherein, susceptor surface is all exposed including installing the bottom wall surface of bore and the sidewall surfaces of installation bore
Face.
Using technical scheme, first, anti-oxidation processing is carried out to susceptor surface, forms antioxidation coating；Secondly,
Gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Finally, laser is placed in corresponding installation bore
It is interior, and welded laser with installing the bottom wall surface of bore by welding material.The technical scheme only swashs to base
Solder side progress of the light device with installing bore is gold-plated, and gold-plated processing is not done on the other parts surface of base then, is so effectively subtracted
The small gold-plated area of base, so that the cost of laser assembly substantially reduces.
Optionally, the Gold plated Layer is formed at the bottom wall surface of the installation bore and the side wall table of the installation bore
Face.It is simultaneously gold-plated to the bottom wall surface and sidewall surfaces of installation bore, it can effectively reduce the gold-plated area of base, reduce sharp
Technology difficulty is reduced while the cost of light device assembly.
Preferably, the Gold plated Layer of bottom wall surface of the laser with installing bore is welded by weld-ring.Using weld-ring
Type of Welding can be such that welding material is distributed on solder side more uniformly, so that welding is firm.
Preferably, the thickness of the weld-ring is 0.05~0.5mm.The thickness selection of weld-ring can not only make within the range
Laser and the solder side welding with installing bore are firm, additionally it is possible to effectively reduce the usage amount of solder.
Preferably, the plated thickness is 0.35~0.5 μm, gold content is more than 85%.The thickness of Gold plated Layer and containing gold
Amount selects that, in the scope, welding effect can not only be ensured, moreover it is possible to gold-plated amount is effectively reduced, so as to reduce cost.
Preferably, the antioxidation coating is nickel coating, thickness is 1~10 μm.
Present invention also offers a kind of laser display projecting apparatus, including the laser assembly as described in preceding any one.
Using technical scheme, first, anti-oxidation processing is carried out to laser mounting seat surface, forms oxygen
Change layer；Secondly, gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Again, laser is placed in correspondingly
Installation bore in, and laser and the bottom wall surface of installation bore are carried out welding and form laser group by welding material
Part；Finally, laser assembly and other laser display projecting apparatus parts are carried out being assembled into laser projection instrument.The skill
Art scheme is gold-plated to the laser of base and the solder side progress of installation bore, and gold-plated place is not done on the other parts surface of base
Reason, so effectively reduces the gold-plated area of base, so that the cost of laser assembly substantially reduces, also makes to include the laser
The cost of the laser displaying projector of device assembly substantially reduces.
Present invention also offers a kind of laser assembly preparation method, methods described includes：
Anti-oxidation processing is carried out to susceptor surface, antioxidation coating is formed in susceptor surface；
The bottom wall surface of installation bore to base carries out gold-plated processing, has in the bottom wall surface of installation bore gold-plated
Layer；
Laser is placed in corresponding installation bore and welded with the bottom wall surface of the installation bore.
Laser assembly is manufactured using this method, first, anti-oxidation processing is carried out to susceptor surface, forms antioxidation coating；
Secondly, gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Finally, laser is placed in corresponding installation
In bore, and laser is welded with installing the bottom wall surface of bore by welding material.This method only swashs to base
Solder side progress of the light device with installing bore is gold-plated, and gold-plated processing is not done on the other parts surface of base, so effective to reduce
The gold-plated area of base, so that the cost of laser assembly substantially reduces.
Optionally, methods described includes：The sidewall surfaces of bottom wall surface and installation bore to installing bore are carried out simultaneously
Gold-plated processing.
Solder side progress by the only laser to base and installation bore is gold-plated, and other faces are not gold-plated, so effective
Reduce the gold-plated area of base so that the cost of laser assembly substantially reduces.
Preferably, it is described to the anti-oxidation processing of susceptor surface progress, including：Nickel Plating Treatment is carried out to susceptor surface.
Preferably, before anti-oxidation processing is carried out to susceptor surface, methods described also includes：Remove the oxygen of susceptor surface
Change layer.
Preferably, the oxide layer for removing susceptor surface, including：Laser base is immersed into sulfuric acid solution setting time
After take out.
Preferably, after anti-oxidation processing is carried out to susceptor surface, enter in the bottom wall surface of the installation bore to base
Before the gold-plated processing of row, methods described also includes：
The surface that gold-plated processing need not be entered in base pastes resistance plating glued membrane or coating resistance plating liquid glue.
Optionally, the surface for not needing gold-plated processing includes：On the base in addition to mounting seat bottom hole wall surface
All surfaces, or on the base except mounting seat bottom hole wall surface with installation bore sidewall surfaces in addition to all surfaces.
Surface by that need not enter gold-plated processing in base pastes resistance plating glued membrane or coating resistance plating liquid glue, it is possible to achieve
Gold-plated part is needed to carry out susceptor surface gold-plated, other parts are not gold-plated.After the completion of gold-plated, the resistance plating glued membrane pasted is taken off
Or the resistance plating liquid glue of coating.
Brief description of the drawings
Fig. 1 is the laser assembly exploded perspective view of the embodiment of the present invention；
Fig. 2 is the schematic diagram of the base of the embodiment of the present invention；
Fig. 3 is the laser assembly preparation method flow chart of one embodiment of the invention；
Fig. 4 is the laser assembly preparation method flow chart of another embodiment of the present invention.
Reference：
1- lasers；
2- bases；
3- weld-rings；
4- laser assemblies；
5- antioxidation coatings；
6- installs the sidewall surfaces of bore；
7- installs the bottom wall surface of bore；
8- Gold plated Layers.
Embodiment
In order to reduce laser display projecting apparatus cost of manufacture, the embodiments of the invention provide a kind of laser assembly, laser
Displaying projector and laser assembly preparation method.To make the object, technical solutions and advantages of the present invention clearer, with following
The present invention is described in further detail for embodiment.
As shown in figure 1, the embodiments of the invention provide a kind of laser assembly 4, including：With at least one installation bore
Base 2, and the laser 1 corresponding to each installation bore, wherein：
The surface of base 2 has antioxidation coating 5, and the bottom wall surface of the installation bore of base 2 has Gold plated Layer, laser 1
In corresponding installation bore and the bottom wall surface with installing bore is welded.
Wherein, the surface of base 2 is all naked including installing the bottom wall surface of bore and the sidewall surfaces of installation bore
Show up.
Using technical scheme, first, anti-oxidation processing is carried out to the surface of base 2, forms antioxidation coating 5；Its
It is secondary, gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Finally, laser 1 is placed in corresponding installation
In bore, and laser 1 is welded with installing the bottom wall surface of bore by welding material.The technical scheme is only to base
Solder side progress of 2 laser 1 with installing bore is gold-plated, and gold-plated processing is not done on the other parts surface of base, so effective
Reduce 2 gold-plated area of base so that the cost of laser assembly 4 substantially reduces.
As shown in Fig. 2 in optional embodiment of the present invention, Gold plated Layer 8 is formed at the bottom wall surface 7 and peace of installation bore
Fill the sidewall surfaces 6 of bore.It is simultaneously gold-plated to the bottom wall surface 7 for installing bore and the sidewall surfaces 6 for installing bore, can have
The gold-plated area of reduction base of effect, technology difficulty is reduced while the cost for reducing laser assembly.
As shown in figure 1, in the preferred embodiment of the invention, laser 1 and the Gold plated Layer of the bottom wall surface of installation bore
Welded by weld-ring 3.Using the Type of Welding of weld-ring 3 welding material can be made to be distributed on solder side more uniformly, so that
It is firm to weld.
In the preferred embodiment of the invention, the thickness of weld-ring 3 is 0.05~0.5mm.The thickness of weld-ring 3 is selected in the model
Laser 1 and the solder side welding with installing bore can not only be made firm in enclosing, additionally it is possible to effectively reduce the usage amount of solder.
As shown in Fig. 2 in preferred embodiments of the present invention, the thickness of Gold plated Layer 8 is 0.35~0.5 μm, and gold content is more than
85%.The thickness and gold content of Gold plated Layer 8 select that, in the scope, welding effect can not only be ensured, moreover it is possible to effective to reduce plating
Jin Liang, so as to reduce cost.
Fig. 2 is continued referring to, in preferred embodiments of the present invention, antioxidation coating 5 is nickel coating, and thickness is 1~10 μm.
The embodiment of the present invention additionally provides a kind of laser display projecting apparatus, including such as any one of preceding laser assembly.
Using technical scheme, first, anti-oxidation processing is carried out to laser mounting seat surface, forms oxygen
Change layer；Secondly, gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Again, laser is placed in correspondingly
Installation bore in, and laser and the bottom wall surface of installation bore are carried out welding and form laser group by welding material
Part；Finally, laser assembly and other laser display projecting apparatus parts are carried out being assembled into laser projection instrument.The skill
Art scheme is gold-plated to the laser of base and the solder side progress of installation bore, and gold-plated place is not done on the other parts surface of base
Reason, so effectively reduces the gold-plated area of base, so that the cost of laser assembly substantially reduces, also makes to include the laser
The cost of the laser projection instrument of device assembly substantially reduces.
As shown in figure 3, the embodiment of the present invention additionally provides a kind of laser assembly preparation method, this method includes：
Step 101：Anti-oxidation processing is carried out to susceptor surface, antioxidation coating is formed in susceptor surface；
Step 102：The bottom wall surface of installation bore to base carries out gold-plated processing, in the bottom wall surface tool of installation bore
There is Gold plated Layer；
Step 103：Laser is placed in corresponding installation bore and welded with the bottom wall surface of the installation bore.
Laser assembly is manufactured using this method, first, anti-oxidation processing is carried out to susceptor surface, forms antioxidation coating；
Secondly, gold-plated processing is carried out to the bottom wall surface for installing bore and forms Gold plated Layer；Finally, laser is placed in corresponding installation
In bore, and laser is welded with installing the bottom wall surface of bore by welding material.This method only swashs to base
Solder side progress of the light device with installing bore is gold-plated, and gold-plated processing is not done on the other parts surface of base, so effective to reduce
The gold-plated area of base, so that the cost of laser assembly substantially reduces.
In optional embodiment of the present invention, the sidewall surfaces of bottom wall surface and installation bore to installing bore are entered simultaneously
The gold-plated processing of row.
Solder side progress by the only laser to base and installation bore is gold-plated, and other faces are not gold-plated, so effective
Reduce the gold-plated area of base so that the cost of laser assembly substantially reduces.
In the preferred embodiment of the invention, anti-oxidation processing is carried out to susceptor surface, including：Susceptor surface is plated
Nickel processing.
In preferred embodiments of the present invention, before anti-oxidation processing is carried out to susceptor surface, this method also includes：Go
Except the oxide layer of susceptor surface.Base is carried out again after the oxide layer of susceptor surface is removed anti-oxidation processing can more added with
The oxidation for preventing base of effect, so that the stability enhancing of base.
In preferred embodiments of the present invention, the oxide layer of susceptor surface is removed, including：Base immersion sulfuric acid solution is set
Taken out after fixing time.Sulfuric acid solution can effectively remove the oxide layer of metal surface, so base is immersed to sulfuric acid solution
The part that the time of middle setting can be oxidized its surface removes.
In the preferred embodiment of the invention, after anti-oxidation processing is carried out to susceptor surface, in the installation to base
Before the bottom wall surface of bore carries out gold-plated processing, this method also includes：
The surface that gold-plated processing need not be carried out in base pastes resistance plating glued membrane or coating resistance plating liquid glue.
The surface that base need not enter gold-plated processing can be the whole on base in addition to the bottom wall surface of installation bore
All surfaces on surface, or base in addition to the bottom wall surface of installation bore and the sidewall surfaces of installation bore.By the bottom of at
The surface that seat need not carry out gold-plated processing pastes resistance plating glued membrane or coating resistance plating liquid glue, it is possible to achieve susceptor surface is needed
Gold-plated part progress is gold-plated, and other parts are not gold-plated.After the completion of gold-plated, the resistance plating glued membrane pasted or the resistance plating solution of coating are taken off
State glue.
As shown in figure 4, in one particular embodiment of the present invention, laser assembly preparation method can be：
Step 1011：Laser base is immersed to the sulfuric acid that temperature is 60 DEG C~70 DEG C and concentration is 8%~20%
Taken out after solution setting time, to remove the oxide layer of susceptor surface and greasy dirt etc., wherein, setting time can be rule of thumb true
Determine or observe in operation to determine；
Step 1012：The base for completing step 1011 is cleaned and dried；
Step 1013：Nickel Plating Treatment is carried out to the susceptor surface for completing step 1012, the thickness of nickel coating is 3~5 μm；
Step 1014：The base for completing step 1013 is cleaned and dried；
Step 1015：The surface in addition to the bottom wall surface of installation bore of base to completing step 1014 pastes resistance plating
Glued membrane；
Step 1016：Gold-plated processing is carried out to the bottom wall surface of the installation bore for the base for completing step 1015, installed
The bottom wall surface of bore forms Gold plated Layer；
Step 1017：Resistance plating glued membrane on the base for completing step 1016 is removed, and carries out cleaning, drying；
Step 1018：Laser is placed in the corresponding floor installation bore for completing step 1017 and by weld-ring and institute
State the bottom wall surface welding of installation bore.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (14)
- A kind of 1. laser assembly, it is characterised in that including：Base with least one installation bore, and each installation Laser corresponding to bore, wherein：The susceptor surface has antioxidation coating, and the bottom wall surface of the installation bore of the base has Gold plated Layer, described to swash Light device welds in corresponding installation bore and with the bottom wall surface of the installation bore.
- 2. laser assembly as claimed in claim 1, it is characterised in that the Gold plated Layer is formed at the bottom of the installation bore The sidewall surfaces of wall surface and the installation bore.
- 3. laser assembly as claimed in claim 2, it is characterised in that the plating of the laser and mounting seat bottom hole wall surface Layer gold is welded by weld-ring.
- 4. laser assembly as claimed in claim 3, it is characterised in that the thickness of the weld-ring is 0.05~0.5mm.
- 5. laser assembly as claimed in claim 1, it is characterised in that the plated thickness is 0.35~0.5 μm, containing gold Amount is more than 85%.
- 6. laser assembly as claimed in claim 1, it is characterised in that the antioxidation coating is nickel coating, and thickness is 1~10 μm。
- 7. a kind of laser display projecting apparatus, it is characterised in that including the laser assembly as described in any one of claim 1~6.
- 8. a kind of laser assembly preparation method, it is characterised in that methods described includes：Anti-oxidation processing is carried out to susceptor surface, antioxidation coating is formed in susceptor surface；The bottom wall surface of installation bore to base carries out gold-plated processing, has Gold plated Layer in the bottom wall surface of installation bore；Laser is placed in corresponding installation bore and welded with the bottom wall surface of the installation bore.
- 9. laser assembly preparation method as claimed in claim 8, it is characterised in that methods described includes：The sidewall surfaces of bottom wall surface and installation bore to installing bore carry out gold-plated processing simultaneously.
- 10. laser assembly preparation method as claimed in claim 8, it is characterised in that described that oxygen is carried out to susceptor surface Change is handled, including：Nickel Plating Treatment is carried out to susceptor surface.
- 11. laser assembly preparation method as claimed in claim 8, it is characterised in that anti-oxidation to susceptor surface progress Before processing, methods described also includes：Remove the oxide layer of susceptor surface.
- 12. laser assembly preparation method as claimed in claim 11, it is characterised in that the oxidation for removing susceptor surface Layer, including：Taken out after laser base is immersed into sulfuric acid solution setting time.
- 13. laser assembly preparation method as claimed in claim 8, it is characterised in that anti-oxidation to susceptor surface progress After processing, before the bottom wall surface of the installation bore to base carries out gold-plated processing, methods described also includes：The surface that gold-plated processing need not be carried out in base pastes resistance plating glued membrane or coating resistance plating liquid glue.
- 14. laser assembly preparation method as claimed in claim 13, it is characterised in that the table for not needing gold-plated processing Face includes：All surfaces on the base in addition to the bottom wall surface of installation bore, or except installation bore on the base Bottom wall surface with installation bore sidewall surfaces beyond all surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703347.6A CN107425411A (en) | 2017-08-16 | 2017-08-16 | Laser assembly, laser display projecting apparatus and laser assembly preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703347.6A CN107425411A (en) | 2017-08-16 | 2017-08-16 | Laser assembly, laser display projecting apparatus and laser assembly preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107425411A true CN107425411A (en) | 2017-12-01 |
Family
ID=60438180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710703347.6A Pending CN107425411A (en) | 2017-08-16 | 2017-08-16 | Laser assembly, laser display projecting apparatus and laser assembly preparation method |
Country Status (1)
| Country | Link |
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| CN (1) | CN107425411A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6576493B1 (en) * | 2000-10-13 | 2003-06-10 | Bridge Semiconductor Corporation | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps |
| CN1992456A (en) * | 2005-12-27 | 2007-07-04 | 三洋电机株式会社 | Semiconductor laser device and manufacturing method thereof |
| CN103187683A (en) * | 2011-12-28 | 2013-07-03 | 日亚化学工业株式会社 | Laser light source |
| CN104112982A (en) * | 2013-04-22 | 2014-10-22 | 日亚化学工业株式会社 | Light source apparatus |
-
2017
- 2017-08-16 CN CN201710703347.6A patent/CN107425411A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6576493B1 (en) * | 2000-10-13 | 2003-06-10 | Bridge Semiconductor Corporation | Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps |
| CN1992456A (en) * | 2005-12-27 | 2007-07-04 | 三洋电机株式会社 | Semiconductor laser device and manufacturing method thereof |
| CN103187683A (en) * | 2011-12-28 | 2013-07-03 | 日亚化学工业株式会社 | Laser light source |
| CN104112982A (en) * | 2013-04-22 | 2014-10-22 | 日亚化学工业株式会社 | Light source apparatus |
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Application publication date: 20171201 |