CN107424897B - Plasma surface processor and plasma apparatus cavity body structure - Google Patents
Plasma surface processor and plasma apparatus cavity body structure Download PDFInfo
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- CN107424897B CN107424897B CN201710343046.7A CN201710343046A CN107424897B CN 107424897 B CN107424897 B CN 107424897B CN 201710343046 A CN201710343046 A CN 201710343046A CN 107424897 B CN107424897 B CN 107424897B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
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- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
Abstract
The present invention relates to vacuum equipment field, disclosing a kind of plasma surface processor and plasma apparatus cavity body structure, plasma apparatus cavity body structure includes: magazine, radio-frequency electrode and grounding electrode；Plasma surface processor includes the vacuum plasma cavity for being provided with air inlet module and bleeding point, is provided with magazine, radio-frequency electrode and grounding electrode in vacuum plasma cavity.Magazine is provided with multiple subject matters, these subject matters are spaced setting in magazine, and makes to be reserved with the gap that gas supply stream passes through between two subject matters of arbitrary neighborhood；Several ventilation slots, ventilation slot and the corresponding setting of number of gaps are provided on the side wall of magazine, so that ventilation slot and gap together constitute the airflow channel by subject matter surface；Radio-frequency electrode is located at the side of magazine, and face airflow channel；At least a part of other side for being located at magazine positioned at grounding electrode of grounding electrode, and face airflow channel.The present invention can be improved the surface treatment effect of subject matter.
Description
Technical field
The present invention relates to vacuum equipment field, in particular to a kind of plasma surface processor and plasma apparatus
Cavity body structure.
Background technique
Vacuum plasma cleaning process, refers in vacuum cavity, by electrode, generates under certain pressure condition
The unordered plasma of high-energy is cleaned product, that is, subject matter surface by plasma bombardment, to reach cleaning mesh
A kind of plasma surface treatment craft.
Semiconductor substrate, lead frame, integrated circuit board are the products in contemporary semiconductor production procedure each stage.In life
During production, usually requires to use vacuum plasma surface processing equipment and carry out clean the surface.Therefore these products are all
The subject matter of common vacuum plasma cleaning.
In existing technology, subject matter is usually held by magazine, ventilation slot is usually provided on magazine, these are logical
Wind groove is used for by plasma gas, to guarantee cleaning effect.
In surface treatment, whether gas can be effectively to influence treatment effect by subject matter surface and gas homogeneity
An important factor for.However since the structure of the prior art limits, gas is when by ventilation slot, it is difficult to effectively flow through subject matter
Centre, although the edge processing effect of subject matter meets expection, the treatment effect at the middle part of subject matter it is to be difficult to
It is satisfied.
Summary of the invention
The purpose of the present invention is to provide a kind of plasma surface processors, can be improved the processing on subject matter surface
Effect.
In order to solve the above-mentioned technical problems, the present invention provides a kind of vacuum plasma surface processing equipments, comprising:
Be provided with the vacuum plasma cavity of air inlet module and bleeding point, be provided in vacuum plasma cavity magazine,
Radio-frequency electrode and grounding electrode；
Magazine is provided with multiple subject matters, these subject matters are spaced setting in magazine, and makes two of arbitrary neighborhood to mark
Object between be reserved with the gap that passes through of gas supply stream；Several ventilation slots, ventilation slot and gap phase are provided on the side wall of magazine
It is correspondingly arranged, so that ventilation slot and gap together constitute the airflow channel by subject matter surface；
Radio-frequency electrode is located at the side of magazine, and face airflow channel；
At least a part of other side positioned at magazine of grounding electrode, and face airflow channel；
Gas enters in vacuum plasma cavity via air inlet module, under the electric field action of radio-frequency electrode and grounding electrode
Ionization, is handled, then be extracted from bleeding point by airflow channel and to the surface of subject matter.
The present invention also provides a kind of plasma apparatus cavity body structures, comprising: magazine, radio-frequency electrode and grounding electrode；
Magazine is provided with multiple subject matters, these subject matters are spaced setting in magazine, and makes two of arbitrary neighborhood to mark
Object between be reserved with the gap that passes through of gas supply stream；Several ventilation slots are provided on the side wall of magazine, ventilation slot and gap are opposite
It should be arranged, so that ventilation slot and gap together constitute the airflow channel by subject matter surface；
Radio-frequency electrode is located at the side of magazine, and face airflow channel；
At least a part of other side positioned at magazine of grounding electrode, and face airflow channel.
For compared with the prior art, radio-frequency electrode by being arranged in the side of magazine by the present invention, so that from radio-frequency electrode
The plasma gas of middle releasing can unimpededly pass through reserved airflow channel.Since the flow path of gas more may be used
Control, therefore can be improved the treatment effect of the central part of subject matter.
Preferably, subject matter is semiconductor substrate, lead frame or integrated circuit board.This three is semi-conductor industry
In conventional products, the surface treatment effect for improving this three is of great significance.
Preferably, grounding electrode is formed as framework, magazine is located at grounding electrode and is formed by inside framework；
Wherein, be provided with several ventilation holes on face opposite with radio-frequency electrode in framework, gas by airflow channel and
Ventilation hole, then be extracted from bleeding point.In general, vacuum chamber is square cavity, and the framework that grounding electrode is formed is in vacuum chamber
Inside.Ventilation hole is set, so that gas can directly shed from ventilation hole after through airflow channel, is flowed more suitable
Freely.
Further, preferably, plasma surface processor further includes being arranged to be formed by frame in grounding electrode
Positioning strip on the inner wall of body, positioning strip are used to limit the position of magazine.The position that positioning strip limits magazine is set, is not only saved
The time of magazine positioning, and via the blocking of positioning strip, it can flow away between magazine and electrode to avoid excessive gas,
Improve the uniformity that gas circulates in the cavity.
Further, preferably, magazine is cuboid, positioning strip has 4, and this four positioning strips respectively correspond material
The four edges of box in the longitudinal direction form card slot, and magazine slides along the length direction and is caught in the card slot.
It can be convenient the handling of magazine in such a way that sliding is caught in, quadrangle positioning also has stable fixed effect.
Preferably, the quantity of ventilation hole, shape and position are all consistent with ventilation slot respectively.Ventilation hole in framework with
Ventilation slot on the side wall of magazine corresponds, and can be reduced as far as obstacle, keep the flowing of gas more smooth.
In addition, preferably, be provided with even number magazine in vacuum plasma cavity, and these magazines are divided into two groups,
This two groups of magazines are located at the two sides of radio-frequency electrode.Magazine and radio-frequency electrode are enclosed in grounding electrode and are formed by framework
It is internal.Magazine, which is all arranged, in the intracorporal two sides of vacuum plasma chamber can be improved the space utilization rate of vacuum plasma cavity.
Preferably, bleeding point is located at the position of face radio-frequency electrode, and the pumping direction of bleeding point exists perpendicular to gas
Flow direction in airflow channel.The bleeding point being arranged in parallel, vertically arranged bleeding point have unified the side of gas flowing
To preventing gas from liquidating.
In addition, preferably, air inlet module is located at the position of face radio-frequency electrode, and the airintake direction and material of air inlet module
The short transverse of box is consistent.It, can be to avoid radio-frequency electrode when the airintake direction of air inlet module is consistent with magazine short transverse
Blocking to gas flow.Moreover, the air inlet module of face radio-frequency electrode setting, which can be such that gas is adequately ionized, enters back into air-flow
The surface of channel processing subject matter.
Preferably, there are two air inlet modules, and the two air inlet modules are located at the two sides of radio-frequency electrode.Two sides are all
It is provided with air inlet module, it also can be preferably using in vacuum plasma cavity compared to for the air inlet module of single side
The uniformity of gas distribution is improved in portion space.
In addition, preferably, surface treatment includes cleaning, activation, oxide removal, nano coating or surface grafting.
The present invention can be realized a plurality of types of surface treatments, therefore can satisfy the surface treatment requirement of unlike material.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of first embodiment of the invention magazine；
Fig. 2 is the stereoscopic schematic diagram of first embodiment of the invention plasma surface processor；
Fig. 3 is the stereoscopic schematic diagram of second embodiment of the invention plasma surface processor；
Fig. 4 is the schematic elevation view of third embodiment of the invention plasma surface processor；
Fig. 5 is the stereoscopic schematic diagram of four embodiment of the invention plasma surface processor；
Fig. 6 is that the present invention the 5th, sixth embodiment plasma surface processor look up schematic cross-sectional view；
Fig. 7 is the schematic elevation view of seventh embodiment of the invention plasma surface processor；
Fig. 8 is the schematic elevation view of eighth embodiment of the invention plasma apparatus cavity body structure；
Fig. 9 is the stereoscopic schematic diagram of eighth embodiment of the invention plasma apparatus cavity body structure.
Description of symbols:
1- vacuum plasma cavity；2- magazine；3- air inlet module；4- grounding electrode；4a- positioning strip；4b- ventilation hole；
5- radio-frequency electrode；6- subject matter；7- bleeding point；8- airflow channel；The gap 8a-；8b- ventilation slot.
Specific embodiment
Embodiment one
First embodiment of the invention provides a kind of plasma surface processor, referring to Fig. 1, Fig. 2 combination institute
Show, comprising:
It is provided with the vacuum plasma cavity 1 of air inlet module 3 and bleeding point 7, is provided in vacuum plasma cavity 1
Magazine 2, radio-frequency electrode 5 and grounding electrode 4；
Magazine 2 is provided with multiple subject matters 6, these subject matters 6 are spaced setting in magazine 2, and make the two of arbitrary neighborhood
The gap 8a that gas supply stream passes through is reserved between a subject matter 6；It is provided with several ventilation slots 8b on the side wall of magazine 2, divulges information
Slot 8b and the corresponding setting of gap 8a are led to so that ventilation slot 8b and gap 8a are together constituted by the air-flow on 6 surface of subject matter
Road 8；
Radio-frequency electrode 5 is located at the side of magazine 2, and face airflow channel 8；
At least a part of other side positioned at magazine 2 of grounding electrode 4, and face airflow channel 8；
Gas enters in vacuum plasma cavity 1 via air inlet module 3, in the electric field of radio-frequency electrode 5 and grounding electrode 4
The lower ionization of effect, is handled, then be extracted from bleeding point 7 by airflow channel 8 and to the surface of subject matter 6.
Wherein, one or more magazines 2 can be set in plasma surface processor.The present inventor builds
The ventilation of an a length of 0.1cm to 50cm, a height of 0.1cm to 10cm is arranged in view in each magazine 2 every 0.1cm to 10cm
Slot 8b is preferred embodiment.For example, every 0.2cm to 2cm be arranged an a length of 1cm to 5cm, a height of 0.2cm to 2cm it is logical
Wind groove 8b is preferred embodiment.Certainly, it can also be not limited to this dimension plan in actual use.Preferably, ventilation slot
8b and gap 8a quantity can be identical and be arranged in a one-to-one correspondence, preferably the treatment effect at 6 middle part of raising subject matter.
It will be appreciated by the skilled addressee that by plasma surface treatment, 6 surface of subject matter can occur physics,
Chemical change, such as etching is generated to 6 surface of subject matter and keeps its coarse, alternatively, forming fine and close cross-linked layer, or introduces and contain
Oxygen polar group so that the hydrophily of subject matter 6, cementability, can dyeability, biocompatibility or electrical property changed
It is kind.
In the present embodiment, surface treatment includes cleaning, activation, oxide removal, nano coating or surface grafting.
The present invention can be realized a plurality of types of surface treatments, therefore can satisfy the surface treatment requirement of unlike material, including part,
Film and circuit board etc..
In addition, in the present embodiment, the subject matter 6 being applicable in is can be with the article of ranked and stacked pile.Specifically, target
Object 6 can be semiconductor substrate, lead frame or integrated circuit board.This three is the conventional products in semi-conductor industry, is changed
Surface treatment effect into this three is of great significance.
For compared with the prior art, radio-frequency electrode 5 by being arranged in the side of magazine 2 by the present invention, so that from radio frequency electrical
The plasma gas released in pole 5 can unimpededly pass through reserved airflow channel 8.Due to gas flow path more
Controllably, thus can be improved subject matter 6 central part treatment effect.
Embodiment two
Second embodiment of the present invention provides a kind of vacuum plasma cleaning equipment.Second embodiment is first
The further improvement of embodiment, mainly thes improvement is that, shown in Figure 3 in second embodiment of the present invention, connects
Ground electrode 4 is formed as framework, and magazine 2 is located at grounding electrode 4 and is formed by inside framework.
Wherein, several ventilation holes 4b is provided on face opposite with radio-frequency electrode 5 in framework, gas passes through airflow channel
8 and ventilation hole 4b, then be extracted from bleeding point 7.In general, vacuum plasma cavity 1 is rectangular, and grounding electrode 4 is formed
Framework in the inside of vacuum plasma cavity 1.Ventilation hole 4b is set, so that gas can be straight after through airflow channel 8
It connects from ventilation hole 4b and sheds, flow more smooth.
In the present embodiment, the quantity, shape of ventilation hole 4b and position can be consistent with ventilation slot 8b respectively, can also
Uniformly to gather in framework as shown in Figure 3.Ventilation hole 4b in framework and the ventilation slot 8b on the side wall of magazine 2 mono- are a pair of
It answers, obstacle can be reduced as far as, keep the flowing of gas more smooth.
Embodiment three
Third embodiment of the present invention provides a kind of vacuum plasma cleaning equipment.Third embodiment is first
Or in second embodiment any one embodiment further improvement, mainly the improvement is that, it is real in third of the invention
It applies in mode, shown in Figure 4, plasma surface processor further includes that grounding electrode 4 is arranged in be formed by framework
Positioning strip 4a on inner wall, positioning strip 4a are used to limit the position of magazine 2.The position that positioning strip 4a limits magazine 2 is set, not only
The time of the positioning of magazine 2 is saved, and via the blocking of positioning strip 4a, it can be to avoid excessive gas in magazine 2 and electrode
Between flow away, improve the uniformity that circulates in the cavity of gas.
In the present embodiment, magazine 2 is cuboid, and positioning strip 4a has 4, and this four positioning strip 4a respectively correspond institute
It states the four edges of magazine 2 in the longitudinal direction and forms card slot, the magazine 2 slides along the length direction and is caught in the card
Slot.
It can be convenient the handling of magazine 2 in such a way that sliding is caught in, quadrangle positioning also has stable fixed effect.
Embodiment four
4th embodiment of the invention provides a kind of plasma surface processor.4th embodiment is second
The further improvement of embodiment, mainly thes improvement is that, shown in Figure 5 in the 4th embodiment of the invention, very
Even number magazine 2 is provided in empty plasma chamber 1, and these magazines 2 are divided into two groups, this two groups of magazines 2 are located at
The two sides of radio-frequency electrode 5.
Magazine 2 and radio-frequency electrode 5 are enclosed in the inside that grounding electrode 4 is formed by framework.In vacuum plasma body cavity
Magazine 2, which is all arranged, in two sides in body 1 can be improved the space utilization rate of vacuum plasma cavity 1.
Embodiment five
5th embodiment of the invention provides a kind of plasma surface processor.5th embodiment is first
The further improvement of any one embodiment into the 4th embodiment, specifically, in the 5th embodiment of the invention,
It is shown in Figure 6, further improvement has been made to the position of bleeding point 7.
Wherein bleeding point 7 is located at the position of face radio-frequency electrode 5, and the pumping direction of bleeding point 7 perpendicular to gas in gas
Flow direction in circulation road 8.The bleeding point 7 being arranged in parallel, vertically arranged bleeding point 7 have unified the side of gas flowing
To preventing gas from liquidating.
Embodiment six
Sixth embodiment of the invention provides a kind of plasma surface processor.Sixth embodiment is first
Into the 5th embodiment, the further improvement of any one embodiment, is mainly theed improvement is that, real the of the invention the 6th
It applies in mode, see also shown in Fig. 6, air inlet module 3 is located at the position of face radio-frequency electrode 5, and the air inlet side of air inlet module 3
To consistent with the short transverse of magazine 2.
Specifically, referring to Fig. 6, air inlet module 3 include along radio-frequency electrode 5 length direction it is spaced it is multiple into
Stomata, the surface that the gas blown out from these air inlets can preferably Jing Guo radio-frequency electrode 5.
Wherein, it is preferred that air inlet can be set under the interval of every 4cm to 5cm, and the size radius of air inlet can
To be 3mm to 5mm.It, can blocking to avoid radio-frequency electrode 5 to gas flow when 3 face radio-frequency electrode 5 of air inlet module.Moreover,
The air inlet module 3 that face radio-frequency electrode 5 is arranged can make gas be adequately ionized the table for entering back into the processing subject matter 6 of airflow channel 8
Face.
Embodiment seven
7th embodiment of the invention provides a kind of plasma surface processor.7th embodiment is the 6th
The further improvement of embodiment, mainly thes improvement is that, shown in Figure 7 in the 7th embodiment of the invention, into
There are two gas modules 3, and the two air inlet modules 3 are located at the two sides of radio-frequency electrode 5.Two sides are both provided with air inlet module 3,
Compared to the inner space that also can preferably utilize vacuum plasma cavity 1 for the air inlet module 3 of single side, gas is improved
The uniformity of body distribution.
Embodiment eight
8th embodiment of the invention provides a kind of plasma apparatus cavity body structure, shown in Figure 8, including material
Box 2, radio-frequency electrode 5 and grounding electrode 4.
Shown in Figure 9 in the 8th embodiment of the invention, magazine 2 is provided with multiple subject matters 6, these targets
Object 6 is spaced setting in magazine 2, and makes to be reserved with the gap 8a that gas supply stream passes through between two subject matters 6 of arbitrary neighborhood；Material
Several ventilation slots 8b, ventilation slot 8b and the corresponding setting of gap 8a are provided on the side wall of box 2, so that ventilation slot 8b and gap 8a
Together constitute the airflow channel 8 by 6 surface of subject matter；
Radio-frequency electrode 5 is located at the side of magazine 2, and face airflow channel 8；
At least a part of other side positioned at magazine 2 of grounding electrode 4, and face airflow channel 8.
Grounding electrode 4 is formed as framework, and magazine 2 is located at grounding electrode 4 and is formed by inside framework；
Wherein, several ventilation holes 4b is provided on face opposite with radio-frequency electrode 5 in framework.
Gas enters in plasma apparatus cavity body structure, electric under the electric field action of radio-frequency electrode 5 and grounding electrode 4
From being handled by airflow channel 8 and to the surface of subject matter 6, then be extracted.Preferably, ventilation slot 8b and gap 8a number
Amount can be identical and be arranged in a one-to-one correspondence, preferably the treatment effect at 6 middle part of raising subject matter.
In the present embodiment, plasma apparatus cavity body structure further includes being arranged to be formed by framework in grounding electrode 4
Inner wall on positioning strip 4a, positioning strip 4a is used to limit the position of magazine 2.Ventilation hole 4b is set, so that gas is passing through gas
It can directly shed, flow more smooth from ventilation hole 4b after circulation road 8.The wherein quantity, shape of ventilation hole 4b and position
It can be consistent with ventilation slot 8b respectively.
Magazine 2 can be cuboid, and positioning strip 4a can have 4, and this four positioning strip 4a can respectively correspond magazine 2
Four edges in the longitudinal direction form card slot, and magazine 2 can slide along its length and be caught in card slot.It is caught in using sliding
Mode can be convenient the handling of magazine 2, and quadrangle positioning also has stable fixed effect.
It is noted that the plasma apparatus cavity body structure of present embodiment is not limited to apply in plasma
On surface processing equipment.It can also be applied in the field of other plasma apparatus.
It will be understood by those skilled in the art that in above-mentioned each embodiment, in order to keep reader more preferably geographical
It solves the application and proposes many technical details.But even if without these technical details and based on the respective embodiments described above
Various changes and modifications can also realize each claim of the application technical solution claimed substantially.Therefore, in reality
In, can to above embodiment, various changes can be made in the form and details, without departing from spirit and model of the invention
It encloses.
Claims (9)
1. a kind of plasma surface processor, for cleaning subject matter (6) characterized by comprising be provided with air inlet mould
The vacuum plasma cavity (1) of block (3) and bleeding point (7), be provided in the vacuum plasma cavity (1) magazine (2),
Radio-frequency electrode (5) and grounding electrode (4)；
The magazine (2) is provided with multiple subject matters (6), the interval setting in the magazine (2) of these subject matters (6), and makes
The gap (8a) that gas supply stream passes through is reserved between two subject matters (6) of arbitrary neighborhood；It is provided on the side wall of the magazine (2)
Several ventilation slots (8b), the ventilation slot (8b) and the gap (8a) corresponding setting so that the ventilation slot (8b) and
The gap (8a) together constitutes the airflow channel (8) by the subject matter (6) surface；
The radio-frequency electrode (5) is located at the side of the magazine (2), and airflow channel described in face (8)；
At least a part of other side positioned at the magazine (2) of the grounding electrode (4), and airflow channel described in face (8)；
Gas enters in the vacuum plasma cavity (1) via the air inlet module (3), in the radio-frequency electrode (5) and
Ionized under the electric field action of the grounding electrode (4), by the airflow channel (8) and to the surface of the subject matter (6) into
Row processing, then be extracted from the bleeding point (7)；
The air inlet module (3) includes the spaced multiple air inlets of length direction along the radio-frequency electrode (5)；
The grounding electrode (4) is formed as framework, and the magazine (2) is located at the grounding electrode (4) and is formed by inside framework；
Wherein, several ventilation holes (4b) are provided on face opposite with the radio-frequency electrode (5) in the framework, gas passes through
The airflow channel (8) and the ventilation hole (4b), then be extracted from the bleeding point (7)；
Quantity, shape and the position of the ventilation hole (4b) are all consistent with the ventilation slot (8b) respectively.
2. plasma surface processor according to claim 1, it is characterised in that: the subject matter (6) is partly to lead
Body substrate, lead frame or integrated circuit board.
3. plasma surface processor according to claim 1, it is characterised in that: the plasma surface treatment
Equipment further includes the positioning strip (4a) being arranged on the inner wall that the grounding electrode (4) is formed by framework, the positioning strip
(4a) is used to limit the position of the magazine (2).
4. plasma surface processor according to claim 3, it is characterised in that: the magazine (2) is cuboid,
The positioning strip (4a) has 4, and this four positioning strips (4a) respectively correspond the four edges of the magazine (2) in the longitudinal direction
Card slot is formed, the magazine (2) is slided along the length direction and is caught in the card slot.
5. plasma surface processor according to claim 1, it is characterised in that: the vacuum plasma cavity
(1) it is provided with even number magazine (2) in, and these magazines (2) are divided into two groups, this two groups of magazines (2) are located at described penetrate
The two sides of frequency electrode (5)；
The magazine (2) and the radio-frequency electrode (5) is enclosed in the inside that the grounding electrode (4) is formed by framework.
6. plasma surface processor according to claim 1, it is characterised in that: the bleeding point (7) is located at just
To the position of the radio-frequency electrode (5), and the pumping direction of the bleeding point (7) perpendicular to gas in the airflow channel (8)
Interior flow direction.
7. plasma surface processor according to claim 1, it is characterised in that: the air inlet module (3) is located at
The position of radio-frequency electrode described in face (5), and the short transverse of the airintake direction of the air inlet module (3) and the magazine (2)
It is consistent.
8. plasma surface processor according to claim 7, it is characterised in that: the air inlet module (3) has two
It is a, and the two air inlet modules (3) are located at the two sides of the radio-frequency electrode (5).
9. plasma surface processor as claimed in any of claims 1 to 8, which is characterized in that the table
Surface treatment includes cleaning, activation, oxide removal, nano coating or surface grafting.
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| CN115047942A (en) * | 2022-05-31 | 2022-09-13 | 中科长城海洋信息系统有限公司长沙分公司 | Air-cooled sealed type reinforced computer |
| CN115156195A (en) * | 2022-06-10 | 2022-10-11 | 深圳泰德半导体装备有限公司 | Plasma cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875454A (en) * | 2003-10-28 | 2006-12-06 | 诺信公司 | Plasma processing system and plasma treatment process |
| CN102652946A (en) * | 2011-03-04 | 2012-09-05 | 富葵精密组件(深圳)有限公司 | Plasma cleaning device and plasma cleaning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201148466Y (en) * | 2007-12-04 | 2008-11-12 | 郭铭书 | Film coating apparatus of dispersed plate having dispersed gas |
| KR101002621B1 (en) * | 2008-08-25 | 2010-12-21 | 영남대학교 산학협력단 | Atmospheric plasma generator |
| CN206961792U (en) * | 2017-05-16 | 2018-02-02 | 上海稷以科技有限公司 | Superficial treatment system and cavity body structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1875454A (en) * | 2003-10-28 | 2006-12-06 | 诺信公司 | Plasma processing system and plasma treatment process |
| CN102652946A (en) * | 2011-03-04 | 2012-09-05 | 富葵精密组件(深圳)有限公司 | Plasma cleaning device and plasma cleaning method |
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