CN107413599A - The preparation method of colloidal solid film - Google Patents
The preparation method of colloidal solid film Download PDFInfo
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- CN107413599A CN107413599A CN201710685661.6A CN201710685661A CN107413599A CN 107413599 A CN107413599 A CN 107413599A CN 201710685661 A CN201710685661 A CN 201710685661A CN 107413599 A CN107413599 A CN 107413599A
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- liquid
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- colloidal
- colloidal solid
- film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
- B05D1/20—Processes for applying liquids or other fluent materials performed by dipping substances to be applied floating on a fluid
Abstract
A kind of preparation method of colloidal solid film, including:Substrate and colloidal solution are provided, the colloidal solution includes the first liquid and the colloidal solid being scattered in first liquid;Second liquid is provided, the second liquid is dissolved each other with first liquid, and the surface tension of the second liquid is less than the surface tension of first liquid, and a liquid film is formed in the substrate surface with the second liquid;And contact the liquid film with the colloidal solution, so as to form colloidal solid film in the substrate surface.The present invention can simply and efficiently obtain the colloidal solid film of uniformity in different substrates.
Description
Technical field
The present invention relates to Material Field, more particularly to a kind of preparation method of colloidal solid film.
Background technology
Colloidal solid is monodispersed, yardstick in nanometer, the other organic or inorganic particle of submicron order.Nanometer, sub-micron
Sized materials have many peculiar properties, many aspects of the colloidal solid in people live in light, electricity, magnetic, power etc.
Play more and more important role.Colloidal solid is formed into single or multiple lift colloidal solid film in substrate surface, not only may be used
To realize that the protection to substrate can also make general performance go out the property not available for colloidal solid, it can be used for anticorrosion, urge
The fields such as change, photoelectric device, sensor and biomedicine.
The preparation of colloidal solid film utilizes colloidal solid and colloid mainly by way of colloidal solid self assembly
Interaction force (Coulomb force, Van der Waals force and hydrophobic forces etc.) between particle and between colloidal solid and substrate surface,
The direction motion for making colloidal solid reduce under these effects towards free energy, forms stabilization when maximum system energy reaches minimum
Single or multiple lift colloidal solid film.Generally, preparing the self-assembling method of colloidal solid film has spin-coating method, convection current method, lifting
The methods of method and electrostatic force method, wherein spin-coating method, convection current method and czochralski method are all to utilize the profit of colloidal solution on the surface of the substrate
Wet and formation film effect, electrostatic force method are colloidal solid is assembled into substrate surface under electrostatic attraction effect.
However, spin-coating method can not form homogeneous single or multiple lift colloidal solid film, the operation of convection current method on curved surface
Method is complex, and required control parameter is more.Although electrostatic force method is applied to curved surface, usually require to change substrate
Property, it is more difficult to control the number of plies of colloidal solid.Czochralski method be using colloidal solution liquid level formed in the place with substrate contact it is curved
Lunar surface, the evaporation induction of the region solution generate the convection current of solution, and colloidal solid is moved to meniscus top in this role,
As the thinned particle of meniscus separates out and adsorbs in substrate, while the liquid level of colloidal solution and substrate is controlled to carry out slowly
Relative movement, so as to which the diverse location constantly in substrate surface forms new meniscus and adsorbs new colloidal solid, finally exist
Substrate surface forms colloidal solid film.The time that this method forms colloidal solid film is longer, and efficiency is low, and applies
When on curved substrate, in relative movement thereof, the shape of the meniscus formed with liquid level due to curved substrate is constantly to change
, so as to cause to cannot get homogeneous colloidal solid film.
The content of the invention
Based on this, it is necessary to provide it is a kind of it is simple efficiently, there is wide applicability to different substrates and can be formed
The preparation method of homogeneous colloidal solid film.
A kind of self-assembling method of colloidal solid, including:
Substrate and colloidal solution are provided, the colloidal solution includes the first liquid and the glue being scattered in first liquid
Body particle;
Second liquid is provided, the second liquid dissolves each other with first liquid, and the surface tension of the second liquid
Less than the surface tension of first liquid, a liquid film is formed in the substrate surface with the second liquid;And
The liquid film is contacted with the colloidal solution, so as to form colloidal solid film in the substrate surface.
In one of the embodiments, it is described to include the liquid film with the method that the colloidal solution contacts:It will be formed
The substrate for having the liquid film is put into the colloidal solution, the liquid film is contacted with the colloidal solution;The colloid
The preparation method of particle film further comprises:By the substrate formed with the colloidal solid film from the colloidal solution
Middle lifting comes out.
In one of the embodiments, the surface tension of the second liquid is less than or equal to the surface of first liquid
The 1/2 of tension force.
In one of the embodiments, the substrate surface for forming the liquid film is plane or curved surface.
In one of the embodiments, the substrate surface for forming the liquid film is continuous surface or noncontinuous surface.
In one of the embodiments, first liquid is water, and the second liquid is ethanol, acetone, acetic acid and first
At least one of alcohol.
In one of the embodiments, by the substrate from during the colloidal solution lifts out, make formed with
The angle of the substrate surface of the colloidal solid film and the liquid level of the colloidal solution is more than 45 ° and less than 135 °.
In one of the embodiments, the speed for the substrate being lifted out from the colloidal solution is less than 5mm/s.
In one of the embodiments, the speed for the substrate being lifted out from the colloidal solution is more than 2mm/s.
In one of the embodiments, after the substrate is lifted from the colloidal solution out, further wrap
Include the step of drying the substrate.
The preparation method of colloidal solid film provided by the invention, when the liquid film contacts with the colloidal solution, institute
State second liquid to be diffused to first liquid, and form, second liquid nearer from the surface distance of the substrate
The higher concentration gradient of the concentration of body.Because the surface tension of the second liquid is less than the surface tension of first liquid,
It is nearer from the surface distance of the substrate so as to form one, the smaller interfacial tension gradient of interfacial tension.At the interface
In the presence of power gradient, the colloidal solid is moved to the direction that interfacial tension reduces and contacted until with the surface of the substrate,
And the surface that the substrate is attracted in the presence of Van der Waals force forms the colloidal solid film.
The interfacial tension gradient that the present invention is formed using the first liquid and second liquid can rapidly realize the colloid
The self assembly of particle and the preparation of the colloidal solid film, and the homogeneous colloid can be formed in different substrates
Grain film, preparation efficiency is high, simple to operate, easily controllable and cost is relatively low, is advantageous to large area preparation of industrialization.
Brief description of the drawings
Fig. 1 is the flow chart of the preparation method of colloidal solid film provided by the invention;
Fig. 2 is the stereoscan photograph for the colloidal solid film that the embodiment of the present invention 1 provides;
Fig. 3 is the stereoscan photograph for the colloidal solid film that the embodiment of the present invention 2 provides;
Fig. 4 is the stereoscan photograph for the colloidal solid film that the embodiment of the present invention 3 provides.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, by the following examples, and combine attached
Figure, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only explaining this hair
It is bright, it is not intended to limit the present invention.
Referring to Fig. 1, first embodiment of the invention provides a kind of self-assembling method of colloidal solid, including:
S1, there is provided substrate and colloidal solution, the colloidal solution include the first liquid and is scattered in first liquid
Colloidal solid;
S2, there is provided second liquid, the second liquid dissolve each other with first liquid, and the surface of the second liquid
Power is less than the surface tension of first liquid, and a liquid film is formed in the substrate surface with the second liquid;And
S3, the liquid film is set to be contacted with the colloidal solution, so as to which the colloidal solid is assembled in into the substrate surface
Form colloidal solid film.
In step sl, the material of the substrate and species are unlimited, can be selected according to being actually needed.The substrate
Surface for forming the liquid film can be plane or curved surface.The substrate is used for the surface for forming the liquid film
Can be continuous surface or noncontinuous surface, such as netted face.The substrate can be by organic material, inorganic material
It is prepared with least one of metal material.The substrate can also be fibrous substrates.
The species of the colloidal solid and first liquid is unlimited, as long as the colloidal solution can be formed.Institute
It can be at least one of organic solvent and inorganic solvent to state the first liquid, such as first liquid can be water.It is described
Colloidal solid can be inorganic particle (such as nano-Ag particles) or organic granular (such as polytetrafluoroethylene (PTFE) capsule shape particle,
PTFE).The colloidal solid shape can be spherical or capsule shape.
In step s 2, the species of the second liquid is unlimited, as long as the substrate can be soaked so as to form the liquid
Film.Preferably, the second liquid has less surface tension in itself, to form the liquid on the substrate
Film.The second liquid can be at least one of ethanol, acetone, acetic acid and methanol.
The method for forming the liquid film on the substrate with the second liquid is unlimited.In one embodiment, with described
The method that second liquid forms the liquid film on the substrate includes:The substrate is totally immersed into the second liquid,
Then the substrate is lifted from the second liquid and come out, so as to form the liquid film on the substrate.Using lifting
Method can quickly and easily obtain the more uniform liquid film.Preferably, the substrate can be erected from the second liquid
Directly lift out.
Further, formed on the substrate before the liquid film, may also include the step cleaned to the substrate
Suddenly, removing the spot of substrate surface residual.At least one of acetone, ethanol and deionized water can be used to described
Substrate is cleaned.After cleaning, the liquid film will be re-formed after the surface drying of the substrate.
In step s3, when the liquid film contacts with the colloidal solution, the second liquid is to first liquid
It is diffused, and forms one nearer from the surface distance of the substrate, the higher concentration gradient of the concentration of the second liquid.By
It is less than the surface tension of first liquid in the surface tension of the second liquid, so as to form a table from the substrate
Identity distance is from nearer, the smaller interfacial tension gradient of interfacial tension.In the presence of the interfacial tension gradient, the colloidal solid
The direction reduced to interfacial tension is moved to be contacted until with the surface of the substrate, and is adsorbed in the presence of Van der Waals force
The colloidal solid film is formed on the surface of the substrate.
The preparation method of colloidal solid film provided by the invention, the interface formed using the first liquid and second liquid
Power gradient can rapidly realize the self assembly of the colloidal solid, and simple to operate efficiently easily to realize, control parameter is less,
And there is universality to different substrates.In addition, which kind of substrate no matter used, the self assembly condition of the colloidal solid is homogeneous
Together, therefore, it can obtain the homogeneous colloidal solid film.
When the second liquid is volatile solvent (such as ethanol), can by the liquid film rapidly with the colloid
Solution contacts, and prevents second liquid from being volatilized before the liquid film contacts with the colloidal solution.
The surface tension of the second liquid and the surface tension gap of first liquid are bigger, and the colloidal solid is got over
Smoothly can rapidly it be adsorbed in the substrate so as to more smoothly be rapidly formed the colloidal solid film.Preferably, institute
The surface tension for stating second liquid is less than or equal to the 1/2 of first surface tension of liquid.
After the colloidal solid film is formed, even if first liquid passes through diffusion with the second liquid
And uniformly mix, the interfacial tension gradient is disappeared, the colloidal solid film is due to Van der Waals force being present between substrate
Deng active force, remain able to be adsorbed in the substrate surface securely.
In one embodiment, can by the way of the substrate formed with the liquid film is put into the colloidal solution,
To cause the liquid film to be contacted with the colloidal solution.Because the colloidal solid in colloidal solution is probably substantial amounts of, except in base
Basal surface is self-assembly of outside colloidal solid film, may also have part colloidal solid to be freely present in second liquid, described
The preparation method of colloidal solid film can further comprise after the colloidal solid film is formed:
S4, the substrate formed with the colloidal solid film is lifted from the colloidal solution and come out.
In step s 4, the substrate is lifted from the colloidal solution and out specifically refers to depart from institute in the substrate
During stating colloidal solution so that the liquid of the substrate surface and the colloidal solution formed with the colloidal solid film
Face angle is more than 0 ° and less than 180 °, to prevent the substrate from, from during the colloidal solution departs from, making containing unassembled
Remain on the colloidal solid film for the colloidal solution of the free colloidal solid of colloidal solid film and influence the glue
The homogeneity of body particle film.Preferably, during the substrate is lifted from the colloidal solution out so that shape
Angle into the substrate surface for having the colloidal solid film and the liquid level of the colloidal solution is more than 45 ° and is less than
135 °, to ensure that unnecessary colloidal solution will not be remained in the substrate.
The substrate can slowly be lifted from the colloidal solution and come out, to cause the colloidal solution will not be by institute
State substrate to take out of, so as to ensure the homogeneity of the colloidal solid film finally obtained.Preferably, by the substrate from described
The speed for lifting out in colloidal solution is less than 5mm/s, to ensure that the colloidal solution will not be taken out of by the substrate.It is more excellent
The speed that the substrate is lifted out by selection of land from the colloidal solution is more than 2mm/s, to enable the substrate quick
Ground departs from the colloidal solution.
After the step S4, the step of drying the substrate is may also include to remove the first liquid of the substrate surface
Body and/or second liquid.Drying the method for the substrate can be selected according to being actually needed, such as can use naturally dry
Method dry the substrate.
Embodiment 1:
Silicon chip is respectively cleaned 5 minutes using acetone, ethanol, deionized water successively, cleaning finishes to be dried up using argon gas.Silicon
Piece is put into absolute ethyl alcohol, lifts out liquid level vertically, and ethanol sprawls into film in silicon chip surface.It is 60% by mass fraction
PTFE colloidal solution is diluted to the PTFE colloidal solution that mass fraction is 6% with deionized water, 10min is stirred by ultrasonic, in ethanol
Before volatilization, substrate is put into vertically in the PTFE colloidal solution that mass fraction is 6%, then lifted vertically with 3mm/s speed
Go out liquid level, silicon chip is put and spontaneously dried in atmosphere, characterized after moisture evaporation through SEM, as shown in Fig. 2 can
To find out that silicon chip is covered by PTFE colloidal solids film, PTFE colloidal solid films are individual layer and have preferable uniformity.
Embodiment 2:
The present embodiment and the embodiment 1 are essentially identical, and difference is deionized water by PTFE colloidal solution quality
Fraction is diluted to 12%.Scanned electron microscope characterizes, as shown in figure 3, silicon chip is covered by PTFE colloidal solids film, PTFE
Film colloidal solid is bilayer and has preferable uniformity.
Embodiment 3:
The present embodiment and the embodiment 1 are essentially identical, and difference is that substrate is stainless (steel) wire.Scanned electronic display
Micro mirror characterize, as shown in figure 4, stainless (steel) wire by PTFE colloidal solids film cover, the PTFE colloidal solids film have compared with
Good uniformity.
As can be seen from the above embodiments, the self-assembling method of colloidal solid provided by the invention, it is not only simple efficient, hold
Easily realize, can apply in the substrate surface such as plane and curved surface, there is stronger applicability, and in the colloidal solid film
The number of plies of colloidal solid can be precisely controlled according to the concentration of the colloidal solution, and the concentration of the colloidal solution is bigger,
The number of plies of the colloidal solid film is more, so as to can obtain the colloidal solid film of single or multiple lift.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of preparation method of colloidal solid film, including:
Substrate and colloidal solution are provided, the colloidal solution includes the first liquid and the colloid being scattered in first liquid
Grain;
Second liquid is provided, the second liquid dissolves each other with first liquid, and the surface tension of the second liquid is less than
The surface tension of first liquid, a liquid film is formed in the substrate surface with the second liquid;And
The liquid film is contacted with the colloidal solution, colloid is formed so as to which the colloidal solid is assembled in into the substrate surface
Particle film.
2. the preparation method of colloidal solid film according to claim 1, it is characterised in that described by the liquid film and institute
Stating the method for colloidal solution contact includes:The substrate formed with the liquid film is put into the colloidal solution, made described
Liquid film contacts with the colloidal solution;
The preparation method of the colloidal solid film further comprises:By the substrate formed with the colloidal solid film from
Lifting comes out in the colloidal solution.
3. the preparation method of colloidal solid film according to claim 1, it is characterised in that the surface of the second liquid
Tension force is less than or equal to the 1/2 of the surface tension of first liquid.
4. the preparation method of colloidal solid film according to claim 1, it is characterised in that for forming the liquid film
The substrate surface is plane or curved surface.
5. the preparation method of colloidal solid film according to claim 1, it is characterised in that for forming the liquid film
The substrate surface is continuous surface or noncontinuous surface.
6. the preparation method of colloidal solid film according to claim 1, it is characterised in that first liquid is water,
The second liquid is at least one of ethanol, acetone, acetic acid and methanol.
7. the preparation method of colloidal solid film according to claim 2, it is characterised in that by the substrate from the glue
During liquid solution lifts out, make the substrate surface formed with the colloidal solid film and the colloidal solution
The angle of liquid level is more than 45 ° and less than 135 °.
8. the preparation method of colloidal solid film according to claim 2, it is characterised in that by the substrate from the glue
The speed for lifting out in liquid solution is less than 5mm/s.
9. the preparation method of colloidal solid film according to claim 2, it is characterised in that by the substrate from the glue
The speed for lifting out in liquid solution is more than 2mm/s.
10. the preparation method of colloidal solid film according to claim 2, it is characterised in that by the substrate from institute
State in colloidal solution after lifting out, the step of further comprising drying the substrate.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110841892A (en) * | 2019-11-26 | 2020-02-28 | 清华大学 | Method for rapidly preparing self-assembly coating based on evaporation-induced tension gradient drive |
CN116251951A (en) * | 2023-03-10 | 2023-06-13 | 清华大学 | Method for preparing metal nanoparticle self-assembled layer based on interfacial tension gradient-electrostatic attraction composite and application thereof |
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CN103025411A (en) * | 2010-05-21 | 2013-04-03 | 阿德里安·布罗曾尔 | Self-assembled surfactant structures |
TW201612358A (en) * | 2014-09-26 | 2016-04-01 | Fujifilm Corp | Method for producing metal oxide particle layer, and method for producing metal layer |
WO2017018946A1 (en) * | 2015-07-28 | 2017-02-02 | Agency For Science, Technology And Research | Method for self-assembly of nanoparticles on substrate |
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CN102239556A (en) * | 2008-10-29 | 2011-11-09 | 雷斯昂公司 | Application of a self-assembled monolayer as an oxide inhibitor |
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Cited By (4)
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CN110841892A (en) * | 2019-11-26 | 2020-02-28 | 清华大学 | Method for rapidly preparing self-assembly coating based on evaporation-induced tension gradient drive |
CN110841892B (en) * | 2019-11-26 | 2021-04-23 | 清华大学 | Method for rapidly preparing self-assembly coating based on evaporation-induced tension gradient drive |
CN116251951A (en) * | 2023-03-10 | 2023-06-13 | 清华大学 | Method for preparing metal nanoparticle self-assembled layer based on interfacial tension gradient-electrostatic attraction composite and application thereof |
CN116251951B (en) * | 2023-03-10 | 2023-11-10 | 清华大学 | Method for preparing metal nanoparticle self-assembled layer based on interfacial tension gradient-electrostatic attraction composite and application thereof |
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