CN107407990A - Electrically conducting transparent thin plate, touch panel module and touch-panel device - Google Patents

Electrically conducting transparent thin plate, touch panel module and touch-panel device Download PDF

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Publication number
CN107407990A
CN107407990A CN201680014111.5A CN201680014111A CN107407990A CN 107407990 A CN107407990 A CN 107407990A CN 201680014111 A CN201680014111 A CN 201680014111A CN 107407990 A CN107407990 A CN 107407990A
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conductive layer
monomer
acrylic
thin plate
conductive
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CN201680014111.5A
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CN107407990B (en
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清水政
清水政一
木口贵美子
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Soken Kagaku KK
Soken Chemical and Engineering Co Ltd
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Soken Chemical and Engineering Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/24—Homopolymers or copolymers of amides or imides
    • C09J133/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Electrically conducting transparent thin plate provided by the invention and using touch panel module and touch-panel device made of the electrically conducting transparent thin plate, can suppress that broken string or short circuit occur because the migration of the metal material of conductive layer is formed；The electrically conducting transparent thin plate at least possesses：The conductive layer of metal material and the adhesive phase with conductive layers make contact are used as conductive material, adhesive phase includes：At least one migration inhibitor selected in acrylic copolymer as comonomer components containing hydrophilic acrylic's monomer and the group formed from moisture absorber and metal ion capturing agent, wherein, hydrophilic acrylic's monomer contains at least one hydrophilic group for selecting in the group formed from hydroxyl, alkoxy, amino and amide groups, the mixed proportion of hydrophilic acrylic's monomer in the comonomer components of acrylic copolymer for the gross weight of acrylic copolymer more than 15wt%.

Description

Electrically conducting transparent thin plate, touch panel module and touch-panel device
Technical field
The present invention relates to electrically conducting transparent thin plate, touch panel module and touch-panel device.
Background technology
Intelligent hand can be widely used in by touching picture display face the band touch panel display that is operated In machine, tablet terminal, notebook computer, ticket machine, ATM etc..There are resistance membrane type and electrostatic capacitive etc. known to touch panel Touch panel, wherein, resistive touch panel is to press screen by measuring voltage change to detect finger or stylus etc. Position, it is electric that capacitive touch panel using sensor senses finger touches weak current, i.e. electrostatic caused by screen Hold the change of (electric charge), so as to grasp touch location.
It is widely used that ITO (oxygen is set on transparent resin film or glass substrate in capacitive touch panel Change indium tin) composition of the film as nesa coating.But because the resistance of ito film is big, thus exist as screen size becomes big And response speed (from time of the finger tip contacts screen untill the position is detected) this slack-off problem.Therefore, it was also proposed that Following methods, i.e.,：The electrode for substituting the transparent metal oxide as ito film to form, and use multiple by strip-shaped conductive The electrode that the grid that region is formed is arranged and formed, so as to reduce sheet resistance, wherein, above-mentioned strip-shaped conductive region uses The metal material of metal particle etc. and formed (such as patent document 1 etc.).
In the known technology illustrated in the grade of patent document 1, with the distribution etc. for forming conductive layer conductive region it is micro- The distance of refinement or wiring closet it is narrowing, easily because the ionization of metal material (silver, copper etc.) for forming distribution is drawn Rise migration and occur broken string or short circuit.In order to solve the above problems, it is proposed that a kind of wired circuit board, it makes and comprising silver The metal wiring transparent adhesive layer that directly contacts and set in contain oxidation-reduction potential (oxidation-reduction Potential) the reproducibility compound (patent document 2) for being 0.40V~1.30V.In the art, using phenolic compound, The reproducibility compound of aminated compounds, sulfur compound etc. by silver ion reduction into argent, so as to suppress silver ion Migration.
【Prior art literature】
【Patent document】
Patent document 1：JP Publication, JP No. 2012-33147 number
Patent document 2：JP Publication, JP No. 2014-82446 number
The content of the invention
The present invention is to complete in view of the foregoing, and its problem is, there is provided one kind can suppress because forming conductive Layer metal material migration and occur broken string or short circuit electrically conducting transparent thin plate and be made using the electrically conducting transparent thin plate Touch panel module and touch-panel device.
Above-mentioned problem is realized by the following present invention.That is,
The electrically conducting transparent thin plate of the present invention is characterised by least possessing：Metal material is used as conductive material Conductive layer and adhesive phase with conductive layers make contact, adhesive phase, which includes, contains hydrophily third as comonomer components Selected at least in the acrylic copolymer of alkene acrylic monomer and the group formed from moisture absorber and metal ion capturing agent A kind of migration inhibitor, wherein, hydrophilic acrylic's monomer contains what is formed from hydroxyl, alkoxy, amino and amide groups At least one hydrophilic group for selecting in group, the hydrophilic acrylic in the comonomer components of acrylic copolymer are single The mixed proportion of body is more than the 15wt% of the gross weight of the acrylic copolymer.
The touch panel module of the present invention is characterised by least possessing：Metal material is used as conductive material Conductive layer and adhesive phase with conductive layers make contact, adhesive phase, which includes, contains hydrophily third as comonomer components Selected at least in the acrylic copolymer of alkene acrylic monomer and the group formed from moisture absorber and metal ion capturing agent A kind of migration inhibitor, wherein, hydrophilic acrylic's monomer contains what is formed from hydroxyl, alkoxy, amino and amide groups At least one hydrophilic group for selecting in group, the hydrophilic acrylic in the comonomer components of acrylic copolymer are single The mixed proportion of body is more than the 15wt% of the gross weight of the acrylic copolymer.
The touch-panel device of the present invention is characterised by least possessing image display device and be arranged at image and show The conductive layer and adhesive phase of the picture display face side of device, the conductive layer uses metal material, and as conductive material, this is viscous Mixture layer and the conductive layers make contact, also, adhesive phase includes as comonomer components and contains hydrophilic acrylic The acrylic copolymer of monomer and at least one selected from the group of moisture absorber and metal ion capturing agent composition are moved Inhibitor is moved, wherein, hydrophilic acrylic's monomer contains to be selected in the group formed from hydroxyl, alkoxy, amino and amide groups At least one hydrophilic group selected, hydrophilic acrylic's monomer in the comonomer components of acrylic copolymer it is mixed Composition and division in a proportion example is more than the 15wt% of the gross weight of the acrylic copolymer.
(invention effect)
In accordance with the invention it is possible to provide can suppress because form conductive layer metal material migration and occur broken string or The electrically conducting transparent thin plate of person's short circuit and use touch panel module and touch-panel device made of the electrically conducting transparent thin plate.
Brief description of the drawings
Fig. 1 is the floor map of one for representing the electrically conducting transparent thin plate of the present invention.
Fig. 2 is the floor map of another for representing the electrically conducting transparent thin plate of the present invention.
Fig. 3 is the amplification view of one when representing to amplify the conductive region shown in Fig. 1 and Fig. 2.
Fig. 4 is the diagrammatic cross-section of one of the cross-section structure for representing the electrically conducting transparent thin plate of the present invention.
Fig. 5 is the diagrammatic cross-section of another of the cross-section structure for representing the electrically conducting transparent thin plate of the present invention.
Fig. 6 is the diagrammatic cross-section of another of the cross-section structure for representing the electrically conducting transparent thin plate of the present invention.
Fig. 7 is the diagrammatic cross-section of another of the cross-section structure for representing the electrically conducting transparent thin plate of the present invention.
Fig. 8 is the diagrammatic cross-section of one of the touch-panel device for representing present embodiment.
(symbol description)
10th, 10A, 10B, 10C, 10D, 10E, 10F electrically conducting transparent thin plate
20th, 20A, 20B, 20C, 20D conductive layer
30th, 30A, 30B adhesive phase
40th, 40A, 40B, 40C matrix material
100th, 100A, 100B conductive region
102 distributions
110th, 110A, 110B conductive region arrange
112 extraction electrode portions
120 connecting portions
130 non-conducting areas
200 touch-panel devices
210 image display devices
212 picture display faces
220th, 230 fixation adhesive layer
240 protective clear layers
300 touch panel modules
Embodiment
The electrically conducting transparent thin plate of present embodiment is characterised by least possessing：Metal is used as conductive material The conductive layer of material and the adhesive phase with conductive layers make contact；Adhesive phase is hydrophilic comprising containing as comonomer components Property acrylic monomer acrylic copolymer and the group that is formed from moisture absorber and metal ion capturing agent in select At least one migration inhibitor, wherein, hydrophilic acrylic's monomer contains from hydroxyl, alkoxy, amino and amide groups institute At least one hydrophilic group selected in the group of composition, also, it is described hydrophilic in the comonomer components of acrylic copolymer Property acrylic monomer mixed proportion for the acrylic copolymer gross weight more than 15wt%.
It is hydrophilic comprising containing as comonomer components in adhesive phase in the electrically conducting transparent thin plate of present embodiment Property acrylic monomer acrylic copolymer (following, sometimes referred to as " hydrophilic polymer ").Therefore, when moisture is from outside During into electrically conducting transparent thin plate, the moisture can be strongly attracted to and the adhesive phase of conductive layers make contact (hydrophilic polymer) Side.
In addition, also include migration inhibitor in adhesive phase.The migration inhibitor is directly or indirectly to suppress to occur The material of metal ion transport, it can utilize moisture absorber and/or metal ion capturing agent.Therefore, it is attracted to bonding The hydrone of oxidant layer easily contacts with migration inhibitor.Absorb in addition, moisture absorber has and keep water present in system The function of molecule, prevent from causing the hydrone of metal ionization to be contacted with metal by the function, so as to suppress hair indirectly Raw migration.Catch in addition, metal ion capturing agent has and keep the function of metal ion present in system, pass through the function And metal ion is caught, so that metal ion can not move, thus directly suppress to migrate.
Therefore, even if the metal material of silver that the moisture being externally entering can be with forming conductive layer etc. reacts and makes gold Belong to ionized material, still, when migration inhibitor uses moisture absorber, due to the hydrone for causing metal material to ionize Absorbed by moisture absorber, thus ion reaction itself is hindered.Therefore, the metal for causing migration is not likely to produce in system Ion, thus, it is possible to suppress to cause conductive layer broken string or short circuit because of migration.
In addition, it can react and make with the metal material of the silver of composition conductive layer etc. even in the moisture being externally entering In the case that metal material ionizes, when migration inhibitor uses metal ion capturing agent, caused metal ion in system Caught by metal ion capturing agent.Therefore, because the concentration for the metal ion that can be migrated in system is very low, thus energy It is enough to suppress to cause conductive layer broken string or short circuit because of migration.
As migration inhibitor, any one in moisture absorber or metal ion capturing agent can be used only, Two kinds can be used.Migration inhibitor using moisture absorber and metal ion capturing agent both when, in the first stage, can To cause the hydrone of ionization using moisture absorber to absorb, in second stage, even if do not absorbed by moisture absorber Hydrone and metal material react and produce metal ion, due to can utilize metal ion capturing agent catch the metal from Son, it is thus possible to more reliably suppress conductive layer and broken string or short circuit occurs.
It additionally, there are substitution migration inhibitor and use the reducing agent (reproducibility compound) disclosed in patent document 2 Technology.But because reducing agent can cause the chemical reaction of material chemical reduction, therefore, it is possible to existing in system Metal ion beyond other materials chemical reaction occurs and by the material modified with reduction.In contrast, present embodiment Migration inhibitor, i.e. moisture absorber or metal ion capturing agent used in electrically conducting transparent thin plate, suction only is produced to material The physical actions such as receipts, seizure, thus compared with reducing agent, will not change other materials present in system beyond metal ion Property.Therefore, in using touch-panel device made of the electrically conducting transparent thin plate of present embodiment, adhesive phase or viscous with this The conductive layer of mixture layer contact will not be modified, so as to produce stain etc. on picture display face.
Next, given the account in greater detail for each layer for forming electrically conducting transparent thin plate.First, as adhesive phase In contained acrylic copolymer comonomer components, at least using containing from hydroxyl, alkoxy, amino and amide groups Hydrophilic acrylic's monomer of at least one hydrophilic group selected in the group of composition.
As hydrophilic acrylic's monomer, as long as contain hydroxyl, alkoxy, amino or acid amides as hydrophilic group The known acrylic monomer of at least any one group in base, can be unrestrictedly to use.In addition, hydrophilic acrylic Class monomer can be the monomer for containing two or more hydrophilic groups in a molecule, or can also contain two in a molecule The monomer of hydrophilic group more than individual.As such hydrophilic acrylic's monomer, monomer described below can be included.
As hydrophilic acrylic's monomer containing hydroxyl, (methyl) acrylate containing hydroxyl can be enumerated, is had Body can be enumerated：(methyl) acrylic acid 2- hydroxyl ethyl esters, (methyl) acrylic acid 4- hydroxy butyl esters, the own ester of (methyl) acrylic acid 6- hydroxyls etc..
As hydrophilic acrylic's monomer containing alkoxy, (methyl) acrylic acid containing alkoxy can be enumerated Ester, it can specifically enumerate：(methyl) methoxyethyl acrylate, (methyl) ethoxyethyl acrylate, (methyl) acrylic acid second Epoxide binaryglycol ester, (methyl) methoxyethyl macrogol ester, (methyl) ethioxy macrogol ester etc..
As hydrophilic acrylic's monomer containing amino, (the first for being 1~20 containing amino and carbon number can be enumerated Base) acrylate, it can specifically enumerate：(methyl) acrylic acid N, N- dimethylaminoethyl, N- acryloyl morpholines etc., from copolymerizable From the viewpoint of, it is preferably (methyl) acrylic acid N, N- dimethylaminoethyl.
As hydrophilic acrylic's monomer containing amide groups, it is 1~20 that can enumerate containing amide groups and carbon number (methyl) acrylate, can specifically be enumerated：(methyl) acrylamide, N methacrylamide, N, N- dimethyl (methyl) third Acrylamide, aminoethyl (methyl) acrylamide, N- methylaminoethyls (methyl) acrylamide etc., from the viewpoint of hydrophily, The unsubstituted monomeric species of hydrogen preferably on N atoms, especially preferably (methyl) acrylamide.
Alternatively, it is also possible to use the monomer containing two or more above-mentioned hydrophilic groups.As containing two or more hydrophilic The monomer of base, N hydroxymethyl acrylamide containing hydroxyl and amide groups etc. can be enumerated.
In addition, from the viewpoint of the hydrophily for ensuring acrylic copolymer, the comonomer of acrylic copolymer The mixed proportion of hydrophilic acrylic's monomer in composition, it is necessary to the gross weight of acrylic copolymer 15wt% with On.When mixed proportion is less than 15wt%, because the hydrone for being difficult to be externally entering is attracted to adhesive phase, so as to be not easy Migration inhibitor is contacted with hydrone, thus can not suppress to migrate.In addition, using containing being participated in by aftermentioned crosslinking agent The functional group of crosslinking or with the crosslinking hydroxyl of facilitation, amino, amide groups hydrophilic acrylic's monomer when, mixing Ratio is preferably in more than 15wt% and below 40wt%, and then preferably in more than 15wt% and below 30wt%.In addition, using During hydrophilic acrylic's monomer containing alkoxy, mixed proportion is preferably in more than 30wt% and below 99wt%, Jin Eryou It is selected in more than 40wt% and below 95wt%.Use at the same time containing hydroxyl, amino, amide groups hydrophilic acrylic's monomer During with hydrophilic acrylic's monomer containing alkoxy, total mixed proportion of two kinds of hydrophilic acrylic's monomers preferably exists More than 17wt%, more preferably in more than 19wt%.
In addition, the comonomer components as acrylic copolymer, from by adjusting the hydrophily third containing hydrophilic group The mixed proportion of alkene acrylic monomer and make acrylic copolymer hydrophily become appropriateness or evenly ensure as bonding From the point of view of the viewpoints such as other various characteristics needed for oxidant layer, preferably in addition to hydrophilic acrylic's monomer containing hydrophilic group also Contain other monomers.
, can be suitably with known monomer as other monomers, it is usually preferred to use not hydroxyl, alkoxy, The monomer of any one in amino and amide groups, the monomer can be acrylic monomer or non-acrylic compounds Monomer.As such hydrophobic monomer, the acrylic monomer containing the alkyl that carbon number is 1~20 can be enumerated, specifically may be used To enumerate：(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, third (methyl) alkyl acrylate of olefin(e) acid 2- ethylhexyls etc..The weight average molecular weight of acrylic copolymer has no special limit It is fixed, in terms of adjustment is for the wetability of conductive layer and the balance of bond properties, preferably 100,000~2,000,000, Jin Ergeng Preferably 300,000~1,500,000.
In addition, as the moisture absorber for being used as migration inhibitor contained in adhesive phase, it can utilize and touch It can be absorbed in the common temperature in use environment of face equipment (0 DEG C~50 DEG C or so) and keep strong known of function of hydrone Material.Specifically, i) inorganic moisture absorber is used as, for example, zeolite, silica gel, activated alumina etc., ii) make For organic moisture absorber, the water absorbent polymer of polyacrylamide etc. can be enumerated；The polyalcohol of glycerine, polyethylene glycol etc. And its polymer；The cellulosic polymer of methylcellulose etc.；Sodium hyaluronate；Collagen etc..
In addition, as the metal ion capturing agent for being used as migration inhibitor contained in adhesive phase, can utilize It can be caught in the common temperature in use environment of touch-panel device (0 DEG C~50 DEG C or so) and keep the function of metal ion strong Known material, generally can be suitably with the group with metal-complexing, structure (amino, phosphino-, mercapto, ehter bond Deng) material.
As concrete example, can enumerate：Acetylacetone,2,4-pentanedione, adenine, 2- ethylaminoethanols, 2- aminoothyl mercaptans, imidazoles, second The metallo-chelate of amine, ethylenediamine, catechol, diethylenetriamine, triethylene tetramine, pyridine, 1,10- phenanthroline etc..
Furthermore it is also possible to enumerate：18- crown- 6- ethers, three benzo-18- crown- 6- ethers, dibenzo-18 crown-6-ether, 15- crown-s The crown ether-like of 5- ethers etc. or metal ion is imported and has formed the functional group of chelate, structure (such as polyamine, glucose amido Deng) chelating resin (chelate resin) etc..
In addition, metal ion capturing agent can properly select metal ion according to the metal material for forming conductive layer The strong agent for capturing of capturing ability.For example, when the metal ion as seizure object is silver ion or copper ion, preferably use 18- crown- 6- ethers, diethylenetriamine etc..
The mixed proportion of contained migration inhibitor is not particularly limited in adhesive phase.But in order to avoid migration Suppressing not abundant enough, the mixed proportion of migration inhibitor is preferably in more than 0.05wt%, more preferably in more than 0.2wt%, and then It is preferred that in more than 0.5wt%.Further, since mixed proportion is excessive and reaches saturation more than the inhibition for taking migration, because This, mixed proportion is preferably below 10wt%, more preferably in below 7wt%, and then preferably in below 4wt%.
The forming method of adhesive phase is not particularly limited, and can generally be pressed down by that will include hydrophilic polymer and migration On surface of the masking liquid of preparation coated in supporter (also referred to as " barrier film (separator) "), and it is dried and makes volatility Composition volatilizees, and conserves (curing) certain time as needed, so as to form adhesive phase.Drying condition, curing condition are simultaneously It is not particularly limited, existing known method can be used.Alternatively, it is also possible to by the way that hydrophilic polymer and inhibition of metastasis will be included On surface of the masking liquid of agent and the reactive diluent added based on needs coated in supporter, and activation evergy line is irradiated, from And form adhesive phase.And then can also be by by comprising hydrophilic polymer and migration inhibitor and based on needing to add Polyfunctional monomer, crosslinking agent, solvent masking liquid coated in supporter surface on and be dried, be then affixed to viscous On attached body and activation evergy line is irradiated, adhesive phase is thus formed on adherend.In addition, reactive diluent refers to containing ethene The chemical species of the polymerizable functional groups of base etc., and be such as monomer, the less chemical species of oligomer equimolecular quantity.It is specific and Speech, can be the monomeric species for forming the acrylic copolymer used in the electrically conducting transparent thin plate of present embodiment.
As activation evergy line, ultraviolet, luminous ray, infrared ray and electron ray can be enumerated.As activation energy The irradiation condition of line is measured, is 1mW/cm generally according to luminous intensity2~200mW/cm2The accumulative light quantity of activation evergy line reach 300mJ/cm2~500mJ/cm2Condition be irradiated.Aggregate rate based on irradiation is preferably 90%~100%.Aggregate rate can Obtained with measuring levels of residual monomers by using gas chromatography.The thickness of adhesive phase can be selected suitably, be led to It is often 1 μm~200 μm or so.
, can be with supporter known to utilization as long as coating can be formed as supporter, such as can use poly- to benzene Naphthalate, polybutylene terephthalate (PBT), PEN, polyethylene film, polypropylene film, It is glassine paper, cellulose diacetate film, cellulose triacetate film, acetylbutyrylcellulose film, polyvinyl chloride film, poly- inclined Dichloroethylene film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, makrolon are thin Film, poly-methyl pentene film, polysulphone film, poly (ether ether ketone) film, Polyethersulfone membranes, PEI film, polyimides are thin The resin film of film, fluorine resin film, nylon film, acrylic resin films etc..
In addition, the surface of supporter can also have release property.There is the supporter of release property using surface Under, have coating is formed on the face of release property at this.In addition, when using the electrically conducting transparent thin plate of present embodiment, before use The supporter that surface is had into release property in advance is peeled off from adhesive phase.On the other hand, on the surface of supporter without de- In the case of mould, supporter can be used at least relative to the transparent transparent supporting body of visible region.
In addition, the adhesive for forming adhesive phase, such as can be manufactured by following steps.First, will contain The starting monomer for having hydrophilic acrylic's monomer loads in reaction vessel, and is heated under the atmosphere of inert gases of nitrogen etc. Set point of temperature, then add thermal polymerization and it is reacted the stipulated time.Again, it is preferred to heat polymerization is fully carried out, To prevent remaining unreacted starting monomer.In addition, migration inhibitor can be added in starting monomer in advance, can also polymerize After be added.
As the thermal polymerization used in heat polymerization, known thermal polymerization can be used, such as It can enumerate：Organic peroxide class, organic hydroperoxide class, organic peroxy ketal class and azo compounds species etc..
Here, as organic peroxide class, such as can include：Cumyl peroxide, di-tert-butyl peroxide Thing, cumyl t-butyl peroxide, dilauroyl peroxide, dibenzoyl peroxide, diacetyl peroxide, peroxidating didecyl Acyl, two different nonanoyl of peroxidating, peroxidating 2- methyl valeryls etc..In addition, as organic hydroperoxide class, can include：Tertiary fourth Base hydrogen peroxide, cumyl hydroperoxide, 2,5- dimethyl -2,5- peroxidating dihydros hexane, hydrogen peroxide are to methane, peroxidating The tertiary own ester of hydrogen diisopropylbenzene (DIPB), peroxidating neopentanoic acid, tert-Butyl peroxypivalate, dimethyl -2, the double methyl propionates of 2 '-azo Deng.
In addition, as organic peroxy ketal class, can include：1,1- double (tertiary hexyls of peroxidating) -3,3,5- trimethyls Double (the tertiary hexyl of the peroxidating) hexamethylenes of hexamethylene, 1,1-, double (tert-butyl peroxide) -3 of 1,1-, 3,5- trimethyl-cyclohexanes, make For azo compounds species, can include：2,2 '-azodiisobutyronitrile, 2,2 '-azo is double -2,4- methyl pentane nitriles, 2,2 ' - Azo double cyclohexanenitrile, 1,1 '-azo double (hexamethylene -1- formonitrile HCNs), 2- benzeneazo -4- methoxyl groups -2,4- methyl pentane nitrile, diformazans Base -2,2 '-azobisisobutylonitrile acid esters etc..
Above-mentioned polymerization initiator can use the mass parts of 0.0001 mass parts~5 relative to the mass parts of starting monomer 100.
In addition, in order to control the weight average molecular weight Mw of hydrophilic polymer, can be by adjusting thermal polymerization Species and usage amount, reaction time, reaction temperature etc. reaction condition or chain-transferring agent is suitably used and is adjusted Section.As chain-transferring agent, can enumerate：Methyl mercaptan, n- dodecyl mereaptan, 2 mercapto ethanol, mercaptoisobutanoic alcohol, thioglycerol (thioglycerol), methyl thioglycolate (Methyl thioglycolate), α-methylstyrenedimer etc..
In addition, the crosslinking of isocyanates crosslinking agent or epoxies crosslinking agent etc. can also be suitably used in adhesive Agent.The combined amount of crosslinking agent can be set to the mass parts of 0.01 mass parts~20 relative to the mass parts of acrylic copolymer 100 Scope.
In addition, as isocyanates crosslinking agent, can include：Toluene di-isocyanate(TDI), chlorine phenylene diisocyanate (chlorophenylene diisocyanate), hexamethylene diisocyanate, tetramethylene diisocyanate, isophorone The isocyanate-monomer of diisocyanate, methyl diphenylene diisocyanate, hydrogenated diphenyl methane diisocyanate etc. or Alcoholic compound more than divalence of above-mentioned isocyanate-monomer and trimethylolpropane etc. etc. is set to carry out addition reaction and generate Isocyanate compound or isocyanurate compounds, biuret form compound etc..Furthermore it is also possible to enumerating makes isocyanates Compound and known PPG or PEPA, acrylic polyol, polybutadiene polyol, poly- isoamyl two Isocyanates of urethane prepolymer type that alkene polyalcohol etc. carries out addition reaction and generated etc..
As epoxies crosslinking agent, can enumerate：Epoxy resin, the ethylene glycol glycidol of bisphenol A/epichlorohydrin type Ether, polyethyleneglycol diglycidylether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6- hexylene glycols shrink Glycerin ether, trihydroxymethylpropanyltri diglycidyl ether, diglycidylaniline, diamines glycidyl amine (diamine Glycidylamine), N, N, N ', double (N, N '-the diamines glycidol ammonia first of N '-four glycidyl group m-xylene diamine, 1,3- Base) hexamethylene (1,3-Bis (N, N '-diamine glycidyl aminomethyl)-cyclohexane) etc..
Alternatively, it is also possible to which ultra-violet absorber, antioxidant, defoamer etc. are further added in adhesive as needed Other polymers beyond various additives or hydrophilic polymer.
As long as conductive layer includes metal material and conductive, then its Rotating fields is just not particularly limited, such as can example Enumerate：By the nm of a diameter of several nm~100, the aggregate structure for the metal nanometer line that length is 1 μm or so~hundreds of μm or so Into conductive layer, form by pattern processing by metal film or include a diameter of several nm~hundreds of nm or so metal particle Film Deng metal ingredient is formed as the conductive layer of regulation shape, directly using a diameter of tens of μm~hundreds of μm or so of wire Conductive layer etc..In addition, in the case of using metal nanometer line or metal particle when forming conductive layer, scattered contain can be used There are the solution or slurry (paste) of above-mentioned metal material., can be suitably with known as the metallic element for forming conductive layer Conductive metal, Ag, Cu, Au etc., especially preferably Ag can be enumerated.In addition, as the metal ingredient for forming conductive layer And in the case of using metal nanometer line or metal particle etc., in addition to above-mentioned metal ingredient, it can also be included in conductive layer There are the other compositions of adhesive ingredients etc., to form and maintain the shape of conductive layer.
And then conductive layer is arranged to contact with adhesive phase.Therefore, it is possible to make transparent conductive panel and use this saturating The Rotating fields of touch panel module and touch-panel device made of bright conductive plate are simpler and thinner.In addition, conductive layer It is arranged to contact with least one face of adhesive phase (hereinafter referred to as " conductive layer forming face "), still, is not configured to By the substantially seamless unoccupied place covering of whole conductive layer forming face, and be configured to the part covering of conductive layer forming face and In defined pattern form.In addition, as long as the required whole plane that played a role as touch-panel device can be realized simultaneously The transparency and perceptional function on direction, then pattern form be not particularly limited.In addition, conductive layer in conductive layer forming face covers Lid rate can suitably be selected in the range of ensuring as the function of touch-panel device, for example, can 0.1%~ Suitably selected in the range of 70%, preferably suitably selected in the range of 1%~50%, more preferably 2% Suitably selected in the range of~40%.
It is flat as such pattern form, such as being formed by first direction and perpendicular to the second direction of first direction In space of planes, the shape illustrated in following (i)~(iii) can be enumerated.
(i) pattern form that following conductive regions row are configured multiple row in a second direction and formed, wherein, above-mentioned conduction region Domain row are by the way that multiple generally square conductive regions are led with the summit of a conductive region with another in the first direction The summit electrical connection (for example, two summits are partially overlapped by each other or set the connecting portion on two summits of connection etc.) in electric region Mode arranged and form (such as the figure illustrated in Fig. 6 disclosed in Japanese Patent Laid-Open 2012-79257 publications etc. Case shape etc.).
(ii) in above-mentioned pattern form (i), by the way that optical ribbon distribution in latticed is configured to form each lead The pattern form (such as pattern form illustrated in Fig. 3 of Japanese Patent Laid-Open 2012-33147 publications etc. etc.) in electric region.
(iii) by the way that the length direction strip-shaped conductive region parallel with first direction is configured into multiple row along second direction, And by the way that optical ribbon distribution is configured to form the pattern form of each conductive region (such as Japan Patent in latticed Fig. 7 of JP 2014-198811 publications, pattern form illustrated in 8 etc. etc.).
The forming method of conductive layer is not particularly limited, can be directly using known method or to known method Utilized after suitably being adjusted, and then two or more known methods can also be combined and utilized.For example, can To manufacture the supporter with conductive layer by the method illustrated in following (A)~(C).
(A) film build method known to sputtering method, vacuum vapour deposition, non-electrolytic plating method etc. is being utilized in supporting body surface Formed after metal film, the method that pattern is formed on the metal film.
In this case, pattern is formed in the following way, i.e.,：After further forming photoresist film on metal film, to light Photoresist film is exposed, development treatment and form resist pattern, for the metal film exposed from resist pattern be etched and selectivity Ground is removed, and finally removes remaining photoresist film on the metal film (conductive layer) for formed pattern.Thereby, it is possible to had There is the supporter of conductive layer.
(B) printed by the pattern form according to regulation in supporting body surface and include metal nanometer line or metal particle Solution or slurry, so as to form the method for conductive layer (referring for example to Japanese Patent Laid-Open 2012-79257 publications etc.).
As printing process, the public affairs such as hectographic printing, letterpress, intaglio printing, silk-screen printing, ink jet printing can be utilized The printing process known.In addition it is also possible to be heated as needed after printing or pressurized treatments.
(C) by being formed photo-sensitive composition of the coating in supporting body surface comprising silver halide and adhesive the methods of Photosensitive layer, then photosensitive layer is exposed, development treatment, so as to form the method for the conductive layer with defined pattern form (referring for example to Japanese Patent Laid-Open 2014-198811 publications etc.).
Hereinafter, as one, in the case of there is the supporter of conductive layer using the method manufacture shown in above-mentioned (B) more Add and specifically illustrate.
In this case, first, surface of the scattered solution containing metal nanometer line coated in the first supporter (is had de- The surface of mould) on, then make its drying, and then pressurized treatments are carried out, so as to form complete membranaceous conducting film.Thus, obtain The first supporter with conducting film.In addition, on the surface of the second supporter, the pattern using silk-screen printing etc. according to regulation Shape printing normal temperature under without cohesive but after the heating with cohesive thermal adhesive (such as polyurethanes bonding Agent etc.).Thus, second supporter with thermal adhesive layer is obtained.
Then, using disk roller laminating (roll laminating method) etc., with conducting film and thermal adhesive Layer mode intimate contact with one another, to the first supporter with conducting film and the second supporter with thermal adhesive layer Heat pressurization and make its bonding.Then, by peeling off the second supporter from the first supporter, so as to only make to be arranged at the Part in conducting film in one supporting body surface, corresponding with the pattern form of thermal adhesive layer is transferred to thermal sensitivity and glued Mixture layer side.Thus, after being formed on the surface of the first supporter with the pattern form upset of thermal adhesive layer is made The conducting film (conductive layer) of pattern form.
Here, obtained from using the method according to above-mentioned (A)~(C), have in predetermined pattern shape When the supporter of conductive layer is to manufacture the electrically conducting transparent thin plate of present embodiment, such as it can be manufactured by following steps transparent Conductive plate.First, the adhesive formed with the electrically conducting transparent thin plate for forming present embodiment on the surface of supporter is prepared The supporter with adhesive phase of layer.
Then, the supporter with conductive layer and the supporter with adhesive phase are added by disk roller laminating etc. Press and make its bonding.In bonding, can also be carried out as needed in the range of it will not cause the performance degradation of adhesive phase Heating.Thereby, it is possible to the layered product A that the body that is supported, conductive layer, adhesive phase, supporter are laminated in this order.It is in addition, logical The supporter from layered product A strippings and conductive layers make contact is crossed, so that conductive layer is transferred on the surface of adhesive phase, thus The layered product B that conductive layer, adhesive phase, supporter are laminated in this order can be obtained.Alternatively, it is also possible to leading in layered product B Electric layer, which is set, to be set protective layer and obtains layered product C on the face of side.And then by being connect from layered product A strippings with adhesive phase After tactile supporter, further bonding with conductive layer supporter, so as to obtain the first supporter, the first conductive layer, The layered product D that adhesive phase, the second conductive layer, the second supporter are laminated in this order.Here, the support for forming conductive layer Body or protective layer, the part with the supporter phase same material for forming adhesive phase can be utilized.
In this case, layered product A, layered product B, layered product C or layered product D can be used as the transparent of present embodiment Conductive plate.Alternatively, it is also possible to which the supporter with adhesive phase to be used as to the branch in the method illustrated in above-mentioned (A)~(C) Support body, and in the formation conductive layer directly on a surface of adhesive phase.But in this case, it is preferred that forming the process of conductive layer In, selection will not cause the conductive layer formation process that the adhesion characteristic of adhesive layer surface substantially deteriorates.As illustrated in more than, lead to Cross and various manufacturing process or intermediate member are suitably combined and utilized, can obtain that there is the saturating of various Rotating fields Bright conductive plate.
Then, the electrically conducting transparent thin plate of present embodiment is more specifically illustrated with reference to the accompanying drawings.Fig. 1 and Fig. 2 are The floor map of one of the electrically conducting transparent thin plate of present embodiment is represented, specifically represents the pattern form of conductive layer The figure of one.In addition, in figure, X-direction and Y-direction shown in arrow are mutually orthogonal directions.
It is in be configured with multiple conductive region row 110A along Y-direction that electrically conducting transparent thin plate 10A (10) shown in Fig. 1, which has, (110) the conductive layer 20A (20) of pattern form, wherein, conductive region row 110A (110) is by the way that multiple square is led Electric region 100A (100) is in X direction with conductive region 100A summit and another conductive region 100A apex portion Overlapping mode is arranged and formed.In addition, in the example depicted in figure 1, in conductive region row 110A (110) X-direction Two sides are further provided with extraction electrode portion 112.In addition, it is in along Y-direction that the electrically conducting transparent thin plate 10B (10) shown in Fig. 2, which has, It is configured with the conductive layer 20B of multiple length directions strip-shaped conductive region 100B (100) parallel with X-direction pattern form (20).In addition, in the example shown in Fig. 2, a conductive region 100B forms a conductive region row 110B (110).In addition, In Fig. 1, Fig. 2, between each conductive region row 110 and it is not connected with and is in electric insulation.In addition, in touch panel module described later Or in touch-panel device, each conductive region row 110 shown in Fig. 1, Fig. 2 are not via extraction wire (not shown) and with scheming The sensor portion connection that printed circuit board (PCB) shown etc. is formed.
In addition, the conductive region 100 shown in Fig. 1, Fig. 2 can be transparent complete membranaceous part, can also be further With such secondary structure illustrated in Fig. 3.Fig. 3 is one when representing to amplify the conductive region 100 shown in Fig. 1 and Fig. 2 The amplification plan view of example.In the example shown in Fig. 3, conductive region 100 is latticed with the distribution 102 of banding is configured to Secondary structure.
Illustrated as shown in Figure 1, Figure 2, conductive layer 20 generally comprises multiple conductive regions 100, and is configured as：From the plurality of Mutually it is not attached between at least two conductive regions 100 selected in conductive region 100 and is in electric insulation.Therefore, as shown in Figure 1 Two neighboring conductive region 100A connecting portion 120 Y-direction length or Fig. 2 shown in conductive region 100B Y-direction In the most narrow part of line width like that such as length, if the metal material for forming conductive layer 20 migrates, easily break.Separately Outside, first conductive region row 110A conductive region 100A, second conductive region row 110A side are being formed as shown in Figure 1 Conductive region 100A, first conductive region row 110A side summit of the summit with forming second conductive region row 110A Between length (gap length G1) or first conductive region row 110B shown in Fig. 2 and second conductive region arrange Length (gap length G2) between 110B like that, in the distance between two conductive regions 100 of electric insulation most short part In, if the metal material for forming conductive layer 20 migrates, short circuit easily occurs.But led in the transparent of present embodiment In electric thin plate 10, as described above, can suppress because air in moisture and cause migration, thus easily prevent break or Short circuit.
In addition, the line width of line width narrowest part is not particularly limited, such as the scope of 10nm~1000 μm can be set to.Line Wide lower limit is preferably in more than 100nm, and more preferably in more than 500nm, and then preferably more than 1 μm, the higher limit of line width is excellent 200 μm are elected as, more preferably below 50 μm, and then preferably below 10 μm.In addition, two conductive regions 100 in electric insulation The distance between the gap length of most short part be not particularly limited, such as 1 μm~5000 μm of scope can be set to.It is most short The lower limit of distance is preferably more than 5 μm, more preferably more than 10 μm, and then preferably more than 50 μm, the upper limit of beeline Value is preferably 1000 μm, more preferably below 500 μm, and then preferably below 10 μm.
In addition, there is no particular restriction for the thickness of conductive layer 20, from the viewpoint of electric conductivity and the transparency, such as can be from The scope of 10nm~1000 μm is selected.The lower limit of thickness is preferably in more than 50nm, more preferably in more than 100nm, thickness Higher limit preferably below 100 μm, more preferably below 10 μm, most preferably below 5 μm.
Fig. 4~Fig. 7 is the diagrammatic cross-section of one of the cross-section structure for the electrically conducting transparent thin plate for representing present embodiment, tool It is the part for representing to exist between the symbol B1-B2 between the symbol A1-A2 in Fig. 1 or in Fig. 2 conductive layer 20 for body The figure of one of cross-section structure.Electrically conducting transparent thin plate 10C (10) shown in Fig. 4 has matrix material 40, adhesive phase 30, conduction The Rotating fields that are laminated in this order of layer 20, the electrically conducting transparent thin plate 10D (10) shown in Fig. 5 have the first matrix material 40A (40), The Rotating fields that adhesive phase 30, conductive layer 20, the second matrix material 40B (40) are laminated in this order, the electrically conducting transparent shown in Fig. 6 Thin plate 10E (10) has the first matrix material 40A (40), the first conductive layer 20C (20), adhesive phase 30, the second conductive layer 20D (20), the Rotating fields that the second matrix material 40B is laminated in this order, the electrically conducting transparent thin plate 10F (10) shown in Fig. 7 have first Matrix material 40A (40), first adhesive phase 30A (30), the first conductive layer 20C (20), the 3rd matrix material 40C (40), The Rotating fields that two conductive layer 20D (20), second adhesive phase 30B (30), the second matrix material 40B are laminated in this order.
The electrically conducting transparent thin plate 10 of present embodiment, as long as conductive layer 20 and adhesive phase 30 possess at least one layer respectively, Then be not limited to the Rotating fields illustrated in Fig. 4~Fig. 7, alternatively, it is also possible to possess as illustrated in Fig. 6~Fig. 7 two layers with On conductive layer 20 and/or adhesive phase 30.In addition, the electrically conducting transparent thin plate 10 of present embodiment can also be only by conductive layer 20 Formed with adhesive phase 30, it is still, generally especially excellent from the viewpoint of in terms of usability of electrically conducting transparent thin plate 10 etc. is practical Choosing possesses more than one layer of matrix material 40.
As matrix material 40, can enumerate：It is used to form conductive layer 20 or adhesive when manufacturing electrically conducting transparent thin plate 10 The supporter of layer 30 or it is applied to be formed the solution of protective layer by applying or pastes protection board etc. the protective layer that is formed Deng.In addition, when matrix material 40 is positioned at the part of the outermost surfaces of electrically conducting transparent thin plate 10, in other words, work as matrix When material 40 is the matrix material 40 in Fig. 4, matrix material 40A, 40B in Fig. 5~7, matrix material 40 and adhesive phase 30 or the face of the contact side of conductive layer 20 can also have release property.In this case, in assembling touch-panel device or touch During panel module, the state that there is the matrix material 40 of release property to peel off on surface is used into electrically conducting transparent thin plate 10.In addition, When assembling touch-panel device or touch panel module, the matrix material 40 being stripped can be transparent part, can also It is opaque part, in other situations in addition, matrix material 40 utilizes transparent part.
In addition, touched being assembled using the electrically conducting transparent thin plate 10A with the conductive layer 20A in pattern form shown in Fig. 1 When face equipment or touch panel module, two conductive layers 20A is combined and used.In this case, make the second layer Conductive layer 20A is rotated by 90 ° in the xy plane relative to first layer conductive layer 20A, and will form second layer conductive layer 20A's Four conductive region 100As of each conductive region 100A configurations in by first layer conductive layer 20A surround generally square non- In conductive region 130.In addition, using the electrically conducting transparent thin plate 10B groups with the conductive layer 20B in pattern form shown in Fig. 2 When filling touch-panel device or touch panel module, also two conductive layers 20B is combined and used.In this case, Second layer conductive layer 20B is configured to：It is rotated by 90 ° in the xy plane relative to first layer conductive layer 20B.
Therefore, the electrically conducting transparent thin plate 10C assembling touch-panel devices or touch surface template die shown in two Fig. 4 are being used During block, as long as the conductive layer 20 for making first electrically conducting transparent thin plate 10C conductive layer 20 and second electrically conducting transparent thin plate 10C is in Above-mentioned configuration relation.This is also same in the electrically conducting transparent thin plate 10D shown in Fig. 5.In addition, using shown in Fig. 6 Electrically conducting transparent thin plate 10E assembling touch-panel devices or during touch panel module, as long as making the first conductive layer 20C and second Conductive layer 20D is in above-mentioned configuration relation.This is also same in the electrically conducting transparent thin plate 10F shown in Fig. 7.
As long as the touch-panel device of present embodiment possesses image display device and is arranged at the figure of image display device As the conductive layer and adhesive phase of display surface side, and the conductive layer uses metal material as conductive material, the bonding Oxidant layer and the conductive layers make contact, then its composition is just not particularly limited, as long as in addition, the touch panel module of present embodiment possesses The conductive layer of metal material and the adhesive phase with the conductive layers make contact are used as conductive material, it is formed just without spy Do not limit.But in touch-panel device and touch panel module, using identical with the electrically conducting transparent thin plate of present embodiment Conductive layer and adhesive phase.
Fig. 8 is the diagrammatic cross-section of one of the touch-panel device for representing present embodiment, specifically represents to make The diagrammatic cross-section of one of touch-panel device made of the electrically conducting transparent thin plate 10F shown in Fig. 7.In touching shown in Fig. 8 Touch in face equipment 200, in the side of picture display face 212 of image display device 210, via the first fixation with adhesive layer 220 and It is pasted with electrically conducting transparent thin plate 10F.And then electrically conducting transparent thin plate 10F, opposite with being configured with the side of image display device 210 Side, be pasted with protective clear layer 240 via the second fixation adhesive layer 230.
Here, image display device can utilize liquid crystal display device, organic electroluminescence display device and method of manufacturing same, plasma to show Image display device known to device etc..In addition, as protective clear layer 240, can include：Glass substrate, makrolon Soft resin layer of the rigid plastic substrate, surface of substrate etc. Jing Guo cure process, sapphire substrate etc..Fixation adhesive layer 220th, 230 the high adhesive of the transmissivity relative to visible region wavelength can be used suitably with known adhesive.
In addition, the touch panel module as present embodiment, can be enumerated：Can be by being bonded or being fixed on touch The part of touch-panel device is substantially assembled on the picture display face of image display device in face equipment.In addition, Touch panel module can also be included further：The institutes such as the printed circuit board (PCB) being connected with conductive layer 20 illustrated in Fig. 1~Fig. 7 The sensor portion of composition or connect extraction wire of the sensor portion and conductive layer 20 etc..For example, in the touch shown in Fig. 8 In face equipment 200, comprising by electrically conducting transparent thin plate 10F, the second fixation adhesive layer 230, protective clear layer 240 in this order The part for the layered product for being laminated and being formed is equivalent to touch panel module 300.In the touch panel of manufacture present embodiment During device, the electrically conducting transparent thin plate of present embodiment, the shape successively on the picture display face of image display device can also be used Into the layer to be played a role as touch panel.But in modular member, the i.e. present embodiment as described above of being prepared in advance Touch panel module in the case of, actually only by by the touch panel module be arranged on image display device image show Show that this simple operations can manufacture touch-panel device on face.
The touch-panel device of present embodiment be especially preferably the touch-panel device of electrostatic capacitive but it is also possible to be The touch-panel device of other modes.In addition, the touch-panel device of present embodiment, shows from images such as such as smart mobile phones The catercorner length (screen size) in face is a few inches or so of the small screen, to tens of inch or more than 100 inches It may be by the screen of all sizes of giant-screen.The purposes of the touch-panel device of present embodiment has no special limit System, for example, it is of course possible to be used in screen size be the smart mobile phones of a few inches to twenties inch, portable phone, Notebook computer, computer, which are used, shows the aobvious of monitor, tablet terminal, ticket machine, ATM, various business appliances or industrial equipment Show in monitor etc., the home-use or business that screen size is twenties inches~100 inch can also be used in In business television set, so can also enumerate screen size be more than twenties inches electronic bill-board (digital signage), draw The requirements such as the business appliance with image display device such as display board, Desktop Conferencing System or blank, recreation facility are led to show Bigger purposes of screen etc..
But the touch-panel device of present embodiment is less than ITO metal material using conductive material using resistance Conductive layer realize the function as touch panel, rather than conductive material uses the metal oxide as ITO Conductive layer, thus be applicable to require in purposes that display screen is larger.From such a viewpoint, present embodiment is transparent The catercorner length of conductive plate, touch panel module and touch-panel device is preferably more than 8 inches, more preferably in 12 English More than very little, and then preferably more than 15 inches.Moreover, the upper limit of catercorner length is not particularly limited, still, from usability etc. From the viewpoint of practical aspect, preferably below 500 inches, more preferably below 300 inches.
In addition, the situation for including moisture absorber in the adhesive phase of touch-panel device of present embodiment is formed Under, hydrone is absorbed by moisture absorber, so as to which the absorbability of moisture absorber present in system gradually reduces.But It is, in the state of the power on of image display device, because picture display face can more or less produce heat, therefore, The heat of picture display face side can be utilized and recover the absorbability of moisture absorber.In addition, wanting further have mesh Property make moisture absorber recover absorbability in the case of, the touch-panel device of present embodiment can also possess to leading Electric layer is powered and the function of electrified regulation is carried out to conductive layer and its surrounding.
【Embodiment】
Hereinafter, enumerate embodiment the present invention will be described, but the present invention is not limited to these embodiments.
(manufacture with the supporter of conductive layer)
1. the manufacture of the supporter with conducting film
As the solution for being dispersed with metal nanometer line, prepare the nano silver wire (Silver containing 0.625wt% Nanowires B Research Grade Japan EM Co., Ltd.) ethanol solution and contain 0.625wt% copper nano-wire (Copper Nanowires Al Research GradeJapanese EM Co., Ltd.) ethanol solution.Then, it is using slit-type squash type coating machine, the various ethanol comprising metal nanometer line are molten Liquid is coated in the first supporter (high transparency PET that thickness is 188 μm and one side is hardened in the way of wet-film thickness is 20 μm Film (HF1C22-188)) hardened face on, and be dried, then with 2000kN/m2Pressure carry out pressurized treatments, so as to Form uniform conducting film.Thus, supporter with the conducting film being made up of nano silver wire is obtained and with by copper nano-wire The supporter of the conducting film of composition.
2. the manufacture of the supporter with thermal adhesive layer
In addition, prepare CRISVON NT-810-45 (production of DIC companies, polyurethane resin, 45% solution) 100 mass Part is dissolved in the thermal adhesive solution formed in the mass parts of methyl ethyl ketone 62.5, the mass parts of toluene 62.5.Then, it is sharp The thermal adhesive solution is printed on into surface with woodburytype has the second supporter of release property (thickness is 23 μm The PET film Teijin Tetron film G2 of production (Di Ren DuPont Films company)) on and form pattern, and do film It is dry, so as to form the thermal adhesive layer that thickness is 0.5 μm~0.8 μm or so.In addition, the heat of pattern is formed by printing The pattern form of sensitive binder layer is to make pattern form (the negative pattern shape after the pattern form upset shown in Fig. 2 (negative pattern shape)).Here, figure of the negative pattern shape as conductive layer 20B shown in the Fig. 2 ultimately formed Case shape, following two kinds of pattern forms are prepared, i.e.,：Between conductive region 100B line width and two neighboring conductive region 100B Interval (gap length G2) in (line width, interval)=(10 μm, 190 μm) pattern form and in (line width, interval)=(20 μ M, 180 μm) pattern form.
3. the manufacture of the supporter with conductive layer
Then, the thermal sensitivity for making the first supporter with conducting film and being formed negative pattern shape with pattern is glued Second supporter of mixture layer, with the conducting film state relative to each other and overlapping with thermal adhesive layer, from composition laminating machine A pair of relative configuration disk rollers (metal heating roller and heat-proof silica gel roller) between pass through and carry out heating pressurization so that tool The supporter and the supporter with thermal adhesive layer for having conducting film bond.In addition, lamination now is：Metal system The temperature of heating roller is 110 DEG C, roller nip pressure (roll nip pressure) (line pressure) is 30kN/m, between a pair of disk rollers By and the transporting velocities of overlapping two supporters be 5m/ minutes.Then, in the temperature of the layered product as obtained from bonding When being reduced to room temperature, the second supporter is peeled off from layered product, so as to obtain on the first supporter formed with Fig. 2 institutes Show the supporter with conductive layer of the conducting film (conductive layer 20B) of pattern form.
In addition, the conductive layer using the supporter (the first supporter) with conductive layer obtained by micro- sem observation.Its As a result, all with the supporter of conductive layer, conductive layer is undamaged in the stripping process for peeling off the second supporter, In addition, the conducting film in the region contacted with thermal adhesive layer is all transferred to the second support side, and do not remain in First support side.In addition, in order to quantitative judge the bad products caused by stripping process, and to resulting each tool The resistance value and light transmittance for having the supporter of conductive layer are measured, and only select the value of resistance value and light transmittance to exist respectively The supporter with conductive layer within average value ± 10%, and it is used in the transparent of each embodiment described later and comparative example In the manufacture of conductive plate.
(synthesis of adhesive phase polymer)
For using monomer as shown below in the synthesis for the polymer for manufacturing adhesive phase.
<Hydrophilic acrylic's monomer>
2HEA：Acrylic acid 2- hydroxyl ethyl esters
2HEMA：HEMA
4HBA：Acrylic acid 4- hydroxy butyl esters
AM：Acrylamide
MEA：Methoxyethyl acrylate
ECA：Ethioxy binaryglycol ester
<Other monomers>
BA：N-butyl acrylate
2EHA：2-EHA
<Polymer A1 synthesis>
In the reaction unit for possessing mixer, reflux cooler, thermometer and nitrogen ingress pipe, load 2HEA：20 Mass parts, AM：1 mass parts, BA：69 mass parts, 2EHA：10 mass parts and the ethyl acetate as solvent, and importing nitrogen Elevated the temperature while gas to 70 DEG C.Then, thermal polymerization (2,2 '-idol of 0.1 mass parts is added while stirring Nitrogen bis-isobutyronitrile, trade name：AIBN, Wako Pure Chemical Industries, Ltd.'s production), and it is reacted 10 hours, so as to obtain third Olefin(e) acid analog copolymer (polymer A1).The component of monomer used in polymer A1 synthesis is as shown in table 1.
<Polymer A2~A30, B1~B22, C1 synthesis>
In addition to the content that the component for the monomer of synthetic polymer is changed to shown in table 1, with polymer A1's Synthesis example is similarly synthesized.The component of monomer used in the synthesis of these polymer is as shown in table 1.
【Table 1】
(manufacture of electrically conducting transparent thin plate)
<Embodiment 1>
Relative to polymer A1：100 mass parts, add the toluene diisocyanate of the trimethylolpropane addition of 0.3 mass parts Acid esters (Coronate L：Nippon Polyurethane Industry Co., Ltd. produces) as 1 mass of isocyanates crosslinking agent and addition The synthetic zeolite (silica alumina ratio=18) of part is used as migration inhibitor, and is defoamed while mixing, so as to obtain containing poly- Compound A1 masking liquid.Then, this is contained to polymer A1 masking liquid, coated in branch in the way of dried thickness is 50 μm On support body (thickness is 100 μm polyethylene terephthalate (PET) film) and it is dried, and pastes applicator surface by reality The PET film (thickness is 25 μm) of lift-off processing is applied, so as to which the supporter with adhesive phase be made.
Then, there will be the pattern form in (line width, interval)=(10 μm, 190 μm) and be formed using nano silver wire The supporter of conductive layer, with by be carried out lift-off processing PET film peel off after the supporter with adhesive phase, with have There is the conductive layer forming face of the supporter of the conductive layer side relative with the adhesive phase forming face of the supporter with adhesive phase Formula is bonded.In addition, implement to bond using identical laminating machine during the supporter with manufacturing with conductive layer, lamination now Condition is：Normal temperature, roller nip pressure (line pressure) be 30kN/m, between a pair of disk rollers by and overlapping two supporters conveying Speed is 5m/ minutes.Then, obtained layered product is stood seven days under conditions of 23 DEG C of temperature, humidity 65%, so as to obtain With Rotating fields (the first matrix material 40A (the 3rd supporter)/adhesive phase shown in the pattern form and Fig. 5 shown in Fig. 2 30/ the second matrix materials of conductive layer 20B/ 40B (the first supporter)) electrically conducting transparent thin plate.
<2~embodiment of embodiment 30,1~comparative example of comparative example 22>
Except the pattern form of adhesive component and conductive layer for forming adhesive phase is changed in table 2 and table 3 Outside shown content, electrically conducting transparent thin plate is obtained similarly to Example 1.
<Reference example 1>
The ito film that thickness is 200nm is formed on the surface of alkali-free glass substrate by sputtering method.Then, in the ito film After upper formation etchant resist, using with make pattern form shown in Fig. 2 overturn after shape photomask etchant resist is exposed, Development, so as to form pattern on etchant resist.Then, using etchant (etchant) for being formed formed with being carried out pattern The etchant resist of processing and it is etched with the glass substrate of ito film, then, is removed using corrosion inhibitor stripper residual in ito film The etchant resist stayed.Thus, obtain with the pattern form (line width shown in Fig. 2：20 μm, interval：180 μm) and by ito film structure Into conductive layer glass substrate.
Then, the supporter with conductive layer in embodiment 1 is substituted, and have what is be made up of ito film using above-mentioned After the glass substrate of conductive layer is bonded so as to form layered product, using disk roller from one provided with the supporter with adhesive The layered product is pressurizeed side.Then, the layered product is stood seven days under conditions of 23 DEG C of temperature, humidity 65%, so as to Obtain having Rotating fields (the first matrix material 40A (the 3rd supporter)/adhesive shown in the pattern form and Fig. 5 shown in Fig. 2 Layer 30/ conductive layer 20B/ the second matrix material 40B (alkali-free glass substrate)) electrically conducting transparent thin plate.
(evaluation)
Found after visually observing the outward appearance of the electrically conducting transparent thin plate of each embodiment, comparative example and reference example, it is all transparent The entire surface of conductive plate is transparent.In addition, for the electrically conducting transparent thin plate of each embodiment, comparative example and reference example, for Migration, resistance change rate and stripper-resistance are evaluated, and also measure the polymer for forming adhesive phase Weight average molecular weight Mw.Details is as follows.
<Weight average molecular weight Mw measurement>
In addition, the weight average molecular weight Mw of each polymer shown in table 1 is carried out using gel permeation chromatography (GPC) Measurement, and obtained as the weight average molecular weight Mw to be converted with polystyrene standard.Measuring condition is as follows.
- condition determination-
Device：HLC-8120 (production of TOSOH Co., Ltd.)
Chromatographic column：G7000HXL (production of TOSOH Co., Ltd.)
GMHXL (production of TOSOH Co., Ltd.)
G2500HXL (production of TOSOH Co., Ltd.)
Sample concentration：1.5mg/mL (is diluted) using tetrahydrofuran
Mobile phase solvent：Tetrahydrofuran
Flow velocity：1.0mL/min
Chromatogram column temperature：40℃
<Migration>
By the electrically conducting transparent thin plate of each embodiment, comparative example and reference example, with to the conductive layer 20B's in pie graph 2 The both ends of each strip-shaped conductive region row 110B (conductive region 100B) apply the state of 3.3V voltages, in hot and humid environment 500 hours are stood under (85 DEG C of temperature, humidity 85%).Then, using SEM observation under hot and humid environment The conductive layer and its neighbouring position of the electrically conducting transparent thin plate of energization, evaluated for whetheing there is generation migration and its degree.In addition, The evaluation criterion of result is as follows shown in table 2,3.
○：Do not observe migration completely.
△：It was observed that a little migration.
×：It was observed that obvious migration.
<The evaluation of resistance change rate>
In order to which the change of the resistance value caused by the migration of the metal material to forming conductive layer is evaluated, for each reality The electrically conducting transparent thin plate of example, comparative example and reference example is applied, a conductive region of the side of Y-direction one in Fig. 2 is arranged 110B (conductive region 100B) both ends are connected on measuring instrument, measure line resistance (k Ω).
Here, hindered on line, for the resistance value Ri of the original state after electrically conducting transparent thin plate is made and by resistance value Ri The electricity of electrically conducting transparent thin plate after being measured after (85 DEG C of temperature, humidity 85%) is placed 500 hours under hot and humid environment Resistance Rw is measured.Then, resistance when electrically conducting transparent thin plate to be positioned over to hot and humid environment is obtained by following formula (1) Value changes rate RCw (%).As a result as Table 2,3.
Formula (1) RCw=100 × (Rw-Ri)/Ri
In addition, the evaluation criterion of result is as follows shown in table 2,3.
○：RC is below 2% for resistance change rate.
△：Resistance change rate RC is more than 2% and less than or equal to 5%.
×：Resistance change rate RC is more than 5%.
<The evaluation of stripper-resistance>
By the support with adhesive phase of the electrically conducting transparent thin plate for manufacturing each embodiment, comparative example and reference example Type is cut into 5cm × 6cm test piece, and the test piece is pasted onto on the surface of glass substrate, then makes the disk roller that weight is 2kg Roll around and crimped three times.After crimping, placed 500 hours under hot and humid environment (85 DEG C of temperature, humidity 85%) Afterwards, growing dim (floating), peeling off for test piece is visually observed.As a result as Table 2,3.
In addition, the evaluation criterion of result is as follows shown in table 2,3.
○：Do not observe completely and grow dim, peel off.
△：It was observed that grow dim, peel off a little.
×：It was observed that grow dim, peel off.
【Table 2】
【Table 3】

Claims (4)

1. a kind of electrically conducting transparent thin plate, it is characterised in that at least possess：
Used as conductive material metal material conductive layer and
With the adhesive phase of the conductive layers make contact,
Described adhesive layer includes：Acrylic copolymer as comonomer components containing hydrophilic acrylic's monomer Thing and at least one migration inhibitor selected from the group of moisture absorber and metal ion capturing agent composition, wherein, it is described Hydrophilic acrylic's monomer contains at least one parent selected in the group formed from hydroxyl, alkoxy, amino and amide groups It is water base,
The mixed proportion of hydrophilic acrylic's monomer in the comonomer components of the acrylic copolymer is institute State more than the 15wt% of the gross weight of acrylic copolymer.
2. electrically conducting transparent thin plate as claimed in claim 1, it is characterised in that
The hydrone absorbent is at least used as the migration inhibitor.
3. a kind of touch panel module, it is characterised in that at least possess：
Used as conductive material metal material conductive layer and
With the adhesive phase of the conductive layers make contact,
Described adhesive layer includes：Acrylic copolymer as comonomer components containing hydrophilic acrylic's monomer Thing and at least one migration inhibitor selected from the group of moisture absorber and metal ion capturing agent composition, wherein, it is described Hydrophilic acrylic's monomer contains at least one parent selected in the group formed from hydroxyl, alkoxy, amino and amide groups It is water base,
The mixed proportion of hydrophilic acrylic's monomer in the comonomer components of the acrylic copolymer is institute State more than the 15wt% of the gross weight of acrylic copolymer.
4. a kind of touch-panel device, it is characterised in that at least possess：
Image display device；With
The conductive layer and adhesive phase of the picture display face side of described image display device are arranged at, wherein, the conductive layer makes By the use of metal material as conductive material, described adhesive layer and the conductive layers make contact,
Described adhesive layer includes：Acrylic copolymer as comonomer components containing hydrophilic acrylic's monomer Thing and at least one migration inhibitor selected from the group of moisture absorber and metal ion capturing agent composition, wherein, it is described Hydrophilic acrylic's monomer contains at least one parent selected in the group formed from hydroxyl, alkoxy, amino and amide groups It is water base,
The mixed proportion of hydrophilic acrylic's monomer in the comonomer components of the acrylic copolymer is institute State more than the 15wt% of the gross weight of acrylic copolymer.
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