CN107396530B - Printed circuit board and semiconductor packaging structure - Google Patents
Printed circuit board and semiconductor packaging structure Download PDFInfo
- Publication number
- CN107396530B CN107396530B CN201710569198.9A CN201710569198A CN107396530B CN 107396530 B CN107396530 B CN 107396530B CN 201710569198 A CN201710569198 A CN 201710569198A CN 107396530 B CN107396530 B CN 107396530B
- Authority
- CN
- China
- Prior art keywords
- hole
- cell columns
- weld pad
- pad
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000003990 capacitor Substances 0.000 claims abstract description 216
- 238000003491 array Methods 0.000 claims description 22
- 230000005611 electricity Effects 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 29
- 230000008859 change Effects 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- -1 acryl Chemical group 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a printed circuit board and a semiconductor packaging structure. The printed circuit board includes a board body and a via array. The via array includes via unit columns periodically arranged in a first direction. The through hole unit column comprises a first through hole group, a second through hole group and a third through hole group which are sequentially arranged along a first direction. The first through hole group to the third through hole group respectively comprise a first through hole, a second through hole, a third through hole and a fourth through hole which are arranged in a row, penetrate through the plate body and are used for being electrically connected with the capacitor. The first via and the second via are used for transmitting a power (power) signal, and the third via and the fourth via are used for transmitting a Ground (GND) signal.
Description
Technical field
The present invention relates to a kind of printed circuit board and semiconductor packages, more particularly to preferable Power Integrity
The printed circuit board and semiconductor package of (power integrity, PI).
Background technique
At present in semiconductor packaging, constantly promoted for the working frequency and power consumption in response to IC chip, with
And the demands such as multi-chip integration encapsulation and multi input/output (I/O) end chip, the working frequency and wiring density of printed circuit board
It must increase accordingly.However, maintaining good Power Integrity (power in the application of high-speed and high-density printed circuit board
Integrity, PI) it is also more and more important.
Therefore, in this technical field, the printed circuit board and semiconductor package of a kind of Improvement type are needed.
Summary of the invention
One embodiment of the invention provides a kind of printed circuit board.Above-mentioned printed circuit board includes a plate body, is had each other
An opposite first surface and a second surface, wherein above-mentioned first surface is to engage a circuit base plate, above-mentioned second surface
To connect one capacitor；One through-hole array, including the multiple through-hole cell columns being periodically arranged along a first direction, wherein above-mentioned
A little through-hole cell columns respectively include be set in sequence along above-mentioned first direction one first group of group of holes, one second group of group of holes and one
Third group group of holes, wherein above-mentioned first group of group of holes to above-mentioned third group group of holes is respectively included being set as a column and be passed through upper
Plate body and the first through hole to be electrically connected above-mentioned capacitor, one second through-hole, a third through-hole and a fourth hole are stated, wherein
Above-mentioned first through hole and above-mentioned second through-hole are for transmitting power supply (power) signal, above-mentioned third through-hole and above-mentioned fourth hole
(GND) signal is grounded for transmitting.
Another embodiment of the present invention provides a kind of semiconductor package.Above-mentioned semiconductor package includes a printing
Circuit board, above-mentioned printed circuit board include a plate body, have a first surface and a second surface relative to each other；One through-hole battle array
Column, including the multiple through-hole cell columns being periodically arranged along a first direction, wherein more above-mentioned through-hole cell columns respectively include edge
One first group of group of holes, one second group of group of holes and the third group group of holes that above-mentioned first direction is set in sequence, wherein above-mentioned
First group of group of holes to above-mentioned third group group of holes is respectively included across above-mentioned plate body and 1 to be electrically connected above-mentioned capacitor
One through-hole, one second through-hole, a third through-hole and a fourth hole, wherein above-mentioned first through hole and above-mentioned second through-hole are for passing
Power supply (power) signal, above-mentioned third through-hole and above-mentioned fourth hole are passed for transmitting ground connection (GND) signal；One packaging body, connects
It is bonded to the above-mentioned first surface of above-mentioned printed circuit board；One first capacitor is bonded to above-mentioned second table of above-mentioned printed circuit board
Face, wherein the first electrode contact of above-mentioned first capacitor and be electrically connected to more above-mentioned through-hole cell columns one of them is above-mentioned logical
The above-mentioned first through hole of the above-mentioned first through hole group of hole cell columns and above-mentioned second through-hole, wherein the one second of above-mentioned first capacitor
Electrode contacts and is electrically connected to the above-mentioned first through hole group's of one of them above-mentioned through-hole cell columns of more above-mentioned through-hole cell columns
Above-mentioned second through-hole and above-mentioned third through-hole.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the semiconductor encapsulating structure of some embodiments of the invention；
Fig. 2~Fig. 5 is the vertical view signal of a printed circuit board of the semiconductor encapsulating structure of some embodiments of the invention
Figure.
Symbol description
600~semiconductor package；
500,500a~500d~printed circuit board；
200~plate body；
201~first surface；
203~second surface；
204~weld pad；
204A1、204A2、204A3、204A4、204B1、204B2、204B3、204B4、204C1、204C2、204C3、
204C4,204D1,204D2,204D3,204D4~pad unit column；
204P-1,204G-1,204P-2,204G-2,204P-3,204G-3~weld pad；
205A, 205B, 205C, 205D~pad arrays；
208,208P-1,208G-1,208P-2,208G-2,208P-3,208G-3~conductive plane layer pattern；
210~through-hole；
210A1、210A2、210A3、210A4、210B1、210B2、210B3、210B4、210C1、210C2、210C3、
210C4,210D1,210D2,210D3,210D4~through-hole cell columns；
210P-1,210G-1,210P-2,210G-2,210P-3,210G-3~through-hole；
211A, 211B, 211C, 211D~through-hole array；
212~weld pad；
212G~ground pad；
212P~power supply weld pad；
214,216~soldermask layer；
222~capacitor；
222A-1,222A-2,222B, 222C, 222D-1,222D-2~capacitor；
224,224-1,224-2~first electrode；
226,226-1,226-2~second electrode；
300~first direction；
302~second direction；
400~packaging body；
401~chip side surface；
402~circuit base plate；
403~soldered ball side surface；
404~chip side weld pad；
406~chip；
408~conductive plane layer pattern；
410~via hole plug；
418~solder bump；
420~soldered ball；
430~molding material；
D~spacing；
L~length；
W~width；
S, S1, S2~distance.
Specific embodiment
In order to which the purpose of the present invention, feature and advantage can be clearer and more comprehensible, special embodiment below, and appended by cooperation
Attached drawing, be described in detail.Description of the invention provides different embodiments to illustrate the skill of different embodiments of the present invention
Art feature.Wherein, the configuration of each element in embodiment is not intended to limit the invention for purposes of discussion.And in embodiment
The part of drawing reference numeral repeats, and is the relevance being not meant as between different embodiments to simplify the explanation.
The embodiment of the present invention provides a kind of semiconductor package, a for example, ball grid array package structure (ball grid
Array package structure, BGA package structure).The printed circuit board of above-mentioned semiconductor package
With the power supply weld pad and ground pad for being electrically connected to spherical grid array package body, and corresponding power vias and grounding through hole.
Also, the printed circuit board of above-mentioned semiconductor package is the configuration mode using power vias and grounding through hole, so as to connect
Together in the soldered ball side surface of printed circuit board capacitor (such as decoupling capacitance) arrangement more closely, it is close capacitor can be promoted
Degree, and the impedance (impedance) of power path is effectively reduced.Therefore, the printed circuit board of the embodiment of the present invention has preferable
Power Integrity (power integrity, PI).
Fig. 1 is the diagrammatic cross-section of the semiconductor encapsulating structure 600 of some embodiments of the invention.Fig. 2~Fig. 5 is Fig. 1
Shown in semiconductor package printed circuit board 500a~500d part substrate side surface schematic top plan view, display
Be configured at the substrate side surface of printed circuit board and to packaging body 400 be electrically connected weld pad, pass through printed circuit board and with it is corresponding
The through-hole (via) of weld pad electrical connection, the capacitor for being configured at the soldered ball side surface of printed circuit board and being electrically connected with respective through hole
Positional relationship.Fig. 2~Fig. 5 be additionally show the capacitor 222A-1,222A-2 being engaged on the soldered ball side surface of printed circuit board,
222B, 222C, 222D-1~222D-4, to illustrate that the connection of power vias and grounding through hole and capacitor of printed circuit board is closed
System.For the sake of for convenience of explanation, the soldermask layer on the soldered ball side surface of printed circuit board is not shown in the 2nd~5 figure.Separately
Outside, the printed circuit board of the embodiment of the present invention and circuit base plate thereon and chip can collectively form semiconductor encapsulating structure,
A for example, ball grid array package structure (ball grid array package structure, BGA package
structure)。
As shown in Figure 1, the semiconductor package 600 of the embodiment of the present invention includes a printed circuit board 500 and is set to
A packaging body 400 and a capacitor 222 above the apparent surface of printed circuit board 500.In some embodiment of the invention, it prints
Circuit board 500 includes a plate body 200, weld pad 204, through-hole 210, weld pad 212 and soldered ball 220.Plate body 200 has relative to each other
One first surface 201 and a second surface 203.In some embodiment of the invention, the first surface 201 of plate body 200 can be considered
One substrate side surface, and second surface 203 can be considered a soldered ball side surface.In some embodiment of the invention, the material of plate body 200
Matter includes paper phenolic resin (paper phenolic resin), composite epoxy resin (composite epoxy), poly- sub- acyl
Polyimide resin (polyimide resin) or glass fibre (glass fiber).
As shown in Figure 1, the through-hole 210 of printed circuit board 500 passes through plate body 200, and two ends of through-hole 210 can be right respectively
Together in the first surface 201 of plate body 200 and second surface 203.In addition, the corresponding weld pad close to first surface 201 of through-hole 210
204 and close to second surface 203 weld pad 212 configure.Therefore, weld pad 204 is electrically connected to corresponding weld pad by through-hole 210
212.In some embodiment of the invention, the through-hole 210 of printed circuit board 500 is to be used for transmission ground connection (GND) or power supply
(power) signal, i.e., it is non-to be used for transmission signal (signal) signal.For convenience of explanation, printed circuit board 500 is used for transmission
The through-hole and weld pad of signal (signal) signal are not shown herein.In some embodiment of the invention, the material of through-hole 210 can
For copper or copper alloy or conductive metal, and using laser drill (laser drilling) manufacture craft and electroplating manufacturing process
Form through-hole 210.
As shown in Figure 1, the weld pad 204 of printed circuit board 500 is set on the first surface 201 of plate body 200 and is electrically connected
To packaging body 400.Therefore, weld pad 204 also can be considered substrate-side weld pad.The weld pad 212 of printed circuit board 500 is set to plate body
On 200 second surface 203 and it is electrically connected to corresponding soldered ball 220.Therefore, weld pad 212 also can be considered soldered ball side weld pad.At this
It invents in some embodiments, weld pad 204 is electric by the conductive plane layer pattern 208 being set on the first surface 201 of plate body 200
It is connected to corresponding through-hole 210.It is other that weld pad 204 and conductive plane layer pattern 208 belong to same conductor layer.As shown in Figure 1
In embodiment, the weld pad 204 and weld pad 212 of printed circuit board 500 are used for transmission ground signalling or power supply signal, but non-signal
Signal.In some embodiment of the invention, the material of weld pad 204 and weld pad 212 can be copper or copper alloy.Using plating, pressure
The manufacture crafts such as conjunction and coating, respectively on first surface (substrate side surface) 201 and second surface (soldered ball side surface) 203
Comprehensive one conductive layer of formation.Then, recycle includes covering photoresist, development (developing), etching
(etching) and an image transfer manufacture craft of striping (striping) step is on first surface (substrate side surface) 201
Weld pad 204 is formed, and in formation weld pad 212 on second surface (soldered ball side surface) 203.And it is same during forming weld pad 204
When formed conductive plane layer pattern 208.
As shown in Figure 1, the printed circuit board 500 of semiconductor package 600 further includes being located at first surface (substrate-side table
Face) soldermask layer 214 on 201 and the soldermask layer 216 that is located on second surface (soldered ball side surface) 203.Positioned at first surface 201
On 214 covering part conductive plane layer pattern 208 of soldermask layer, and it can have one or more openings, above-mentioned opening exposure
Part or all of weld pad 204 out, and can be separated by a distance with weld pad 204, thus the conductive plane layer pattern 208 under it can be protected
It is not oxidized.Soldermask layer 216 on second surface (soldered ball side surface) 203 can have one or more openings, above-mentioned to open
Mouthful expose weld pad 212, and can be separated by a distance with weld pad 212, to avoid be set to can on neighbouring its of 220 misconnection of soldered ball
His conducting wire or soldered ball and be electrically short-circuited to each other.Also, the above-mentioned opening of soldermask layer 216 can provide the forming position of subsequent solder bump.
In some embodiment of the invention, soldermask layer 214,216 may include the anti-welding material of for example green paint, or can be includes polyimide
(polyimide), ABF film (ajinomoto build-up film), epoxy resin or acryl resin or the former two's is compound
The insulating materials of object or polypropylene (polypropylene, PP).Using coating, print, paste, press etc. modes formed it is anti-
Layer 214,216.
As shown in Figure 1, the packaging body 400 of semiconductor package 600 is set to the plate body 200 of printed circuit board 500
On first surface, and it is electrically connected with the weld pad of printed circuit board 500 204.In the present embodiment, above-mentioned packaging body 400 is a ball
Grid array package body (ball grid array package, BGA package).In some embodiment of the invention, packaging body
400 include circuit base plate 402 and chip 406.Circuit base plate 402 has a chip side surface 401 and a scolding tin relative to each other
Convex block side surface 403.As shown in Figure 1, chip 406 is set to the chip side surface 401 of circuit base plate 402 and passes through solder bump
418 are electrically connected to the chip side weld pad 404 of circuit base plate 402.In embodiments of the present invention, chip 406 can be by close to chip
The chip side weld pad 404 of side surface 401, conductive plane layer pattern 408, across circuit base plate 402 via hole plug 410 and connect
The weld pad 412 of nearly soldered ball block side surface 403 is electrically connected to the soldered ball 420 for being set to soldered ball side surface 403.Also, 420 electricity of soldered ball
It is connected to the weld pad 204 of corresponding printed circuit board 500.
In the embodiment shown in fig. 1, the chip side weld pad 404 of circuit base plate 402, conductive plane layer pattern 408, lead
Via plug 410 and weld pad 412 are used for transmission/are grounded (GND) or power supply (power) signal, i.e., non-to be used for transmission signal
(signal) signal.For convenience of explanation, the conductive plane layers figure for being used for transmission signal (signal) signal of circuit base plate 402
Case, via hole plug and weld pad are not shown herein.
As shown in Figure 1, molding material (an encapsulated material) 430, is set to the core of circuit base plate 402
On piece side surface 401, molding material 430 covers and surrounds chip 406.In some embodiment of the invention, molding material 430 can
It is formed by any non-conducting material, such as epoxy resin (epoxy), resin (resin), plastic type polymer (moldable
) or similar material polymer.
As shown in Figure 1, semiconductor package 600 further includes second surface (the soldered ball side for being engaged in printed circuit board 500
Surface) capacitor 222 on 203.In some embodiment of the invention, capacitor 222 can be decoupling capacitance.Decoupling capacitance can incite somebody to action
Extra electric energy is stored in capacitor, and in electric energy insufficient supply, feedback power supply system, and access capable of reducing power source
Impedance.Capacitor 222 has first electrode 224 and second electrode 226.The first electrode 224 of capacitor 222 is electrically connected to printed circuit
Power supply weld pad 212P on the second surface (soldered ball side surface) 203 of plate 500, and the second electrode 226 of capacitor 222 is electrically connected to
Ground pad 212G on the second surface (soldered ball side surface) 203 of printed circuit board 500.
Illustrate to be configured on the substrate side surface 201 of printed circuit board 200 followed by Fig. 2~Fig. 5 and with packaging body (ball
Grid array package body) 400 electrical connections weld pad 204, across printed circuit board 200 and the through-hole that is electrically connected with corresponding weld pad 204
(via) 210 the capacitor 222 for, being configured on the soldered ball side surface 203 of printed circuit board 200 and being electrically connected with respective through hole 210
Positional relationship.Fig. 2~Fig. 5 is the part first surface 201 of printed circuit board 500a~500c of some embodiments of the invention
Schematic top plan view.Soldermask layer for the sake of for convenience of explanation, on the soldered ball side surface 201 of printed circuit board 500a~500c
214 not show herein.
Fig. 2 is the schematic top plan view of the part first surface 201 of the printed circuit board 500a of some embodiments of the invention.?
In some embodiments of the invention, it is configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500a and and packaging body
The weld pad 204 that (spherical grid array package body) 400 is electrically connected is configured to a pad arrays 205A.Above-mentioned pad arrays 205A can be by edge
Multiple pad units column (pad column unit) that first direction 300 and second direction 302 are periodically arranged are formed, such as
Pad unit column 204A1,204A2,204A3,204A4 shown in Fig. 2.Signified " pad unit column " are that longitudinal direction lines up one herein
Several weld pads of column, and the weld pad of different location has designated transmitting power supply (power) signal respectively or ground connection (GND) signal
A specific configuration.In some embodiment of the invention, the pad unit column of printed circuit board 500a include along first direction 300
It is set as multiple weld pads of a column.For example, pad unit column 204A1,204A2 of pad arrays 205A as shown in Figure 2,
204A3,204A4 are made of six weld pads for being set as a column along first direction 300 respectively, and above-mentioned six weld pads are respectively along the
Weld pad 204P-1, weld pad 204G-1, weld pad 204P-2, weld pad 204G-2, weld pad 204P-3 and the weldering that one direction 300 is set in sequence
Pad 204G-3.Also, the weld pad 204P-1 of each pad unit column 204A1,204A2,204A3,204A4, weld pad 204G-1, weldering
204P-2, weld pad 204G-2, weld pad 204P-3, weld pad 204G-3 are padded each other with a spacing (pitch) D setting.In addition, being
For the sake of being clearly painted, two pad units column of the pad arrays 205A that Fig. 2 is shown to be periodically arranged along first direction 300
(being located at the upper pad unit column 204A1 and pad unit column 204A1 positioned at lower), and in a second direction
302 four pad units being periodically arranged arrange (i.e. pad unit column 204A1,204A2,204A3,204A4) to illustrate, but not
As limit, in other embodiments, it can also optionally change line number (the row quantity of the pad unit column of pad arrays 205A
(row number)) and columns (file quantity (column number)).
In some embodiment of the invention, the weld pad in each pad unit column 204A1,204A2,204A3,204A4
204P-1~204P-3 is for transmitting power supply (power) signal, and weld pad 204G-1~204G-3 is for transmitting ground connection (GND) letter
Number.Therefore, the two of them weld pad difference adjacent to each other in weld pad 204P-1~204P-3 and weld pad 204G-1~204G-3
For transmitting power supply (power) signal and ground connection (GND) signal.For example, weld pad 204P-1 and weld pad adjacent thereto
204G-1 is respectively used for transmitting power supply (power) signal and ground connection (GND) signal, and is used to transmit the weldering of ground connection (GND) signal
The opposite side of 204G-1 is padded adjacent to the weld pad 204P-1 and weld pad 204P-2 for transmitting power supply (power) signal.Above-mentioned weldering
The transmitting signal type for padding other two neighboring weld pads of cell columns can analogize according to above-mentioned relation.
In other embodiments of the present invention, weld pad in each pad unit column 204A1,204A2,204A3,204A4
The position of 204P-1~204P-3 can respectively with weld pad 204G-1~204G-3 exchange, it is only necessary to meet pad unit column 204A1,
204A2,204A3,204A4 are identical configuration, and two of them through-hole adjacent to each other is respectively used for transmitting power supply
(power) condition of signal and ground connection (GND) signal.
In some embodiment of the invention, the pad unit column of printed circuit board 500a can be along first direction 300 periodically
It repeats to be arranged.For example, setting pad unit column 204A1, weldering can be repeated cyclically along first direction 300 in same row
Pad cell columns 204A2, pad unit column 204A3 or pad unit column 204A4.In some embodiment of the invention, along first party
It is located in different pad units column to 300 and weld pad adjacent to each other is arranged with space D.For example, pad unit column 204A1
Weld pad 204G-3 and another pad unit column 204A1 (lower in figure of (upper pad unit column 204A1 in figure)
Pad unit column 204A1) weld pad 204P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, positioned at along the adjacent different pad units column of first direction 300 and phase each other
Adjacent weld pad is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in Fig. 2, being located at figure
In upper pad unit column 204A1 weld pad 204G-3 for transmitting ground connection (GND) signal, lower is another in figure
The weld pad 204P-1 of one pad unit column 204A1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different pad units column in and the transmitting signal types of adjacent to each other two weld pads can analogize according to above-mentioned relation.
In some embodiment of the invention, printed circuit board 500a pad unit column can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in Fig. 2, pad unit column 20,4A1 302 is arranged in a second direction adjacent to pad unit
204A2, pad unit column 204A2 are in a second direction 302 adjacent to pad unit column 204A3, and pad unit column 204A3 is along second
Direction 302 is adjacent to pad unit column 204A4.In some embodiment of the invention, in a second direction 302 be located at different weld pad lists
In member column and weld pad adjacent to each other is arranged with space D.For example, the weld pad 204P-1 and weld pad of pad unit column 204A1
The weld pad 204P-1 of cell columns 204A2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, in a second direction 302 be located at different pad units column in and weldering adjacent to each other
Pad is all for transmitting power supply (power) signal or ground connection (GND) signal.For example, as shown in Fig. 2, pad unit column 204A1
Weld pad 204P-1 in a second direction 302 adjacent to pad unit column 204A2 weld pad 204P-1, and pad unit column 204A1
Weld pad 204P-1 and the weld pad 204P-1 of pad unit column 204A2 be all used to transmit power supply (power) signal.Pad unit column
The weld pad 204G-1 of 204A1 in a second direction 302 adjacent to pad unit column 204A2 weld pad 204G-1, and pad unit arrange
The weld pad 204G-1 of the weld pad 204G-1 and pad unit column 204A2 of 204A1 are all used to transmit ground connection (GND) signal.Along second
Direction 302 is located in different pad units column and the transmitting signal type of two weld pads adjacent to each other can be according to above-mentioned relation class
It pushes away.
In some embodiment of the invention, be configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500a and
The through-hole being electrically connected with weld pad 204 is configured to a through-hole array 211A (attached drawing mark-on number).Above-mentioned through-hole array 211A can be by edge
Multiple through-hole cell columns (via column unit) formation that first direction 300 and second direction 302 are periodically arranged, such as
Through-hole cell columns 210A1,210A2,210A3,210A4 shown in Fig. 2.Signified " through-hole cell columns " are that longitudinal direction lines up one herein
Several through-holes of column, and the through-hole of different location has designated transmitting power supply (power) signal respectively or ground connection (GND) signal
A specific configuration.In some embodiment of the invention, through-hole cell columns 210A1,210A2,210A3,210A4 respectively with weld pad
Cell columns 204A1,204A2,204A3,204A4 are separated by a fixed range.In some embodiment of the invention, printed circuit board
The through-hole cell columns of 500a include multiple through-holes that a column are set as along first direction 300.For example, as shown in Figure 2 logical
Through-hole cell columns 210A1,210A2,210A3,210A4 of hole array 211A is respectively by being set as a column along first direction 300
Six through-holes are constituted, above-mentioned six through-holes be respectively the through-hole 210P-1 being set in sequence along first direction 300, through-hole 210G-1,
Through-hole 210P-2, through-hole 210G-2, through-hole 210P-3 and through-hole 210G-3.Each through-hole cell columns 210A1,210A2,210A3,
Through-hole 210P-1, through-hole 210G-1, through-hole 210P-2, through-hole 210G-2, through-hole 210P-3 and the through-hole 210G-3 of 210A4 is each other
Between with a spacing (pitch) D setting.Wherein, for the sake of being clearly painted, the through-hole array 211A that Fig. 2 is shown is along first party
(it is located at upper through-hole cell columns 210A1 and positioned at lower to two through-hole cell columns that 300 are periodically arranged
Through-hole cell columns 210A1) and 302 four through-hole cell columns (i.e. through-hole cell columns being periodically arranged in a second direction
210A1,210A2,210A3,210A4) it illustrates, but not limited to this, in other embodiments, can also optionally change through-hole
The line number (row quantity (row number)) and columns (file quantity (column of the through-hole cell columns of array 211A
number))。
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500a can be along first direction 300 periodically
It repeats to be arranged.For example, it can be repeated cyclically setting through-hole cell columns 210A1 along first direction 300 in same row, lead to
Hole cell columns 210A2, through-hole cell columns 210A3 or through-hole cell columns 210A4.In some embodiment of the invention, along first party
It is located in different through-hole cell columns to 300 and through-hole adjacent to each other is arranged with space D.For example, through-hole cell columns 210A1
Through-hole 210G-3 and another through-hole cell columns 210A1 (lower in figure of (upper through-hole cell columns 210A1 in figure)
Through-hole cell columns 210A1) through-hole 210P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500a can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in Fig. 2, through-hole cell columns 210A1 is in a second direction 302 adjacent to through-hole cell columns
210A2, through-hole cell columns 210A2 are in a second direction 302 adjacent to through-hole cell columns 210A3, and 210A3 is along second for through-hole cell columns
Direction 302 is adjacent to through-hole cell columns 210A4.In some embodiment of the invention, in a second direction 302 be located at different through-hole lists
In member column and through-hole adjacent to each other is arranged with space D.For example, the through-hole 210P-1 and through-hole of through-hole cell columns 210A1
The through-hole 210P-1 of cell columns 210A2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the weld pad of pad unit column is along first direction 300 and corresponding through-hole cell columns
Through-hole be staggered.For example, six weld pad 204P-1 of the pad unit column 204A1 that Fig. 2 is shown, weld pad 204G-1,
Weld pad 204P-2, weld pad 204G-2, weld pad 204P-3 and weld pad 204G-3 are along first direction 300 and through-hole cell columns 210A1's
Six through-hole 210P-1, through-hole 210G-1, through-hole 210P-2, through-hole 210G-2, through-hole 210P-3 and through-hole 210G-3 are staggeredly set
It sets.Also, it looks along first direction 300, first weld pad 204P-1 of pad unit column 204A1 is located at through-hole cell columns
Between the first through-hole 210P-1 and second through-hole 210G-1 of 210A1.The weld pad of other pad units column leads to corresponding
Positional relationship between the through-hole of hole cell columns can be analogized according to above-mentioned relation.
In some embodiment of the invention, the different weld pads of pad unit column are corresponding with corresponding through-hole cell columns respectively
Through-hole is separated by a fixed range along first direction 300 and in a second direction 302 respectively.For example, the pad unit that Fig. 2 is shown
The through-hole 210P-1 of the weld pad 204P-1 and through-hole cell columns 210A1 of column are respectively along first direction 300 and in a second direction 302 about
It is separated by the space D of half times.Position between the weld pad and the through-hole of corresponding through-hole cell columns of other pad units column
Relationship can be analogized according to above-mentioned relation.
As shown in Fig. 2, in some embodiment of the invention, the different weld pads of pad unit column are to pass through conductive plane respectively
Layer pattern is electrically connected to the different through-holes of corresponding through-hole cell columns, and the weld pad of pad unit column and corresponding through-hole cell columns
Through-hole be each other one-to-one connection relationship.For example, six weld pad 204P-1, the weld pads of pad unit column 204A1
204G-1, weld pad 204P-2, weld pad 204G-2, weld pad 204P-3 and weld pad 204G-3 pass through conductive plane layer pattern respectively
208P-1,208G-1,208P-2,208G-2,208P-3 and 208G-3 are electrically connected to six through-holes of through-hole cell columns 210A1
210P-1, through-hole 210G-1, through-hole 210P-2, through-hole 210G-2, through-hole 210P-3 and through-hole 210G-3.Other pad units column
Weld pad and the through-hole of corresponding through-hole cell columns between electrical connection can analogize according to above-mentioned relation.
The electrical connection between weld pad and the through-hole of corresponding through-hole cell columns arranged due to above-mentioned pad unit, because
This, in some embodiment of the invention, the through-hole 210P-1 in each through-hole cell columns 210A1,210A2,210A3,210A4
~210P-3 is for transmitting power supply (power) signal, and through-hole 210G-1~210G-3 is for transmitting ground connection (GND) signal.Therefore,
Two of them through-hole adjacent to each other in through-hole 210P-1~210P-3 and through-hole 210G-1~210G-3 is respectively used for transmitting
Power supply (power) signal and ground connection (GND) signal.For example, through-hole 210P-1 and through-hole 210G-1 adjacent thereto difference
For transmitting power supply (power) signal and ground connection (GND) signal, and be used to transmit the through-hole 210G-1 of ground connection (GND) signal
Opposite side is adjacent to the through-hole 210P-1 and through-hole 210P-2 for transmitting power supply (power) signal.Above-mentioned through-hole cell columns
The transmitting signal type of other two neighboring through-holes can analogize according to above-mentioned relation.
In some embodiment of the invention, positioned at along the adjacent different through-hole cell columns of first direction 300 and each other phase
Adjacent through-hole is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in Fig. 2, being located at figure
In upper through-hole cell columns 210A1 through-hole 210G-3 for transmitting ground connection (GND) signal, lower is another in figure
The through-hole 210P-1 of one through-hole cell columns 210A1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different through-hole cell columns in and the transmitting signal types of adjacent to each other two through-holes can analogize according to above-mentioned relation.
In some embodiment of the invention, 302 it is located in different through-hole cell columns and adjacent to each other logical in a second direction
Hole is all used to transmit power supply (power) signal or ground connection (GND) signal.For example, as shown in Fig. 2, through-hole cell columns 210A1
Through-hole 210P-1 in a second direction 302 adjacent to through-hole cell columns 210A2 through-hole 210P-1, and through-hole cell columns 210A1
Through-hole 210P-1 and the through-hole 210P-1 of through-hole cell columns 210A2 be all used to transmit power supply (power) signal.Through-hole cell columns
The through-hole 210G-1 of 210A1 in a second direction 302 adjacent to through-hole cell columns 210A2 through-hole 210G-1, and through-hole cell columns
The through-hole 210G-1 of the through-hole 210G-1 and through-hole cell columns 210A2 of 210A1 are all used to transmit ground connection (GND) signal.Along second
Direction 302 is located in different through-hole cell columns and the transmitting signal type of two through-holes adjacent to each other can be according to above-mentioned relation class
It pushes away.
Followed by Fig. 2 illustrate across each cell columns 210A1,210A2 of the through-hole of printed circuit board 500a, 210A3,
Through-hole 210P-1~the 210P-3 and through-hole 210G-1~210G-3 of 210A4 and the soldered ball side table for being bonded to printed circuit board 500a
The positional relationship of capacitor 222A-1,222A-2 for being electrically connected on face 203 and with respective through hole, i.e., each through-hole cell columns 210A1,
210A2,210A3,210A4 correspond to two capacitors 222A-1,222A-2.As shown in Fig. 2, in some embodiment of the invention, often
One through-hole cell columns 210A1,210A2,210A3,210A4 are electrically connected to two capacitors being set in sequence along first direction 300
222A-1,222A-2.Therefore, capacitor 222A-1,222A-2 can periodically be set corresponding to the line number and columns of through-hole cell columns
It sets.In addition, capacitor 222A-1,222A-2 be respectively provided with along first direction 300 a length L and in a second direction 302 it is one wide
Spend W.The length L range of capacitor 222A-1,222A-2 can be greater than or equal to the space D on substrate side surface 201 between weld pad
Twice and it is less than three times of space D.The width W range of capacitor 222A-1,222A-2 can be greater than or equal on substrate side surface 201
One times of space D between weld pad and it is less than twice of space D.For example, the size of each capacitor 222A-1,222A-2 can
The weld pad for being located at 3 (row) x2 (column) on substrate side surface 201 is completely covered.
In some embodiment of the invention, capacitor 222A-1 has first electrode 224-1 and second electrode 226-1, and electric
Holding 222A-2 has first electrode 224-2 and second electrode 226-2.In the embodiment shown in Figure 2, the first of capacitor 222A-1
Electrode 224-1 and second electrode 226-1 is covered each by and is electrically connected in through-hole cell columns 210A1 and configures along first direction 300
First through-hole 210P-1 and second through-hole 210G-1.In other words, the first electrode 224-1 electrical connection of capacitor 222A-1
To for transmitting the through-hole 210P-1 of power supply (power) signal and Chong Die with through-hole 210P-1, and the second of capacitor 222A-1 is electric
Pole 226-1 is electrically connected to for transmitting the through-hole 210G-1 of ground connection (GND) signal and Chong Die with through-hole 210G-1.Therefore, through-hole
The through-hole 210P-1 of cell columns 210A1 being electrically connected with the first electrode 224-1 of capacitor 222A-1 and second electrode 226-1, lead to
Hole 210G-1 is located in a boundary of capacitor 222A-1.
In addition, in the embodiment shown in Figure 2, the first electrode 224-2 and second electrode 226-2 of capacitor 222A-2 distinguishes
It covers and is electrically connected to logical along the 5th through-hole 210P-3 and the 4th of the configuration of first direction 300 in through-hole cell columns 210A1
Hole 210G-2.In other words, the first electrode 224-2 of capacitor 222A-2 is electrically connected to for transmitting power supply (power) signal
Through-hole 210P-3 and Chong Die with through-hole 210P-3, and the second electrode 226-2 of capacitor 222A-2 is electrically connected to for transmitting ground connection
(GND) the through-hole 210G-2 of signal and Chong Die with through-hole 210G-2.Therefore, through-hole cell columns 210A1 with capacitor 222A-2's
Through-hole 210P-3, the through-hole 210G-2 of first electrode 224-2 and second electrode 226-2 electrical connection are located at one side of capacitor 222A-2
In boundary.
Configure it is worth noting that, in the embodiment shown in Figure 2, in through-hole cell columns 210A1 along first direction 300 and
The 6th through-hole for transmitting the third through-hole 210P-2 of power supply (power) signal and for transmitting ground connection (GND) signal
210G-3 will not be overlapped in and be electrically connected to the first electrode and second electrode of any one capacitor 222A-1,222A-2.Therefore,
Capacitor 222A-1, the 222A-2 for being electrically connected to same through-hole cell columns 210A1 each other can spaced a distance S.In the present invention
In some embodiments, the range of distance S can be greater than or equal to the half of the space D on substrate side surface 201 between weld pad
Again and less than one times of space D.Also, the of the through-hole 210G-1 of transmitting ground connection (GND) signal is coupled in capacitor 222A-1
Second electrode of the two electrode 226-1 close to the through-hole 210G-2 for being coupled to transmitting ground connection (GND) signal in capacitor 222A-2
226-2.Through-hole positioned at same through-hole cell columns is closed with the electrical connection between the first electrode of corresponding capacitor and second electrode
Standoff distance between system and two capacitors can analogize according to above-mentioned relation.
In some embodiment of the invention, it is electrically connected to the capacitor 222A-2 of through-hole cell columns 210A1 upper in Fig. 2
First electrode 224-2 can be close to the capacitor 222A-1 for another through-hole cell columns 210A1 for being electrically connected to lower in Fig. 2
First electrode 224-1.The through-hole of the different through-hole cell columns adjacent along first direction 300 and the first electrode of corresponding capacitor and
Electrical connection between second electrode can analogize according to above-mentioned relation.
In some embodiment of the invention, capacitor 222A-1,222A-2 of through-hole cell columns 210A2 are electrically connected to and is electrically connected
It is connected to capacitor 222A-1,222A-2 configuration having the same of through-hole cell columns 210A1.For example, it is electrically connected to through-hole list
The first electrode 224-1 and second electrode 226-1 of the capacitor 222A-1 of member column 210A2 is covered each by and is electrically connected to through-hole unit
Through-hole 210P-1, the through-hole 210G-1 for arranging 210A2, are electrically connected to the first electrode of the capacitor 222A-2 of through-hole cell columns 210A2
224-2 and second electrode 226-2 is covered each by and is electrically connected to the configured in through-hole cell columns 210A2 along first direction 300
Five through-hole 210P-3 and the 4th through-hole 210G-2.Also, in a second direction 302 adjacent capacitors can for continuous setting without
It need to be separated from each other.For example, it is electrically connected to the capacitor 222A-1 of through-hole cell columns 210A2 and is electrically connected to through-hole cell columns
The capacitor 222A-1 of 210A1 can be continuously to be arranged and be connected with each other.The different through-hole cell columns of 302 configurations is logical in a second direction
The standoff distance between electrical connection and two capacitors between hole and the first electrode of corresponding capacitor and second electrode
It can analogize according to above-mentioned relation.
Fig. 3 is the schematic top plan view of the part first surface 201 of the printed circuit board 500b of some embodiments of the invention.On
Each element in attached drawing is stated if any same as shown in Figure 2 or similar part, then can refer to the related narration of front, do not do herein
Repeated explanation.In some embodiment of the invention, it is configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500b
And the weld pad 204 being electrically connected with packaging body (spherical grid array package body) 400 is configured to a pad arrays 205B.Above-mentioned pad arrays
205B can be arranged by the multiple pad units being periodically arranged along first direction 300 and second direction 302 and be formed, such as shown in Fig. 3
Pad unit column 204B1,204B2,204B3,204B4.In some embodiment of the invention, the weld pad of printed circuit board 500b
Cell columns include multiple weld pads that a column are set as along first direction 300.For example, pad arrays 205B as shown in Figure 3
Pad unit column 204B1,204B2,204B3,204B4 respectively by being set as three weld pad structures of a column along first direction 300
At above three weld pad is respectively weld pad 204P-1, weld pad 204G-1 and the weld pad 204G- being set in sequence along first direction 300
2.Weld pad 204P-1 adjacent welding-pad 204G-1, weld pad 204G-1 adjacent welding-pad 204G-2, and weld pad 204G-1 is along first direction 300
Between weld pad 204P-1 and weld pad 204G-2.Also, the weldering of each pad unit column 204B1,204B2,204B3,204B4
204P-1, weld pad 204G-1 and weld pad 204G-2 are padded each other with a spacing (pitch) D setting.In addition, to be clearly painted
See, the pad arrays 205B that Fig. 3 is shown (is located on relatively with the two pad units column being periodically arranged along first direction 300
The square pad unit column 204B1 and pad unit column 204B1 positioned at lower) and 302 periodically set in a second direction
The four column pad units set arrange (i.e. pad unit column 204B1,204B2,204B3,204B4) to illustrate, and but not limited to this,
In other embodiments, it can also optionally change the line number and columns of the pad unit column of pad arrays 205B.
In some embodiment of the invention, the weld pad in each pad unit column 204B1,204B2,204B3,204B4
204P-1 is for transmitting power supply (power) signal, weld pad 204G-1 adjacent to each other and weld pad 204G-2 for transmitting ground connection
(GND) signal.The transmitting signal type of three weld pads in other pad units column can analogize according to above-mentioned relation.
In some embodiment of the invention, the pad unit column of printed circuit board 500b can be along first direction 300 periodically
It repeats to be arranged.For example, setting pad unit column 204B1, weldering can be repeated cyclically along first direction 300 in same row
Pad cell columns 204B2, pad unit column 204B3 or pad unit column 204B4.In some embodiment of the invention, along first party
It is located in different pad units column to 300 and weld pad adjacent to each other is arranged with space D.For example, pad unit column 204B1
Weld pad 204G-2 and another pad unit column 204B1 (lower in figure of (upper pad unit column 204B1 in figure)
Pad unit column 204B1) weld pad 204P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, positioned at along the adjacent different pad units column of first direction 300 and phase each other
Adjacent weld pad is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in figure 3, being located at figure
In upper pad unit column 204B1 weld pad 204G-2 for transmitting ground connection (GND) signal, lower is another in figure
The weld pad 204P-1 of one pad unit column 204B1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different pad units column in and the transmitting signal types of adjacent to each other two weld pads can analogize according to above-mentioned relation.
In some embodiment of the invention, printed circuit board 500b pad unit column can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 3, pad unit column 20,4B1 302 is arranged in a second direction adjacent to pad unit
204B2, pad unit column 204B2 are in a second direction 302 adjacent to pad unit column 204B3, and pad unit column 204B3 is along second
Direction 302 is adjacent to pad unit column 204B4.In some embodiment of the invention, in a second direction 302 be located at different weld pad lists
In member column and weld pad adjacent to each other is arranged with space D.For example, the weld pad 204P-1 and weld pad of pad unit column 204B1
The weld pad 204P-1 of cell columns 204B2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, in a second direction 302 be located at different pad units column in and weldering adjacent to each other
Pad is all for transmitting power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 3, pad unit column 204B1
Weld pad 204P-1 in a second direction 302 adjacent to pad unit column 204B2 weld pad 204P-1, and pad unit column 204B1
Weld pad 204P-1 and the weld pad 204P-1 of pad unit column 204B2 be all used to transmit power supply (power) signal.Pad unit column
The weld pad 204G-1 of 204B1 in a second direction 302 adjacent to pad unit column 204B2 weld pad 204G-1, and pad unit arrange
The weld pad 204G-1 of the weld pad 204G-1 and pad unit column 204B2 of 204B1 are all used to transmit ground connection (GND) signal.Weld pad list
The weld pad 204G-2 of member column 204B1 in a second direction 302 adjacent to pad unit column 204B2 weld pad 204G-2, and weld pad list
The weld pad 204G-2 of the weld pad 204G-2 and pad unit column 204B2 of member column 204B1 are all used to transmit ground connection (GND) signal.Edge
Second direction 302 is located in different pad units column and the transmitting signal type of two weld pads adjacent to each other can be according to above-mentioned relation
Analogize.
In some embodiment of the invention, be configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500b and
The through-hole being electrically connected with weld pad 204 is configured to a through-hole array 211B.Above-mentioned through-hole array 211B can be by along 300 He of first direction
Multiple through-hole cell columns that second direction 302 is periodically arranged are formed, such as through-hole cell columns 210B1,210B2 shown in Fig. 3,
210B3,210B4.In some embodiment of the invention, through-hole cell columns 210B1,210B2,210B3,210B4 respectively with weld pad
Cell columns 204B1,204B2,204B3,204B4 are separated by a fixed range.In some embodiment of the invention, printed circuit board
The through-hole cell columns of 500b include multiple through-holes that a column are set as along first direction 300.For example, as shown in Figure 3 logical
Through-hole cell columns 210B1,210B2,210B3,210B4 of hole array 211B is respectively by being set as a column along first direction 300
Three through-holes are constituted, above three through-hole be respectively through-hole 210P-1, the through-hole 210P-2 being set in sequence along first direction 300 and
Through-hole 210G-1.Through-hole 210P-1 adjacent through-holes 210P-2, through-hole 210P-2 adjacent through-holes 210G-1, and through-hole 210P-2 is along
One direction 300 is between through-hole 210P-1 and through-hole 210G-1.Each through-hole cell columns 210B1,210B2,210B3,210B4
Through-hole 210P-1, through-hole 210P-2 and through-hole 210G-1 each other with a spacing (pitch) D setting.In addition, clearly to draw
For the sake of showing, the through-hole array 211B that Fig. 3 is shown (is located at two through-hole cell columns being periodically arranged along first direction 300
The upper through-hole cell columns 210B1 and through-hole cell columns 210B1 positioned at lower) and 302 period in a second direction
Property setting four column through-hole cell columns (i.e. through-hole cell columns 210B1,210B2,210B3,210B4) illustrate, but not as
Limit, in other embodiments, can also optionally change the line number and columns of the through-hole cell columns of through-hole array 211B.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500b can be along first direction 300 periodically
It repeats to be arranged.For example, it can be repeated cyclically setting through-hole cell columns 210B1 along first direction 300 in same row, lead to
Hole cell columns 210B2, through-hole cell columns 210B3 or through-hole cell columns 210B4.In some embodiment of the invention, along first party
It is located in different through-hole cell columns to 300 and through-hole adjacent to each other is arranged with space D.For example, through-hole cell columns 210B1
Through-hole 210G-1 and another through-hole cell columns 210B1 (lower in figure of (upper through-hole cell columns 210B1 in figure)
Through-hole cell columns 210B1) through-hole 210P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500b can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 3, through-hole cell columns 210B1 is in a second direction 302 adjacent to through-hole cell columns
210B2, through-hole cell columns 210B2 are in a second direction 302 adjacent to through-hole cell columns 210B3, and 210B3 is along second for through-hole cell columns
Direction 302 is adjacent to through-hole cell columns 210B4.In some embodiment of the invention, in a second direction 302 be located at different through-hole lists
In member column and through-hole adjacent to each other is arranged with space D.For example, the through-hole 210P-1 and through-hole of through-hole cell columns 210B1
The through-hole 210P-1 of cell columns 210B2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the weld pad of pad unit column is along first direction 300 and corresponding through-hole cell columns
Through-hole be staggered.For example, three weld pad 204P-1, the weld pad 204G-1 of the pad unit column 204B1 that Fig. 3 is shown and
Three through-hole 210P-1s, through-hole 210P-2 and through-hole of the weld pad 204G-2 along first direction 300 and through-hole cell columns 210B1
210G-1 is staggered.Also, it looks along first direction 300, first weld pad 204P-1 of pad unit column 204B1 is located at logical
Between the first through-hole 210P-1 and second through-hole 210P-2 of hole cell columns 210B1.Other pad units column weld pad with
Positional relationship between the through-hole of corresponding through-hole cell columns can be analogized according to above-mentioned relation.
In some embodiment of the invention, the different weld pads of pad unit column are corresponding with corresponding through-hole cell columns respectively
Through-hole is separated by a fixed range along first direction 300 and in a second direction 302 respectively.For example, the pad unit that Fig. 3 is shown
The through-hole 210P-1 of the weld pad 204P-1 and through-hole cell columns 210B1 of column are respectively along first direction 300 and in a second direction 302 about
It is separated by the space D of half times.Position between the weld pad and the through-hole of corresponding through-hole cell columns of other pad units column
Relationship can be analogized according to above-mentioned relation.
As shown in figure 3, in some embodiment of the invention, the weld pad of pad unit column is respectively by conductive plane layers figure
Case is electrically connected to the through-hole of corresponding through-hole cell columns.Also, for transmitting the weldering of power supply (power) signal in pad unit column
Pad with the through-hole of corresponding through-hole cell columns be each other a pair two connection relationship, and pad unit column in for transmit be grounded
(GND) weld pad of signal is two pair one of connection relationship with the through-hole of corresponding through-hole cell columns each other.For example, weld pad list
The weld pad 204P-1 of member column 204B1 is electrically connected to through-hole cell columns by two conductive plane layer patterns 208P-1,208P-2
Two through-holes 210P-1,210P-2 of 210B1, weld pad 204G-1,204G-2 of pad unit column 204B1 pass through two respectively to be led
Level surface layer pattern 208G-1,208G-2 are electrically connected to the same through-hole 210G-1 of through-hole cell columns 210B1.Other weld pad lists
Electrical connection between the weld pad and the through-hole of corresponding through-hole cell columns of member column can analogize according to above-mentioned relation.
The electrical connection between weld pad and the through-hole of corresponding through-hole cell columns arranged due to above-mentioned pad unit, because
This, in some embodiment of the invention, the through-hole 210P- in each through-hole cell columns 210B1,210B2,210B3,210B4
1,210P-2 is for transmitting power supply (power) signal, and through-hole 210G-1 is for transmitting ground connection (GND) signal.Above-mentioned through-hole list
The transmitting signal type of other two neighboring through-holes of member column can analogize according to above-mentioned relation.
In some embodiment of the invention, positioned at along the adjacent different through-hole cell columns of first direction 300 and each other phase
Adjacent through-hole is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in figure 3, being located at figure
In upper through-hole cell columns 210B1 through-hole 210G-1 for transmitting ground connection (GND) signal, lower is another in figure
The through-hole 210P-1 of one through-hole cell columns 210B1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different through-hole cell columns in and the transmitting signal types of adjacent to each other two through-holes can analogize according to above-mentioned relation.
In some embodiment of the invention, 302 it is located in different through-hole cell columns and adjacent to each other logical in a second direction
Hole is all used to transmit power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 3, through-hole cell columns 210B1
Through-hole 210P-1 in a second direction 302 adjacent to through-hole cell columns 210B2 through-hole 210P-1, and through-hole cell columns 210B1
Through-hole 210P-1 and the through-hole 210P-1 of through-hole cell columns 210B2 be all used to transmit power supply (power) signal.Through-hole cell columns
The through-hole 210P-2 of 210B1 in a second direction 302 adjacent to through-hole cell columns 210B2 through-hole 210P-2, and through-hole cell columns
The through-hole 210P-2 of the through-hole 210P-2 and through-hole cell columns 210B2 of 210B1 are all used to transmit power supply (power) signal.Through-hole
The through-hole 210G-1 of cell columns 210B1 in a second direction 302 adjacent to through-hole cell columns 210B2 through-hole 210G-1, and through-hole
The through-hole 210G-1 of the through-hole 210G-1 and through-hole cell columns 210B2 of cell columns 210B1 are all used to transmit ground connection (GND) signal.
302 in different through-hole cell columns in a second direction and the transmitting signal type of two through-holes adjacent to each other can be according to above-mentioned pass
System analogizes.
Illustrate through-hole cell columns 210B1,210B2,210B3,210B4 across printed circuit board 500b followed by Fig. 3
Through-hole 210P-1,210P-2 and through-hole 210G-1 be bonded on the soldered ball side surface 203 of printed circuit board 500b and with phase
The positional relationship for the capacitor 222B for answering through-hole to be electrically connected.As shown in figure 3, in some embodiment of the invention, each through-hole list
Member column 210B1,210B2,210B3,210B4 are electrically connected to a capacitor 222B.Therefore, capacitor 222B can correspond to through-hole cell columns
Line number and columns be periodically arranged.In addition, capacitor 222B is with the length L along first direction 300 and in a second direction
A 302 width W.The length L range of capacitor 222B can be greater than or equal to the space D on substrate side surface 201 between weld pad
Twice and it is less than three times of space D.The width W range of capacitor 222B can be greater than or equal on substrate side surface 201 between weld pad
One times of space D and be less than twice of space D.For example, the size of capacitor 222B can be completely covered positioned at substrate-side table
The weld pad of (row) x2 (column) 3 on face 201.
In some embodiment of the invention, capacitor 222B has first electrode 224 and second electrode 226.Shown in Fig. 3
In embodiment, the first electrode 224 and second electrode 226 of capacitor 222B is covered each by and is electrically connected to through-hole cell columns 210B1
Through-hole 210P-2, through-hole 210G-1.In other words, the first electrode 224 of capacitor 222B is electrically connected to for transmitting power supply
(power) the through-hole 210P-2 of signal and Chong Die with through-hole 210P-2, and the second electrode 226 of capacitor 222B is electrically connected to and is used for
The transmitting ground connection through-hole 210G-1 of (GND) signal and Chong Die with through-hole 210G-1.Therefore, through-hole cell columns 210B1's and capacitor
Through-hole 210P-2, the through-hole 210G-1 of first electrode 224 and second electrode 226 electrical connection of 222B are located at the one of capacitor 222B-1
In boundary.
Configure it is worth noting that, in the embodiment shown in fig. 3, in through-hole cell columns 210B1 along first direction 300 and
First through-hole 210P-1 for transmitting power supply (power) signal may not be overlapped in the first electrode 224 of capacitor 222B
With second electrode 226.Therefore, be electrically connected to along the capacitor 222B of the adjacent different through-hole cell columns 210B1 of first direction 300 that
It can spaced a distance S between this.In some embodiment of the invention, the range of distance S can be greater than or equal to substrate side surface 201
The half of space D between upper weld pad is again and less than one times of space D.Also, it is electrically connected to through-hole upper in Fig. 3
The second electrode 226 of the capacitor 222B of cell columns 210B1 can be close to another through-hole cell columns for being electrically connected to lower in Fig. 3
The first electrode 224 of the capacitor 222B of 210B1.The through-hole of the different through-hole cell columns adjacent along first direction 300 with it is corresponding
Electrical connection between the first electrode and second electrode of capacitor can analogize according to above-mentioned relation.
In some embodiment of the invention, it is electrically connected to the capacitor 222B of through-hole cell columns 210B2 and is electrically connected to through-hole
The capacitor 222B configuration having the same of cell columns 210B1.For example, it is electrically connected to the capacitor of through-hole cell columns 210B2
The first electrode 224 and second electrode 226 of 222B be covered each by and be electrically connected to the through-hole 210P-2 of through-hole cell columns 210B2,
Through-hole 210G-1.Also, 302 adjacent capacitors can be arranged to be continuous without being separated from each other in a second direction.For example, electric
The capacitor 222B for being connected to through-hole cell columns 210B2 can be continuously to set with the capacitor 222B for being electrically connected to through-hole cell columns 210B1
It sets and is connected with each other.In a second direction through-hole and the first electrode of corresponding capacitor of the different through-hole cell columns of 302 configurations and
The standoff distance between electrical connection and two capacitors between second electrode can analogize according to above-mentioned relation.
Fig. 4 is the schematic top plan view of the part first surface 201 of the printed circuit board 500c of some embodiments of the invention.On
Each element in attached drawing is stated if any with the same or similar part shown in Fig. 2~Fig. 3, then the correlation that can refer to front describes,
This does not do repeated explanation.In some embodiment of the invention, it is configured at the substrate side surface of the plate body 200 of printed circuit board 500c
The weld pad 204 being electrically connected on 201 and with packaging body (spherical grid array package body) 400 is configured to a pad arrays 205C.Above-mentioned weldering
Pad array 205C can be arranged by the multiple pad units being periodically arranged along first direction 300 and second direction 302 and be formed, such as be schemed
Pad unit column 204C1,204C2,204C3,204C4 shown in 4.In some embodiment of the invention, printed circuit board 500c
Pad unit column include multiple weld pads that a column are set as along first direction 300.For example, weld pad battle array as shown in Figure 4
Pad unit column 204C1,204C2,204C3,204C4 of 205C are arranged respectively by being set as three of a column along first direction 300
Weld pad is constituted, and above three weld pad is respectively weld pad 204P-1, weld pad 204P-2 and the weld pad being set in sequence along first direction 300
204G-1.Weld pad 204P-1 adjacent welding-pad 204P-2, weld pad 204P-2 adjacent welding-pad 204G-1, and weld pad 204P-2 is along first party
To 300 between weld pad 204P-1 and weld pad 204G-1.Also, each pad unit column 204C1,204C2,204C3,
Weld pad 204P-1, weld pad 204P-2 and the weld pad 204G-1 of 204C4 is each other with a spacing (pitch) D setting.In addition, being
For the sake of being clearly painted, two pad units column of the pad arrays 205C that Fig. 4 is shown to be periodically arranged along first direction 300
(being located at the upper pad unit column 204C1 and pad unit column 204C1 positioned at lower) and in a second direction
302 four pad units being periodically arranged arrange (i.e. pad unit column 204C1,204C2,204C3,204C4) to illustrate, but not
As limit, in other embodiments, it can also optionally change the line number and columns of the pad unit column of pad arrays 205C.
In some embodiment of the invention, phase each other in each pad unit column 204C1,204C2,204C3,204C4
Adjacent weld pad 204P-1, weld pad 204P-2 is for transmitting power supply (power) signal, and weld pad 204G-1 is for transmitting ground connection
(GND) signal.The transmitting signal type of three weld pads in other pad units column can analogize according to above-mentioned relation.
In some embodiment of the invention, the pad unit column of printed circuit board 500c can be along first direction 300 periodically
It repeats to be arranged.For example, setting pad unit column 204C1, weld pad can be repeated cyclically along first direction 300 in same row
Cell columns 204C2, pad unit column 204C3 or pad unit column 204C4.In some embodiment of the invention, along first direction
300 in different pad units column and weld pad adjacent to each other is arranged with space D.For example, pad unit column 204C1
Weld pad 204G-2 and another pad unit column 204C1 (lower in figure of (upper pad unit column 204C1 in figure)
Pad unit column 204C1) weld pad 204P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, positioned at along the adjacent different pad units column of first direction 300 and phase each other
Adjacent weld pad is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in figure 4, being located at figure
In upper pad unit column 204C1 weld pad 204G-2 for transmitting ground connection (GND) signal, lower is another in figure
The weld pad 204P-1 of one pad unit column 204C1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different pad units column in and the transmitting signal types of adjacent to each other two weld pads can analogize according to above-mentioned relation.
In some embodiment of the invention, printed circuit board 500c pad unit column can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 4, pad unit column 20,4C1 302 is arranged in a second direction adjacent to pad unit
204C2, pad unit column 204C2 are in a second direction 302 adjacent to pad unit column 204C3, and pad unit column 204C3 is along second
Direction 302 is adjacent to pad unit column 204C4.In some embodiment of the invention, in a second direction 302 be located at different weld pad lists
In member column and weld pad adjacent to each other is arranged with space D.For example, the weld pad 204P-1 and weld pad of pad unit column 204C1
The weld pad 204P-1 of cell columns 204C2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, in a second direction 302 be located at different pad units column in and weldering adjacent to each other
Pad is all for transmitting power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 4, pad unit column 204C1
Weld pad 204P-1 in a second direction 302 adjacent to pad unit column 204C2 weld pad 204P-1, and pad unit column 204C1
Weld pad 204P-1 and the weld pad 204P-1 of pad unit column 204C2 be all used to transmit power supply (power) signal.Pad unit column
The weld pad 204P-2 of 204C1 in a second direction 302 adjacent to pad unit column 204C2 weld pad 204P-2, and pad unit arrange
The weld pad 204P-2 of the weld pad 204P-2 and pad unit column 204C2 of 204C1 are all used to transmit power supply (power) signal.Weld pad
The weld pad 204G-1 of cell columns 204C1 in a second direction 302 adjacent to pad unit column 204C2 weld pad 204G-1, and weld pad
The weld pad 204G-1 of the weld pad 204G-1 and pad unit column 204C2 of cell columns 204C1 are all used to transmit ground connection (GND) signal.
302 in different pad units column in a second direction and the transmitting signal type of two weld pads adjacent to each other can be according to above-mentioned pass
System analogizes.
In some embodiment of the invention, be configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500c and
The through-hole being electrically connected with weld pad 204 is configured to a through-hole array 211C.Above-mentioned through-hole array 211C can be by along 300 He of first direction
Multiple through-hole cell columns that second direction 302 is periodically arranged are formed, such as through-hole cell columns 210C1,210C2 shown in Fig. 4,
210C3,210C4.In some embodiment of the invention, through-hole cell columns 210C1,210C2,210C3,210C4 respectively with weld pad
Cell columns 204C1,204C2,204C3,204C4 are separated by a fixed range.In some embodiment of the invention, printed circuit board
The through-hole cell columns of 500c include multiple through-holes that a column are set as along first direction 300.For example, as shown in Figure 4 logical
Through-hole cell columns 210C1,210C2,210C3,210C4 of hole array 211C is respectively by being set as a column along first direction 300
Three through-holes are constituted, above three through-hole be respectively through-hole 210P-1, the through-hole 210G-1 being set in sequence along first direction 300 and
Through-hole 210G-2.Through-hole 210P-1 adjacent welding-pad 204G-1, through-hole 210G-1 adjacent through-holes 210G-2, and through-hole 210G-1 is along
One direction 300 is between through-hole 210P-1 and through-hole 210G-2.Each through-hole cell columns 210C1,210C2,210C3,210C4
Through-hole 210P-1, through-hole 210G-1 and through-hole 210G-2 each other with a spacing (pitch) D setting.In addition, clearly to draw
For the sake of showing, the through-hole array 211C that Fig. 4 is shown (is located at two through-hole cell columns being periodically arranged along first direction 300
The upper through-hole cell columns 210C1 and through-hole cell columns 210C1 positioned at lower) and 302 period in a second direction
Property setting four through-hole cell columns (i.e. through-hole cell columns 210C1,210C2,210C3,210C4) illustrate, but not as
Limit, in other embodiments, can also optionally change the line number and columns of the through-hole cell columns of through-hole array 211C.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500c can be along first direction 300 periodically
It repeats to be arranged.For example, setting through-hole cell columns 210C1, through-hole can be repeated cyclically along first direction 300 in same row
Cell columns 210C2, through-hole cell columns 210C3 or through-hole cell columns 210C4.In some embodiment of the invention, along first direction
300 in different through-hole cell columns and through-hole adjacent to each other is arranged with space D.For example, through-hole cell columns 210C1
Through-hole 210G-1 and another through-hole cell columns 210C1 (lower in figure of (upper through-hole cell columns 210C1 in figure)
Through-hole cell columns 210C1) through-hole 210P-1 it is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500c can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 4, through-hole cell columns 210C1 is in a second direction 302 adjacent to through-hole cell columns
210C2, through-hole cell columns 210C2 are in a second direction 302 adjacent to through-hole cell columns 210C3, and 210C3 is along second for through-hole cell columns
Direction 302 is adjacent to through-hole cell columns 210C4.In some embodiment of the invention, in a second direction 302 be located at different through-hole lists
In member column and through-hole adjacent to each other is arranged with space D.For example, the through-hole 210P-1 and through-hole of through-hole cell columns 210C1
The through-hole 210P-1 of cell columns 210C2 is adjacent to each other and with the setting of above-mentioned space D.
In some embodiment of the invention, the weld pad of pad unit column is along first direction 300 and corresponding through-hole cell columns
Through-hole be staggered.For example, three weld pad 204P-1, the weld pad 204P-2 of the pad unit column 204C1 that Fig. 4 is shown and
Three through-hole 210P-1s, through-hole 210G-1 and through-hole of the weld pad 204G-1 along first direction 300 and through-hole cell columns 210C1
210G-2 is staggered.Also, it looks along first direction 300, first through-hole 210P-1 of through-hole cell columns 210C1 is located at weldering
Between the first weld pad 204P-1 and second weld pad 204P-2 for padding cell columns 204C1.Other pad units column weld pad with
Positional relationship between the through-hole of corresponding through-hole cell columns can be analogized according to above-mentioned relation.
In some embodiment of the invention, the different weld pads of pad unit column are corresponding with corresponding through-hole cell columns respectively
Through-hole is separated by a fixed range along first direction 300 and in a second direction 302 respectively.For example, the pad unit that Fig. 4 is shown
The through-hole 210P-1 of the weld pad 204P-1 and through-hole cell columns 210C1 of column are respectively along first direction 300 and in a second direction 302 about
It is separated by the space D of half times.Position between the weld pad and the through-hole of corresponding through-hole cell columns of other pad units column
Relationship can be analogized according to above-mentioned relation.
As shown in figure 4, in some embodiment of the invention, the weld pad of pad unit column is respectively by conductive plane layers figure
Case is electrically connected to the through-hole of corresponding through-hole cell columns.Also, for transmitting the weldering of power supply (power) signal in pad unit column
Pad is two pair one of connection relationship with the through-hole of corresponding through-hole cell columns each other, and is grounded in pad unit column for transmitting
(GND) weld pad of signal and the through-hole of corresponding through-hole cell columns are the connection relationship of a pair two each other.For example, weld pad list
Member column 204C1 weld pad 204P-1,204P-2 pass through respectively two conductive plane layer patterns 208P-1,208P-2 be electrically connected to it is logical
The weld pad 204G-1 of the same through-hole 210P-1 of hole cell columns 210C1, pad unit column 204C1 pass through two conductive plane layers
Pattern 208G-1,208G-2 are electrically connected to two through-holes 210G-1,210G-2 of through-hole cell columns 210C1.Other pad units
Electrical connection between the weld pad of column and the through-hole of corresponding through-hole cell columns can analogize according to above-mentioned relation.
The electrical connection between weld pad and the through-hole of corresponding through-hole cell columns arranged due to above-mentioned pad unit, because
This, in some embodiment of the invention, the through-hole 210P-1 in each through-hole cell columns 210C1,210C2,210C3,210C4
For transmitting power supply (power) signal, and through-hole 210G-1,210G-2 are for transmitting ground connection (GND) signal.Above-mentioned through-hole unit
The transmitting signal type of other two neighboring through-holes of column can analogize according to above-mentioned relation.
In some embodiment of the invention, positioned at along the adjacent different through-hole cell columns of first direction 300 and each other phase
Adjacent through-hole is respectively used for transmitting power supply (power) signal and ground connection (GND) signal.For example, as shown in figure 4, being located at figure
In upper through-hole cell columns 210C1 through-hole 210G-2 for transmitting ground connection (GND) signal, lower is another in figure
The through-hole 210P-1 of one through-hole cell columns 210C1 is for transmitting power supply (power) signal.Positioned at adjacent along first direction 300
Different through-hole cell columns in and the transmitting signal types of adjacent to each other two through-holes can analogize according to above-mentioned relation.
In some embodiment of the invention, 302 it is located in different through-hole cell columns and adjacent to each other logical in a second direction
Hole is all used to transmit power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 4, through-hole cell columns 210C1
Through-hole 210P-1 in a second direction 302 adjacent to through-hole cell columns 210C2 through-hole 210P-1, and through-hole cell columns 210C1
Through-hole 210P-1 and the through-hole 210P-1 of through-hole cell columns 210C2 be all used to transmit power supply (power) signal.Through-hole cell columns
The through-hole 210G-1 of 210C1 in a second direction 302 adjacent to through-hole cell columns 210C2 through-hole 210G-1, and through-hole cell columns
The through-hole 210G-1 of the through-hole 210G-1 and through-hole cell columns 210C2 of 210C1 are all used to transmit ground connection (GND) signal.Through-hole list
The through-hole 210G-2 of member column 210C1 in a second direction 302 adjacent to through-hole cell columns 210C2 through-hole 210G-2, and through-hole list
The through-hole 210G-2 of the through-hole 210G-2 and through-hole cell columns 210C2 of member column 210C1 are all used to transmit ground connection (GND) signal.Edge
Second direction 302 is located in different through-hole cell columns and the transmitting signal type of two through-holes adjacent to each other can be according to above-mentioned relation
Analogize.
Illustrate through-hole cell columns 210C1,210C2,210C3,210C4 across printed circuit board 500c followed by Fig. 4
Through-hole 210P-1,210P-2 and through-hole 210G-1 be bonded on the soldered ball side surface 203 of printed circuit board 500c and with phase
The positional relationship for the capacitor 222C for answering through-hole to be electrically connected.As shown in figure 4, in some embodiment of the invention, each through-hole list
Member column 210C1,210C2,210C3,210C4 are electrically connected to a capacitor 222C.Therefore, capacitor 222C can correspond to through-hole list
The line number and columns of member column are periodically arranged.In addition, capacitor 222C has along a length L of first direction 300 and along second
The one width W in direction 302.The length L range of capacitor 222C can be greater than or equal to the spacing on substrate side surface 201 between weld pad
And it is less than three times of space D twice of D.The width W range of capacitor 222C can be greater than or equal to substrate side surface 201 on weld pad it
Between one times of space D and be less than space D twice (.For example, the size of capacitor 222C can be completely covered positioned at substrate-side
The weld pad of (row) x2 (column) 3 on surface 201.
In some embodiment of the invention, capacitor 222C has first electrode 224 and second electrode 226.It is shown in Fig. 4
In embodiment, the first electrode 224 and second electrode 226 of capacitor 222C is covered each by and is electrically connected to through-hole cell columns 210C1
Through-hole 210P-1, through-hole 210G-1.In other words, the first electrode 224 of capacitor 222C is electrically connected to for transmitting power supply
(power) the through-hole 210P-1 of signal and Chong Die with through-hole 210P-1, and the second electrode 226 of capacitor 222C is electrically connected to and is used for
The transmitting ground connection through-hole 210G-1 of (GND) signal and Chong Die with through-hole 210G-1.Therefore, through-hole cell columns 210C1's and capacitor
Through-hole 210P-1, the through-hole 210G-1 of first electrode 224 and second electrode 226 electrical connection of 222C are located at the one of capacitor 222C-1
In boundary.
Configure it is worth noting that, in the embodiment shown in fig. 4, in through-hole cell columns 210C1 along first direction 300 and
Third through-hole 210G-2 for transmitting ground connection (GND) signal may not be overlapped in 224 He of first electrode of capacitor 222C
Second electrode 226.Therefore, be electrically connected to along the adjacent different through-hole cell columns 210C1 of first direction 300 capacitor 222C each other
Between can spaced a distance S.In some embodiment of the invention, the range of distance S can be greater than or equal on substrate side surface 201
The half of space D between weld pad is again and less than one times of space D.Also, it is electrically connected to through-hole list upper in Fig. 4
The second electrode 226 of the capacitor 222C of member column 210C1 can be close to another through-hole cell columns for being electrically connected to lower in Fig. 4
The first electrode 224 of the capacitor 222C of 210C1.The through-hole of the different through-hole cell columns adjacent along first direction 300 with it is corresponding
Electrical connection between the first electrode and second electrode of capacitor can analogize according to above-mentioned relation.
In some embodiment of the invention, it is electrically connected to the capacitor 222C of through-hole cell columns 210C2 and is electrically connected to through-hole
The capacitor 222C configuration having the same of cell columns 210C1.For example, it is electrically connected to the capacitor of through-hole cell columns 210C2
The first electrode 224 and second electrode 226 of 222C be covered each by and be electrically connected to the through-hole 210P-1 of through-hole cell columns 210C2,
Through-hole 210G-1.Also, 302 adjacent capacitors can be arranged to be continuous without being separated from each other in a second direction.For example, electric
The capacitor 222C for being connected to through-hole cell columns 210C2 can be continuously to set with the capacitor 222C for being electrically connected to through-hole cell columns 210C1
It sets and is connected with each other.In a second direction through-hole and the first electrode of corresponding capacitor of the different through-hole cell columns of 302 configurations and
The standoff distance between electrical connection and two capacitors between second electrode can analogize according to above-mentioned relation.
Fig. 5 is the schematic top plan view of the part first surface 201 of the printed circuit board 500d of some embodiments of the invention.On
Each element in attached drawing is stated if any with the same or similar part shown in Fig. 2~Fig. 3, then the correlation that can refer to front describes,
This does not do repeated explanation.In some embodiment of the invention, it is configured at the substrate side surface of the plate body 200 of printed circuit board 500d
The weld pad 204 being electrically connected on 201 and with packaging body (spherical grid array package body) 400 is configured to a pad arrays 205D.Above-mentioned weldering
Pad array 205D can be arranged by the multiple pad units being periodically arranged along first direction 300 and second direction 302 and be formed, such as be schemed
Pad unit column 204D1,204D2,204D3,204D4 shown in 5.In some embodiment of the invention, printed circuit board 500d
Pad unit column include multiple weld pads that a column are set as along first direction 300.For example, as shown in figure 5, being located in figure
Pad unit column 204D1,204D2,204D3,204D4 of upper pad arrays 205D along first direction 300 respectively by setting
12 weld pads for being set to a column are constituted, and above-mentioned 12 weld pads are respectively the weld pad 204P- being set in sequence along first direction 300
1, weld pad 204P-2, weld pad 204G-1, weld pad 204G-2, weld pad 204P-3, weld pad 204P-4, weld pad 204G-3, weld pad 204G-
4, weld pad 204P-5, weld pad 204P-6, weld pad 204G-5 and weld pad 204G-6.Also, each pad unit column 204D1,
The weld pad 204P-1 of 204D2,204D3,204D4, weld pad 204P-2, weld pad 204G-1, weld pad 204G-2, weld pad 204P-3, weldering
Pad 204P-4, weld pad 204G-3, weld pad 204G-4, weld pad 204P-5, weld pad 204P-6, weld pad 204G-5 and weld pad 204G-6 that
With a spacing (pitch) D setting between this.In addition, the pad arrays 205D that Fig. 5 is shown is along first for the sake of being clearly painted
The pad unit column 204D1 and 302 four pad units being periodically arranged arrange in a second direction that direction 300 is arranged
(i.e. pad unit column 204D1,204D2,204D3,204D4) illustrates, and but not limited to this, in other embodiments, can also
Optionally change the line number and columns of the pad unit column of pad arrays 205D.
In some embodiment of the invention, the weld pad in each pad unit column 204D1,204D2,204D3,204D4
204P-1~204P-6 is for transmitting power supply (power) signal, and weld pad 204G-1~204G-6 is for transmitting ground connection (GND) letter
Number.For example, as viewed from first direction 300, in each pad unit column 204D1,204D2,204D3,204D4
First weld pad 204P-1, second weld pad 204P-2, the 5th weld pad 204P-3, the 6th weld pad 204P-4, the 9th weldering
204P-5 and the tenth weld pad 204P-6 of pad for transmitting power supply (power) signal, and third weld pad 204G-1, the 4th weld
Pad 204G-2, the 7th weld pad 204G-3, the 8th weld pad 204G-4, the 11st weld pad 204G-5 and the 12nd weld pad
204G-6 is for transmitting ground connection (GND) signal.
In some embodiment of the invention, 12 welderings of pad unit column 204D1,204D2,204D3,204D4 are constituted
Pad can be divided into three weld pad groups being set in sequence along first direction 300, for example, the first weld pad group, the second weld pad group and third weld pad
Group.Also, each weld pad group respectively includes four weld pads.For example, the first weld pad group includes weld pad 204P-1, weld pad
204P-2, weld pad 204G-1 and weld pad 204G-2, the second weld pad group include weld pad 204P-3, weld pad 204P-4, weld pad 204G-3
With weld pad 204G-4, and third weld pad group includes weld pad 204P-5, weld pad 204P-6, weld pad 204G-5 and weld pad 204G-6.?
In some embodiments of the invention, first weld pad of each weld pad group and second weld pad are used to transmit power supply (power) signal,
And third weld pad and the 4th weld pad are for transmitting ground connection (GND) signal.For example, the weld pad 204P-1 of the first weld pad group
With weld pad 204P-2, the weld pad 204P-3 and weld pad 204P-4 of the second weld pad group, the weld pad 204P-5 and weld pad of third weld pad group
204P-6 is for transmitting power supply (power) signal.In addition, the weld pad 204G-1 and weld pad 204G-2 of the first weld pad group, the second weldering
The weld pad 204G-3 and weld pad 204G-4 of group are padded, the weld pad 204G-5 and weld pad 204G-6 of third weld pad group is for transmitting ground connection
(GND) signal.
In some embodiment of the invention, the pad unit column of printed circuit board 500d can be along first direction 300 periodically
Setting.For example, pad unit column 204D1, pad unit column periodically can be set along first direction 300 in same row
204D2, pad unit column 204D3 or pad unit column 204D4.For example, two be arranged along first direction 300 in same row
In a pad unit column 204D1, the 12nd weld pad 204G-6 of first pad unit column 204D1 is (for transmitting ground connection
(GND) signal) adjacent to second pad unit column 204D1 first weld pad 204P-1 (for transmit power supply (power) letter
Number) (second pad unit column 204D1 is not illustrated in Fig. 5).In other words, two be arranged along first direction 300 in same row
In a pad unit column 204D1, the 4th weld pad 204G-6 of the third weld pad group of first pad unit column 204D1 adjacent to
First weld pad 204P-1 of the first weld pad group of second pad unit column 204D1.
In some embodiment of the invention, weldering in different pad units column and adjacent to each other is located at along first direction 300
Pad is arranged with space D.
In some embodiment of the invention, printed circuit board 500d pad unit column can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 5, pad unit column 20,4D1 302 is arranged in a second direction adjacent to pad unit
204D2, pad unit column 204D2 are in a second direction 302 adjacent to pad unit column 204D3, and pad unit column 204D3 is along second
Direction 302 is adjacent to pad unit column 204D4.In some embodiment of the invention, in a second direction 302 be located at different weld pad lists
In member column and weld pad adjacent to each other is arranged with space D.For example, the weld pad 204P-1 and weld pad of pad unit column 204D1
The weld pad 204P-1 of cell columns 204D2 is adjacent to each other and with the setting of above-mentioned space D.In other words, the of pad unit column 204D1
First weld pad 204P-1 of the first weld pad group of the first weld pad 204P-1 and pad unit column 204D2 of one weld pad group are each other
It is adjacent and with above-mentioned space D setting.
In some embodiment of the invention, in a second direction 302 be located at different pad units column in and weldering adjacent to each other
Pad is all for transmitting power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 5, pad unit column 204D1
Weld pad 204P-1 in a second direction 302 adjacent to pad unit column 204D2 weld pad 204P-1, and pad unit column 204D1
Weld pad 204P-1 and the weld pad 204P-1 of pad unit column 204D2 be all used to transmit power supply (power) signal.Pad unit column
The weld pad 204G-1 of 204D1 in a second direction 302 adjacent to pad unit column 204D2 weld pad 204G-1, and pad unit arrange
The weld pad 204G-1 of the weld pad 204G-1 and pad unit column 204D2 of 204D1 are all used to transmit ground connection (GND) signal.Along second
Direction 302 is located in different pad units column and the transmitting signal type of two weld pads adjacent to each other can be according to above-mentioned relation class
It pushes away.
In some embodiment of the invention, be configured on the substrate side surface 201 of the plate body 200 of printed circuit board 500d and
The through-hole being electrically connected with weld pad 204 is configured to a through-hole array 211D.Above-mentioned through-hole array 211D can be by along 300 He of first direction
Multiple through-hole cell columns that second direction 302 is periodically arranged are formed, such as through-hole cell columns 210D1,210D2 shown in fig. 5,
210D3,210D4.In some embodiment of the invention, through-hole cell columns 210D1,210D2,210D3,210D4 respectively with weld pad
Cell columns 204D1,204D2,204D3,204D4 are separated by a fixed range.In some embodiment of the invention, printed circuit board
The through-hole cell columns of 500d include multiple through-holes that a column are set as along first direction 300.For example, as shown in figure 5, being located at
Through-hole cell columns 210D1,210D2,210D3,210D4 of upper through-hole array 211D is respectively by along first direction in figure
300 12 through-holes for being set as a column are constituted, and above-mentioned 12 through-holes are respectively the through-hole being set in sequence along first direction 300
210P-1, through-hole 210P-2, through-hole 210G-1, through-hole 210G-2, through-hole 210P-3, through-hole 210P-4, through-hole 210G-3, through-hole
210G-4, through-hole 210P-5, through-hole 210P-6, through-hole 210G-5 and through-hole 210G-6.Each through-hole cell columns 210D1,
The through-hole 210P-1 of 210D2,210D3,210D4, through-hole 210P-2, through-hole 210G-1, through-hole 210G-2, through-hole 210P-3, lead to
Hole 210P-4, through-hole 210G-3, through-hole 210G-4, through-hole 210P-5, through-hole 210P-6, through-hole 210G-5 and through-hole 210G-6 that
With a spacing (pitch) D setting between this.In addition, the through-hole array 211D that Fig. 5 is shown is along first for the sake of being clearly painted
One through-hole cell columns 210D1 of the setting of direction 300 and in a second direction 302 four through-hole cell columns being periodically arranged
(i.e. through-hole cell columns 210D1,210D2,210D3,210D4) illustrates, and but not limited to this, in other embodiments, can also
Optionally change the line number and columns of the through-hole cell columns of through-hole array 211D.
In some embodiment of the invention, the through-hole in each through-hole cell columns 210D1,210D2,210D3,210D4
210P-1~210P-6 is for transmitting power supply (power) signal, and through-hole 210G-1~210G-6 is for transmitting ground connection (GND) letter
Number.For example, as viewed from first direction 300, in each through-hole cell columns 210D1,210D2,210D3,210D4
First through-hole 210P-1, second through-hole 210P-2, the 5th through-hole 210P-3, the 6th through-hole 210P-4, the 9th it is logical
Hole 210P-5 and the tenth through-hole 210P-6 for transmitting power supply (power) signal, and third through-hole 210G-1, the 4th lead to
Hole 210G-2, the 7th through-hole 210G-3, the 8th through-hole 210G-4, the 11st through-hole 210G-5 and the 12nd through-hole
210G-6 is for transmitting ground connection (GND) signal.
In some embodiment of the invention, 12 for constituting through-hole cell columns 210D1,210D2,210D3,210D4 are logical
Hole can be divided into three group of holes being set in sequence along first direction 300, for example, first through hole group, the second group of holes and third through-hole
Group.Also, each group of holes respectively includes four through-holes.For example, first through hole group includes through-hole 210P-1, through-hole
210P-2, through-hole 210G-1 and through-hole 210G-2, the second group of holes include through-hole 210P-3, through-hole 210P-4, through-hole 210G-3
With through-hole 210G-4, and third through-hole group includes through-hole 210P-5, through-hole 210P-6, through-hole 210G-5 and through-hole 210G-6.?
In some embodiments of the invention, first through-hole of each group of holes and second through-hole are used to transmit power supply (power) signal,
And through-hole third through-hole and the 4th through-hole are for transmitting ground connection (GND) signal.For example, the through-hole of first through hole group
210P-1 and through-hole 210P-2, the through-hole 210P-3 and through-hole 210P-4 of the second group of holes, the through-hole 210P-5 of third through-hole group
With through-hole 210P-6 for transmitting power supply (power) signal.In addition, the through-hole 210G-1 and through-hole 210G-2 of first through hole group,
The through-hole 210G-3 and through-hole 210G-4 of second group of holes, the through-hole 210G-5 and through-hole 210G-6 of third through-hole group is for transmitting
It is grounded (GND) signal.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500d can be along first direction 300 periodically
Setting.For example, through-hole cell columns 210D1, through-hole cell columns periodically can be set along first direction 300 in same row
210D2, through-hole cell columns 210D3 or through-hole cell columns 210D4.For example, two be arranged along first direction 300 in same row
In a through-hole cell columns 210D1, the 12nd through-hole 210G-6 of first through-hole cell columns 210D1 is (for transmitting ground connection
(GND) signal) adjacent to second through-hole cell columns 210D1 first through-hole 210P-1 (for transmit power supply (power) letter
Number).In other words, along first direction 300 in two through-hole cell columns 210D1 that same row is arranged, first through-hole unit
Arrange first through hole group of the 4th through-hole 210G-6 adjacent to second through-hole cell columns 210D1 of the third through-hole group of 210D1
First through-hole 210P-1.
In some embodiment of the invention, it is located in different through-hole cell columns along first direction 300 and adjacent to each other logical
Hole is arranged with space D.
In some embodiment of the invention, the through-hole cell columns of printed circuit board 500d can in a second direction 302 periodically
It repeats to be arranged.For example, as shown in figure 5, through-hole cell columns 210D1 is in a second direction 302 adjacent to through-hole cell columns
210D2, through-hole cell columns 210D2 are in a second direction 302 adjacent to through-hole cell columns 210D3, and 210D3 is along second for through-hole cell columns
Direction 302 is adjacent to through-hole cell columns 210D4.In some embodiment of the invention, in a second direction 302 be located at different through-hole lists
In member column and through-hole adjacent to each other is arranged with space D.For example, the through-hole 210P-1 and through-hole of through-hole cell columns 210D1
The through-hole 210P-1 of cell columns 210D2 is adjacent to each other and with the setting of above-mentioned space D.In other words, the of through-hole cell columns 210D1
First through-hole 210P-1 of the first through hole group of the first through-hole 210P-1 and through-hole cell columns 210D2 of one group of holes are each other
It is adjacent and with above-mentioned space D setting.
In some embodiment of the invention, the weld pad of pad unit column is along first direction 300 and corresponding through-hole cell columns
Through-hole be staggered.For example, 12 weld pad 204P-1, the weld pad 204P- for the pad unit column 204D1 that Fig. 5 is shown
2, weld pad 204G-1, weld pad 204G-2, weld pad 204P-3, weld pad 204P-4, weld pad 204G-3, weld pad 204G-4, weld pad 204P-
5,12 through-holes of weld pad 204P-6, weld pad 204G-5 and weld pad 204G-6 along first direction 300 and through-hole cell columns 210D1
210P-1, through-hole 210P-2, through-hole 210G-1, through-hole 210G-2, through-hole 210P-3, through-hole 210P-4, through-hole 210G-3, through-hole
210G-4, through-hole 210P-5, through-hole 210P-6, through-hole 210G-5 and through-hole 210G-6 are staggered.In other words, pad unit
First weld pad of each weld pad group of column 204D1 is to the 4th weld pad along first direction 300 and the first of corresponding group of holes
A through-hole to the 4th through-hole is staggered.For example, first weld pad of the first weld pad group of pad unit column 204D1 be extremely
4th weld pad (weld pad 204P-1, weld pad 204P-2, weld pad 204G-1, weld pad 204G-2) is along first direction 300 and through-hole list
First through-hole of the first through hole group of member column 210D1 is to the 4th through-hole (through-hole 210P-1, through-hole 210P-2, through-hole 210G-
1, through-hole 210G-2) it is staggered.Also, it looks along first direction 300, first weld pad 204P- of pad unit column 204D1
1 between the first through-hole 210P-1 and second through-hole 210P-2 of through-hole cell columns 210D1.Other pad units column
Positional relationship between weld pad and the through-hole of corresponding through-hole cell columns can be analogized according to above-mentioned relation.
In some embodiment of the invention, the different weld pads of pad unit column are corresponding with corresponding through-hole cell columns respectively
Through-hole is separated by a fixed range along first direction 300 and in a second direction 302 respectively.For example, the pad unit that Fig. 5 is shown
The through-hole 210P-1 of the weld pad 204P-1 and through-hole cell columns 210D1 of column are respectively along first direction 300 and in a second direction 302 about
It is separated by the space D of half times.Position between the weld pad and the through-hole of corresponding through-hole cell columns of other pad units column
Relationship can be analogized according to above-mentioned relation.
As shown in figure 5, in some embodiment of the invention, the different weld pads of pad unit column are to pass through conductive plane respectively
Layer pattern is electrically connected to the different through-holes of corresponding through-hole cell columns, and the weld pad of pad unit column and corresponding through-hole cell columns
Through-hole be each other one-to-one connection relationship.For example, 12 weld pad 204P-1, the weld pads of pad unit column 204D1
204P-2, weld pad 204G-1, weld pad 204G-2, weld pad 204P-3, weld pad 204P-4, weld pad 204G-3, weld pad 204G-4, weld pad
204P-5, weld pad 204P-6, weld pad 204G-5 and weld pad 204G-6 pass through respectively conductive plane layer pattern 208P-1,208P-2,
208G-1,208G-2,208P-3,208P-4,208G-3,208G-4,208P-5,208P-6,208G-5 and 208G-6 electrical connection
To 12 through-hole 210P-1, through-hole 210P-2, through-hole 210G-1, the through-hole 210G-2, through-hole of through-hole cell columns 210D1
210P-3, through-hole 210P-4, through-hole 210G-3, through-hole 210G-4, through-hole 210P-5, through-hole 210P-6, through-hole 210G-5 and logical
Hole 210G-6.The weld pad of other pad units column can be according to above-mentioned with the electrical connection between the through-hole of corresponding through-hole cell columns
Relationship is analogized.
The electrical connection between weld pad and the through-hole of corresponding through-hole cell columns arranged due to above-mentioned pad unit, because
This, in some embodiment of the invention, the through-hole 210P-1 in each through-hole cell columns 210D1,210D2,210D3,210D4
~210P-6 is for transmitting power supply (power) signal, and through-hole 210G-1~210G-6 is for transmitting ground connection (GND) signal.Citing
For, as viewed from first direction 300, first in each through-hole cell columns 210D1,210D2,210D3,210D4
Through-hole 210P-1, second through-hole 210P-2, the 5th through-hole 210P-3, the 6th through-hole 210P-4, the 9th through-hole 210P-
5 and the tenth through-hole 210P-6 is for transmitting power supply (power) signal, and third through-hole 210G-1, the 4th through-hole 210G-
2, the 7th through-hole 210G-3, the 8th through-hole 210G-4, the 11st through-hole 210G-5 and the 12nd through-hole 210G-6 are used
(GND) signal is grounded in transmitting.The transmitting signal type of other two neighboring through-holes of above-mentioned through-hole cell columns can be according to above-mentioned pass
System analogizes.
In some embodiment of the invention, 302 it is located in different through-hole cell columns and adjacent to each other logical in a second direction
Hole is all used to transmit power supply (power) signal or ground connection (GND) signal.For example, as shown in figure 5, through-hole cell columns 210D1
Through-hole 210P-1 in a second direction 302 adjacent to through-hole cell columns 210D2 through-hole 210P-1, and through-hole cell columns 210D1
Through-hole 210P-1 and the through-hole 210P-1 of through-hole cell columns 210D2 be all used to transmit power supply (power) signal.Through-hole cell columns
The through-hole 210G-1 of 210D1 in a second direction 302 adjacent to through-hole cell columns 210D2 through-hole 210G-1, and through-hole cell columns
The through-hole 210G-1 of the through-hole 210G-1 and through-hole cell columns 210D2 of 210D1 are all used to transmit ground connection (GND) signal.Along second
Direction 302 is located in different through-hole cell columns and the transmitting signal type of two through-holes adjacent to each other can be according to above-mentioned relation class
It pushes away.
Illustrate through-hole cell columns 210D1,210D2,210D3,210D4 across printed circuit board 500d followed by Fig. 5
Through-hole 210P-1~210P-6 and through-hole 210G-1~210G-6 be bonded to the soldered ball side surface 203 of printed circuit board 500d
The positional relationship of capacitor 222D-1,222D-2,222D-3 and 222D-4 for being electrically connected above and with respective through hole.As shown in figure 5,
In some embodiments of the invention, each through-hole cell columns 210D1,210D2,210D3,210D4 are electrically connected to along first party
Four capacitors 222D-1,222D-2,222D-3 and 222D-4 being set in sequence to 300.Therefore, capacitor 222D-1,222D-2,
222D-3 and 222D-4 can be periodically arranged corresponding to the line number and columns of through-hole cell columns.In addition, capacitor 222D-1,
222D-2,222D-3 and 222D-4 are respectively provided with a length L and a 302 width W in a second direction along first direction 300.
The length L range of capacitor 222D-1,222D-2,222D-3 and 222D-4 can be greater than or equal to substrate side surface 201 on weld pad it
Between twice of space D and be less than three times of space D.The width W range of capacitor 222D-1,222D-2,222D-3 and 222D-4
One times of the space D on substrate side surface 201 between weld pad can be greater than or equal to and be less than twice of space D.For example, electric
(row) x2 (column) 3 on substrate side surface 201 can be completely covered in the size for holding 222D-1,222D-2,222D-3 and 222D-4
Weld pad.
In some embodiment of the invention, capacitor 222D-1 has first electrode 224-1 and second electrode 226-1, capacitor
There is 222D-2 first electrode 224-2 and second electrode 226-2, capacitor 222D-3 to have first electrode 224-3 and second electrode
226-3, and capacitor 222D-4 has first electrode 224-4 and second electrode 226-4.In the embodiment shown in fig. 5, capacitor
The first electrode 224-1 of 222D-1 is covered and is electrically connected to first configured in through-hole cell columns 210D1 along first direction 300
Through-hole 210P-1 and second through-hole 210P-2, and second electrode 226-1 is covered and is electrically connected in through-hole cell columns 210D1
The third through-hole through-hole 210G-1 configured along first direction 300.In other words, the first electrode 224-1 electricity of capacitor 222D-1
Be connected to two through-hole 210P-1 for transmitting power supply (power) signal and through-hole 210P-2 and with through-hole 210P-1 and through-hole
210P-2 overlapping, and the second electrode 226-1 of capacitor 222D-1 is electrically connected to a through-hole for transmitting ground connection (GND) signal
210G-1 and Chong Die with through-hole 210G-1.Also, through-hole cell columns 210D1 with the first electrode 224-1 of capacitor 222D-1 and
Through-hole 210P-1, through-hole 210P-2 and the through-hole 210G-1 of second electrode 226-1 electrical connection are located at a boundary of capacitor 222D-1
It is interior.
In some embodiment of the invention, the first electrode 224-1 of capacitor 222D-1 is contacted and is electrically connected to through-hole unit
First through-hole of the first through hole group of column 210D1 and second through-hole (through-hole 210P-1 and through-hole 210P-2), and the first electricity
Hold the second electrode 226-1 contact of 222D-1 and is electrically connected to the third through-hole of the first through hole group of through-hole cell columns 210D1
(through-hole 210G-1).
In addition, in the embodiment shown in fig. 5, the first electrode 224-2 of capacitor 222D-2 is covered and is electrically connected to through-hole
The 5th through-hole 210P-3 and the 6th through-hole 210P-4 configured in cell columns 210D1 along first direction 300, and second electrode
226-2 is covered and is electrically connected to the 4th through-hole 210G-2 configured in through-hole cell columns 210D1 along first direction 300.Change sentence
It talks about, the first electrode 224-2 of capacitor 222D-2 is electrically connected to two through-hole 210P-3 for transmitting power supply (power) signal
With through-hole 210P-4 and Chong Die with through-hole 210P-3 and through-hole 210P-4, and the second electrode 226-2 of capacitor 222D-2 is electrically connected
To for transmitting the through-hole 210G-2 of ground connection (GND) signal and Chong Die with through-hole 210G-2.Also, through-hole cell columns 210D1 it
Through-hole 210P-3, the through-hole 210P-4, through-hole being electrically connected with the first electrode 224-2 of capacitor 222D-2 and second electrode 226-2
210G-2 is located in a boundary of capacitor 222D-2.
In some embodiment of the invention, the first electrode 224-2 of capacitor 222D-2 is contacted and is electrically connected to through-hole unit
First through-hole of the second group of holes of column 210D1 and second through-hole (through-hole 210P-3 and through-hole 210P-4), and the second electricity
Hold the second electrode 226-2 contact of 222D-2 and is electrically connected to the 4th through-hole of the first through hole group of through-hole cell columns 210D1
(through-hole 210G-2).
In some embodiment of the invention, it configures in through-hole cell columns 210D1 along first direction 300 and is grounded for transmitting
(GND) the third through-hole 210G-1 of signal partially overlaps and is electrically connected to the second electrode 226-1 of capacitor 222D-1, is used for
The 4th through-hole 210G-2 of transmitting ground connection (GND) signal is partially overlapped and is electrically connected to the second electrode of capacitor 222D-2
226-2.Therefore, the second electrode 226-2 for being electrically connected to the capacitor 222D-1 of through-hole cell columns 210D1 in Fig. 5 can be close to capacitor
The second electrode 226-2 of 222D-2.In some embodiment of the invention, capacitor 222D-1 and capacitor 222D-2 each other can phase
Every a distance S1.In some embodiment of the invention, between the range of distance S1 is smaller than on substrate side surface 201 between weld pad
Half away from D times.In other embodiments of the present invention, capacitor 222D-1 and capacitor 222D-2 can be continuously arranged without that
This is separated.
In addition, in the embodiment shown in fig. 5, the first electrode 224-3 of capacitor 222D-3 is covered and is electrically connected to through-hole
The 9th through-hole 210P-5 configured in cell columns 210D1 along first direction 300, and second electrode 226-3 covering and electrical connection
The 7th through-hole 210G-3 and the 8th through-hole 210G-4 configured into through-hole cell columns 210D1 along first direction 300.Change sentence
It talks about, the first electrode 224-3 of capacitor 222D-3 is electrically connected to a through-hole 210P-5 for transmitting power supply (power) signal
And it is Chong Die with through-hole 210P-5, and the second electrode 226-3 of capacitor 222D-3 is electrically connected to for transmitting ground connection (GND) signal
Two through-hole 210G-3, through-hole 210G-4 and Chong Die with through-hole 210G-3, through-hole 210G-4.Also, through-hole cell columns 210D1 it
Through-hole 210P-5, the through-hole 210G-3, through-hole being electrically connected with the first electrode 224-3 of capacitor 222D-3 and second electrode 226-3
210G-4 is located in a boundary of capacitor 222D-3.
In some embodiment of the invention, the first electrode 224-3 of capacitor 222D-3 is contacted and is electrically connected to through-hole unit
Arrange 210D1 third through-hole group first through-hole (through-hole 210P-5), and capacitor 222D-3 second electrode 226-3 contact and
It is electrically connected to the third through-hole and the 4th through-hole (through-hole 210G-3, through-hole of the second group of holes of through-hole cell columns 210D1
210G-4)。
In addition, in the embodiment shown in fig. 5, the first electrode 224-4 of capacitor 222D-4 is covered and is electrically connected to through-hole
The tenth through-hole 210P-6 configured in cell columns 210D1 along first direction 300, and second electrode 226-4 covering and electrical connection
The 11st through-hole 210G-5 and the 12nd through-hole 210G-6 configured into through-hole cell columns 210D1 along first direction 300.
In other words, the first electrode 224-4 of capacitor 222D-4 is electrically connected to a through-hole for transmitting power supply (power) signal
210P-6 and Chong Die with through-hole 210P-6, and the second electrode 226-4 of capacitor 222D-4 is electrically connected to for transmitting ground connection (GND)
Two through-hole 210G-5, the through-hole 210G-6 of signal and Chong Die with through-hole 210G-5, through-hole 210G-6.Also, through-hole cell columns
The through-hole 210P-5 being electrically connected with the first electrode 224-4 of capacitor 222D-4 and second electrode 226-4, the through-hole 210G- of 210D1
5, through-hole 210G-6 is located in a boundary of capacitor 222D-3.
In some embodiment of the invention, the first electrode 224-4 of capacitor 222D-4 is contacted and is electrically connected to through-hole unit
Arrange 210D1 third through-hole group second through-hole (through-hole 210P-6), and capacitor 222D-4 second electrode 226-4 contact and
It is electrically connected to the third through-hole and the 4th through-hole (through-hole 210G-5, through-hole of the third through-hole group of through-hole cell columns 210D1
210G-6)。
Configure it is worth noting that, in the embodiment shown in fig. 5, in through-hole cell columns 210D1 along first direction 300 and
The 6th through-hole 210P-4 for transmitting power supply (power) signal partially overlaps and is electrically connected to the first of capacitor 222D-2
Electrode 224-2, the 7th through-hole 210G-3 for transmitting ground connection (GND) signal are partially overlapped and are electrically connected to capacitor
The second electrode 226-3 of 222D-3.Therefore, capacitor 222D-2,222D-3 of same through-hole cell columns 210D1 are electrically connected to each other
Between can spaced a distance S2.In some embodiment of the invention, the range of distance S1 can be greater than or equal to substrate side surface 201
The half of space D between upper weld pad is again and less than one times of space D.Also, transmitting electricity is coupled in capacitor 222D-2
The first electrode 224-2 of the through-hole 210G-2 of source (power) signal is close to being coupled to transmitting ground connection (GND) in capacitor 222D-3
The second electrode 226-3 of the through-hole 210G-3 of signal.Positioned at the first electricity of through-hole and the corresponding capacitor of same through-hole cell columns
The standoff distance between electrical connection and two capacitors between pole and second electrode can analogize according to above-mentioned relation.
In some embodiment of the invention, capacitor 222D-1,222D-2,222D- of through-hole cell columns 210D2 are electrically connected to
3 and 222D-4 has identical with capacitor 222D-1,222D-2,222D-3 and the 222D-4 for being electrically connected to through-hole cell columns 210D1
Configuration.For example, it is electrically connected to the first electrode 224-1 covering of the capacitor 222D-1 of through-hole cell columns 210D2 and is electrically connected
It is connected to the first through-hole 210P-1 and second through-hole 210P-2 configured in through-hole cell columns 210D2 along first direction 300, and
Second electrode 226-1 is covered and is electrically connected in through-hole cell columns 210D2 to be led to along the third through-hole that first direction 300 configures
Hole 210G-1.The first electrode 224-2 of capacitor 222D-2 is covered and is electrically connected in through-hole cell columns 210D2 along first direction
The 5th through-hole 210P-3 and the 6th through-hole 210P-4 of 300 configurations, and second electrode 226-2 is covered and is electrically connected to through-hole
The 4th through-hole 210G-2 configured in cell columns 210D2 along first direction 300.The first electrode 224-3 of capacitor 222D-3 covers
Cover and be electrically connected to the 9th through-hole 210P-5 configured in through-hole cell columns 210D2 along first direction 300, and second electrode
226-3 is covered and is electrically connected to the 7th through-hole 210G-3 and the 8th configured in through-hole cell columns 210D2 along first direction 300
A through-hole 210G-4.The first electrode 224-4 of capacitor 222D-4 is covered and is electrically connected in through-hole cell columns 210D2 along first party
To the tenth through-hole 210P-6 of 300 configurations, and second electrode 226-4 is covered and is electrically connected to edge in through-hole cell columns 210D2
The 11st through-hole 210G-5 and the 12nd through-hole 210G-6 that first direction 300 configures.Also, 302 phase in a second direction
Adjacent capacitor can be arranged to be continuous without being separated from each other.For example, it is electrically connected to the capacitor of through-hole cell columns 210D2
222D-1 can be continuously to be arranged and be connected with each other with the capacitor 222D-1 for being electrically connected to through-hole cell columns 210D1.In a second direction
Through-hole and the electrical connection between the first electrode of corresponding capacitor and second electrode of the different through-hole cell columns of 302 configurations
And the standoff distance between two capacitors can analogize according to above-mentioned relation.
The embodiment of the present invention provides a kind of printed circuit board and a kind of semiconductor package.Above-mentioned printed circuit board is for example
For the printed circuit board for carrying a spherical grid array package body (ball grid array package, BGA package).
Above-mentioned semiconductor package be, for example, a ball grid array package structure (ball grid array package structure,
BGA package structure).The printed circuit board of above-mentioned semiconductor package, which has, is electrically connected to BGA Package
The power supply weld pad and ground pad of body, and corresponding power vias and grounding through hole.In some embodiment of the invention, above-mentioned
The printed circuit board of semiconductor package has through-hole array comprising is periodically arranged along first direction and second direction
Multiple through-hole cell columns.In some embodiment of the invention, through-hole cell columns include across printed circuit board plate body and to
Six through-holes along first direction setting of capacitor are electrically connected, wherein two of them through-hole adjacent to each other is respectively used for transmitting electricity
Source (power) signal and ground connection (GND) signal.In some embodiment of the invention, through-hole cell columns include three along first party
To the through-hole of setting, for transmitting power supply (power) signal, third through-hole is used for first through-hole as viewed from first direction
Transmitting ground connection (GND) signal, and second through-hole is for transmitting power supply (power) signal or ground connection (GND) signal.In the present invention
In some embodiments, through-hole cell columns include the first through hole group being set in sequence along first direction, one second group of holes and one
Third through-hole group.First through hole group respectively includes to third through-hole group across plate body and one first to be electrically connected capacitor leads to
Hole, one second through-hole, a third through-hole and a fourth hole, first through hole and second through-hole are for passing as viewed from first direction
Power supply (power) signal, the third through-hole and the fourth hole are passed for transmitting ground connection (GND) signal.Above-mentioned semiconductor packages
The printed circuit board of structure utilizes the configuration mode of above-mentioned power vias and grounding through hole, so as to be engaged in printed circuit board
The arrangement of the capacitor (such as decoupling capacitance) of soldered ball side surface more closely, can promote capacitance density.Also, the present invention is implemented
The printed circuit board of example arranges close capacitor because having, the impedance of power path in printed circuit board is effectively reduced
(impedance) there is preferable Power Integrity (power integrity, PI).
Although disclosing the present invention in conjunction with above embodiments, it is not intended to limit the invention, it is any to be familiar with this
Operator can make some changes and embellishment without departing from the spirit and scope of the present invention, therefore protection scope of the present invention
It should be subject to what the appended claims were defined.
Claims (17)
1. a kind of printed circuit board, comprising:
Plate body has each other relative first surface and second surface, and wherein the first surface, should to engage a circuit base plate
Second surface is to connect one capacitor；And
Through-hole array, including the multiple through-hole cell columns being periodically arranged along a first direction, wherein those through-hole cell columns are divided
Do not include:
First through hole group, the second group of holes and the third through-hole group being set in sequence along the first direction, wherein first through hole group
It respectively includes being set as a column to third through-hole group and passes through the plate body and the first through hole to be electrically connected the capacitor, second
Through-hole, third through-hole and fourth hole, wherein the first through hole and second through-hole, should for transmitting power supply (power) signal
Third through-hole and the fourth hole are for transmitting ground connection (GND) signal.
2. printed circuit board as described in claim 1, wherein one of them through-hole cell columns in those through-hole cell columns
Third through-hole group the fourth hole another one through-hole cell columns adjacent thereto first through hole group should
First through hole is adjacent to each other.
3. printed circuit board as described in claim 1, wherein those through-hole cell columns edges of the part of the through-hole array are different from
One second direction of the first direction is periodically arranged, and this of the first through hole group of one of them through-hole cell columns is first logical
Hole is along the second direction adjacent to the first through hole of the first through hole group of wherein another through-hole cell columns.
4. printed circuit board as described in claim 1, further includes:
Pad arrays are set on the first surface of the plate body, and wherein the pad arrays include along first direction periodicity
The multiple pad units column being arranged, those pad units column are spaced a distance with those through-hole cell columns, wherein those weld pad lists
Member column respectively include:
The first weld pad group, the second weld pad group and the third weld pad group being set in sequence along a first direction, wherein the first weld pad group
The first weld pad, the second weld pad, third weld pad and the 4th weld pad that are set as a column are respectively included to third weld pad group,
Wherein those pad units column one of them pad unit column the first weld pad group first weld pad, this second
Weld pad, the third weld pad and the 4th weld pad are respectively electrically connected to one of them through-hole cell columns in those through-hole cell columns
First through hole group the first through hole, second through-hole, the third through-hole and the fourth hole.
5. printed circuit board as claimed in claim 4, wherein one of them pad unit of those pad units column arranges
First weld pad, second weld pad, the third weld pad and the 4th weld pad of the first weld pad group along the first direction respectively with
The first through hole of the first through hole group of one of them through-hole cell columns in those through-hole cell columns, second through-hole,
The third through-hole and the fourth hole are staggered.
6. printed circuit board as described in claim 1, further includes:
First capacitor is bonded to the second surface of the printed circuit board,
Wherein a first electrode of the first capacitor contacts and is electrically connected to one of them through-hole list of those through-hole cell columns
Member column first through hole group the first through hole and second through-hole, wherein the first capacitor a second electrode contact and electricity
It is connected to the third through-hole of the first through hole group of one of them through-hole cell columns of those through-hole cell columns.
7. printed circuit board as claimed in claim 6, further includes:
Second capacitor is bonded to the second surface of the printed circuit board and sequentially sets with the first capacitor along the first direction
It sets, wherein a first electrode of second capacitor contacts and is electrically connected to one of them through-hole unit of those through-hole cell columns
First through hole and second through-hole of second group of holes of column, and the second electrode contact and electrical connection of second capacitor
To the fourth hole of the first through hole group of one of them through-hole cell columns of those through-hole cell columns.
8. printed circuit board as claimed in claim 7, further includes:
Third capacitor, be bonded to the second surface of the printed circuit board and with the first capacitor and second capacitor along this first
Direction is set in sequence, and wherein a first electrode of the third capacitor contacts and is electrically connected to one of them of those through-hole cell columns
The first through hole of the third through-hole group of the through-hole cell columns, and a second electrode of the third capacitor is contacted and is electrically connected to
Third through-hole and the fourth hole of second group of holes of one of them of those through-hole cell columns through-hole cell columns.
9. printed circuit board as claimed in claim 8, further includes:
4th capacitor is bonded to the second surface of the printed circuit board and is somebody's turn to do with the first capacitor, second capacitor and along this
Third capacitor first direction is set in sequence, and wherein a first electrode of the 4th capacitor contacts and is electrically connected to those through-hole units
Second through-hole of the third through-hole group of one of them through-hole cell columns of column, and a second electrode of the 4th capacitor connects
Touch and be electrically connected to the third through-hole group of one of them through-hole cell columns of those through-hole cell columns the third through-hole and
The fourth hole.
10. a kind of semiconductor package, comprising:
Printed circuit board, comprising:
Plate body has a first surface and a second surface relative to each other；And
Through-hole array, including the multiple through-hole cell columns being periodically arranged along a first direction, wherein those through-hole cell columns are divided
Do not include:
A first through hole group, one second group of holes and the third through-hole group being set in sequence along the first direction, wherein this first
Group of holes is respectively included to third through-hole group across the plate body and the first through hole to be electrically connected a capacitor, one second logical
Hole, a third through-hole and a fourth hole, wherein the first through hole and second through-hole are used to transmit power supply (power) signal,
The third through-hole and the fourth hole are for transmitting ground connection (GND) signal；
Packaging body is bonded to the first surface of the printed circuit board；And
First capacitor is bonded to the second surface of the printed circuit board,
Wherein a first electrode of the first capacitor contacts and is electrically connected to one of them through-hole list of those through-hole cell columns
Member column first through hole group the first through hole and second through-hole, wherein the first capacitor a second electrode contact and electricity
It is connected to the third through-hole of the first through hole group of one of them through-hole cell columns of those through-hole cell columns.
11. semiconductor package as claimed in claim 10, wherein those through-hole cell columns edges of the part of the through-hole array
Periodically it is arranged different from a second direction of the first direction, the first through hole group's of one of them through-hole cell columns should
First through hole is along the second direction adjacent to the first through hole of the first through hole group of wherein another through-hole cell columns.
12. semiconductor package as claimed in claim 11, further includes:
Second capacitor is bonded to the second surface of the printed circuit board and sequentially sets with the first capacitor along the first direction
It sets, wherein a first electrode of second capacitor contacts and is electrically connected to one of them through-hole unit of those through-hole cell columns
First through hole and second through-hole of second group of holes of column, and the second electrode contact and electrical connection of second capacitor
To the fourth hole of the first through hole group of one of them through-hole cell columns of those through-hole cell columns.
13. semiconductor package as claimed in claim 12, further includes:
Third capacitor, be bonded to the second surface of the printed circuit board and with the first capacitor and second capacitor along this first
Direction is set in sequence, and wherein a first electrode of the third capacitor contacts and is electrically connected to one of them of those through-hole cell columns
The first through hole of the third through-hole group of the through-hole cell columns, and a second electrode of the third capacitor is contacted and is electrically connected to
Third through-hole and the fourth hole of second group of holes of one of them of those through-hole cell columns through-hole cell columns.
14. semiconductor package as claimed in claim 13, further includes:
4th capacitor is bonded to the second surface of the printed circuit board and is somebody's turn to do with the first capacitor, second capacitor and along this
Third capacitor first direction is set in sequence, and wherein a first electrode of the 4th capacitor contacts and is electrically connected to those through-hole units
Second through-hole of the third through-hole group of one of them through-hole cell columns of column, and a second electrode of the 4th capacitor connects
Touch and be electrically connected to the third through-hole group of one of them through-hole cell columns of those through-hole cell columns the third through-hole and
The fourth hole.
15. semiconductor package as claimed in claim 10, further includes:
Pad arrays are set on the first surface of the plate body, and wherein the pad arrays include along first direction periodicity
The multiple pad units column being arranged, those pad units column are spaced a distance with those through-hole cell columns, wherein those weld pad lists
Member column respectively include:
The first weld pad group, the second weld pad group and the third weld pad group being set in sequence along a first direction, wherein the first weld pad group
The first weld pad, the second weld pad, third weld pad and the 4th weld pad that are set as a column are respectively included to third weld pad group,
Wherein those pad units column one of them pad unit column the first weld pad group first weld pad, this second
Weld pad, the third weld pad and the 4th weld pad are respectively electrically connected to one of them through-hole cell columns in those through-hole cell columns
First through hole group the first through hole, second through-hole, the third through-hole and the fourth hole.
16. semiconductor package as claimed in claim 15, one of them weld pad list that wherein those pad units arrange
First weld pad, second weld pad, the third weld pad and the 4th weld pad of the first weld pad group of member column is along the first direction
Respectively with the first through hole of the first through hole group of one of them through-hole cell columns in those through-hole cell columns, this second
Through-hole, the third through-hole and the fourth hole are staggered.
17. semiconductor package as claimed in claim 10, wherein the packaging body includes circuit base plate and chip, wherein should
Chip is set on a chip side surface of the circuit base plate, and wherein the printed circuit board is set to a scolding tin of the circuit base plate
On convex block side surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106120867A TWI686111B (en) | 2017-06-22 | 2017-06-22 | Printed circuit board and semiconductor package structure |
| TW106120867 | 2017-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107396530A CN107396530A (en) | 2017-11-24 |
| CN107396530B true CN107396530B (en) | 2019-10-18 |
Family
ID=60340593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710569198.9A Active CN107396530B (en) | 2017-06-22 | 2017-07-13 | Printed circuit board and semiconductor packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107396530B (en) |
| TW (1) | TWI686111B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610971A (en) * | 2001-06-26 | 2005-04-27 | 英特尔公司 | Electronic assembly with vertically connected capacitors and manufacturing method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7738259B2 (en) * | 2004-01-22 | 2010-06-15 | Alcatel Lucent | Shared via decoupling for area arrays components |
| US7292450B2 (en) * | 2006-01-31 | 2007-11-06 | Microsoft Corporation | High density surface mount part array layout and assembly technique |
| US7906734B2 (en) * | 2007-01-30 | 2011-03-15 | Mcdata Corporation | Electrical terminal footprints for a printed circuit board |
| US8759689B2 (en) * | 2011-01-04 | 2014-06-24 | Alcatel Lucent | Land pattern for 0201 components on a 0.8 mm pitch array |
| US9549459B2 (en) * | 2012-01-27 | 2017-01-17 | Panasonic Intellectual Property Management Co., Ltd. | Multilayer printed circuit board |
| TWI586205B (en) * | 2012-11-26 | 2017-06-01 | 魏慶德 | Dc core circuit of led driver circuit |
| CN103491720B (en) * | 2013-09-16 | 2017-06-20 | 华为技术有限公司 | The preparation method and printed circuit board (PCB) of a kind of printed circuit board (PCB) |
-
2017
- 2017-06-22 TW TW106120867A patent/TWI686111B/en active
- 2017-07-13 CN CN201710569198.9A patent/CN107396530B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1610971A (en) * | 2001-06-26 | 2005-04-27 | 英特尔公司 | Electronic assembly with vertically connected capacitors and manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI686111B (en) | 2020-02-21 |
| CN107396530A (en) | 2017-11-24 |
| TW201906508A (en) | 2019-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107318216B (en) | Printed circuit board and semiconductor packaging structure | |
| US5847936A (en) | Optimized routing scheme for an integrated circuit/printed circuit board | |
| CN104409439B (en) | circuit substrate | |
| US9730328B2 (en) | Printed circuit board with embedded component and method for manufacturing same | |
| JP2005515611A (en) | High performance low cost micro circuit package with interposer | |
| US10504829B2 (en) | Semiconductor package and semiconductor module including the same | |
| JP3562568B2 (en) | Multilayer wiring board | |
| JP6651212B1 (en) | Bus bar cable for vehicles | |
| EP3979327A1 (en) | Electronic device and manufacturing method therefor | |
| CN103545286B (en) | Circuit substrate, semiconductor packaging structure and circuit substrate manufacturing process | |
| CN1327519C (en) | Device package, a printed wiring board, and an electronic apparatus | |
| US20110084410A1 (en) | Wiring Substrate for a Semiconductor Chip, and Semiconducotor Package Having the Wiring Substrate | |
| CN107396530B (en) | Printed circuit board and semiconductor packaging structure | |
| CN107333387B (en) | Printed circuit board and semiconductor packaging structure | |
| US20190373732A1 (en) | Printed wiring board | |
| CN117293122A (en) | Hexagonal arrangement connection pattern for high density device packaging | |
| JP2018082070A (en) | Wiring board and electronic apparatus using the same | |
| JP2004207741A (en) | Signal connection technique between electronic element and signal transmission multilayer pc substrate | |
| US20050110167A1 (en) | Routing scheme for differential pairs in flip chip substrates | |
| KR100505672B1 (en) | Array printed circuit board having symmetric layout | |
| ITVI20120145A1 (en) | COMPREHENSIVE STRUCTURE OF ENCLOSURE INCLUDING SIDE CONNECTIONS | |
| KR102555243B1 (en) | LED module with flexible multilayer circuit substrate | |
| JP4382774B2 (en) | Semiconductor package, board, electronic device, and method for connecting semiconductor package and printed board | |
| KR20000059562A (en) | Flexible Substrates of Multi Metal Layer | |
| CN101577268A (en) | Package structure for stacked type integrated circuit chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 301, 2537 Jinke Road, Zhangjiang High Tech Park, Pudong New Area, Shanghai 201203 Patentee after: Shanghai Zhaoxin Semiconductor Co.,Ltd. Address before: Room 301, 2537 Jinke Road, Zhangjiang hi tech park, Shanghai 201203 Patentee before: VIA ALLIANCE SEMICONDUCTOR Co.,Ltd. |