CN107378273B - A kind of aluminium alloy laser drilling - Google Patents
A kind of aluminium alloy laser drilling Download PDFInfo
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- CN107378273B CN107378273B CN201710727156.3A CN201710727156A CN107378273B CN 107378273 B CN107378273 B CN 107378273B CN 201710727156 A CN201710727156 A CN 201710727156A CN 107378273 B CN107378273 B CN 107378273B
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- 229910000838 Al alloy Inorganic materials 0.000 title claims abstract description 101
- 238000005553 drilling Methods 0.000 title claims abstract description 34
- 238000007747 plating Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000012545 processing Methods 0.000 claims abstract description 42
- 230000008569 process Effects 0.000 claims abstract description 21
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 28
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 28
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 28
- 239000000243 solution Substances 0.000 claims description 26
- 238000007654 immersion Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910000648 terne Inorganic materials 0.000 claims description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 15
- 235000019270 ammonium chloride Nutrition 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 235000005074 zinc chloride Nutrition 0.000 claims description 14
- 239000011592 zinc chloride Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000005554 pickling Methods 0.000 claims description 12
- 150000003839 salts Chemical class 0.000 claims description 12
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 11
- 229910052733 gallium Inorganic materials 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 11
- 239000007864 aqueous solution Substances 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 230000003647 oxidation Effects 0.000 claims description 9
- 238000007254 oxidation reaction Methods 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 7
- 238000002161 passivation Methods 0.000 claims description 7
- 229910020220 Pb—Sn Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 238000012805 post-processing Methods 0.000 abstract description 3
- 238000010924 continuous production Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 29
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 16
- 229910052786 argon Inorganic materials 0.000 description 8
- 239000011148 porous material Substances 0.000 description 8
- 241000208340 Araliaceae Species 0.000 description 4
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 235000008434 ginseng Nutrition 0.000 description 4
- 238000002386 leaching Methods 0.000 description 4
- 210000001367 artery Anatomy 0.000 description 3
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
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- -1 that is Substances 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/10—Lead or alloys based thereon
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
The invention belongs to technical field of laser processing, provide a kind of aluminium alloy laser drilling of low cost.This method covers one layer of pb-sn alloy plating in aluminum alloy surface using the method for hot-dip, forms gel protective film, then carries out perforation processing to resulting aluminum alloy plate materials using accurate digital control laser process equipment, obtains required product.The laser drilling that this method uses, the pore-forming taper that can effectively enable aluminum alloy to reduces, and prevents liquid phase from splashing, simultaneous processing is high-efficient, at low cost, and post-processing is simple, continuous production can be achieved, and have excellent performance in terms of highly difficult material processing and at empty control.
Description
Technical field
The invention belongs to technical field of laser processing, provide a kind of aluminium alloy laser drilling.
Background technique
Laser (Light Amplification by Stimulated Emission of Radiation, abbreviation
LASER), refer to that the illumination rays of narrow frequency are resonated by stimulated radiation amplification and necessary feedback, generate collimation, monochrome,
The process of relevant directional beam.Laser technology originates from phase early 1960s, be 20th century and atomic energy, semiconductor,
Eponymous one of four invention of great significance of computer.So far, products & services relevant to laser are all over the world, form rich
Rich and huge laser industry.It has penetrated into all trades and professions, forms more complete industrial chain distribution.Industrial chain upstream
It mainly include optical material and component, middle reaches are mainly various lasers and its corollary equipment, and downstream is then produced with laser application
Product, consumer products, based on instrument and equipment.Three during the last ten years, and the laser technology based on laser has obtained rapidly in China
Development, be widely used in industrial production, communication, information processing, health care, military affairs, culture and education and scientific research
Etc. every field, achieve good economic benefit and social benefit, national economy and social development will be played more and more heavy
The effect wanted.
The appearance of laser industry has pushed the development of opto-electronics, is the pillar industry of information industry.It is ground according to prediction industry
Study carefully institute's measuring and calculating, domestic laser industry market scale is at 130,000,000,000 yuan or so within 2014.When to immediate objective in 2016, laser light is produced
The industry output value is estimated to surpass 400,000,000,000 yuan, and value added exceeds 100 billion.Laser industry garden it is built and under construction more than 16.I
Current laser enterprise of state has 3000 or more.Laser industry is in rapid growth period.Global energy laser and information laser
The gross output value is more than 100,000,000,000 dollars, and wherein 30,000,000,000 dollars of energy laser industry, the Income situation of enterprise leading in the world show: whole
The increasing degree of volumetric laser industry will be 10% or so；Leading companies growth rate with advanced technology will be more than 50%；Laser
Equipment entirety sales volume is larger by macro-economy influence.Laser product aerospace, the energy, communications and transportation, Medical Devices with
And the market segment that metal product etc. is not influenced by economic recession, achievement increase good.The sales volume of global laser in 2016
10,400,000,000 dollars are risen to, 97.1 hundred million dollars of sales volume more revised than 2015 increase about 7.1%, global manufacturing market warp
Growth is gradually recovered after crossing 2 years steady developments.With the upgrading of manufacturing equipment, it is contemplated that global laser sale in 2017
Volume is up to 11,000,000,000 dollars.
In laser industry, laser boring is indispensable and widely used laser processing side in current small hole machined
One of method.The method of traditional aluminium alloy processing through-hole has stamping, drilling machine drilling and electric spark, however, these processing methods
Aluminum alloy materials deformation and processing efficiency can not be overcome the problems, such as, for example, requirement of the stamping processing to formed punch is high and is able to satisfy
Processing efficiency requirement, but deformation is serious；The low efficiency of drilling machine drilling, deformation are relatively small, but drill bit consume is at high cost；Electricity
Spark punching can satisfy deformation requirement, but inefficiency, is easy to produce metamorphic layer in process, need to further remove, and
And working solution, that is, mist of oil is liable to stick to the surfaces externally and internally of aluminium alloy, it is difficult to disposably clean up, increase subsequent processing hardly possible
Degree.
In response to this, it is proposed that a kind of technical method of aluminium alloy laser boring.It mainly utilizes dilute hydrochloric acid
After carrying out pickling to aluminum alloy plate materials, it is placed in the mixed aqueous solution of ammonium chloride and zinc chloride and cleans up, then aluminium alloy is set
It in the Pb-Sn alloy plating bath of melting, after the completion of immersion plating, uses chromic anhydride for main salt Passivation Treatment, it is thin to form gel protection
Film finally carries out perforation processing to resulting aluminum alloy plate materials using accurate digital control laser process equipment, the corresponding ginseng of rationally setting
Number, available aperture is controllable, the lesser pore-forming of taper.By such method, the pore-forming taper that can effectively enable aluminum alloy to subtracts
Small, and prevent liquid phase from splashing, simultaneous processing is high-efficient, at low cost, and post-processing is simple, it can be achieved that continuous production, and high-leveled and difficult
Degree material is processed and has excellent performance at sky control aspect.
Summary of the invention
The object of the present invention is to provide a kind of aluminium alloy laser drilling, the conventional method that can solve laser boring adds
Work requires high, and deformation is serious, efficient under, the disadvantages of drill bit cost depletions are high, subsequent processing difficulty is big, it is most important, create
Property aluminum alloy surface cover one layer of pb-sn alloy plating, effectively reduce the taper of pore-forming, and prevent liquid phase from splashing, and
It can guarantee the high efficiency and low cost of boring procedure.
Specific technical solution of the present invention is as follows:
A kind of aluminium alloy laser drilling, using dilute hydrochloric acid to aluminum alloy plate materials carry out pickling after, be placed in ammonium chloride with
It is cleaned up in the mixed aqueous solution of zinc chloride, then aluminium alloy is placed in the Pb-Sn alloy plating bath of melting, after the completion of immersion plating,
It uses chromic anhydride for main salt Passivation Treatment, forms gel protective film, finally using accurate digital control laser process equipment to gained
Aluminum alloy plate materials carry out perforation processing, relevant parameter is rationally set, can get aperture it is controllable, the lesser pore-forming of taper.Specifically
Steps are as follows:
(1) one layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip: first lower dilute with concentration
Hydrochloric acid carries out pickling to aluminum alloy plate materials, removes the oxidation material and impurity on surface, is subsequently placed in the mixed of ammonium chloride and zinc chloride
It is cleaned up in Heshui solution.Aluminium alloy is placed in the Pb-Sn alloy plating bath of melting again, a certain amount of silicon and gallium is added, with limit
The growth of brittle layer processed improves quality of coating.It after the completion of immersion plating, uses chromic anhydride for main salt, processing is passivated to coating, at it
Surface forms gel protective film；
(2) laser boring: step (1) resulting aluminum alloy plate materials are punched using accurate digital control laser process equipment
Processing, rationally setting expand the ginsengs such as ratio, auxiliary gas atmosphere, pulse energy, pulse number, pulse width, pulse recurrence frequency
Number, available aperture is controllable, the lesser pore-forming of taper.
Preferably, the concentration of step (1) described dilute hydrochloric acid is not higher than 5mol/L；
Preferably, step (1) ammonium chloride is that equimolar mixes with zinc chloride, and the volumetric concentration of solution is 2 ~ 5mol/
L；
Preferably, the quality proportioning of step (1) described Pb-Sn alloy plating bath are as follows: lead accounts for 70 ~ 80%, and tin accounts for 20 ~ 30%；
Preferably, the immersion plating temperature of step (1) described terne metal is 400 ~ 500 DEG C；
Preferably, the additional amount of step (1) described silicon is the 0.02 ~ 0.03% of plating solution quality, and the additional amount of gallium is plating solution matter
The 0.005 ~ 0.01% of amount；
Preferably, the volumetric concentration of step (1) described chromic anhydride is 5 ~ 10g/L, and the pH value of passivating solution is 1 ~ 1.5；
Preferably, step (1) passivation temperature is 15 ~ 35 DEG C, and passivation time is 30 ~ 90s；
Preferably, the laser wavelength of step (2) described laser drilling device be 1064nm, spot diameter be 0.3 ~
1.0nm；
Preferably, step (2) is described expands than being set as 2.5 ~ 4.5, and auxiliary gas atmosphere is set as 2 ~ 3bar；
Preferably, step (2) described pulse energy is set as 1.0 ~ 2.5J, and pulse number is set as 150, pulse width
It is set as 1ms, pulse recurrence frequency is set as 20 ~ 30Hz；
Preferably, step (2) described defocusing amount should be 0mm.
In the parameter setting of laser boring, the influence of many factors is considered.Expand compare the influence in upper hole aperture compared with
It is small, because expanding than becoming smaller, it will lead to hot spot and become larger, energy density reduces, and upper aperture is smaller, and when expanding than becoming larger, hot spot
Become smaller, although energy density is high, limited by spot size, upper aperture is still smaller；Expand compare the influence in lower aperture compared with
Greatly, it expands than bigger, the hot spot of lower surface is bigger, and lower aperture becomes larger, and expands than smaller, and depth of focus is longer, and lower aperture can also become
Greatly, it therefore is expanded than under in larger or smaller, lower aperture size can all become larger.And assist gas atmosphere to upper pore size influences not
Greatly, lower aperture can reduce with the increase of auxiliary gas atmosphere.When assisting gas atmosphere excessive, liquid when punching is influenced whether
The removal of metal causes hole that cannot punch.Pulse energy increases, and upper aperture and lower aperture all increase, and advantageously forms preferably
Pass, this is because energy is higher, the fluent material of removal is more, and aperture is bigger.But when energy increases, taper can also increase
Greatly, and the forming quality in hole is poor, therefore pulse energy should be arranged in lower range.
The present invention provides a kind of aluminium alloy laser drillings, compared with prior art, the feature and excellent protruded
Effect be:
1. the laser drilling that the present invention uses, the pore-forming taper that can effectively enable aluminum alloy to reduces, and prevents liquid
Mutually splash；
2. the laser drilling that the present invention uses, high in machining efficiency, at low cost, post-processing is simple, it can be achieved that serialization
Production；
It 3. the laser drilling that the present invention uses, how the hardness of tube material can not punch successfully, is added in hardly possible
The optimal selection of aperture processing is carried out on work material；
4. the laser drilling that the present invention uses can preset every ginseng of laser by the method for numerical simulation
Number is suitble to wide popularization and application to realize pore-forming control.
Specific embodiment
In the following, the present invention will be further described in detail by way of specific embodiments, but this should not be interpreted as to the present invention
Range be only limitted to example below.Without departing from the idea of the above method of the present invention, according to ordinary skill
The various replacements or change that knowledge and customary means are made, should be included in the scope of the present invention.
Embodiment 1
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 5mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 500 DEG C.The mass fraction of lead is 80% in terne metal, and the mass fraction of tin is 20%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.03% are 0.01% improves quality of coating to limit the growth of brittle layer.Immersion plating
After the completion, use chromic anhydride for main salt, configuration concentration be 5g/L passivating solution, adjust pH value be 1.5,15 DEG C at a temperature of to plating
Layer is passivated processing, after 90s, has been formed on its surface gel protective film；Then laser boring is carried out: using accurate
To treated, aluminum alloy plate materials carry out perforation processing to digital control laser process equipment, use argon gas to assist gas, setting expands
Than being 4.5, auxiliary gas atmosphere is 3bar, and pulse energy 2.5J, pulse number is 150, pulse width 1ms, pulse
Repetition rate is 20Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 1 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 2
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 4mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 450 DEG C.The mass fraction of lead is 75% in terne metal, and the mass fraction of tin is 25%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.02% are 0.005% improves quality of coating to limit the growth of brittle layer.Leaching
After the completion of plating, use chromic anhydride for main salt, configuration concentration be 10g/L passivating solution, adjust pH value be 1.5,20 DEG C at a temperature of
Processing is passivated to coating, after 70s, has been formed on its surface gel protective film；Then it carries out laser boring: using
To treated, aluminum alloy plate materials carry out perforation processing to accurate digital control laser process equipment, use argon gas to assist gas, setting
It expands than being 3.5, auxiliary gas atmosphere is 2.5bar, and pulse energy 2.0J, pulse number is 150, and pulse width is
1ms, pulse recurrence frequency 20Hz, defocusing amount 0mm can obtain that aperture is controllable, and taper is lesser on aluminum alloy plate materials
Pore-forming.
The aluminum alloy plate materials obtained to embodiment 2 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 3
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 3mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 400 DEG C.The mass fraction of lead is 70% in terne metal, and the mass fraction of tin is 30%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.02% are 0.01% improves quality of coating to limit the growth of brittle layer.Immersion plating
After the completion, use chromic anhydride for main salt, configuration concentration be 6g/L passivating solution, adjust pH value be 1.5,25 DEG C at a temperature of to plating
Layer is passivated processing, after 40s, has been formed on its surface gel protective film；Then laser boring is carried out: using accurate
To treated, aluminum alloy plate materials carry out perforation processing to digital control laser process equipment, use argon gas to assist gas, setting expands
Than being 3, auxiliary gas atmosphere is 2.5bar, and pulse energy 1.0J, pulse number is 150, pulse width 1ms, pulse
Repetition rate is 30Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 3 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 4
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 3mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 500 DEG C.The mass fraction of lead is 80% in terne metal, and the mass fraction of tin is 20%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.03% are 0.005% improves quality of coating to limit the growth of brittle layer.Leaching
After the completion of plating, use chromic anhydride for main salt, configuration concentration be 8g/L passivating solution, adjust pH value be 1.2,30 DEG C at a temperature of it is right
Coating is passivated processing, after 60s, has been formed on its surface gel protective film；Then laser boring is carried out: using essence
To treated, aluminum alloy plate materials carry out perforation processing to close digital control laser process equipment, use argon gas to assist gas, setting is expanded
Beam ratio is 3.5, and auxiliary gas atmosphere is 2bar, and pulse energy 2.5J, pulse number is 150, pulse width 1ms, arteries and veins
Rushing repetition rate is 25Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 4 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 5
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 3mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 400 DEG C.The mass fraction of lead is 75% in terne metal, and the mass fraction of tin is 25%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.025% are 0.005% improves quality of coating to limit the growth of brittle layer.Leaching
After the completion of plating, use chromic anhydride for main salt, configuration concentration be 8g/L passivating solution, adjust pH value be 1,20 DEG C at a temperature of to plating
Layer is passivated processing, after 80s, has been formed on its surface gel protective film；Then laser boring is carried out: using accurate
To treated, aluminum alloy plate materials carry out perforation processing to digital control laser process equipment, use argon gas to assist gas, setting expands
Than being 4, auxiliary gas atmosphere is 3bar, and pulse energy 2.5J, pulse number is 150, pulse width 1ms, pulse weight
Complex frequency is 20Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 5 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 6
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 2mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 400 DEG C.The mass fraction of lead is 80% in terne metal, and the mass fraction of tin is 20%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.03% are 0.005% improves quality of coating to limit the growth of brittle layer.Leaching
After the completion of plating, use chromic anhydride for main salt, configuration concentration be 7g/L passivating solution, adjust pH value be 1.5,35 DEG C at a temperature of it is right
Coating is passivated processing, after 50s, has been formed on its surface gel protective film；Then laser boring is carried out: using essence
To treated, aluminum alloy plate materials carry out perforation processing to close digital control laser process equipment, use argon gas to assist gas, setting is expanded
Beam ratio is 2.5, and auxiliary gas atmosphere is 2bar, and pulse energy 1.5J, pulse number is 150, pulse width 1ms, arteries and veins
Rushing repetition rate is 20Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 6 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Embodiment 7
A kind of aluminium alloy laser drilling, detailed process is as follows for aluminum alloy heat immersion plating processing and laser boring:
One layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip first: being first not higher than using concentration
The dilute hydrochloric acid of 5mol/L to aluminum alloy plate materials carry out pickling, remove the oxidation material and impurity on surface, be subsequently placed in ammonium chloride with
It is cleaned up in the aqueous solution that the concentration of zinc chloride equimolar mixing is 4mol/L.Aluminium alloy is placed in the terne metal of melting again
In plating solution, immersion plating is carried out in 450 DEG C.The mass fraction of lead is 70% in terne metal, and the mass fraction of tin is 30%, is added
The gallium that the silicon and mass fraction that mass fraction is 0.02% are 0.01% improves quality of coating to limit the growth of brittle layer.Immersion plating
After the completion, use chromic anhydride for main salt, configuration concentration be 5g/L passivating solution, adjust pH value be 1.5,20 DEG C at a temperature of to plating
Layer is passivated processing, after 60s, has been formed on its surface gel protective film；Then laser boring is carried out: using accurate
To treated, aluminum alloy plate materials carry out perforation processing to digital control laser process equipment, use argon gas to assist gas, setting expands
Than being 3.5, auxiliary gas atmosphere is 2.5bar, and pulse energy 2.5J, pulse number is 150, pulse width 1ms, arteries and veins
Rushing repetition rate is 25Hz, defocusing amount 0mm, and it is controllable to obtain aperture on aluminum alloy plate materials, the lesser pore-forming of taper.
The aluminum alloy plate materials obtained to embodiment 7 are tested at pore size, obtained upper aperture, lower aperture and cone
Degree, as shown in table 1.
Table 1:
| Specific embodiment | Upper aperture (μm) | Lower aperture (μm) | Taper (°) |
| Embodiment 1 | 687 | 720 | -1.2 |
| Embodiment 2 | 780 | 790 | -0.8 |
| Embodiment 3 | 650 | 625 | 0.5 |
| Embodiment 4 | 695 | 720 | -1.4 |
| Embodiment 5 | 770 | 680 | 1.1 |
| Embodiment 6 | 648 | 730 | -1.5 |
| Embodiment 7 | 720 | 650 | 0.8 |
Seen from table 1:
(1) in certain embodiments, calculating gained taper is negative value, this is because using argon gas to assist gas, material
Thickness is larger, and the auxiliary gas for reaching lower surface is less, and oxygen helps combustion effect to punching, and lower aperture is caused to be greater than upper hole
Diameter.
(2) laser boring is carried out to aluminum alloy plate materials using method of the invention, the aperture up and down of hole can pass through ginseng
Number setting is controlled, and the taper of pore-forming is smaller.
Claims (10)
1. a kind of aluminium alloy laser drilling, it is characterised in that after carrying out pickling to aluminum alloy plate materials using dilute hydrochloric acid, be placed in
It is cleaned up in the mixed aqueous solution of ammonium chloride and zinc chloride, then aluminium alloy is placed in the Pb-Sn alloy plating bath of melting, soaked
It after the completion of plating, uses chromic anhydride for main salt Passivation Treatment, forms gel protective film, finally set using accurate digital control laser processing
It is standby that perforation processing is carried out to resulting aluminum alloy plate materials, relevant parameter is rationally set, it is controllable to can get aperture, taper it is lesser at
Hole, specific step is as follows for preparation:
(1) one layer of pb-sn alloy plating is covered in aluminum alloy surface using the method for hot-dip: first uses the lower dilute hydrochloric acid of concentration
Pickling is carried out to aluminum alloy plate materials, the oxidation material and impurity on surface is removed, is subsequently placed in the mixing water of ammonium chloride and zinc chloride
It is cleaned up in solution；Aluminium alloy is placed in the Pb-Sn alloy plating bath of melting again, a certain amount of silicon and gallium is added, it is crisp to limit
Property layer growth, improve quality of coating；It after the completion of immersion plating, uses chromic anhydride for main salt, processing is passivated to coating, on its surface
Form gel protective film；
(2) laser boring: punching is carried out to step (1) resulting aluminum alloy plate materials using accurate digital control laser process equipment and is added
Work, rationally setting expand ratio, auxiliary gas atmosphere, pulse energy, pulse number, pulse width, pulse recurrence frequency and defocus
Parameter is measured, available aperture is controllable, the lesser pore-forming of taper.
2. a kind of aluminium alloy laser drilling according to claim 1, which is characterized in that step (1) described dilute hydrochloric acid
Concentration is not higher than 5mol/L.
3. a kind of aluminium alloy laser drilling according to claim 1, which is characterized in that step (1) ammonium chloride with
Zinc chloride is equimolar mixing, and the volumetric concentration of solution is 2 ~ 5mol/L.
4. a kind of aluminium alloy laser drilling according to claim 1, which is characterized in that step (1) described terne metal
The quality proportioning of plating solution are as follows: lead accounts for 70 ~ 80%, and tin accounts for 20 ~ 30%.
5. a kind of aluminium alloy laser drilling according to claim 1, which is characterized in that step (1) described terne metal
Immersion plating temperature be 400 ~ 500 DEG C.
6. a kind of aluminium alloy laser drilling according to claim 1, which is characterized in that the addition of step (1) described silicon
Amount is the 0.02 ~ 0.03% of plating solution quality, and the additional amount of gallium is the 0.005 ~ 0.01% of plating solution quality；The volumetric concentration of the chromic anhydride
For 5 ~ 10g/L, the pH value of passivating solution is 1 ~ 1.5；The passivation temperature is 15 ~ 35 DEG C, and passivation time is 30 ~ 90s.
7. a kind of aluminium alloy laser drilling according to claim 1, it is characterised in that: step (2) described laser boring
The laser wavelength of equipment is 1064nm, and spot diameter is 0.3 ~ 1.0nm.
8. a kind of aluminium alloy laser drilling according to claim 1, it is characterised in that: step (2) is described to be expanded than setting
2.5 ~ 4.5 are set to, auxiliary gas atmosphere is set as 2 ~ 3bar.
9. a kind of aluminium alloy laser drilling according to claim 1, it is characterised in that: step (2) described pulse energy
It is set as 1.0 ~ 2.5J, pulse number is set as 150, and pulse width is set as 1ms, and pulse recurrence frequency is set as 20 ~
30Hz。
10. a kind of aluminium alloy laser drilling according to claim 1, it is characterised in that: step (2) described defocusing amount is answered
For 0mm.
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