CN107367836A - A kind of Electrowetting device and preparation method thereof - Google Patents
A kind of Electrowetting device and preparation method thereof Download PDFInfo
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- CN107367836A CN107367836A CN201710754150.5A CN201710754150A CN107367836A CN 107367836 A CN107367836 A CN 107367836A CN 201710754150 A CN201710754150 A CN 201710754150A CN 107367836 A CN107367836 A CN 107367836A
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 238000011049 filling Methods 0.000 claims abstract description 6
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 239000003292 glue Substances 0.000 claims description 20
- 239000000243 solution Substances 0.000 claims description 6
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 11
- 230000002776 aggregation Effects 0.000 abstract description 6
- 238000004220 aggregation Methods 0.000 abstract description 6
- 238000010276 construction Methods 0.000 abstract description 6
- 230000002209 hydrophobic effect Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 19
- 239000012530 fluid Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 238000001259 photo etching Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000009938 salting Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000010148 water-pollination Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
- G02B26/005—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid based on electrowetting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention belongs to electrowetting field, disclose a kind of Electrowetting device, including upper substrate, infrabasal plate, upper substrate and infrabasal plate are to being filled with encapsulation liquid in the cavity to formation, the upper substrate includes upper backup pad, first electrode, pixel wall, the pixel wall is provided with oil-control structure, and the infrabasal plate includes lower supporting plate, second electrode, drain insulating layer.The invention also discloses the preparation method of Electrowetting device.The present invention is by improving restriction of the method realization of pixel compartments construction to ink, so as to prevent the aggregation of ink.The thickness of filling ink layer is limited by oil-control structure；Relative hydrophilic and hydrophobic by adjusting oil-control structure and pixel wall layers reduces the generation of overflow problem；The addition of oil-control structure improves the ink uniformity of encapsulation process.
Description
Technical field
The invention belongs to electrowetting field, specifically a kind of Electrowetting device and preparation method thereof.
Background technology
Electrowetting display device includes fluid chamber and electrode structure, and wherein fluid chamber includes nonconducting first fluid
(alkane etc.), conductive second fluid (water or salting liquid), fluid contacts with each other and immiscible.Such as patent CN
102792207A describes a kind of electrowetting display device, and it includes two supporting plates, is provided with wherein in a supporting plate
Wall pattern is pixel wall, and pixel wall is obtained by photoetching gelatin substance (such as SU8) through photoetching process, the pixel compartments that pixel wall surrounds
The region formed is exactly viewing area, and electrowetting display device just produces display effect on this viewing area.It is nonconducting
First fluid is just filled in the viewing area that pixel wall is formed, and the pixel wall around it is used to stop first fluid flow direction week
Pixel compartments are enclosed, so as to the display structure stablized.
Another Electrowetting device is described in United States Patent (USP) US9274331B2, is provided with one of supporting plate
Electrode layer and drain insulating layer, and electrode layer and very high pixel wall are provided with another supporting plate, between two supporting plates
The conductor fluid for filling nonpolar ink and polarity is packaged into Electrowetting device afterwards.
The drain insulating layer of the first Electrowetting device needs first to carry out hydrophilic treated, then can just arrange in the above
Pixel wall, and then recover its hydrophobicity by way of high temperature reflux, so drain insulating layer hydrophobicity be present can not be complete
Recover, and dislocation and the damage to drain insulating layer caused by slip of the pixel wall in drain insulating layer in pyroprocess.
The drain insulating layer of second of Electrowetting device is steady by the processing and recovery process, Nature comparison of hydrophobe-hydrophile-hydrophobic
It is fixed.
But the electrowetting structure of high second pixel wall, upon application of a voltage, the ink of multiple pixel compartments is easily assembled
To an ink together, is turned into, so that display effect is very uneven.Therefore, it is necessary to develop new Electrowetting device
Structure solves these problems.
The content of the invention
It is an object of the invention to provide a kind of Electrowetting device, the method constructed by improving pixel compartments is realized to ink
Limit, so as to prevent the aggregation of ink.
It is a further object of the present invention to provide the preparation method of Electrowetting device.
To reach one of above-mentioned purpose, the present invention uses following technical scheme：
A kind of Electrowetting device, including upper substrate, infrabasal plate, upper substrate and infrabasal plate in the cavity to formation to being filled with
Liquid is encapsulated, the upper substrate includes upper backup pad, first electrode, pixel wall, glue frame, and the pixel wall is provided with oil-control knot
Structure, the infrabasal plate include lower supporting plate, second electrode, drain insulating layer.
Further, the contact angle of the oil-control structure is 30~90 degree.
Further, the oil-control structure is square, rectangle, cross or cylinder.
Further, the height of the oil-control structure is 1~10 μm.
Further, the oil-control structure is located at the crosspoint of pixel wall.
Further, the contact angle of the pixel wall is 10~80 degree.
Further, the height of the pixel wall is 1~100 μm.
Further, the encapsulation liquid is polar electrolyte solution and non-polar solution.
A kind of method for preparing above-mentioned Electrowetting device, comprises the following steps：
S1, second electrode is arranged on lower supporting plate, arrange drain insulating layer on the second electrode；
S2, first electrode is arranged on upper backup pad, on the first electrode laying out pixel wall, oil-control is arranged in pixel wall
Structure；
S3, filling encapsulation liquid, upper substrate and infrabasal plate fitting.
The invention has the advantages that：
The present invention is by improving restriction of the method realization of pixel compartments construction to ink, so as to prevent the aggregation of ink.It is logical
Oil-control structure is crossed to limit the thickness of filling ink layer；Reduced by the relative hydrophilic and hydrophobic for adjusting oil-control structure and pixel wall layers
The generation of overflow problem；The addition of oil-control structure improves the ink uniformity of encapsulation process.
In the first a patent application of applicant, based on traditional Electrowetting device structure, in the picture positioned at infrabasal plate
On plain wall set oil-control structure, pixel wall is not high, pixel wall can play a part of limit level of ink, oil-control structure make ink to
Oil-control structure is assembled, so as to control ink in the direction of motion of opening procedure.The present invention be directed to the presence of new electrowetting structure
The problem of, the pixel wall of new electrowetting structure is very high in upper substrate, pixel wall, it is impossible to limits ink, ink is filled and beaten
Ink is very easy to aggregation during opening etc., therefore sets oil-control structure to prevent ink from assembling.So oil-control structure is at two
Effect in scheme is antipodal, is to promote oil when oil-control structure is located at the pixel wall of traditional Electrowetting device
Ink aggregation, it is to prevent ink from assembling when oil-control structure is located at the pixel wall of new Electrowetting device.
Brief description of the drawings
Fig. 1 is existing Electrowetting device structural representation；
Fig. 2 is that existing Electrowetting device ink climbs wall schematic diagram；
Fig. 3 is the Electrowetting device structural representation of the present invention；
The Electrowetting device ink that Fig. 4 is the present invention climbs wall schematic diagram；
Fig. 5 is the top view of pixel wall construction；
Fig. 6 is pixel wall and cross oil-control structure top view；
Fig. 7 is the side view of the cross oil-control structure and pixel wall obtained by the method for Twi-lithography；
Fig. 8 is to obtain the side view of cross oil-control structure and pixel wall by the method for etching；
Fig. 9 is pixel wall and cylindrical oil-control structure top view；
Figure 10 is the side view of cylindrical the oil-control structure and pixel wall that are obtained by the method for Twi-lithography；
Figure 11 is to obtain the side view of cylindrical oil-control structure and pixel wall by the method for etching；
Figure 12 is the technological process that two step photoetching processes prepare pixel wall and oil-control structure；
Figure 13 is the top view of the first mask plate；
Figure 14 is the top view of cross mask plate；
Figure 15 is the top view of cylindrical shadow mask version；
Figure 16 is the technological process that Protection glue etching method prepares pixel wall and oil-control structure；
Figure 17 is the top view of cross mask plate；
Figure 18 is the top view of cylindrical shadow mask version；
Figure 19 is the schematic diagram after Protection glue exposure imaging.
Embodiment
With reference to specific embodiment, the present invention is described further.
Embodiment
Fig. 1 is existing Electrowetting device structure, and first electrode 2, pixel wall 6 and glue frame 9 are disposed with upper backup pad 1,
Second electrode 4 and drain insulating layer 5 are disposed with lower supporting plate 3, after filling nonpolar liquid 7 and polar liquid 8, passes through glue
Upper and lower base plate is bonded by frame 9.
Fig. 2 is that existing Electrowetting device ink climbs wall schematic diagram, and ink easily occurs for electrowetting structure on high-wall
Wetting, that is, the situation of wall is climbed, so as to cause oil film in pixel compartments uneven.
Fig. 3 is the Electrowetting device structure after improving, and first electrode 2 and pixel wall 6, pixel wall 6 are disposed with supporting plate 1
Oil-control structure 10 is provided with, second electrode 4 and drain insulating layer 5 are disposed with lower supporting plate 3, fills nonpolar liquid 7 and pole
After property liquid 8, upper and lower base plate is bonded by glue frame 9.
The requirement of oil-control structure 10 has certain hydrophily, and contact angle is preferably 30~90 degree, and pixel wall 6 can be with oil-control knot
Structure material is consistent, or more hydrophilic material, preferably contact angle are 10~80 degree.
The Electrowetting device ink that Fig. 4 is the present invention climbs wall schematic diagram, and the electrowetting structure after improvement is because of pixel wall and control
The hydrophilic and hydrophobic of oily structure has gradient, therefore it is to need to overcome certain energy barrier that ink soaks across oil-control structure to pixel wall,
So that the height controlled oil structure control at oil film edge, obtained oil film uniformity are relatively good.
Fig. 5 is the top view of pixel wall construction, and pixel wall 6 surrounds viewing area 11.
Oil-control structure is preferably placed at the crosspoint of pixel wall.
Fig. 6 is the pixel wall and oil-control structure top view of the Electrowetting device after improving, and oil-control structure 10 is cross.Figure
7 be the side view of the cross oil-control structure and pixel wall obtained by the method for Twi-lithography, and Fig. 8 is the method by etching
Obtain the side view of cross oil-control structure (oil-control structure is identical with pixel wall structural material) and pixel wall.
Oil-control structure can be cylinder, as shown in Figure 9.Figure 10 is that the cylinder obtained by the method for Twi-lithography is controlled
The side view of oily structure and pixel wall, Figure 11 are to obtain cylindrical oil-control structure (oil-control structure and pixel by the method for etching
Wall construction material is identical) with the side view of pixel wall.
Oil-control structure can also be rectangle, square etc..
Electrowetting device structure is prepared in accordance with the following methods：
First, the arrangement of infrabasal plate：
First, can be various in lower supporting plate surface layout electrode layer (second electrode), such as ITO, Al, lower supporting plate
The glass of thickness, or polymeric material, such as PET, PI, both can be rigid substrates or flexible base board.Electricity
Pole layer can be the film or patterning of a flood, it might even be possible to be TFT layer.The arrangement of electrode layer includes true
It is the methods of empty plated film, vapour deposition, magnetron sputtering, similar with the film plating process of LCD industries.
Then, in electrode layer (second electrode) surface layout drain insulating layer, such as AF1600, Cytop, Parylene material
Material.Specifically：By modes such as silk-screen printing, spin coating, slot coated, blade coatings, the solution coating of drain insulating layer material is arrived
Electrode layer surface, then, the solvent in drain insulating layer is removed by high-temperature baking, that is, obtains drain insulating layer film.
2nd, the arrangement of upper substrate：
In upper backup pad surface layout electrode layer (first electrode), such as ITO, Al, upper backup pad can be various thickness
Glass, or polymeric material, such as PET, PI, both can be rigid substrates or flexible base board.Electrode layer
Arrangement include vacuum coating, vapour deposition, magnetron sputtering etc..
Then, in electrode layer (first electrode) surface layout pixel wall layers, the shape of pixel wall can be square, rectangular
Shape, or other polygons, circle.By taking square as an example, Fig. 3 is the structure top view of pixel wall.The height of pixel wall be 1~
100 μm, preferably 10~80 μm, more excellent is 30~60 μm, pixel wall has both been considered the support upper bottom crown, it is further contemplated that entirely
The thickness of device.
Then, in one layer of oil-control structure of pixel wall surface layout, shown in criss-cross construction and Fig. 9 as shown in Figure 6
Cylindrical-shaped structure.The highly preferred of oil-control structure is 1~10 μm, and more excellent is 2~5 μm, relevant with the thickness of ink.
3rd, nonpolar liquid ink and polar liquid are filled, is bonded upper and lower two substrates by glue frame, is obtained with control
The improvement Electrowetting device of oily structure.
Wherein pixel wall and oil-control structure is disposed with two methods of two step photoetching processes and Protection glue etching method.
Figure 12 is the technological process that two step photoetching processes prepare pixel wall and oil-control structure.
First in electrode layer 2 surface layout, one layer of pixel wall material 6 ' of upper substrate, by taking negative photoresist as an example, at front baking
It is exposed and toasted after reason, its exposure area is crosslinked reaction or polymerisation.The temperature and time of baking, expose
The energy of light is relevant with the property of the pixel wall material of selection and the height of pixel wall.First mask plate 12 such as Figure 13 of exposure
It is shown, by taking square as an example, area of illumination of the ultraviolet light 13 through mask plate 12.
Then, oil-control structure 10 ' is prepared from another material, the hydrophilic and hydrophobic of such oil-control structure can be with pixel wall
The difference of layer.Because pixel wall layers contact with water relatively more, therefore it is required that pixel wall layers are hydrophilic, preferably water droplet contact angle is less than 80
Degree, preferably less than 50 degree.And oil-control structure can be slightly water-wet, or weak hydrophobic, water droplet contact angle is preferred
For 50~120 degree, more excellent is 60~100 degree.So, the gradient of hydrophilic and hydrophobic is obtained, ink will not expand to the side of pixel wall
Exhibition.Meanwhile ink is limited in oil-control structure, the aggregation of ink is prevented.When the contact angle of pixel wall material is 60~80
When between degree, pixel wall and oil-control structure can also be same material.Concrete technology step is：(1) in the table of pixel wall layers 6 '
Face coating oil-control structural material 10 ', and carry out prebake conditions.Coating method can be, but not limited to spin coating, silk-screen printing, slit painting
Cloth, roller coating etc..The temperature and time of baking is relevant with material character, oil-control Laminate construction thickness；(2) oil-control structure sheaf is entered
Row exposure, the energy of exposure are related to the material and thickness of oil-control structure.Exposure mask version 14 is divided as shown in Figure 14, Figure 15
Not Wei cross and cylindrical structural, ultraviolet light 15 through mask plate 14 area of illumination.
Again, pixel wall layers 6 ' and oil-control structure 10 ' are developed.When the developer solution of the two is consistent, can select
This method.When the developer solution of the two is inconsistent, development and rear baking are carried out after being toasted first to pixel wall exposure structure, and then
It is coated oil-control structure sheaf.That is, step development or two steps are selected separately to develop according to the whether consistent of the two development situation.
Figure 16 is the technological process that Protection glue etching method prepares pixel wall and oil-control structure.The pixel wall layers that the method obtains
As oil-control structural material.
Laying out pixel wall layers first, the high several microns of height pixel wall more photolithographic than two steps of pixel wall, as two steps
Photolithographic pixel wall adds the height sum of oil-control structure.When making pixel wall layers using negative photoresist, technique includes applying
Cloth-front baking-exposure-middle baking-development-is the step of baking afterwards, the parameter of technique and property, the height correlation of pixel wall material, when adopting
During with negative photoresist, mask plate structure is the first mask plate.Certainly, pixel wall layers can also be other organic materials or inorganic
Material, such as PE, PP, PET, PDMS, silicon materials, it is arranged by solution coating and the method for toasting evaporation solvent.
Secondly, one layer of protection glue material 18 ' is coated with the surface of pixel wall 6 ', and by oil-control knot by way of exposure imaging
Protection glue outside structure and viewing area is removed, the pixel wall of Protection glue protection part and all exposed electrode layers.Ultraviolet light 17
Protection glue is exposed through the area of illumination of exposure mask version 16.The structure of mask plate 16 is by positive photoresist of Protection glue
Example, Figure 17 and Figure 18 are respectively the mask plate of decussate texture and cylindrical structural.
By the method for physical etch by one section of height of partial pixel stela eating away of no Protection glue, the height etched away
Preferably 1~10 μm, more excellent is 2~5 μm, relevant with the thickness of ink.Finally, the development of remaining Protection glue is fallen or peeled off
Fall.Therefore, Protection glue is preferably positive photoresist, can be shelled Protection glue by way of exposure imaging after so having etched
From.Figure 19 is the schematic diagram after Protection glue exposure imaging.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Belong to those skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (9)
1. a kind of Electrowetting device, including upper substrate, infrabasal plate, upper substrate and infrabasal plate are to being filled with envelope in the cavity to formation
Fill liquid, it is characterised in that the upper substrate includes upper backup pad, first electrode, pixel wall, glue frame, is set in the pixel wall
There is oil-control structure, the infrabasal plate includes lower supporting plate, second electrode, drain insulating layer.
2. Electrowetting device according to claim 1, it is characterised in that the contact angle of the oil-control structure is 30~90
Degree.
3. Electrowetting device according to claim 1, it is characterised in that the oil-control structure is square, rectangle, ten
Font or cylinder.
4. Electrowetting device according to claim 1, it is characterised in that the height of the oil-control structure is 1~10 μm.
5. Electrowetting device according to claim 1, it is characterised in that the oil-control structure is located at the intersection of pixel wall
Point.
6. Electrowetting device according to claim 1, it is characterised in that the contact angle of the pixel wall is 10~80 degree.
7. Electrowetting device according to claim 1, it is characterised in that the height of the pixel wall is 1~100 μm.
8. Electrowetting device according to claim 1, it is characterised in that it is described encapsulation liquid be polar electrolyte solution and
Non-polar solution.
A kind of 9. method for preparing the Electrowetting device described in claim 1~8 any one, it is characterised in that including following
Step：
S1, second electrode is arranged on lower supporting plate, arrange drain insulating layer on the second electrode；
S2, first electrode is arranged on upper backup pad, on the first electrode laying out pixel wall, oil-control knot is arranged in pixel wall
Structure；
S3, filling encapsulation liquid, upper substrate and infrabasal plate fitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710754150.5A CN107367836B (en) | 2017-08-29 | 2017-08-29 | Electrowetting device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710754150.5A CN107367836B (en) | 2017-08-29 | 2017-08-29 | Electrowetting device and preparation method thereof |
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| Publication Number | Publication Date |
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| CN107367836A true CN107367836A (en) | 2017-11-21 |
| CN107367836B CN107367836B (en) | 2020-09-15 |
Family
ID=60311655
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113467075A (en) * | 2021-07-19 | 2021-10-01 | 苏州清越光电科技股份有限公司 | Display device, preparation method thereof and display |
| WO2021246867A1 (en) * | 2020-06-02 | 2021-12-09 | Miortech Holding B.V. | Electrowetting display |
| WO2022028054A1 (en) * | 2020-08-03 | 2022-02-10 | 华南师范大学 | Electrowetting display device structure and packaging method therefor |
| CN115220216A (en) * | 2022-06-14 | 2022-10-21 | 京东方科技集团股份有限公司 | Electrowetting display panel, preparation method thereof and display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103270446A (en) * | 2010-10-29 | 2013-08-28 | 米路塔克控股公司 | Electrowetting optical element |
| CN105372812A (en) * | 2015-11-24 | 2016-03-02 | 华南师范大学 | Flexible electrofluidic display and preparation method thereof |
-
2017
- 2017-08-29 CN CN201710754150.5A patent/CN107367836B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103270446A (en) * | 2010-10-29 | 2013-08-28 | 米路塔克控股公司 | Electrowetting optical element |
| CN105372812A (en) * | 2015-11-24 | 2016-03-02 | 华南师范大学 | Flexible electrofluidic display and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021246867A1 (en) * | 2020-06-02 | 2021-12-09 | Miortech Holding B.V. | Electrowetting display |
| NL2025729B1 (en) * | 2020-06-02 | 2022-01-20 | Miortech Holding B V | electrowetting display |
| WO2022028054A1 (en) * | 2020-08-03 | 2022-02-10 | 华南师范大学 | Electrowetting display device structure and packaging method therefor |
| CN113467075A (en) * | 2021-07-19 | 2021-10-01 | 苏州清越光电科技股份有限公司 | Display device, preparation method thereof and display |
| CN115220216A (en) * | 2022-06-14 | 2022-10-21 | 京东方科技集团股份有限公司 | Electrowetting display panel, preparation method thereof and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107367836B (en) | 2020-09-15 |
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