CN107357395A - A kind of notebook computer - Google Patents

A kind of notebook computer Download PDF

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Publication number
CN107357395A
CN107357395A CN201710780750.9A CN201710780750A CN107357395A CN 107357395 A CN107357395 A CN 107357395A CN 201710780750 A CN201710780750 A CN 201710780750A CN 107357395 A CN107357395 A CN 107357395A
Authority
CN
China
Prior art keywords
housing
heat emission
emission hole
notebook computer
heat exchange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710780750.9A
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Chinese (zh)
Inventor
袁思伟
孙英
吴昕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lenovo Beijing Ltd
Original Assignee
Lenovo Beijing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lenovo Beijing Ltd filed Critical Lenovo Beijing Ltd
Priority to CN201710780750.9A priority Critical patent/CN107357395A/en
Publication of CN107357395A publication Critical patent/CN107357395A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a kind of notebook computer, it includes system end and display end, the housing of the system end is provided with multiple heat emission holes, corresponded in the housing and heat exchange film is provided with the heat emission hole, the heat exchange film can control the opening and closure of its fenestra according to the difference of temperature, with the temperature in the housing it is relatively low when close the heat emission hole, and the heat emission hole is opened during temperature rise in the housing, to allow cool exterior air to carry out heat exchange with the hot-air in the housing.The notebook computer of institute of the invention can adjust the closing and unlatching of heat emission hole according to the temperature conditions of each hot-zone in its system end, and then adjust the flow direction of cold air, increase radiating effect.

Description

A kind of notebook computer
Technical field
The present invention relates to a kind of electronic equipment, more particularly to a kind of notebook computer.
Background technology
At present in notebook computer each component power consumption more and more higher so that people are being absorbed in CPU, GPU radiatings Have to draw attention to new high heat consumption element simultaneously.With PCIE SSD, the rise of optane hard disks, these parts make With frequency more and more higher, therefore its heat dissipation problem also turns into can influence the key issue of notebook computer performance to tackle above-mentioned feelings Condition, when existing most thermal designs generally make it that above-mentioned high-power-consuming components do not reach peak performance also, it will trigger automatically Built-in component frequency reducing point, hence in so that the base part can not play its high-performance very well.Such as PCIE SSD are read in high speed When writing storage, temperature drastically raises, and not only surface temperature is above standard, and SSD own temperature also can be too high, now system meeting The automatic frequency reducings of SSD are triggered, to reach the effect for reducing PCIE SSD bulk temperatures.
Also some solutions, such as:
Scheme 1. pastes some heat-conducting creams to carry out soaking on high energy consumption component.But the shortcomings that program is that solve to dissipate Heat energy power is than relatively limited.
Scheme 2. high energy consumption component bottom set air inlet, but be the shortcomings that the program when high energy consumption component away from It is distinguished and admirable still mainly to enter from the air inlet close to fan when distant from fan, flow through the air quantity of high energy consumption component Seldom, its radiating is still problem.
The content of the invention
Problem to be solved by this invention is to provide a kind of notebook computer, and the notebook computer can be according to its system The closing and unlatching of the temperature conditions regulation heat emission hole of each hot-zone in end, and then the flow direction of cold air is adjusted, increase radiating effect.
In order to solve the above problems, the present invention provides a kind of notebook computer, and it includes system end and display end, the system The housing at system end is provided with multiple heat emission holes, is corresponded in the housing and heat exchange film is provided with the heat emission hole, the heat exchange film energy Enough openings and closure that its fenestra is controlled according to the difference of temperature, with the temperature in the housing it is relatively low when close the radiating Hole, and the heat emission hole is opened during temperature rise in the housing, to allow the heat in cool exterior air and the housing Air carries out heat exchange.
Preferably, the heat exchange film is PNIPAM film.
Preferably, division has multiple hot-zones in the housing, multiple heat emission holes be divided into it is multigroup, on the housing At least provided with heat emission hole described in one group at corresponding each hot-zone.
Preferably, multiple heat emission holes in heat emission hole described in every group are set in row or in row or in dispersion shape.
Preferably, the heat exchange film is multiple, and be in bar shaped or circle, with can be respectively cooperating with lid cover it is multigroup described scattered Hot hole.
Preferably, the heat emission hole is rectangular opening or circular hole or profiled holes.
Preferably, it is provided with fan in the housing.
The beneficial effect of the notebook computer of the present invention is, sets and dissipates on the position by corresponding to each hot-zone on housing Hot hole sets heat exchange film on heat emission hole simultaneously so that notebook computer can be adjusted according to the temperature conditions of each hot-zone in system end Save heat emission hole closing and unlatching, and then adjust notebook computer in heat convection cool exterior air enter housing flow and Flow direction, more cold airs is flowed directly into high-temperature region, increase radiating effect.
Brief description of the drawings
Fig. 1 is the structural representation of the notebook computer of the present invention.
Fig. 2 is the structural representation of the system end of the notebook computer of the present invention.
Reference:
1- system ends;2- display ends;3- heat emission holes;4- heat exchange films.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be described in detail.
As depicted in figs. 1 and 2, embodiments of the invention provide a kind of notebook computer, and it includes system end 1 and display end 2, the housing of system end 1 is provided with multiple heat emission holes 3, is corresponded in housing and heat exchange film 4 is provided with heat emission hole 3.The heat exchange film 4 has Temperature response characteristics, the opening and closure of its fenestra can be controlled according to the difference of temperature, with the temperature in housing it is relatively low when Close heat emission hole 3, and heat emission hole 3 is opened during temperature rise in housing, to allow the heat in cool exterior air and housing empty Gas carries out heat exchange.It is, (forming high-temperature area) when some regional temperature heating of system end 1 is too high, it is arranged on To should be at the heat emission hole 3 in region heat exchange film 4 then pyrocondensation to expand its fenestra, enables the region to carry out the friendship of air Change, reduce the temperature in the region.And other regions, because the fenestra of corresponding heat exchange film 4 is unexpanded, therefore can not be carried out with outside The convection current of hot and cold gas, hence in so that outside cold air can only flow to high-temperature area, so as to strengthen the heat exchange of high-temperature area Effect.
For example, when high-speed read-write stores, not only surface temperature surpasses the PCIE SSD in notebook computer in the prior art Standard is crossed, and SSD own temperatures are also higher, reach the temperature of the automatic frequency reducing of meeting.Because it is located in notebook computer Radiating fan remotely, even if therefore fan at a high speed rotate, it is distinguished and admirable also mostly from close to fan CPU heat emission hole 3 at enter In system end 1, and it is still less to flow to air quantity at PCIE SSD, can not solve its heat dissipation problem at all.And utilize the skill of the application Art scheme, corresponded in the system end 1 of notebook computer and multiple heat emission holes 3 are set at PCIE SSD, while in the correspondence of system end 1 Multiple heat emission holes 3 are equally set at CPU, and heat exchange film 4 is set at corresponding each heat emission hole 3.So, when CPU is not transported at a high speed Then cause temperature too high, when only PCIE SSD temperature is above standard, the nib of heat exchange film 4 for only corresponding to PCIE SSD can be caused By thermal enlargement, and correspondingly the nib of the heat exchange film 4 at CPU is still in the state close to closure, and now, outside cold air can be several All flow to PCIE SSD, and then accelerate its radiating, ensure that it still is able to high-speed cruising, will not automatic frequency reducing, influence user Use.
Further, the heat exchange film 4 in the application is PNIPAM film (english abbreviation PNIPAM)).When The film body that other, which also so may be selected, has pyrocondensation characteristic is used as heat exchange film 4.
Continuing with shown in Fig. 2, include multiple high energy consumption components due in notebook computer more, be that this can be according to multiple Enclosure interior space is divided into multiple hot-zones by the position of high energy consumption component, at the same multiple heat emission holes 3 are divided into it is multigroup, Corresponded on housing at each hot-zone at least provided with one group of heat emission hole 3, i.e. multigroup heat emission hole 3 is may also set up, it is specific to regard reality Depending on situation.In addition, multiple heat emission holes 3 in every group of heat emission hole 3 can be in row or be set in row, then or set in emitting shape, So that the part that each hot-zone is corresponded on housing can be covered with, ensure later stage radiating effect.Accordingly, film 4 is exchanged heat also to be multiple, and It is identical with the shape that each group heat emission hole 3 is formed, it is in such as bar shaped fire circle, covers multigroup heat emission hole 3 so that lid can be respectively cooperating with. The shape of heat emission hole 3 is not unique, can be circular port or is rectangular opening or profiled holes, and the specific size in hole is unlimited, as long as can protect Demonstrate,prove the radiating effect in later stage.
Above example is only the exemplary embodiment of the present invention, is not used in the limitation present invention, protection scope of the present invention It is defined by the claims.Those skilled in the art can make respectively in the essence and protection domain of the present invention to the present invention Kind modification or equivalent substitution, this modification or equivalent substitution also should be regarded as being within the scope of the present invention.

Claims (7)

1. a kind of notebook computer, it includes system end and display end, it is characterised in that the housing of the system end is provided with more Individual heat emission hole, correspond in the housing and heat exchange film is provided with the heat emission hole, the heat exchange film can be controlled according to the difference of temperature Make the opening and closure of its fenestra, with the temperature in the housing it is relatively low when close the heat emission hole, and in the housing Temperature rise when open the heat emission hole, to allow the hot-air in cool exterior air and the housing to carry out heat exchange.
2. notebook computer according to claim 1, it is characterised in that the heat exchange film is PNIPAM Film.
3. notebook computer according to claim 1, it is characterised in that division has multiple hot-zones in the housing, multiple The heat emission hole be divided into it is multigroup, at least provided with heat emission hole described in one group at the corresponding each hot-zone on the housing.
4. notebook computer according to claim 3, it is characterised in that multiple heat emission holes in heat emission hole described in every group are in Row is set in row or in dispersion shape.
5. notebook computer according to claim 4, it is characterised in that the heat exchange film is multiple, and is in bar shaped or circle Shape, cover multigroup heat emission hole so that lid can be respectively cooperating with.
6. notebook computer according to claim 3, it is characterised in that the heat emission hole is rectangular opening or circular hole or abnormal shape Hole.
7. notebook computer according to any one of claim 1 to 6, it is characterised in that be provided with fan in the housing.
CN201710780750.9A 2017-09-01 2017-09-01 A kind of notebook computer Pending CN107357395A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710780750.9A CN107357395A (en) 2017-09-01 2017-09-01 A kind of notebook computer

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Application Number Priority Date Filing Date Title
CN201710780750.9A CN107357395A (en) 2017-09-01 2017-09-01 A kind of notebook computer

Publications (1)

Publication Number Publication Date
CN107357395A true CN107357395A (en) 2017-11-17

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108785868A (en) * 2018-07-24 2018-11-13 苏州中科先进技术研究院有限公司 Far-infrared therapy rehabilitation equipment
CN110677787A (en) * 2019-09-23 2020-01-10 广东小天才科技有限公司 Vibrating diaphragm, control method and device of vibrating diaphragm aperture, terminal equipment and storage medium
CN112870966A (en) * 2021-01-20 2021-06-01 南阳师范学院 Nano semiconductor photocatalysis device for air purification

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101045797A (en) * 2007-03-30 2007-10-03 东华大学 Preparation of moisture controllable polymer composite film and its application
CN101109982A (en) * 2007-08-22 2008-01-23 中兴通讯股份有限公司 Method for implementing variable air quantity zone control and system frame thereof
CN101615061A (en) * 2008-06-23 2009-12-30 英业达股份有限公司 Adjustable ventilation structure
CN102061049A (en) * 2010-11-30 2011-05-18 天津工业大学 Temperature sensitive polyvinylidene fluoride gel film and preparation method thereof
US20110279974A1 (en) * 2010-05-11 2011-11-17 Kabushiki Kaisha Toshiba Display device and electronic apparatus
CN202257423U (en) * 2011-09-15 2012-05-30 深圳宝龙达信息技术股份有限公司 Hidden heat dissipation structure of notebook computer
US20120315265A1 (en) * 2011-06-13 2012-12-13 Chang Gung University Hydrogel-forming polymer, and preparation process and uses thereof
CN103116391A (en) * 2012-12-31 2013-05-22 联宝(合肥)电子科技有限公司 Centralized heat dissipation method and cooling system of computer cooling system
CN103744495A (en) * 2014-01-06 2014-04-23 合肥联宝信息技术有限公司 Aperture ratio adjustment device for air inlet of computer
CN104718015A (en) * 2012-08-09 2015-06-17 亥姆霍兹盖斯特哈赫特材料及海岸研究中心有限公司 Method for producing a thermoresponsive filtration membrane and thermoresponsive filtration membrane
CN106467605A (en) * 2016-09-22 2017-03-01 北京化工大学 One kind is containing temperature sensitive and degradable segment triblock copolymer, preparation method and nano thin-film

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101045797A (en) * 2007-03-30 2007-10-03 东华大学 Preparation of moisture controllable polymer composite film and its application
CN101109982A (en) * 2007-08-22 2008-01-23 中兴通讯股份有限公司 Method for implementing variable air quantity zone control and system frame thereof
CN101615061A (en) * 2008-06-23 2009-12-30 英业达股份有限公司 Adjustable ventilation structure
US20110279974A1 (en) * 2010-05-11 2011-11-17 Kabushiki Kaisha Toshiba Display device and electronic apparatus
CN102061049A (en) * 2010-11-30 2011-05-18 天津工业大学 Temperature sensitive polyvinylidene fluoride gel film and preparation method thereof
US20120315265A1 (en) * 2011-06-13 2012-12-13 Chang Gung University Hydrogel-forming polymer, and preparation process and uses thereof
CN202257423U (en) * 2011-09-15 2012-05-30 深圳宝龙达信息技术股份有限公司 Hidden heat dissipation structure of notebook computer
CN104718015A (en) * 2012-08-09 2015-06-17 亥姆霍兹盖斯特哈赫特材料及海岸研究中心有限公司 Method for producing a thermoresponsive filtration membrane and thermoresponsive filtration membrane
CN103116391A (en) * 2012-12-31 2013-05-22 联宝(合肥)电子科技有限公司 Centralized heat dissipation method and cooling system of computer cooling system
CN103744495A (en) * 2014-01-06 2014-04-23 合肥联宝信息技术有限公司 Aperture ratio adjustment device for air inlet of computer
CN106467605A (en) * 2016-09-22 2017-03-01 北京化工大学 One kind is containing temperature sensitive and degradable segment triblock copolymer, preparation method and nano thin-film

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
安树林: "《膜科学技术实用教程》", 28 February 2005, 化学工业出版社 *
谢锐等: ""环境响应型智能开关膜的研究进展"", 《膜科学与技术》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108785868A (en) * 2018-07-24 2018-11-13 苏州中科先进技术研究院有限公司 Far-infrared therapy rehabilitation equipment
CN110677787A (en) * 2019-09-23 2020-01-10 广东小天才科技有限公司 Vibrating diaphragm, control method and device of vibrating diaphragm aperture, terminal equipment and storage medium
CN112870966A (en) * 2021-01-20 2021-06-01 南阳师范学院 Nano semiconductor photocatalysis device for air purification

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Application publication date: 20171117