CN107352941A - A kind of ultralight inorganic heat-insulation board - Google Patents
A kind of ultralight inorganic heat-insulation board Download PDFInfo
- Publication number
- CN107352941A CN107352941A CN201710442495.7A CN201710442495A CN107352941A CN 107352941 A CN107352941 A CN 107352941A CN 201710442495 A CN201710442495 A CN 201710442495A CN 107352941 A CN107352941 A CN 107352941A
- Authority
- CN
- China
- Prior art keywords
- parts
- insulation board
- inorganic heat
- ultralight
- silicon
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/24—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing alkyl, ammonium or metal silicates; containing silica sols
- C04B28/26—Silicates of the alkali metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/40—Porous or lightweight materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Building Environments (AREA)
Abstract
The invention discloses a kind of ultralight inorganic heat-insulation board, its composition includes：Waterglass, silicon phosphate, silicon dioxide aerosol, silane coupler, bentonite, glass bead.There is the warming plate of the present invention the advantages of high-strength light, insulation, fire-proof and water-proof to be provided the foundation for the development of warming plate.
Description
Technical field
The present invention relates to Material Field, more particularly to a kind of ultralight inorganic heat-insulation board.
Background technology
The insulation material that the building maintenance structure of domestic market 80% uses is with EPS plates, XPS plates, the poly- ammonia of hard bubble
Based on the organic materials such as ester, due to its material combustibility of itself, B2 level combustible products are listed in, in recent years by its initiation
More large-sized fires, have beaten alarm bell to common people.Therefore, A1 and A2 level heat preservation plate materials are the futures of building heat preservation industry
Development trend.But traditional inorganic heat preservation sheet material, such as gypsum sheet material, cement class sheet material, glass bead sheet material, steel wire net rack
Cement class sandwich sheet isodensity is big, heat-insulating property is general, it is very difficult to which large-area applications are promoted.For these reasons, herein from glass
The basic theories for changing micro-sphere thermal insulation plate development is set about with technology, experimental study, and developing not only has high-strength light, insulation
And the inorganic heat preservation sheet material with fire-proof and water-proof advantage.
The content of the invention
In order to solve the above technical problems, one aspect of the present invention is：A kind of ultralight inorganic heat-insulation board is provided,
Its composition includes：Waterglass, silicon phosphate, silicon dioxide aerosol, silane coupler, bentonite, glass bead.
Further, 25 parts of waterglass, 9 parts of silicon phosphate, 8 parts of silicon dioxide aerosol, 11 parts of silane coupler, bentonite 21
Part, 18 parts of glass bead.
Further, the glass bead particle diameter is 0.3mm ~ 1.2mm.
Further, the silicon dioxide aerosol granularity 0.055mm ~ 0.4mm.
Further, the silane coupler is silane coupler KH -550.
The beneficial effects of the invention are as follows：A kind of ultralight inorganic heat-insulation board prepared using the composition of the present invention, is overcome
Conventional density of material is big, heat-insulating property is general, does not possess the shortcomings that fire-proof and water-proof, warming plate of the invention has lightweight height
By force, provided the foundation the advantages of insulation, fire-proof and water-proof for the development of warming plate.
Embodiment
Embodiment 1
Weigh 9 parts of silicon phosphate, 8 parts of silicon dioxide aerosol, silane coupler KH -550 respectively, 11 parts, 21 parts of bentonite, vitreous
18 parts of microballon, after mixing, add 25 parts of waterglass and stir, load mould, 90 DEG C, hardening time 4h of solidification temperature, system
Obtain warming plate sample of the present invention.
Embodiment 2
Weigh 8 parts of silicon phosphate, 7 parts of silicon dioxide aerosol, silane coupler KH -550 respectively, 12 parts, 20 parts of bentonite, vitreous
16 parts of microballon, after mixing, add 24 parts of waterglass and stir, load mould, 90 DEG C, hardening time 4h of solidification temperature, system
Obtain warming plate sample of the present invention.
Embodiment 2
（1）The measure of thermal conductivity factor：The sample that Examples 1 and 2 make and existing commercial samples are put into DRY300X heat conduction system
The thermal conductivity factor of number tester measurement sample, it is found that the thermal conductivity factor of the making sample of embodiment 1 is smaller.（2）The survey of dry density
It is fixed：By the sample that Examples 1 and 2 make with existing commercial samples according to GB/T5486-2008《Inorganic hard insulating product tries
Proved recipe method》Regulation carries out the measurement of dry density, it is found that the thermal conductivity factor of the making sample of embodiment 1 is small.（3）The survey of compression strength
It is fixed：The sample and existing commercial samples that Examples 1 and 2 are made, according to GB/T 5486-2008《Inorganic hard insulating product
Test method》Regulation carry out compressive strength test, take the compression strength average value of 6 test specimens, it is found that embodiment 1 makes sample
The thermal conductivity factor of product is small.（4）The measure of water absorption rate：By the sample that Examples 1 and 2 make with existing commercial samples with reference to GB/
T5486-2008《Inorganic hard insulating product test method》Specification, measuring and calculation water absorption rate have found that embodiment 1 makes sample
Water absorption rate it is small.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
The equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (5)
1. a kind of ultralight inorganic heat-insulation board, it is characterised in that the warming plate composition includes：Waterglass, silicon phosphate, titanium dioxide
Silicon aerosol, silane coupler, bentonite, glass bead.
2. a kind of ultralight inorganic heat-insulation board according to claim 1, it is characterised in that the composition is by weight
For 25 parts of waterglass, 9 parts of silicon phosphate, 8 parts of silicon dioxide aerosol, 11 parts of silane coupler, 21 parts of bentonite, glass bead 18
Part.
3. a kind of ultralight inorganic heat-insulation board according to claim 1, it is characterised in that the glass bead particle diameter is
0.3mm~1.2mm。
A kind of 4. ultralight inorganic heat-insulation board according to claim 1, it is characterised in that the silicon dioxide aerosol granularity
0.055mm~0.4mm。
5. a kind of ultralight inorganic heat-insulation board according to claim 1, it is characterised in that the silane coupler is that silane is even
Join agent KH -550.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442495.7A CN107352941A (en) | 2017-06-13 | 2017-06-13 | A kind of ultralight inorganic heat-insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710442495.7A CN107352941A (en) | 2017-06-13 | 2017-06-13 | A kind of ultralight inorganic heat-insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107352941A true CN107352941A (en) | 2017-11-17 |
Family
ID=60272860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710442495.7A Withdrawn CN107352941A (en) | 2017-06-13 | 2017-06-13 | A kind of ultralight inorganic heat-insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107352941A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108569884A (en) * | 2018-05-31 | 2018-09-25 | 佛山市高明区爪和新材料科技有限公司 | A kind of preparation method of Combined thermal insulative panel |
-
2017
- 2017-06-13 CN CN201710442495.7A patent/CN107352941A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108569884A (en) * | 2018-05-31 | 2018-09-25 | 佛山市高明区爪和新材料科技有限公司 | A kind of preparation method of Combined thermal insulative panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171117 |
|
| WW01 | Invention patent application withdrawn after publication |