CN107343355A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN107343355A CN107343355A CN201710729872.5A CN201710729872A CN107343355A CN 107343355 A CN107343355 A CN 107343355A CN 201710729872 A CN201710729872 A CN 201710729872A CN 107343355 A CN107343355 A CN 107343355A
- Authority
- CN
- China
- Prior art keywords
- liquid crystal
- layer
- layer structure
- polymer liquid
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 24
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 24
- 239000005264 High molar mass liquid crystal Substances 0.000 claims description 113
- 238000009413 insulation Methods 0.000 claims description 95
- 239000011248 coating agent Substances 0.000 claims description 68
- 238000000576 coating method Methods 0.000 claims description 68
- 239000004973 liquid crystal related substance Substances 0.000 claims description 23
- 239000002052 molecular layer Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 229920002521 macromolecule Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 description 20
- -1 polyparaphenylene Polymers 0.000 description 20
- 229920000728 polyester Polymers 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 8
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- 125000000033 alkoxyamino group Chemical group 0.000 description 4
- 125000006598 aminocarbonylamino group Chemical group 0.000 description 4
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 description 4
- 125000004682 aminothiocarbonyl group Chemical group NC(=S)* 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 description 4
- 150000007942 carboxylates Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- PEPBFCOIJRULGJ-UHFFFAOYSA-N 3h-1,2,3-benzodioxazole Chemical compound C1=CC=C2NOOC2=C1 PEPBFCOIJRULGJ-UHFFFAOYSA-N 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000005518 carboxamido group Chemical group 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 125000002349 hydroxyamino group Chemical group [H]ON([H])[*] 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920003366 poly(p-phenylene terephthalamide) Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VSSAADCISISCOY-UHFFFAOYSA-N 1-(4-furo[3,4-c]pyridin-1-ylphenyl)furo[3,4-c]pyridine Chemical compound C1=CN=CC2=COC(C=3C=CC(=CC=3)C3=C4C=CN=CC4=CO3)=C21 VSSAADCISISCOY-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical class C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001555 benzenes Chemical class 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Abstract
A circuit board comprises a first insulating layer structure, a first redistribution layer, a second insulating layer structure and a second redistribution layer. The first insulating layer structure has an upper surface and includes a first liquid crystal polymer layer. The first redistribution layer is located on an upper surface of the first insulating layer structure. The second insulating layer structure is located on the upper surface of the first insulating layer structure and covers the first redistribution layer. The second insulating layer structure has a top surface opposite to the upper surface and comprises a second liquid crystal polymer layer. The second redistribution layer is located on a top surface of the second insulating layer structure. This structure provides a high frequency circuit board having a low dielectric constant (dielectric constant between 2 and 4).
Description
Technical field
The invention relates to a kind of circuit board.Contain liquid crystal polymer (Liquid- in particular to one kind
Crystal Polymer, LCP) circuit board.
Background technology
Mobile device (mobile device) now, such as smart mobile phone (smart phone), tablet personal computer
(tablet computer) and notebook computer (laptop), its used central processing unit (Central
Processing Unit, CPU) clock pulse (clock rate) mostly more than Gigahertz (gigahertz, GHz) so that
It need coordinate the central processing unit of above-mentioned Gigahertz clock pulse using high-frequency circuit in current mobile device.And in order to meet
The demand of high-frequency circuit, existing mobile device need to reduce harmful effect caused by RC delay (RC delay).
The content of the invention
The aspect of the present invention provides a kind of circuit board, includes one first insulation layer structure, one first redistribution layer, one the
Two insulation layer structures and one second redistribution layer.First insulation layer structure has a upper surface and includes one first liquid crystal high score
Sublayer.First redistribution layer is located on the upper surface of the first insulation layer structure.Second insulation layer structure is located at the first insulating barrier knot
On the upper surface of structure and cover the first redistribution layer.Second insulation layer structure has the top surface relative to upper surface, and wraps
Containing one second polymer liquid crystal layer.Second redistribution layer is located on the top surface of the second insulation layer structure.
In one embodiment of the present invention, the first insulation layer structure also includes one first adhesion coating.First adhesion coating position
Between the first polymer liquid crystal layer and the first redistribution layer.
In one embodiment of the present invention, the first insulation layer structure also includes one the 3rd polymer liquid crystal layer and one second
Adhesion coating.Second adhesion coating is between the first polymer liquid crystal layer and the 3rd polymer liquid crystal layer.
In one embodiment of the present invention, the second insulation layer structure also includes one the 4th polymer liquid crystal layer and one the 3rd
Adhesion coating.3rd adhesion coating is between the second polymer liquid crystal layer and the 4th polymer liquid crystal layer.
In one embodiment of the present invention, the second insulation layer structure also includes a conductive hole.Conductive hole is electrically connected with the
One redistribution layer and the second redistribution layer.
The aspect of the present invention provides a kind of circuit board, includes one first insulation layer structure, one first redistribution layer, one the
Two insulation layer structures, one second redistribution layer, one the 3rd redistribution layer, one the 3rd insulation layer structure and one the 4th redistribution
Layer.First insulation layer structure has a first surface and the second surface relative to first surface, and the first insulating barrier knot
Structure includes one first polymer liquid crystal layer.First redistribution layer is located on the first surface of the first insulation layer structure.Second insulation
Rotating fields are located on the first surface of the first insulation layer structure and cover the first redistribution layer.Second insulation layer structure has relative
One second polymer liquid crystal layer is included in one the 3rd surface of first surface and the second insulation layer structure.Second redistribution layer is located at
On 3rd surface of the second insulation layer structure.3rd redistribution layer is located on the second surface of the first insulation layer structure.3rd is exhausted
Edge layer structure is located on the second surface of the first insulation layer structure and covers the 3rd redistribution layer.3rd insulation layer structure has
One the 3rd polymer liquid crystal layer is included relative to one the 4th surface of second surface and the 3rd insulation layer structure.4th redistribution
Layer is on the 4th surface of the 3rd insulation layer structure.
In one embodiment of the present invention, the first insulation layer structure is also comprising one first adhesion coating and one second adhesion
Layer.First adhesion coating is between the first polymer liquid crystal layer and the first redistribution layer and the second adhesion coating is located at the first liquid crystal height
Between molecular layer and the 3rd redistribution layer.
In one embodiment of the present invention, the first insulation layer structure also includes one the 4th polymer liquid crystal layer and one the 3rd
Adhesion coating.3rd adhesion coating is between the first polymer liquid crystal layer and the 4th polymer liquid crystal layer.
In one embodiment of the present invention, the second insulation layer structure also includes one the 5th polymer liquid crystal layer and one the 4th
Adhesion coating.4th adhesion coating is between the second polymer liquid crystal layer and the 5th polymer liquid crystal layer.
In one embodiment of the present invention, the 3rd insulation layer structure also includes one the 6th polymer liquid crystal layer and one the 5th
Adhesion coating.5th adhesion coating is between the 3rd polymer liquid crystal layer and the 6th polymer liquid crystal layer.
In one embodiment of the present invention, the first insulation layer structure also includes one first conductive hole.First conductive hole electricity
Property connection the first redistribution layer and the 3rd redistribution layer.
In one embodiment of the present invention, the second insulation layer structure also includes one second conductive hole.Second conductive hole electricity
Property connection the first redistribution layer and the second redistribution layer.
In one embodiment of the present invention, the 3rd insulation layer structure also includes one the 3rd conductive hole.3rd conductive hole electricity
Property connection the 3rd redistribution layer and the 4th redistribution layer.
Brief description of the drawings
For above and other purpose, feature, advantage and the embodiment of the present invention can be become apparent, appended accompanying drawing is said
It is bright as follows：
Fig. 1 illustrates the diagrammatic cross-section of the circuit board according to some embodiments of the present invention；
Fig. 2 illustrates the diagrammatic cross-section of the circuit board according to some embodiments of the present invention；
Fig. 3 illustrates the diagrammatic cross-section of the circuit board according to some embodiments of the present invention；
Fig. 4 illustrates the diagrammatic cross-section of the circuit board according to other embodiment of the present invention；
Fig. 5 illustrates the diagrammatic cross-section of the circuit board according to other embodiment of the present invention；
Fig. 6 illustrates the diagrammatic cross-section of the circuit board according to other embodiment of the present invention.
Embodiment
Multiple embodiments of the present invention, as clearly stated, the details in many practices will be disclosed with accompanying drawing below
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying accompanying drawing, one
A little known usual structures will be illustrated in a manner of simply illustrating in the accompanying drawings with element.
In this article, unless being particularly limited in interior text for article, otherwise " one " and "the" can refer to single or
It is multiple.It will be further appreciated that "comprising" used herein, " comprising ", " having " and similar vocabulary, indicate that it is remembered
Feature, region, integer, step, operation, element and/or the component of load, but it is not excluded for its described or extra one or more
Further feature, region, integer, step, operation, element, component, and/or group therein.
Referring to Fig. 1, Fig. 1 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 1 institutes
Show, circuit board 100 include one first insulation layer structure 110, one first redistribution layer 140, one second insulation layer structure 120 and
One second redistribution layer 150.First insulation layer structure 110 has an a first surface 110a and second surface 110b, and
One insulation layer structure 110 includes one first polymer liquid crystal layer 112.First redistribution layer 140 is located at the first insulation layer structure 110
First surface 110a on.Second insulation layer structure 120 is located on the first surface 110a of the first insulation layer structure 110 and covered
First redistribution layer 140, and the second insulation layer structure 120 has one the 3rd surface 120a relative to first surface 110a, its
In the second insulation layer structure 120 include one second polymer liquid crystal layer 122.Second redistribution layer 150 is located at the second insulating barrier knot
On 3rd surface 120a of structure 120.
In some embodiments of the present invention, circuit board 100 can be an one side harden structure.In some implementations of the present invention
In mode, the material of the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122 can include liquid crystal polymer and be selected from
Aromatic polyester (aromatic polyester), aromatic polyamide (aromatic polyamide), poly- paraphenylene terephthalamide
P-phenylenediamine (poly para-phenylene terephthalamide, PPTA), polyparaphenylene's benzo dioxazole (poly (p-
Phenylene-2,6-benzobisoxazole, PBO) and the copolymer of P-hydroxybenzoic acid and 6- hydroxyl -2- naphthoic acids
It is at least one of (poly (p-hydroxybenzoic acid-co-2-hydroxy-6-naphthoic acid)) or more
Kind, but be not limited thereto.In some embodiments of the present invention, the first polymer liquid crystal layer 112 and the second liquid crystal high score
The material of sublayer 122 may be the same or different.
In more detail, above-mentioned liquid crystal polymer can be soluble liquid crystal polymer, and this soluble liquid crystal polymer is logical
Cross the functional group of modification liquid crystal polymer and formed.For example, liquid crystal polymer is modified by way of adding or substituting
Functional group.Soluble liquid crystal polymer after functional group modifies can have following functional group, such as amino
(amino), amide groups (carboxamido), imido grpup (imido or imino), amidino groups (amidino), amino carbonyl amino
(aminocarbonylamino), aminothiocarbonyl (aminothiocarbonyl), amino carbonyl epoxide
(aminocarbonyloxy), amino-sulfonyl (aminosulfonyl), aminosulfonyl epoxide (aminosulfonyloxy),
Aminosulfonylamino (aminosulfonylamino), carboxylate (carboxyl ester), (carboxylate) amino
((carboxyl ester) amino), (alkoxy carbonyl) epoxide ((alkoxycarbonyl) oxy), alkoxy carbonyl
(alkoxycarbonyl), azanol base (hydroxyamino), alkoxy amino (alkoxyamino), cyanato-
(cyanato), isocyanate group (isocyanato) or its combination, but be not limited thereto.It is high compared to unmodified liquid crystal
Molecule, the solubility of soluble liquid crystal polymer is in specific solvent, higher than the liquid crystal polymer modified without functional group.
In one embodiment of this invention, it is solvable in the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122
Property liquid crystal polymer is formed by aromatic liquid-crystal polyester solution.Aromatic liquid-crystal polyester solution includes solvent and aromatic series liquid
Brilliant polyester, that is, aromatic liquid-crystal polyester has good solubility in a solvent, wherein the solid of aromatic liquid-crystal polyester into
Point percentage by weight for 1wt% to 85wt%, such as can be 5wt%, 15wt%, 25wt%, 35wt%, 45wt%,
55wt%, 65wt% or 75wt%.Specifically, aromatic liquid-crystal polyester has been subjected to the modification of functional group, and passes through functional group
Aromatic liquid-crystal polyester after modification can have a following functional group, for example, amino (amino), amide groups (carboxamido),
Imido grpup (imido or imino), amidino groups (amidino), amino carbonyl amino (aminocarbonylamino), aminothio
Carbonyl (aminothiocarbonyl), amino carbonyl epoxide (aminocarbonyloxy), amino-sulfonyl
(aminosulfonyl), aminosulfonyl epoxide (aminosulfonyloxy), aminosulfonylamino
(aminosulfonylamino), carboxylate (carboxyl ester), (carboxylate) amino ((carboxyl ester)
Amino), (alkoxy carbonyl) epoxide ((alkoxycarbonyl) oxy), alkoxy carbonyl (alkoxycarbonyl), azanol
Base (hydroxyamino), alkoxy amino (alkoxyamino), cyanato- (cyanato), isocyanate group (isocyanato)
Or its combination.Solvent in aromatic liquid-crystal polyester solution for example can be selected from by METHYLPYRROLIDONE, N, N- dimethyl
The group that acetamide, gamma-butyrolacton, dimethylformamide, butoxy ethanol and cellosolvo are formed.
In other embodiments of the invention, above-mentioned aromatic liquid-crystal polyester solution can be also comprising one or more additions
Agent.For example, additive includes inorganic filler, such as silica, aluminium hydroxide and calcium carbonate；High dielectric filler,
Such as barium titanate and strontium titanates；Whisker (whisker), such as potassium titanate and aluminium borate；Organic filler, the epoxy such as solidified
The acrylic acid series polymeric compounds of resin, the benzo birds droppings polyimide resin of interlinkage and interlinkage；Silane coupling agent；Antioxidant；And UV
Absorbent etc., but be not limited thereto.After removing the solvent in aromatic liquid-crystal polyester solution, that is, form polymer liquid crystal layer.
In the other embodiment of the present invention, the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122 can be with
Formed by membranaceous liquid crystal polymer.The material for forming membranaceous liquid crystal polymer includes liquid crystal polymer and selected from fragrant adoption
Ester, aromatic polyamide, PPTA, polyparaphenylene's benzo dioxazole and P-hydroxybenzoic acid and 6- hydroxyls
At least one of copolymer of base -2- naphthoic acids is a variety of, but is not limited thereto.In the other embodiment of the present invention,
Optionally polymer liquid crystal layer can be formed using soluble liquid crystal polymer or membranaceous liquid crystal polymer.
In some embodiments of the present invention, the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122 have
Good processability, heat resistance, low water absorbable and low-k (such as between 2 to 4), it is a kind of excellent high frequency base
Plate material.
In some embodiments of the present invention, the material of the first redistribution layer 140 and the second redistribution layer 150 can be
In copper, aluminium, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, chromium, manganese, cobalt, gold, tin, lead or stainless steel, or above metal material
At least two alloys mixed, but be not limited thereto.In some embodiments of the present invention, the first redistribution layer
140 and second the material of redistribution layer 150 may be the same or different.In some embodiments of the present invention, the first redistribution layer
140 surfaces contacted with the first polymer liquid crystal layer 112 can have between 0.2um to 5um roughness, such as can be 0.5um,
1um, 2um, 3um or 4um, to improve the adhesion between the first redistribution layer 140 and the first polymer liquid crystal layer 112.Together
Reason, the surface that the second redistribution layer 150 contacts with the second polymer liquid crystal layer 122 can also have between the coarse of 0.2um to 5um
Degree, such as can be 0.5um, 1um, 2um, 3um or 4um.
Referring to Fig. 2, Fig. 2 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 2 institutes
Show, circuit board 100a the first insulation layer structure 110 can further include one first adhesion coating 114.First adhesion coating 114 is located at
Between first polymer liquid crystal layer 112 and the first redistribution layer 140.In some embodiments of the present invention, the first adhesion coating
114 material can be by epoxy resin, phenoxy resin, acrylic resin, urethane resin, silicon rubber system resin, poly-
To ring diformazan benzene series resin, liquid crystal polymer, bismaleimide amine system resin or polyimide resin, or these resin materials
In at least two mixtures made by.In some embodiments of the present invention, can more be strengthened by the first adhesion coating 114
Adhesion between first polymer liquid crystal layer 112 and the first redistribution layer 140.In the other embodiment of the present invention, the
Also an adhesion coating (not shown) is can further include between one polymer liquid crystal layer 112 and the second redistribution layer 150, to improve
Adhesion between one polymer liquid crystal layer 112 and the second redistribution layer 150.
Referring to Fig. 3, Fig. 3 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 3 institutes
Show, circuit board 100b the first insulation layer structure 110 also includes one the 3rd polymer liquid crystal layer 116 and one second adhesion coating 118.
Second adhesion coating 118 is between the first polymer liquid crystal layer 112 and the 3rd polymer liquid crystal layer 116.As shown in figure 3, circuit
Plate 100b the second insulation layer structure 120 is also conductive comprising one the 4th polymer liquid crystal layer 124, one the 3rd adhesion coating 126 and one
Hole 129.3rd adhesion coating 126 is between the second polymer liquid crystal layer 122 and the 4th polymer liquid crystal layer 124.Conductive hole 129
Through the second polymer liquid crystal layer 122 of the 4th polymer liquid crystal layer 124, the 3rd adhesion coating 126 and part, and it is electrically connected with
First redistribution layer 140 and the second redistribution layer 150.In some embodiments of the present invention, the second adhesion coating 118 and the 3rd
The material of the material of adhesion coating 126 and the first adhesion coating 114 is same or like.3rd polymer liquid crystal layer 116 and the 4th liquid crystal
The material of macromolecule layer 124 and the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122 are same or like.Conductive hole
129 inside packing material can be same or like with the material of the first redistribution layer 140 and the second redistribution layer 150.In this hair
In bright other embodiment, it is viscous that one is also can further include between the 4th polymer liquid crystal layer 124 and the second redistribution layer 150
Layer (not shown), to improve the adhesion between the 4th polymer liquid crystal layer 124 and the second redistribution layer 150.
Referring to Fig. 4, Fig. 4 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 4 institutes
Show, circuit board 200 includes one first insulation layer structure 210, one first redistribution layer 240, one second insulation layer structure 220, one
Second redistribution layer 250, one the 3rd redistribution layer 260, one the 3rd insulation layer structure 230 and one the 4th redistribution layer 270.The
One insulation layer structure 210 has a first surface 210a and second surface 210b relative to first surface 210a, and first
Insulation layer structure 210 includes one first polymer liquid crystal layer 212.First redistribution layer 240 is located at the first insulation layer structure 210
On first surface 210a.Second insulation layer structure 220 is located on the first surface 210a of the first insulation layer structure 210 and covers
One redistribution layer 240, and the second insulation layer structure 220 has one the 3rd surface 220a relative to first surface 210a, wherein
Second insulation layer structure 220 includes one second polymer liquid crystal layer 222.Second redistribution layer 250 is located at the second insulation layer structure
On 220 the 3rd surface 220a.3rd redistribution layer 260 is located on the second surface 210b of the first insulation layer structure 210.3rd
Insulation layer structure 230 is located on the second surface 210b of the first insulation layer structure 210 and covers the 3rd redistribution layer 260, and the
Three insulation layer structures 230 have one the 4th surface 230a relative to second surface 210b, wherein the structure bag of the 3rd insulating barrier 230
Containing one the 3rd polymer liquid crystal layer 232.4th redistribution layer 270 is located on the 4th surface 230a of the 3rd insulation layer structure 230.
In some embodiments of the present invention, the table that the first redistribution layer 240 contacts with the first polymer liquid crystal layer 212
Face can have the roughness between 0.2um to 5um, such as can be 0.5um, 1um, 2um, 3um or 4um, be divided again with improving first
Adhesion between the polymer liquid crystal layer 212 of layer of cloth 240 and first.Similarly, the second redistribution layer 250 and the second liquid crystal polymer
The surface and the 4th redistribution that the surface of the contact of layer 222, the 3rd redistribution layer 260 contact with the first polymer liquid crystal layer 212
The surface that layer 270 contacts with the 3rd polymer liquid crystal layer 232 can also have the roughness between 0.2um to 5um, such as can be
0.5um, 1um, 2um, 3um or 4um.
Referring to Fig. 5, Fig. 5 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 5 institutes
Show, circuit board 200a the first insulation layer structure 210 also includes one first adhesion coating 214a and one second adhesion coating 214b.First
Adhesion coating 214a is between the first polymer liquid crystal layer 212 and the first redistribution layer 240, and the second adhesion coating 214b is positioned at the
Between one polymer liquid crystal layer 212 and the 3rd redistribution layer 260.In some embodiments of the present invention, the first adhesion is passed through
Layer 214a can more strengthen the adhesion between the first polymer liquid crystal layer 212 and the first redistribution layer 240.Similarly, is passed through
Two adhesion coating 214b can also more strengthen the adhesion between the first polymer liquid crystal layer 212 and the 3rd redistribution layer 260.At this
In the other embodiment of invention, between the second polymer liquid crystal layer 222 and the second redistribution layer 250 and the 3rd liquid crystal high score
Also an adhesion coating (not shown) can be included between the redistribution layer 270 of sublayer 232 and the 4th respectively, to improve the 4th liquid crystal polymer
Adhesion between the redistribution layer 150 of layer 124 and second between the 3rd polymer liquid crystal layer 232 and the 4th redistribution layer 270.
Referring to Fig. 6, Fig. 6 illustrates the diagrammatic cross-section of circuit board according to some embodiments of the present invention.Such as Fig. 6 institutes
Show, circuit board 200b the first insulation layer structure 210 also comprising one the 4th polymer liquid crystal layer 216, one the 3rd adhesion coating 218 and
One conductive hole 219.3rd adhesion coating 218 is between the first polymer liquid crystal layer 212 and the 4th polymer liquid crystal layer 216.Lead
Electric hole 219 is through the first adhesion coating 214a, the first polymer liquid crystal layer 212, the 3rd adhesion coating 218, the 4th polymer liquid crystal layer
The 216 and second adhesion coating 214b, and it is electrically connected with the first redistribution layer 240 and the 3rd redistribution layer 260.In certain of the present invention
In a little embodiments, the first polymer liquid crystal layer 212 and the 4th polymer liquid crystal layer can be increased by the 3rd adhesion coating 218
Adhesion between 216.
As shown in fig. 6, circuit board 200b the second insulation layer structure 220 also includes one the 5th polymer liquid crystal layer 224, one
4th adhesion coating 226 and a conductive hole 229.4th adhesion coating 226 is located at the second polymer liquid crystal layer 222 and the 5th liquid crystal high score
Between sublayer 224.Conductive hole 229 runs through the second liquid crystal of the 5th polymer liquid crystal layer 224, the 4th adhesion coating 226 and part
Macromolecule layer 222, and it is electrically connected with the first redistribution layer 240 and the second redistribution layer 250.In some embodiments of the present invention
In, the knot between the second polymer liquid crystal layer 222 and the 5th polymer liquid crystal layer 224 can be increased by the 4th adhesion coating 226
With joint efforts.In the other embodiment of the present invention, it can also divide between the 5th polymer liquid crystal layer 224 and the second redistribution layer 250
Not Bao Han an adhesion coating (not shown), to improve the combination between the 5th polymer liquid crystal layer 224 and the second redistribution layer 250
Power.
As shown in fig. 6, circuit board 200b the 3rd insulation layer structure 230 also includes one the 6th polymer liquid crystal layer 234, one
5th adhesion coating 236 and a conductive hole 239.5th adhesion coating 236 is positioned at the 3rd polymer liquid crystal layer 232 and the 6th liquid crystal
Between macromolecule layer 234.Conductive hole 239 runs through the 3rd of the 6th polymer liquid crystal layer 234, the 5th adhesion coating 236 and part
Polymer liquid crystal layer 232, and it is electrically connected with the 3rd redistribution layer 260 and the 4th redistribution layer 270.In some implementations of the present invention
In mode, it can be increased between the 3rd polymer liquid crystal layer 232 and the 6th polymer liquid crystal layer 234 by the 5th adhesion coating 236
Adhesion.In the other embodiment of the present invention, between the 6th polymer liquid crystal layer 234 and the 4th redistribution layer 270 also
An adhesion coating (not shown) can be included respectively, to improve the knot between the 6th polymer liquid crystal layer 234 and the 4th redistribution layer 270
With joint efforts.
In some embodiments of the present invention, the 4th polymer liquid crystal layer 216, the 5th polymer liquid crystal layer 224 and
The material of six polymer liquid crystal layers 234 it is identical with the material of the first polymer liquid crystal layer 112 and the second polymer liquid crystal layer 122 or
It is similar.The material and the first adhesion coating 214a and second of 3rd adhesion coating 218, the 4th adhesion coating 226 and the 5th adhesion coating 236 are viscous
The material for layer 214b is same or like.The inside packing material of conductive hole 219,229,239 can be filled out with the inside of conductive hole 129
It is same or like to fill material.
In addition, various circuit boards of the present invention can be combined without departing from the spirit of the present invention to be formed it is thicker
Circuit board.For example, insulation layer structure can include more than two layers of polymer liquid crystal layer, but not limited to this, can according to for
The design requirement of different-thickness, the thickness of the number of plies therein, material and individual layer is arbitrarily adjusted, to coordinate the gold that its surface is carried
Belong to the design of distribution, and with the optimal ability for bearing high voltage or high current.
It finally it should be emphasised that, in the case where the spacing of electronic product size micro and circuit is reduced, through the present invention
Disclosed content, circuit design, the thickness of circuit board of the elasticity adjustment containing polymer liquid crystal layer can be coordinated.Utilize
Liquid crystal polymer with above-mentioned many excellent specific properties, reaching simplified processing procedure, with low-k, (dielectric is normal with one kind is provided
Number is between 2 to 4) high-frequency circuit board, and then electronic product is played higher efficiency.
Although the present invention is disclosed above with embodiment, the better embodiment of the present invention is the foregoing is only, not
It is any to be familiar with this those skilled in the art to limit the present invention, without departing from the spirit and scope of the present invention, when various equalizations can be made
Change and modification, it should all belong to the covering scope of the present invention, therefore protection scope of the present invention is when regarding appended claims institute
The scope defined is defined.
Claims (13)
1. a kind of circuit board, it is characterised in that include：
One first insulation layer structure, has a upper surface, and first insulation layer structure includes one first polymer liquid crystal layer；
One first redistribution layer, on the upper surface of first insulation layer structure；
One second insulation layer structure, on the upper surface of first insulation layer structure and first redistribution layer is covered, and
With the top surface relative to the upper surface, second insulation layer structure includes one second polymer liquid crystal layer；And
One second redistribution layer, on the top surface of second insulation layer structure.
2. circuit board according to claim 1, it is characterised in that first insulation layer structure is also comprising one first adhesion
Layer, between first polymer liquid crystal layer and first redistribution layer.
3. circuit board according to claim 1, it is characterised in that first insulation layer structure is also high comprising one the 3rd liquid crystal
Molecular layer and one second adhesion coating, and second adhesion coating is located at first polymer liquid crystal layer and the 3rd polymer liquid crystal layer
Between.
4. circuit board according to claim 1, it is characterised in that second insulation layer structure is also high comprising one the 4th liquid crystal
Molecular layer and one the 3rd adhesion coating, and the 3rd adhesion coating is located at second polymer liquid crystal layer and the 4th polymer liquid crystal layer
Between.
5. circuit board according to claim 1, it is characterised in that second insulation layer structure also includes a conductive hole, electricity
Property connects first redistribution layer and second redistribution layer.
6. a kind of circuit board, it is characterised in that include：
One first insulation layer structure, there is a first surface and the second surface relative to the first surface, this is first exhausted
Edge layer structure includes one first polymer liquid crystal layer；
One first redistribution layer, on the first surface of first insulation layer structure；
One second insulation layer structure, on the first surface of first insulation layer structure and cover first redistribution layer,
And include one second polymer liquid crystal layer with one the 3rd surface relative to the first surface, second insulation layer structure；
One second redistribution layer, on the 3rd surface of second insulation layer structure；
One the 3rd redistribution layer, on the second surface of first insulation layer structure；
One the 3rd insulation layer structure, on the second surface of first insulation layer structure and cover the 3rd redistribution layer,
And include one the 3rd polymer liquid crystal layer with one the 4th surface relative to the second surface, the 3rd insulation layer structure；
One the 4th redistribution layer, on the 4th surface of the 3rd insulation layer structure.
7. circuit board according to claim 6, it is characterised in that first insulation layer structure also includes one first adhesion coating
With one second adhesion coating, first adhesion coating be located between first polymer liquid crystal layer and first redistribution layer and this second
Adhesion coating is located between first polymer liquid crystal layer and the 3rd redistribution layer.
8. circuit board according to claim 6, it is characterised in that first insulation layer structure is also high comprising one the 4th liquid crystal
Molecular layer and one the 3rd adhesion coating, and the 3rd adhesion coating is located at first polymer liquid crystal layer and the 4th polymer liquid crystal layer
Between.
9. circuit board according to claim 6, it is characterised in that second insulation layer structure is also high comprising one the 5th liquid crystal
Molecular layer and one the 4th adhesion coating, and the 4th adhesion coating is located at second polymer liquid crystal layer and the 5th polymer liquid crystal layer
Between.
10. circuit board according to claim 6, it is characterised in that the 3rd insulation layer structure also includes one the 6th liquid crystal
Macromolecule layer and one the 5th adhesion coating, and the 5th adhesion coating is located at the 3rd polymer liquid crystal layer and the 6th liquid crystal polymer
Between layer.
11. circuit board according to claim 6, it is characterised in that first insulation layer structure is also conductive comprising one first
Hole, it is electrically connected with first redistribution layer and the 3rd redistribution layer.
12. circuit board according to claim 6, it is characterised in that second insulation layer structure is also conductive comprising one second
Hole, it is electrically connected with first redistribution layer and second redistribution layer.
13. circuit board according to claim 6, it is characterised in that the 3rd insulation layer structure is also conductive comprising one the 3rd
Hole, it is electrically connected with the 3rd redistribution layer and the 4th redistribution layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106123857 | 2017-07-17 | ||
| TW106123857A TWI634820B (en) | 2017-07-17 | 2017-07-17 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107343355A true CN107343355A (en) | 2017-11-10 |
Family
ID=60214351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710729872.5A Withdrawn CN107343355A (en) | 2017-07-17 | 2017-08-23 | Circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107343355A (en) |
| TW (1) | TWI634820B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110746887A (en) * | 2018-07-24 | 2020-02-04 | 佳胜科技股份有限公司 | Circuit board structure and composition for forming insulating substrate |
| US11044802B2 (en) | 2017-02-16 | 2021-06-22 | Azotek Co., Ltd. | Circuit board |
| US11225563B2 (en) | 2017-02-16 | 2022-01-18 | Azotek Co., Ltd. | Circuit board structure and composite for forming insulating substrates |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6759600B2 (en) * | 2001-04-27 | 2004-07-06 | Shinko Electric Industries Co., Ltd. | Multilayer wiring board and method of fabrication thereof |
| TWI437931B (en) * | 2011-12-16 | 2014-05-11 | Prologium Technology Co Ltd | Pcb structure |
-
2017
- 2017-07-17 TW TW106123857A patent/TWI634820B/en active
- 2017-08-23 CN CN201710729872.5A patent/CN107343355A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11044802B2 (en) | 2017-02-16 | 2021-06-22 | Azotek Co., Ltd. | Circuit board |
| US11225563B2 (en) | 2017-02-16 | 2022-01-18 | Azotek Co., Ltd. | Circuit board structure and composite for forming insulating substrates |
| CN110746887A (en) * | 2018-07-24 | 2020-02-04 | 佳胜科技股份有限公司 | Circuit board structure and composition for forming insulating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201909704A (en) | 2019-03-01 |
| TWI634820B (en) | 2018-09-01 |
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Application publication date: 20171110 |