CN107331489A - A kind of manufacturing process of combination electrode electronic ceramic component - Google Patents
A kind of manufacturing process of combination electrode electronic ceramic component Download PDFInfo
- Publication number
- CN107331489A CN107331489A CN201710340860.3A CN201710340860A CN107331489A CN 107331489 A CN107331489 A CN 107331489A CN 201710340860 A CN201710340860 A CN 201710340860A CN 107331489 A CN107331489 A CN 107331489A
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- CN
- China
- Prior art keywords
- ceramics
- base metal
- slurry
- coating
- electronic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
Abstract
The present invention relates to the technical field of electronic component, more particularly to a kind of manufacturing process of combination electrode electronic ceramic component, it comprises the following steps：Prepare ceramic chip；Ceramics is surface-treated, and is cleaned and is dried；Base metal slurry is coated on ceramics surface by the way of traditional silk-screened, with traditional high temperature reduction technique, the coated electrode that first layer is in close contact with porcelain body is formed；Second layer base metal coating is carried out in above-mentioned coating surface using the method for electric arc spraying or vacuum arc magnetron sputtering, purpose makes electronic component have the function of being welded with wire, meets completed electronic elements and makes requirement.Because materials at two layers uses base metal slurry, manufacturing cost is low.
Description
Technical field
The present invention relates to the technical field of electronic component, more particularly to a kind of manufacture of combination electrode electronic ceramic component
Technique.
Background technology
The Electronic Performance of electronic ceramics will be by can just display, commonly referred to as with the close affixed metal electrode of its porcelain body
For interior electrode.Traditional method is that silver paste is made using silver powder in the industry at present, then with porcelain body surface is screen printed onto, then passes through height
Temperature reduction（Usual more than 500 DEG C）Into interior electrode.This method major defect is：Ag material cost is high.
Some Enterprises are attempted to starch base metal such as copper into the electrocondution slurry as silk-screen printing, but will be in reducing atmosphere bar
Sintered under part, equipment is expensive, and due under the conditions of high temperature reducing atmospheres, also there are special requirement to ceramics, using being difficult to promote.
Some Enterprises are attempted the method for base metal vacuum arc magnetron sputtering doing interior electrode, because vacuum sputtering is each only
Can thin one layer of the book of covering, it is necessary to repeatedly can be only achieved thickness requirement, inefficiency, equipment is expensive, using being difficult to promote.And this hair
The method of bright magnetron sputtering does interior electrode, is on the basis of ceramics surface coating base metal slurry, then to be sputtered, simply
Function is welding conductors, and the conducting function of super-high-current impact is main to be undertaken by ceramics surface coating base metal.
The content of the invention
It is an object of the invention to provide a kind of low cost, more preferably a kind of system of combination electrode electronic ceramic component of performance
Make technique.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that：The technique comprises the following steps：
（1）Prepare ceramic chip；
（2）Ceramics is surface-treated, and is cleaned and is dried；
（3）By the way of traditional silk-screened base metal slurry is coated on ceramics surface；
（4）By 450-850C high temperature reductions, the first layer base metal and the coated electrode of porcelain body close contact of forming step 3；
Sinter in atmosphere；
（5）Second layer base metal coating is carried out in above-mentioned coating surface using the method for electric arc spraying/vacuum arc magnetron sputtering,
Make electronic component porcelain body that there is the function of being welded with conductor；
It is used as preferred, above-mentioned steps（3）The base metal slurry of coating, is aluminium paste, zinc slurry or copper slurry base metal slurry.
It is used as preferred, above-mentioned steps（5）Material therefor be CU, zinc, stainless steel, TI, nickel, tin in any one or
Its alloy base metal.
The Inner electrodes of above process ceramic chip are completed, are directly welded with wire, in the manufactured goods after encapsulating, solidification,
Applied to electronic equipment.
Piezo-resistance ceramics, thermistor ceramics, the capacitor ceramics of above process are completed, is directly welded with wire,
The manufactured goods after encapsulating, solidification, applied to electronic equipment.
Piezo-resistance ceramics, thermistor ceramics, the capacitor ceramics of above process are completed, surface mount elements are directly made,
Applied to electronic equipment.
The advantage of the invention is that
1. using base metal slurry using be screen printed onto that substrate surface printed, manufacturing cost is low；
2. base metal coating procedure be divided into twice, substrate surface formation two levels coating, for the first time coating base metal compared with
Thickness, energization ability by force, solves noble metal such as silver in the prior art, brushes the thickness high problem of cost, second layer coating meets lead
Solderability, can use the methods such as electric arc spraying, vacuum arc magnetron sputtering to be processed, meet the requirement of welding lead；
3. because first layer printing slurry is thicker, product electrical property is improved, and electric current passes through etc., and ability is significantly improved.
Embodiment
Implement one：
Prepare after piezo-resistance ceramics (base material), be put into roller and rotate about 10 minutes, take out, ceramics surface is entered with running water
Row cleaning, is then dried, and base metal slurry, the first layer of forming step 3 are coated on ceramics surface by the way of silk-screen printing
The coating that base metal is in close contact with porcelain body；Second layer base metal painting is carried out on ceramics surface using the method for electric arc spraying again
Cover, make electronic component that there is the function of being welded with wire；Then using traditional silver paste reducing process.Silk-screen printing uses slurry
For aluminium paste.After the completion of interior electrode fabrication, the finished product after welded, encapsulating, solidification, indices meet GB/T10193, GB/
T10194, that is, IEC61051-1, IEC61051-2 requirement.Also meet GB/T18802.1, GB/T18802.331 simultaneously
Namely IEC61643-1, IEC61643-331 standard requirement, have reached international higher level.
Implement two：
After the thermistor ceramics (base material) of preparation, it is put into roller and rotates about 5 minutes, takes out, with running water to ceramics surface
Cleaned, then dried, base metal slurry, the first of forming step 3 are coated on ceramics surface by the way of silk-screen printing
The coating that layer base metal is in close contact with porcelain body, this process need not provide reducing atmosphere；Then vacuum arc magnetic is used again
The method for controlling sputtering carries out second layer base metal coating on ceramics surface, electronic component is had the function of being welded with wire.
Silk-screen printing uses slurry for zinc, after the completion of interior electrode fabrication, and the finished product after welded, encapsulating, solidification, test indices are accorded with
Close JB/T9476《Thermistor general technical specifications》Standard requirement.Surface mount elements are directly then made, applied to electronic equipment.
Implement three：
Prepare after capacitor ceramics, rotated about 15 minutes with being put into roller, take out, ceramics surface is carried out clearly with running water
Wash, then dry, base metal slurry, the low-priced gold of first layer of forming step 3 are coated on ceramics surface by the way of silk-screen printing
The coating that category is in close contact with porcelain body；Second layer base metal coating is carried out on ceramics surface using the method for silk-screen printing again, made
Electronic component has the function of being welded with wire, and silk-screen printing is that zinc starches basic material using slurry.Interior electrode fabrication is complete
Cheng Hou, the finished product after welded, encapsulating, solidification, capacitor index meets every international standard.
Certainly, better embodiment of the present invention is these are only, the use scope of the present invention is not limited with this, therefore, it is every
Equivalent change is made in the principle of the invention to should be included within the scope of the present invention.
Claims (6)
1. a kind of manufacturing process of combination electrode electronic ceramic component, it is characterised in that comprise the following steps：
（1）Prepare ceramic chip；
（2）Ceramics is surface-treated, and is cleaned and is dried；
（3）By the way of traditional silk-screened base metal slurry is coated on ceramics surface；
（4）By 450-850C high temperature reductions, the first layer base metal and the coated electrode of porcelain body close contact of forming step 3；
Sinter in atmosphere；
（5）Second layer base metal coating is carried out in above-mentioned coating surface using the method for electric arc spraying/vacuum arc magnetron sputtering,
Make electronic component porcelain body that there is the function of being welded with conductor.
2. spraying coating process according to claim 1, it is characterised in that：Above-mentioned steps（3）The base metal slurry of coating, is aluminium
Slurry, zinc slurry or copper slurry base metal slurry.
3. spraying coating process according to claim 1, it is characterised in that：Above-mentioned steps（5）Material therefor is CU, zinc, stainless
Any one in steel, TI, nickel, tin or its alloy base metal.
4. the coating processes according to any one in claim 1-3, it is characterised in that：Complete above process ceramic chip
Inner electrodes, directly with wire weld, by encapsulating, solidification after manufactured goods, applied to electronic equipment.
5. the spraying coating process according to any one in claim 1-3, it is characterised in that：Complete the pressure-sensitive electricity of above process
Ceramics, thermistor ceramics, capacitor ceramics are hindered, is directly welded with wire, in the manufactured goods after encapsulating, solidification, is applied to
Electronic equipment.
6. according to the spraying coating process described in any one in claim 1-3, it is characterised in that：Complete the piezo-resistance of above process
Ceramics, thermistor ceramics, capacitor ceramics, directly make surface mount elements, applied to electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710340860.3A CN107331489A (en) | 2017-05-16 | 2017-05-16 | A kind of manufacturing process of combination electrode electronic ceramic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710340860.3A CN107331489A (en) | 2017-05-16 | 2017-05-16 | A kind of manufacturing process of combination electrode electronic ceramic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107331489A true CN107331489A (en) | 2017-11-07 |
Family
ID=60193610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710340860.3A Pending CN107331489A (en) | 2017-05-16 | 2017-05-16 | A kind of manufacturing process of combination electrode electronic ceramic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107331489A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599669A (en) * | 2020-05-12 | 2020-08-28 | 西安工业大学 | Method for manufacturing ohmic electrode suitable for heating coating material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538347A (en) * | 1984-06-18 | 1985-09-03 | Gte Laboratories Incorporated | Method for making a varistor package |
| CN1313616A (en) * | 2000-03-14 | 2001-09-19 | 株式会社村田制作所 | Ceramic electronic components with leading terminals |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
-
2017
- 2017-05-16 CN CN201710340860.3A patent/CN107331489A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4538347A (en) * | 1984-06-18 | 1985-09-03 | Gte Laboratories Incorporated | Method for making a varistor package |
| CN1313616A (en) * | 2000-03-14 | 2001-09-19 | 株式会社村田制作所 | Ceramic electronic components with leading terminals |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599669A (en) * | 2020-05-12 | 2020-08-28 | 西安工业大学 | Method for manufacturing ohmic electrode suitable for heating coating material |
| CN111599669B (en) * | 2020-05-12 | 2023-01-31 | 西安工业大学 | Method for manufacturing ohmic electrode suitable for heating coating material |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171107 |
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| RJ01 | Rejection of invention patent application after publication |