CN107325725A - A kind of use for electronic products oil polish and preparation method thereof - Google Patents
A kind of use for electronic products oil polish and preparation method thereof Download PDFInfo
- Publication number
- CN107325725A CN107325725A CN201710697404.4A CN201710697404A CN107325725A CN 107325725 A CN107325725 A CN 107325725A CN 201710697404 A CN201710697404 A CN 201710697404A CN 107325725 A CN107325725 A CN 107325725A
- Authority
- CN
- China
- Prior art keywords
- parts
- electronic products
- atoleine
- cyanate
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D191/00—Coating compositions based on oils, fats or waxes; Coating compositions based on derivatives thereof
- C09D191/06—Waxes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/324—Alkali metal phosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of use for electronic products oil polish, include following component according to mass fraction:5 10 parts of bisphenol A type epoxy resin, 10 12 parts of atoleine, 48 parts of cyanate, 37 parts of silica, 46 parts of polyethylene glycol, 24 parts of sodium phosphate, 13 parts of titanium dioxide, 35 parts of peanut protein, 26 parts of tung oil, 13 parts of film reinforcing agent, 30 36 parts of organic solvent, 13 parts of stabilizer, oil polish of the present invention can effectively lift the glossiness on electronic product surface, prepare simple and convenient, effectively reduce the problem of appearance caused by long-time is using rubbing with temperature change, and using raw material without harmful components, ensure electronic product uses safety, reduce environmental pollution.
Description
Technical field
The present invention relates to a kind of printing supplies, in particular to a kind of use for electronic products oil polish and preparation method thereof.
Background technology
Oil polish refers to be coated in printed matter surface, plays increase glossiness, wearability, a kind of liquid of water proofing property.On
Gloss oil includes the kind such as water lustering oil, oiliness oil polish, UV oil polishes, alcohol-soluble oil polish, and present domestic application is most
It is water lustering oil, because it possesses extraordinary environmental-protecting performance, but during the use of oil polish, because electronic product exists
The outward appearance printed article caused by frequently rubbing with temperature change is easier to during use smudgy, gloss decline causes normal
Use it is impacted, make usage experience reduce, at the same using the excessive oil polish of chemistry addition can cause product using safety
It is affected, causes environmental pollution.
The content of the invention
The invention provides a kind of use for electronic products oil polish and preparation method thereof.
To achieve the above object, the present invention provides following technical scheme:
A kind of use for electronic products oil polish, includes following component according to mass fraction:
5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica, poly- second
4-6 parts of glycol, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, 1-3 parts of film reinforcing agent, have
30-36 parts of machine solvent, 1-3 parts of stabilizer.
Further, following composition is included according to mass fraction:
5 parts of bisphenol A type epoxy resin, 10 parts of atoleine, 4 parts of cyanate, 3 parts of silica, 4 parts of polyethylene glycol, phosphorus
Sour 2 parts of sodium, 1 part of titanium dioxide, 3 parts of peanut protein, 2 parts of tung oil, 1 part of film reinforcing agent, 30 parts of organic solvent, 1 part of stabilizer.
Further, following composition is included according to mass fraction:
7 parts of bisphenol A type epoxy resin, 11 parts of atoleine, 6 parts of cyanate, 5 parts of silica, 5 parts of polyethylene glycol, phosphorus
Sour 3 parts of sodium, 2 parts of titanium dioxide, 4 parts of peanut protein, 4 parts of tung oil, 2 parts of film reinforcing agent, 33 parts of organic solvent, 2 parts of stabilizer.
Further, following composition is included according to mass fraction:
10 parts of bisphenol A type epoxy resin, 12 parts of atoleine, 8 parts of cyanate, 7 parts of silica, 6 parts of polyethylene glycol, phosphorus
Sour 4 parts of sodium, 3 parts of titanium dioxide, 5 parts of peanut protein, 6 parts of tung oil, 3 parts of film reinforcing agent, 36 parts of organic solvent, 3 parts of stabilizer.
Further, a kind of preparation method of use for electronic products oil polish, is comprised the following steps:
1), by 5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica,
4-6 parts of polyethylene glycol, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, film reinforcing agent 1-3
Part, 30-36 parts of organic solvent, 1-3 parts of stabilizer, add water and mix to liquid, and are sufficiently stirred for that mixture A is made;
2), by after mixture A stirrings made from step one, it is placed in agitator, persistently stirs 6-8 minutes, stop stirring
After filter insoluble impurity, take clear liquid encapsulation i.e. usable.
The beneficial effects of the invention are as follows:
1st, electronic product outward appearance can effectively be reduced by the influence used, it is ensured that use persistence.
2nd, the materials safety used is harmless, does not interfere with the safety that uses of product, more environmentally friendly.
Embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described,
Obviously, described embodiment, only a part of embodiment of the invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made,
Belong to the scope of protection of the invention.
Embodiment one:
A kind of use for electronic products oil polish, includes following component according to mass fraction:
5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica, poly- second
4-6 parts of glycol, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, 1-3 parts of film reinforcing agent, have
30-36 parts of machine solvent, 1-3 parts of stabilizer.
The preparation method of above-mentioned formula:
1), by 5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica,
4-6 parts of polyethylene glycol, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, film reinforcing agent 1-3
Part, 30-36 parts of organic solvent, 1-3 parts of stabilizer, add water and mix to liquid, and are sufficiently stirred for that mixture A is made;
2), by after mixture A stirrings made from step one, it is placed in agitator, persistently stirs 6-8 minutes, stop stirring
After filter insoluble impurity, take clear liquid encapsulation i.e. usable.
Embodiment two:
A kind of use for electronic products oil polish includes following component according to mass fraction:
5 parts of bisphenol A type epoxy resin, 10 parts of atoleine, 4 parts of cyanate, 3 parts of silica, 4 parts of polyethylene glycol, phosphorus
Sour 2 parts of sodium, 1 part of titanium dioxide, 3 parts of peanut protein, 2 parts of tung oil, 1 part of film reinforcing agent, 30 parts of organic solvent, 1 part of stabilizer.
Embodiment three:
A kind of use for electronic products oil polish, includes following composition according to mass fraction:
7 parts of bisphenol A type epoxy resin, 11 parts of atoleine, 6 parts of cyanate, 5 parts of silica, 5 parts of polyethylene glycol, phosphorus
Sour 3 parts of sodium, 2 parts of titanium dioxide, 4 parts of peanut protein, 4 parts of tung oil, 2 parts of film reinforcing agent, 33 parts of organic solvent, 2 parts of stabilizer.
Example IV:
A kind of use for electronic products oil polish, includes following composition according to mass fraction:
10 parts of bisphenol A type epoxy resin, 12 parts of atoleine, 8 parts of cyanate, 7 parts of silica, 6 parts of polyethylene glycol, phosphorus
Sour 4 parts of sodium, 3 parts of titanium dioxide, 5 parts of peanut protein, 6 parts of tung oil, 3 parts of film reinforcing agent, 36 parts of organic solvent, 3 parts of stabilizer.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It may be appreciated other embodiment.
Claims (5)
1. a kind of use for electronic products oil polish, it is characterised in that:Include following component according to mass fraction:
5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica, polyethylene glycol
4-6 parts, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, 1-3 parts of film reinforcing agent, You Jirong
30-36 parts of agent, 1-3 parts of stabilizer.
2. a kind of use for electronic products oil polish according to claim 1, it is characterised in that:Include according to mass fraction as follows
Composition:
5 parts of bisphenol A type epoxy resin, 10 parts of atoleine, 4 parts of cyanate, 3 parts of silica, 4 parts of polyethylene glycol, sodium phosphate 2
Part, 1 part of titanium dioxide, 3 parts of peanut protein, 2 parts of tung oil, 1 part of film reinforcing agent, 30 parts of organic solvent, 1 part of stabilizer.
3. a kind of use for electronic products oil polish according to claim 1, it is characterised in that:Include according to mass fraction as follows
Composition:
7 parts of bisphenol A type epoxy resin, 11 parts of atoleine, 6 parts of cyanate, 5 parts of silica, 5 parts of polyethylene glycol, sodium phosphate 3
Part, 2 parts of titanium dioxide, 4 parts of peanut protein, 4 parts of tung oil, 2 parts of film reinforcing agent, 33 parts of organic solvent, 2 parts of stabilizer.
4. a kind of use for electronic products oil polish according to claim 1, it is characterised in that:Include according to mass fraction as follows
Composition:
10 parts of bisphenol A type epoxy resin, 12 parts of atoleine, 8 parts of cyanate, 7 parts of silica, 6 parts of polyethylene glycol, sodium phosphate
4 parts, 3 parts of titanium dioxide, 5 parts of peanut protein, 6 parts of tung oil, 3 parts of film reinforcing agent, 36 parts of organic solvent, 3 parts of stabilizer.
5. a kind of preparation method of use for electronic products oil polish as described in claim 1-4 is any, it is characterised in that:Comprising such as
Lower step:
1), by 5-10 parts of bisphenol A type epoxy resin, 10-12 parts of atoleine, 4-8 parts of cyanate, 3-7 parts of silica, poly- second
4-6 parts of glycol, 2-4 parts of sodium phosphate, 1-3 parts of titanium dioxide, 3-5 parts of peanut protein, 2-6 parts of tung oil, 1-3 parts of film reinforcing agent, have
30-36 parts of machine solvent, 1-3 parts of stabilizer, add water and mix to liquid, and are sufficiently stirred for that mixture A is made;
2), by after mixture A stirrings made from step one, it is placed in agitator, persistently stirs 6-8 minutes, stop mistake after stirring
Insoluble impurity is filtered, takes clear liquid encapsulation to can be used.
Priority Applications (1)
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CN201710697404.4A CN107325725A (en) | 2017-08-15 | 2017-08-15 | A kind of use for electronic products oil polish and preparation method thereof |
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CN201710697404.4A CN107325725A (en) | 2017-08-15 | 2017-08-15 | A kind of use for electronic products oil polish and preparation method thereof |
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CN107325725A true CN107325725A (en) | 2017-11-07 |
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CN201710697404.4A Pending CN107325725A (en) | 2017-08-15 | 2017-08-15 | A kind of use for electronic products oil polish and preparation method thereof |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104910712A (en) * | 2015-06-16 | 2015-09-16 | 合肥启华环保科技有限公司 | High-gloss water-based gloss oil and preparation method thereof |
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2017
- 2017-08-15 CN CN201710697404.4A patent/CN107325725A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104910712A (en) * | 2015-06-16 | 2015-09-16 | 合肥启华环保科技有限公司 | High-gloss water-based gloss oil and preparation method thereof |
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Application publication date: 20171107 |