CN107313048A - A kind of electroplating technology of IH ceramic cookers - Google Patents
A kind of electroplating technology of IH ceramic cookers Download PDFInfo
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- CN107313048A CN107313048A CN201710317635.8A CN201710317635A CN107313048A CN 107313048 A CN107313048 A CN 107313048A CN 201710317635 A CN201710317635 A CN 201710317635A CN 107313048 A CN107313048 A CN 107313048A
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- ceramic
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- electroplating technology
- ceramic cooker
- cooker
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
Abstract
The invention belongs to ceramic field of electroplating, and in particular to a kind of electroplating technology of IH ceramic cookers.The electroplating technology of the present invention comprises the following steps：Oil removing degreasing-roughening-sensitization-chemical plating-plating.Pass through the electroplating technology of the IH ceramic cookers of the present invention, the good silver film of uniform, fine and close, adhesion can be formed on ceramic cooker surface, so that the service life of IH ceramic pans significantly extends, fraction defective is substantially reduced, it can also efficiently reduce manufacturing procedure, and then can be effectively cost-effective and improve production efficiency.By the electroplating technology of the present invention, Electromagnetic Heating mode can be reliably used in ceramic inner vessel, add the security reliability used, energy-efficient, accurate temperature control can be realized, be the new taste of kitchen life increase.
Description
Technical field
The invention belongs to ceramic field of electroplating, and in particular to a kind of electroplating technology of IH ceramic cookers.
Background technology
Current IH ceramic cookers are all the schemes that magnetic conductive film is transferred using water, or magnetic conductive film is directly printed on into pan
Bottom, then carries out high temperature sintering, allows the material welding of magnetic conductive film, so that and Ceramic bond.The defect of such scheme is a lot of, tool
Body surface it is now following some：(1) magnetic conductive film of different batches printing is it cannot be guaranteed that density, the uniformity of thickness；(2) magnetic conductive film with
The adhesion of ceramics with use time with being deteriorated；(3) whole technological process is various, adds the probability of fraction defective.
The content of the invention
, should it is an object of the invention to provide a kind of electroplating technology of IH ceramic cookers in order to solve the deficiencies in the prior art
Technique can form the good silver film of uniform, fine and close, adhesion on ceramic cooker surface so that the service life of IH ceramic pans
Significantly extension.
The purpose of the present invention is achieved through the following technical solutions：
A kind of electroplating technology of IH ceramic cookers, comprises the following steps：
(1) oil removing degreasing：Ceramic cooker is placed in 40-60 DEG C of degreasing fluid and cleans 5-15min, ceramic cooker surface is removed
Various greasy dirts, the degreasing fluid on ceramic cooker surface is removed after taking-up with air pressure gun, is then cleaned and is dried with distilled water；
(2) it is roughened：Ceramic cooker is placed in coarsening solution and is roughened 2-3min, ceramic cooker surface is removed with air pressure gun after taking-up
Coarsening solution, then cleaned and dried with distilled water；
(3) it is sensitized：Ceramic cooker bottom is placed on etch 10-15min in sensitizing solution, ceramic cooker lower surface is produced
Raw rough fixing point, the sensitizing solution of residual is removed using air pressure gun, is then cleaned and is dried with distilled water after taking-up；
(4) chemical plating：Under the conditions of 30 DEG C, 20-30min is soaked into ceramic cooker bottom in chemical plating fluid, in ceramics
Pan surface forms layer of metal film；
(5) electroplate：Using electrolysis, ceramic cooker bottom is positioned in electroplate liquid and electroplates 25-35min, in ceramic cooker
Lower surface forms the good silver film of uniform, fine and close, adhesion.
Preferably, the degreasing fluid includes 20-30g/L Na2CO3, 30-50g/L Na2HPO4With 3-7g/L fat
Sour FMEE sodium sulfonate.
Preferably, the coarsening solution includes 50-60g/L CrO3, 110-120mL/L HF and 110-130ml/L
H2SO4。
Preferably, the sensitizing solution includes 10-20g/L SnCl2With 0.5-0.9ml/L HCl.
Preferably, the chemical plating fluid is 10-14 comprising volume ratio：1 silver ammino solution and reducing solution.
Preferably, the silver ammino solution is main by AgNO of the concentration for 3-7g/L3Solution, concentration are 0.3-0.7g/L ammonia
Water, concentration constitute for 2-4g/L KOH solution and water, wherein the percent by volume of each material is as follows：
3-7g/L AgNO3Solution 20-35%
0.3-0.7g/L ammoniacal liquor 20-30%
2-4g/L KOH solution 1-5%
Surplus is water.
It is preferred that, the reducing solution mainly be 1.0-2.0g/L by concentration glucose solution, concentration be 0.1-0.3g/L
Tartaric acid and water composition, wherein the percent by volume of each material is as follows：
1.0-2.0g/L glucose solution 0.1-0.2%
0.1-0.3g/L tartaric acid solution 0.01-0.03%
Surplus is water.
Preferably, the metal film described in step (4) is silverskin.
Preferably, the electroplate liquid includes 130-150g/L imidazoles, 160-180g/L sulfosalicylic acid, 15-25g/L
Silver nitrate and 1.25-2.0g/L silica.
Preferably, step 5) plating conditions it is as follows：Anode material is the silver strip that purity is 99.99%；Operating voltage is
30kV, cathode current is 0.2A/dm2。
In the present invention, chemical plating and the metal level electroplated are identical metal levels, first pass through chemical plating at ceramic pan bottom
Portion formed layer silver film, for next step plating provide be electrolysed required for negative electrode, then by electroplating thin
Silver film uniform, that fine and close, adhesion is good is formed on silver film, silver film is firmly combined with ceramic pot bottom.
Beneficial effects of the present invention：
By the electroplating technology of the IH ceramic cookers of the present invention, uniform, fine and close, combination can be formed on ceramic cooker surface
The good silver film of power so that the service life of IH ceramic pans significantly extends, and fraction defective is substantially reduced, also effectively reduces and adds
Work process, and then can be effectively cost-effective and improve production efficiency.By the electroplating technology of the present invention, electromagnetism can be added
Hot mode is reliably used in ceramic inner vessel, adds the security reliability used, can realize energy-efficient, accurate temperature control,
Being lived for kitchen increases new taste.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in more detail.
Embodiment 1
A kind of electroplating technology of IH ceramic cookers, is comprised the following steps that：
(1) oil removing degreasing：Ceramic cooker is placed in 50 DEG C of degreasing fluids and cleans 10min, the degreasing fluid includes 25g/L's
Na2CO3, 40g/L Na2HPO4With 5g/L fatty acid methyl ester ethoxylate sodium sulfonate, the various of ceramic cooker surface are removed
Greasy dirt, the degreasing fluid on ceramic cooker surface is removed with air pressure gun, is then cleaned and is dried with distilled water after taking-up；
(2) it is roughened：Under room temperature condition, ceramic cooker is placed on the CrO comprising 55g/L3, 115mL/L HF and 120ml/L
H2SO4Coarsening solution in be roughened 2min, the coarsening solution on ceramic cooker surface is removed after taking-up with air pressure gun, it is then clear with distilled water
Wash and dry；
(3) it is sensitized：Ceramic cooker bottom is placed on the SnCl comprising 15g/L2In 0.7ml/L HCl sensitizing solution
Etch 12min, makes ceramic cooker lower surface produce rough fixing point, removes the sensitization of residual after taking-up using air pressure gun
Liquid, is then cleaned and is dried with distilled water；
(4) chemical plating：By volume percent, by 27%5g/L AgNO3Solution, 25%0.5g/L ammoniacal liquor, 3%
3g/L KOH solution and water surplus is well mixed to form silver ammino solution；By volume percent, by 0.15%1.5g/L grape
Reducing solution is formed after sugar juice, 0.02%0.2g/L tartaric acid solution and water surplus mixing, silver ammino solution and reduction are also pressed
Volume 12:1 it is well mixed form chemical plating fluid, under the conditions of 30 DEG C, ceramic cooker bottom is soaked in chemical plating fluid
25min, one layer of silverskin is formed on the surface of ceramic cooker；
(5) electroplate：Electroplate liquid comprising 140g/L imidazoles, 170g/L sulfosalicylic acid, 20g/L silver nitrate and
1.6g/L silica, anode material is the silver strip that purity is 99.99%, and operating voltage is 30kV, and cathode current is 0.2A/
dm2, ceramic cooker bottom is electroplated 30min on this condition, uniform, fine and close, adhesion formed in ceramic cooker lower surface
Good silver film.
Embodiment 2
A kind of electroplating technology of IH ceramic cookers, is comprised the following steps that：
(1) oil removing degreasing：Ceramic cooker is placed in 40 DEG C of degreasing fluids and cleans 15min, the degreasing fluid includes 20g/L's
Na2CO3, 30g/L Na2HPO4With 3g/L auxiliary agent fatty acid methyl ester ethoxylate sodium sulfonate, ceramic cooker surface is removed
Various greasy dirts, the degreasing fluid on ceramic cooker surface is removed with air pressure gun, is then cleaned and is dried with distilled water after taking-up；
(2) it is roughened：Under room temperature condition, ceramic cooker is placed on the CrO comprising 50g/L3, 110mL/L HF and 110ml/L
H2SO4Coarsening solution in be roughened 3min, the coarsening solution on ceramic cooker surface is removed after taking-up with air pressure gun, it is then clear with distilled water
Wash and dry；
(3) it is sensitized：Ceramic cooker bottom is placed on the SnCl comprising 10g/L2In 0.9ml/L HCl sensitizing solution
Etch 15min, makes ceramic cooker lower surface produce rough fixing point, removes the sensitization of residual after taking-up using air pressure gun
Liquid, is then cleaned and is dried with distilled water；
(4) chemical plating：By volume percent, by 35%3g/L AgNO3Solution, 30%0.3g/L ammoniacal liquor, 5%
2g/L KOH solution and water surplus is well mixed to form silver ammino solution；By volume percent, by 0.2%1.0g/L grape
Reducing solution is formed after sugar juice, 0.01%0.3g/L tartaric acid solution and water surplus mixing, silver ammino solution and reduction are also pressed
Volume 14:1 it is well mixed form chemical plating fluid, under the conditions of 30 DEG C, ceramic cooker bottom is soaked in chemical plating fluid
20min, one layer of silverskin is formed on the surface of ceramic cooker；
(5) electroplate：Electroplate liquid comprising 130g/L imidazoles, 160g/L sulfosalicylic acid, 15g/L silver nitrate and
1.25g/L silica, anode material is the silver strip that purity is 99.99%, and operating voltage is 30kV, and cathode current is
0.2A/dm2, ceramic cooker bottom is electroplated 35min on this condition, uniform, fine and close, knot formed in ceramic cooker lower surface
Good silver film with joint efforts.
Embodiment 3
A kind of electroplating technology of IH ceramic cookers, is comprised the following steps that：
(1) oil removing degreasing：Ceramic cooker is placed in 60 DEG C of degreasing fluids and cleans 5min, the degreasing fluid includes 30g/L's
Na2CO3, 50g/L Na2HPO4With 7g/L fatty acid methyl ester ethoxylate sodium sulfonate, the various of ceramic cooker surface are removed
Greasy dirt, the degreasing fluid on ceramic cooker surface is removed with air pressure gun, is then cleaned and is dried with distilled water after taking-up；
(2) it is roughened：Under room temperature condition, ceramic cooker is placed on the CrO comprising 60g/L3, 120mL/L HF and 130ml/L
H2SO4Coarsening solution in be roughened 3min, the coarsening solution on ceramic cooker surface is removed after taking-up with air pressure gun, it is then clear with distilled water
Wash and dry；
(3) it is sensitized：Ceramic cooker bottom is placed on the SnCl comprising 20g/L2In 0.5ml/L HCl sensitizing solution
Etch 10min, makes ceramic cooker lower surface produce rough fixing point, removes the sensitization of residual after taking-up using air pressure gun
Liquid, is then cleaned and is dried with distilled water；
(4) chemical plating：By volume percent, by 20%7g/L AgNO3Solution, 20%0.7g/L ammoniacal liquor, 1%
4g/L KOH solution and water surplus is well mixed to form silver ammino solution；By volume percent, by 0.1%2.0g/L grape
Reducing solution is formed after sugar juice, 0.03%0.1g/L tartaric acid solution and water surplus mixing, silver ammino solution and reduction are also pressed
Volume 10:1 it is well mixed form chemical plating fluid, under the conditions of 30 DEG C, ceramic cooker bottom is soaked in chemical plating fluid
30min, one layer of silverskin is formed on the surface of ceramic cooker；
(5) electroplate：Electroplate liquid comprising 150g/L imidazoles, 180g/L sulfosalicylic acid, 25g/L it is silver nitrate,
2.0g/L silica and anode material are the silver strip that purity is 99.99%, and operating voltage is 30kV, and cathode current is
0.2A/dm2, ceramic cooker bottom is electroplated 25min on this condition, uniform, fine and close, knot formed in ceramic cooker lower surface
Good silver film with joint efforts.
Claims (9)
1. a kind of electroplating technology of IH ceramic cookers, it is characterised in that comprise the following steps：
(1) oil removing degreasing：Ceramic cooker is placed in 40-60 DEG C of degreasing fluid and cleans 5-15min, each of ceramic cooker surface is removed
Greasy dirt is planted, the degreasing fluid on ceramic cooker surface is removed after taking-up with air pressure gun, is then cleaned and dried with distilled water；
(2) it is roughened：Ceramic cooker is placed in coarsening solution and is roughened 2-3min, the thick of ceramic cooker surface is removed with air pressure gun after taking-up
Change liquid, then cleaned and dried with distilled water；
(3) it is sensitized：Ceramic cooker bottom is placed on etch 10-15min in sensitizing solution, produces ceramic cooker lower surface recessed
Convex uneven fixing point, the sensitizing solution of residual is removed using air pressure gun, is then cleaned and is dried with distilled water after taking-up；
(4) chemical plating：Under the conditions of 30 DEG C, 20-30min is soaked into ceramic cooker bottom in chemical plating fluid, in ceramic cooker
Surface forms layer of metal film；
(5) electroplate：Using electrolysis, ceramic cooker bottom is placed in electroplate liquid and electroplates 25-35min, in ceramic cooker bottom
Surface forms silver film.
2. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that the degreasing fluid includes 20-
30g/L Na2CO3, 30-50g/L Na2HPO4With 3-7g/L fatty acid methyl ester ethoxylate sodium sulfonate.
3. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that the coarsening solution includes 50-
60g/L CrO3, 110-120mL/L HF and 110-130ml/L H2SO4。
4. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that the sensitizing solution includes 10-
20g/L SnCl2With 0.5-0.9ml/L HCl.
5. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that the chemical plating fluid includes volume
Than for 10-14：1 silver ammino solution and reducing solution.
6. the electroplating technology of IH ceramic cookers according to claim 5, it is characterised in that the silver ammino solution is main by dense
Spend the AgNO for 3-7g/L3KOH solution and the water composition that ammoniacal liquor that solution, concentration are 0.3-0.7g/L, concentration are 2-4g/L, its
In each material percent by volume it is as follows：20-35%3-7g/L AgNO3Solution, 20-30%0.3-0.7g/L ammoniacal liquor, 1-
5%2-4g/L KOH solution and water surplus.
7. the electroplating technology of IH ceramic cookers according to claim 5, it is characterised in that the reducing solution is main by concentration
The tartaric acid and water that are 0.1-0.3g/L for 1.0-2.0g/L glucose solution, concentration are constituted, wherein the volume hundred of each material
Divide ratio as follows：0.1-0.2%1.0-2.0g/L glucose solution, 0.01-0.03%0.1-0.3g/L tartaric acid solution and
Water surplus.
8. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that the electroplate liquid includes 130-
150g/L imidazoles, 160-180g/L sulfosalicylic acid, 15-25g/L silver nitrate and 1.25-2.0g/L silica.
9. the electroplating technology of IH ceramic cookers according to claim 1, it is characterised in that step 5) plating conditions such as
Under：Anode material is the silver strip that purity is 99.99%；Operating voltage is 30kV, and cathode current is 0.2A/dm2。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317635.8A CN107313048A (en) | 2017-05-08 | 2017-05-08 | A kind of electroplating technology of IH ceramic cookers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317635.8A CN107313048A (en) | 2017-05-08 | 2017-05-08 | A kind of electroplating technology of IH ceramic cookers |
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| CN107313048A true CN107313048A (en) | 2017-11-03 |
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ID=60185532
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
| CN113818061A (en) * | 2021-09-23 | 2021-12-21 | 镇江锦兴表面工程技术有限公司 | Surface electroplating process for ceramic product |
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| KR20040080466A (en) * | 2003-03-11 | 2004-09-20 | 주식회사 엘지화학 | Electroplating Solution for Forming Silver Thin Film and Method for Forming Silver Thin Film Using the Solution |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
| CN113818061A (en) * | 2021-09-23 | 2021-12-21 | 镇江锦兴表面工程技术有限公司 | Surface electroplating process for ceramic product |
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