CN107301261A - Simulated based on COMSOL temperature models and calculate Laser Processing and the method in temperature field in welding process - Google Patents

Simulated based on COMSOL temperature models and calculate Laser Processing and the method in temperature field in welding process Download PDF

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Publication number
CN107301261A
CN107301261A CN201611268954.6A CN201611268954A CN107301261A CN 107301261 A CN107301261 A CN 107301261A CN 201611268954 A CN201611268954 A CN 201611268954A CN 107301261 A CN107301261 A CN 107301261A
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comsol
temperature
model
laser
temperature field
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刘曰利
洪习何
程娜
陈韬
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Wuhan Bo Union Technology Co Ltd
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Wuhan Bo Union Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/36Circuit design at the analogue level
    • G06F30/367Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • G06F30/23Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]

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  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention belongs to laser machine and welding field, and in particular to a kind of simulated based on COMSOL temperature models calculates Laser Processing and the universality method in temperature field in welding process, it is characterised in that comprise the following steps:1)Transient temperature field model is set up using COMSOL softwares;2)Introduce LASER Light Source;3)The solid physical model of handled material is set up, and assigns model relevant physicochemical attribute;4)Set model initial and border thermal source condition;5)Grid division is simultaneously calculated.The present invention in COMSOL finite element softwares by loading customized Gauss heat source model, numerical simulation is carried out to the distribution of polymer/metal material laser field of welding temperature using COMSOL softwares, obtain field of welding temperature figure, predict the temperature of weldment each point, it is simple to operate, experimental period and cost is greatly reduced, alignment confirms that knowing the regularity of distribution of polymer/metal material laser field of welding temperature, control welding quality and performance provides theoretical direction and technical support.

Description

Laser Processing and temperature field in welding process are calculated based on the simulation of COMSOL temperature models Method
Technical field
The invention belongs to laser welding and manufacture field, and in particular to one kind is calculated based on the simulation of COMSOL temperature models to swash Light processes the method with temperature field in welding process.
Background technology
As science and technology constantly improves, the progress of material industry is also promoted, the requirement to material is more and more subtilized Change, lightweight and multifunction.Two or more different materials are subjected to Composite and have become new material One of development trend, the complex effect of generation has very big attraction, how to allow material to combine and has given play to respective advantage, It is always in the problem of discussion.
Noncontact is carried out using laser and is welded into one of best solution, it can significantly reduce workpiece Heat affected area;It can realize and be accurately positioned welding;Realize the welding on complex geometry position;Because welding spot size is small, make Obtain in circuit board, be possibly realized in the part welding of connector and flexible PCB;In addition, the potential bridging phenomenon between solder joint is big To reduce, welding quality and reliability are greatly improved.Therefore, laser non-contact welding technology can be widely applied to microelectronics and add The industry fields such as work, automobile, consumer electronics, optic communication, machinery, aviation, packaging.
But laser welding is one quick without uniform Thermal Cycling, temperature during being heated or cooled near weld seam Spend gradient larger, the technological parameter and temperature field situation cost too expensive of laser welding, and operation are determined by testing Difficulty is big, complex procedures, therefore the regularity of distribution of accurate understanding laser welding temperature field, theoretically Guiding Practice, to control Welding quality and performance have important practical significance.
The content of the invention
It is a kind of based on COMSOL present invention aims at providing for the deficiency of existing laser welding temperature field analogue simulation Temperature model simulation calculates Laser Processing and the method in temperature field in welding process, and wherein COMSOL softwares possess succinct close friend's Operation interface, can load customized Gauss heat source model, it is adaptable to polymer/metal material laser welding temperature field distribution Numerical simulation, and solve with this difficult point in background technology.
To achieve the above object, the technical solution adopted in the present invention is:One kind simulates meter based on COMSOL temperature models Calculate Laser Processing and the method in temperature field in welding process, it is characterised in that comprise the following steps:
1)Transient temperature field model is set up using COMSOL softwares;
2)Introduce LASER Light Source;
3)The solid physical model of handled material is set up, and assigns model corresponding material properties;
4)Set model initial and border thermal source condition;
5)Grid division is simultaneously calculated.
In such scheme, step 1)New established model is selected for three-dimensional laser heating-up temperature field model, and Selecting research type For transient state.
In such scheme, step 2)LASER Light Source is introduced by loading Gauss heat source model, heating radius is 1-3.5 Mm, laser power are 1-5 kW, and the simulation to different-energy density laser light source can be achieved.
In such scheme, step 3)Metal material is set as copper, polymeric material is epoxy glass laminates pressing plate, wherein metal The specification of material copper is the mm of mm × 0.1 of 10 ~ 50 mm × 10 ~ 50 ~ 1.5, and the specification of polymer epoxy glass cloth laminated board is 10 ~50 mm×10~50 mm×0.1~1.5 mm;The physical parameter of definition material, the physical parameter of every kind of material includes normal pressure heat Appearance, density and thermal conductivity factor.In such scheme, step 4)Set metal and polymer formation association, and laser direct irradiation When, whole workpiece all with environment heat insulation, between two parts be solid heat transfer above and below workpiece.
In such scheme, step 5)According to the specification of chosen material, in order to reach the precision of solution, it is desirable to which unit size is The 1/4-1/5 of spot size, according to the type of model, the mode of selection mesh generation is to scan;Setting calculates total duration 0.2-1 s, step-length is 0.001-0.01 s.
Beneficial effects of the present invention are as follows:The present invention in COMSOL finite element softwares by loading customized Gauss heat Source model, carries out numerical simulation to the distribution of polymer/metal material laser field of welding temperature using COMSOL softwares, is welded Jointing temp figure, predicts the temperature of weldment each point, simple to operate, and experimental period and cost is greatly reduced, and alignment confirms The regularity of distribution, control welding quality and performance for knowing polymer/metal material laser field of welding temperature provide theoretical direction And technical support.
Brief description of the drawings
Fig. 1 is the general flow chart of the present invention.
Fig. 2 is the physical parameter chart of metal material of copper in COMSOL numerical simulations.
Fig. 3 is the physical parameter chart of polymeric material epoxy glass cloth laminated board in COMSOL numerical simulations.
Fig. 4(a)It is gaussian laser pulse curve figure in COMSOL.
Fig. 4(b)It is laser scanning function curve diagram in COMSOL.
Fig. 4(c)It is laser energy density distribution map in COMSOL.
Fig. 5 is geometric mould mesh generation figure in COMSOL numerical simulations.
Analog temperature when Fig. 6 is 0.02 s of copper surface under different spot radius of the COMSOL in Step=0.02 s Field figure(The kw of power 3, the s of cycle 0.1).
Fig. 7 is gained analog temperature figure after the completion of embodiment 1 is calculated.
Fig. 8 is gained analog temperature figure after the completion of embodiment 2 is calculated.
Fig. 9 is gained analog temperature figure after the completion of embodiment 3 is calculated.
Embodiment
For a better understanding of the present invention, with reference to the embodiment content that the present invention is furture elucidated, but the present invention Content is not limited solely to the following examples.
Embodiment 1
It is a kind of based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, comprise the following steps:
(1)The foundation of heat source model:
Into software main interface, select " model guide ", newly-built three-dimensional laser heating physical field model, and select " to study " as wink State.The increase function in " definition ", defines Gaussian pulse function and waveform, so as to set up the circular thermal source mould of mobile Gauss Type.Setting laser power is 3 kW, and spot radius are 2.5 mm, and the laser action cycle is 0.1 s.
(2)The foundation of model:
Setting model size is the mm of the mm of 20 mm × 20 × 1(Solid 1)With the mm of the mm of 20 mm × 20 × 3(Solid 2), adjust The angle position of whole solid so that combined closely above and below being formed therebetween.
(3)Initial and boundary condition:
When setting laser direct irradiation, whole geometrical model all with environment heat insulation, between two parts be solid above and below solid Heat transfer modes, initial temperature is 298.15 K;It is the logical face of heat to set the direct shadow surface of laser.
(4)The setting of material property parameter:
Solid 1 is clicked on, " copper " is searched in COMSOL databases, and be given to solid 1;Solid 2 is clicked on, is set Its normal pressure thermal capacitance, density and thermal conductivity factor.After being provided with, by two solid formation associations.
(5)Mesh generation:
The mode of selection mesh generation is scans, and number of unit is 20.
(6)Calculate:
Into research, in " step 1:Set material calculation as 0.01 s in " setting " of transient state ", total time is 0.1 s, and is examined Whether look into has parameter setting mistake, clicked if inerrancy "=calculate " enter calculating.After the completion of calculating, to meter in " result " Count according to being analyzed and processed.
Obtained by the present embodiment during analog temperature, copper hot face temperature is 904 K, and temperature is simulated after the completion of calculating Spend field figure as shown in Figure 7.
Embodiment 2
It is a kind of based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, comprise the following steps:
(1)The foundation of heat source model:
Into software main interface, select " model guide ", newly-built three-dimensional laser heating physical field model, and select " to study " as wink State.The increase function in " definition ", defines Gaussian pulse function and waveform, so as to set up the circular thermal source mould of mobile Gauss Type.Setting laser power is 3 kW, and spot radius are 2.5 mm, and the laser action cycle is 0.1 s.
(2)The foundation of model:
Setting model size is the mm of the mm of 20 mm × 20 × 1(Solid 1)With the mm of the mm of 20 mm × 20 × 3(Solid 2), adjust The angle position of whole solid so that combined closely above and below being formed therebetween.
(3)Initial and boundary condition:
When setting laser direct irradiation, whole geometrical model all with environment heat insulation, between two parts be solid above and below solid Heat transfer modes, initial temperature is 298.15 K;It is the logical face of heat to set the direct shadow surface of laser.
(4)The setting of material property parameter:
Solid 1 is clicked on, " copper " is searched in COMSOL databases, and be given to solid 1;Solid 2 is clicked on, is set Its normal pressure thermal capacitance, density and thermal conductivity factor.After being provided with, by two solid formation associations.
(5)Mesh generation:
The mode of selection mesh generation is scans, and number of unit is 20.
(6)Calculate:
Into research, in " step 1:Set material calculation as 0.01 s in " setting " of transient state ", total time is 0.4 s, and is examined Whether look into has parameter setting mistake, clicked if inerrancy "=calculate " enter calculating.After the completion of calculating, to meter in " result " Count according to being analyzed and processed.
Obtained by the present embodiment during analog temperature, copper hot face temperature is 1327 K, is simulated after the completion of calculating Temperature field figure is as shown in Figure 8.
Embodiment 3
It is a kind of based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, comprise the following steps:
(1)The foundation of heat source model:
Into software main interface, select " model guide ", newly-built three-dimensional laser heating physical field model, and select " to study " as wink State.The increase function in " definition ", defines Gaussian pulse function and waveform, so as to set up the circular thermal source mould of mobile Gauss Type.Setting laser power is 1 kW, and spot radius are 2.5 mm, and the laser action cycle is 0.1 s.
(2)The foundation of model:
Setting model size is the mm of the mm of 20 mm × 20 × 1(Solid 1)With the mm of the mm of 20 mm × 20 × 3(Solid 2), adjust The angle position of whole solid so that combined closely above and below being formed therebetween.
(3)Initial and boundary condition:
When setting laser direct irradiation, whole geometrical model all with environment heat insulation, between two parts be solid above and below solid Heat transfer modes, initial temperature is 298.15 K;It is the logical face of heat to set the direct shadow surface of laser.
(4)The setting of material property parameter:
Solid 1 is clicked on, " copper " is searched in COMSOL databases, and be given to solid 1;Solid 2 is clicked on, is set Its normal pressure thermal capacitance, density and thermal conductivity factor.After being provided with, by two solid formation associations.
(5)Mesh generation:
The mode of selection mesh generation is scans, and number of unit is 20.
(6)Calculate:
Into research, in " step 1:Set material calculation as 0.01 s in " setting " of transient state ", total time is 0.4 s, and is examined Whether look into has parameter setting mistake, clicked if inerrancy "=calculate " enter calculating.After the completion of calculating, to meter in " result " Count according to being analyzed and processed.
Obtained by the present embodiment during analog temperature, copper hot face temperature is 478 K, and temperature is simulated after the completion of calculating Spend field figure as shown in Figure 9.
Obviously, above-described embodiment is only intended to clearly illustrate made example, and the not limitation to embodiment.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change or change therefore amplified Move within still in the protection domain of the invention.

Claims (6)

1. simulated based on COMSOL temperature models and calculate Laser Processing and the method in temperature field in welding process, it is characterised in that Comprise the following steps:
1)Transient temperature field model is set up using COMSOL softwares;
2)Introduce LASER Light Source;
3)The solid physical model of handled material is set up, and assigns model corresponding material properties;
4)Set model initial and border thermal source condition;
5)Grid division is simultaneously calculated.
2. simulated based on COMSOL temperature models calculate Laser Processing and temperature field in welding process according to claim 1 Method, it is characterised in that:The step 1)Transient temperature field model be three-dimensional laser heating-up temperature field model.
3. according to claim 1 based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, its feature It is, step 2)Introduce LASER Light Source by loading Gauss heat source model, heating radius is that 1-3.5 mm, laser power are 1- 5 kW, can be achieved the simulation to different-energy density laser light source.
4. according to claim 1 based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, its feature It is, step 3)Metal material is set as copper, polymeric material is epoxy glass laminates pressing plate, the specification of wherein metal material of copper is The mm of mm × 0.1 of 10 ~ 50 mm × 10 ~ 50 ~ 1.5, the specification of polymer epoxy glass cloth laminated board is 10 ~ 50 mm × 10 ~ 50 mm×0.1~1.5 mm;The physical parameter of definition material, the physical parameter of every kind of material includes normal pressure thermal capacitance, density and heat conduction system Number.
5. according to claim 1 based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, its feature It is, step 4)Metal and polymer formation association are set, and during laser direct irradiation, whole workpiece is all exhausted with ambient heat Between two parts it is solid heat transfer above and below edge, workpiece.
6. according to claim 1 based on methods of the COMSOL to Simulating Calculation of Temperature Field in laser beam welding, its feature It is, step 5)According to the specification of chosen material, in order to reach the precision of solution, it is desirable to which unit size is the 1/4- of spot size 1/5, according to the type of model, the mode of selection mesh generation is to scan;It is 0.2-1 s to set and calculate total duration, and step-length is 0.001-0.01 s。
CN201611268954.6A 2016-12-31 2016-12-31 Simulated based on COMSOL temperature models and calculate Laser Processing and the method in temperature field in welding process Pending CN107301261A (en)

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Cited By (14)

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CN108038288A (en) * 2017-12-01 2018-05-15 南昌航空大学 A kind of Forecasting Methodology and system of nano core-shell particle temperature field
CN109635442A (en) * 2018-12-13 2019-04-16 武汉理工大学 A kind of face inner mold thermo-electric device construction design method based on COMSOL software
CN109800524A (en) * 2019-01-29 2019-05-24 福州大学 Automobile wind shield glass molding simulation method based on COMSOL Multiphysics
CN110209066A (en) * 2019-05-05 2019-09-06 珠海格力电器股份有限公司 Control method, device and the equipment of soldering furnace
CN110309530A (en) * 2019-04-18 2019-10-08 中国水产科学研究院渔业机械仪器研究所 A method of course of defrosting is simulated using COMSOL software emulation and optimizes thawing technique
CN111222256A (en) * 2020-02-26 2020-06-02 天津理工大学 Numerical simulation method for predicting selective laser melting single-melting-channel molding defects
CN111797547A (en) * 2019-03-20 2020-10-20 东汉新能源汽车技术有限公司 Method for calculating temperature field of mold
CN112668212A (en) * 2020-09-02 2021-04-16 国网内蒙古东部电力有限公司检修分公司 Finite element-based method for analyzing overflow characteristics of grounding electrode under different soil models
CN113282976A (en) * 2021-04-30 2021-08-20 重庆大学 Powder bed construction method based on COMSOL
CN113436691A (en) * 2021-05-27 2021-09-24 重庆大学 Method for predicting molten pool distribution of molten/solidified metal powder based on COMSOL
CN115544936A (en) * 2022-03-07 2022-12-30 深圳荣耀智能机器有限公司 Method and device for determining plate brazing temperature field distribution and computer readable storage medium
CN115889346A (en) * 2022-12-22 2023-04-04 中国人民解放军海军航空大学青岛校区 Laser-based airplane lap joint structure cleaning method and electronic equipment
CN115906555A (en) * 2022-10-12 2023-04-04 中建二局安装工程有限公司 COMSOL-based prediction method for residual stress and leakage magnetic field thereof in welding process
CN116564453A (en) * 2023-06-01 2023-08-08 哈尔滨工业大学 Laser parameter optimization method and system for temperature field distribution of laser irradiation first wall material

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Cited By (20)

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Publication number Priority date Publication date Assignee Title
CN108038288A (en) * 2017-12-01 2018-05-15 南昌航空大学 A kind of Forecasting Methodology and system of nano core-shell particle temperature field
CN109635442A (en) * 2018-12-13 2019-04-16 武汉理工大学 A kind of face inner mold thermo-electric device construction design method based on COMSOL software
CN109635442B (en) * 2018-12-13 2022-11-18 武汉理工大学 In-plane thermoelectric device structure design method based on COMSOL software
CN109800524A (en) * 2019-01-29 2019-05-24 福州大学 Automobile wind shield glass molding simulation method based on COMSOL Multiphysics
CN109800524B (en) * 2019-01-29 2023-04-18 福州大学 Automobile windshield glass forming simulation method based on COMSOL Multiphysics
CN111797547A (en) * 2019-03-20 2020-10-20 东汉新能源汽车技术有限公司 Method for calculating temperature field of mold
CN110309530B (en) * 2019-04-18 2022-10-11 中国水产科学研究院渔业机械仪器研究所 Method for simulating thawing process and optimizing thawing process by adopting COMSOL software
CN110309530A (en) * 2019-04-18 2019-10-08 中国水产科学研究院渔业机械仪器研究所 A method of course of defrosting is simulated using COMSOL software emulation and optimizes thawing technique
CN110209066A (en) * 2019-05-05 2019-09-06 珠海格力电器股份有限公司 Control method, device and the equipment of soldering furnace
CN111222256A (en) * 2020-02-26 2020-06-02 天津理工大学 Numerical simulation method for predicting selective laser melting single-melting-channel molding defects
CN112668212B (en) * 2020-09-02 2023-03-24 国网内蒙古东部电力有限公司检修分公司 Finite element-based method for analyzing overflow characteristics of grounding electrode under different soil models
CN112668212A (en) * 2020-09-02 2021-04-16 国网内蒙古东部电力有限公司检修分公司 Finite element-based method for analyzing overflow characteristics of grounding electrode under different soil models
CN113282976A (en) * 2021-04-30 2021-08-20 重庆大学 Powder bed construction method based on COMSOL
CN113436691A (en) * 2021-05-27 2021-09-24 重庆大学 Method for predicting molten pool distribution of molten/solidified metal powder based on COMSOL
CN115544936A (en) * 2022-03-07 2022-12-30 深圳荣耀智能机器有限公司 Method and device for determining plate brazing temperature field distribution and computer readable storage medium
CN115906555A (en) * 2022-10-12 2023-04-04 中建二局安装工程有限公司 COMSOL-based prediction method for residual stress and leakage magnetic field thereof in welding process
CN115906555B (en) * 2022-10-12 2023-09-19 中建二局安装工程有限公司 Residual stress and leakage magnetic field prediction method in welding process based on COMSOL
CN115889346A (en) * 2022-12-22 2023-04-04 中国人民解放军海军航空大学青岛校区 Laser-based airplane lap joint structure cleaning method and electronic equipment
CN116564453A (en) * 2023-06-01 2023-08-08 哈尔滨工业大学 Laser parameter optimization method and system for temperature field distribution of laser irradiation first wall material
CN116564453B (en) * 2023-06-01 2024-02-02 哈尔滨工业大学 Laser parameter optimization method and system for laser irradiation wall material temperature distribution

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