CN107299383B - A kind of flow-type electroplating bath - Google Patents

A kind of flow-type electroplating bath Download PDF

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Publication number
CN107299383B
CN107299383B CN201710706294.3A CN201710706294A CN107299383B CN 107299383 B CN107299383 B CN 107299383B CN 201710706294 A CN201710706294 A CN 201710706294A CN 107299383 B CN107299383 B CN 107299383B
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CN
China
Prior art keywords
baffle
electroplating bath
cavity
partition
bath ontology
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Active
Application number
CN201710706294.3A
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Chinese (zh)
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CN107299383A (en
Inventor
范祥荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiuteng Metal Products Guangdong Co ltd
Original Assignee
Suzhou Jinxiang Titanium Equipment Co Ltd
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Priority to CN201710706294.3A priority Critical patent/CN107299383B/en
Publication of CN107299383A publication Critical patent/CN107299383A/en
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor

Abstract

The present invention relates to a kind of flow-type electroplating baths, including electroplating bath ontology, it is fixed on the intrinsic partition of the electroplating bath, first baffle is provided between the partition and the left side wall of the electroplating bath ontology, second baffle is provided between the partition and the right side wall of the electroplating bath ontology, the first cavity that the first baffle, partition and electroplating bath ontology surround is connected with the second cavity that the second baffle, partition and electroplating bath ontology surround, and the first baffle and second baffle can be horizontal mobile in the same direction.It is the configuration of the present invention is simple, easy to use, the flowing of electroplate liquid between the first cavity and the second cavity is realized so that the liquid level of the first cavity or the second cavity increases by mobile first baffle in the same direction simultaneously and second baffle, so that the thickness of coating of workpiece to be plated is uniform, electroplating quality is good.

Description

A kind of flow-type electroplating bath
Technical field
The present invention relates to electroplating device field more particularly to a kind of flow-type electroplating baths.
Background technique
Plating is to process coating in metal material surface, and mainly workpiece is placed in the electroplate liquid of electroplating bath, and Conducting electric current on workpiece achievees the purpose that protect workpiece surface, needs to be electroplated to form one layer of metal layer in workpiece surface Liquid is stirred, so that plating uniformly, improves electroplating quality.But in existing electroplating bath electroplate liquid bottom mixing uniformity phase It is poor for the mixing uniformity on electroplate liquid top, cause the electroplated layer of workpiece thickness difference occur, influences electroplating quality.
Summary of the invention
The present invention overcomes the deficiencies in the prior art, provide a kind of simple flow-type electroplating bath of structure.
In order to achieve the above objectives, the technical solution adopted by the present invention are as follows: a kind of flow-type electroplating bath, including electroplating bath sheet Body is fixed on the intrinsic partition of the electroplating bath, and is provided between the partition and the left side wall of the electroplating bath ontology One baffle, is provided with second baffle between the partition and the right side wall of the electroplating bath ontology, the first baffle, partition with And the first cavity that electroplating bath ontology surrounds is connected with the second cavity that the second baffle, partition and electroplating bath ontology surround Logical, the first baffle and second baffle can be horizontal mobile in the same direction.
In a preferred embodiment of the present invention, a kind of flow-type electroplating bath further comprises the first baffle and second gear Stiff rod is connected between plate, the stiff rod is connected with the cylinder arm for the cylinder being fixed on the electroplating bath ontology.
In a preferred embodiment of the present invention, a kind of flow-type electroplating bath further comprises that the free end of the cylinder arm is solid Surely there is supporting plate, the stiff rod is connected with the supporting plate.
In a preferred embodiment of the present invention, a kind of flow-type electroplating bath further comprise the partition bottom end with it is described There is gap between the bottom wall of electroplating bath ontology.
In a preferred embodiment of the present invention, a kind of flow-type electroplating bath further comprises the front side end of the first baffle The first sealing strip is provided with rear side end.
In a preferred embodiment of the present invention, a kind of flow-type electroplating bath further comprises the front side end of the second baffle The second sealing strip is provided with rear side end.
The invention solves the defect existing in the background technology, the configuration of the present invention is simple, easy to use, by simultaneously in the same direction Mobile first baffle and second baffle realize the first cavity and the second sky so that the liquid level of the first cavity or the second cavity increases The flowing of electroplate liquid between chamber, so that the thickness of coating of workpiece to be plated is uniform, electroplating quality is good.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structural schematic diagram of the preferred embodiment of the present invention;
In figure: 2, electroplating bath ontology, 4, partition, 6, first baffle, 8, second baffle, the 10, first cavity, 12, second is empty Chamber, 14, stiff rod, 16, cylinder, 18, cylinder arm, 20, supporting plate, 22, gap.
Specific embodiment
Presently in connection with drawings and examples, the present invention is described in further detail, these attached drawings are simplified signal Figure, the basic structure of the invention will be illustrated schematically only, therefore it only shows the composition relevant to the invention.
As shown in Figure 1, a kind of flow-type electroplating bath, including electroplating bath ontology 2, the partition being fixed in electroplating bath ontology 2 4, be provided with first baffle 6 between partition 4 and the left side wall of electroplating bath ontology 2, the right side wall of partition 4 and electroplating bath ontology 2 it Between be provided with second baffle 8, the first cavity 10 that first baffle 6, partition 4 and electroplating bath ontology 2 surround and second baffle 8, The second cavity 12 that partition 4 and electroplating bath ontology 2 surround is connected, and first baffle 6 and second baffle 8 can be horizontal in the same direction It is mobile.
It is connected with stiff rod 14 between the preferred first baffle 6 of the present invention and second baffle 8, stiff rod 14 and is fixed on electroplating bath sheet The cylinder arm 18 of cylinder 16 on body 2 is connected.
In order to improve the stability that stiff rod 14 is connect with cylinder arm 18, the free end of the preferred cylinder arm 18 of the present invention is fixed with Supporting plate 20, stiff rod 14 are connected with supporting plate 20.
For the ease of the flowing of electroplate liquid between the first cavity 10 and the second cavity 12, the bottom end of preferred separator 4 of the present invention There is gap 22 between the bottom wall of electroplating bath ontology 2.
It in order to avoid electroplate liquid flows out the first cavity 10, avoids wasting, the front side end of the preferred first baffle 6 of the present invention is with after Side is provided with the first sealing strip (not shown), two the first sealing strips respectively with the front side wall of electroplating bath ontology 2 and Rear wall is close to.
It in order to avoid electroplate liquid flows out the second cavity 12, avoids wasting, the front side end of the preferred second baffle 8 of the present invention is with after Side is provided with the second sealing strip (not shown), two the second sealing strips respectively with the front side wall of electroplating bath ontology 2 and Rear wall is close to.
In the use of the present invention, when cylinder 16 drives first baffle 6 and second baffle 8 simultaneously to moving to left by cylinder arm 18 It is dynamic, so that the liquid level in the second cavity 12 increases, the at the connectivity part i.e. gap 22 of the first cavity 10 and the second cavity 12 Two cavitys, 12 pressure is big, and electroplate liquid flows to the first cavity 10 from the second cavity 12;When cylinder 16 drives first by cylinder arm 18 Baffle 6 and second baffle 8 move right simultaneously, so that the liquid level in the first cavity 10 increases, the first cavity 10 and the second cavity First cavity, 10 pressure is big at 12 connectivity part i.e. gap 22, and electroplate liquid flows to the second cavity 12 from the first cavity 10.
Based on the above description of the preferred embodiments of the present invention, through the above description, related personnel completely can be with Without departing from the scope of the technological thought of the present invention', various changes and amendments are carried out.The technical scope of this invention It is not limited to the contents of the specification, it is necessary to determine the technical scope according to the scope of the claims.

Claims (1)

1. a kind of flow-type electroplating bath, it is characterised in that: including electroplating bath ontology, be fixed on the electroplating bath it is intrinsic every Plate has gap, the partition and the electroplating bath ontology between the bottom end of the partition and the bottom wall of the electroplating bath ontology Left side wall between be provided with first baffle, the front side end and rear side end of the first baffle are provided with the first sealing strip, institute It states and is provided with second baffle between partition and the right side wall of the electroplating bath ontology, the front side end and rear side end of the second baffle It is provided with the second sealing strip, the first cavity that the first baffle, partition and electroplating bath ontology surround and the second gear The second cavity that plate, partition and electroplating bath ontology surround is connected, and the first baffle and second baffle can be horizontal same To movement, it is connected with stiff rod between the first baffle and second baffle, the stiff rod and is fixed on the electroplating bath ontology The cylinder arm of cylinder be connected, the free end of the cylinder arm is fixed with supporting plate, and the stiff rod is connected with the supporting plate.
CN201710706294.3A 2017-08-17 2017-08-17 A kind of flow-type electroplating bath Active CN107299383B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710706294.3A CN107299383B (en) 2017-08-17 2017-08-17 A kind of flow-type electroplating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710706294.3A CN107299383B (en) 2017-08-17 2017-08-17 A kind of flow-type electroplating bath

Publications (2)

Publication Number Publication Date
CN107299383A CN107299383A (en) 2017-10-27
CN107299383B true CN107299383B (en) 2019-03-29

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2241152Y (en) * 1995-11-08 1996-11-27 刘铁镇 Electrolyte circuit electroplating bath
CN202107790U (en) * 2011-04-22 2012-01-11 北京北方微电子基地设备工艺研究中心有限责任公司 Plating device
EP2995371A1 (en) * 2014-09-10 2016-03-16 Rolls-Royce plc Agitator and method of coating a component
CN205999504U (en) * 2016-08-31 2017-03-08 珠海市玛斯特五金塑胶制品有限公司 A kind of local tank liquor switch type electroplanting device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6926437B2 (en) * 2002-09-10 2005-08-09 Gerhardt Van Drie Gravity powered mixer system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2241152Y (en) * 1995-11-08 1996-11-27 刘铁镇 Electrolyte circuit electroplating bath
CN202107790U (en) * 2011-04-22 2012-01-11 北京北方微电子基地设备工艺研究中心有限责任公司 Plating device
EP2995371A1 (en) * 2014-09-10 2016-03-16 Rolls-Royce plc Agitator and method of coating a component
CN205999504U (en) * 2016-08-31 2017-03-08 珠海市玛斯特五金塑胶制品有限公司 A kind of local tank liquor switch type electroplanting device

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Effective date of registration: 20240129

Address after: 523131 Building 12, No. 126 Guangma Avenue, Machong Town, Dongguan City, Guangdong Province

Patentee after: Jiuteng Metal Products (Guangdong) Co.,Ltd.

Country or region after: China

Address before: 215000 211 front bridge road, maple bridge, hi tech Zone, Suzhou, Jiangsu

Patentee before: SUZHOU JINXIANGTAI EQUIPMENT Co.,Ltd.

Country or region before: China

TR01 Transfer of patent right