CN107295239A - A kind of CCD camera assembly and electronic equipment - Google Patents
A kind of CCD camera assembly and electronic equipment Download PDFInfo
- Publication number
- CN107295239A CN107295239A CN201710725270.2A CN201710725270A CN107295239A CN 107295239 A CN107295239 A CN 107295239A CN 201710725270 A CN201710725270 A CN 201710725270A CN 107295239 A CN107295239 A CN 107295239A
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- China
- Prior art keywords
- sensitive chip
- ccd camera
- camera assembly
- optical signal
- chip
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The embodiment of the invention discloses a kind of CCD camera assembly and electronic equipment, the CCD camera assembly includes camera lens, the first sensitive chip, the second sensitive chip and Optical devices；The optical signal that Optical devices are used to gather on the camera lens is sent to the first sensitive chip and/or the second sensitive chip；First sensitive chip and the second induction chip are used to the optical signal received being converted into corresponding picture signal；The program can be shared a camera lens by two kinds of sensitive chips and realize two kinds of different images of acquisition, with the volume of camera module and can save cost.
Description
Technical field
The present invention relates to camera technology field, and in particular to a kind of CCD camera assembly and electronic equipment.
Background technology
At present, the electronic installation such as mobile phone, notebook computer, tablet personal computer rises is shot simultaneously using double camera modules
The new technology of same object, the image that two camera modules are shot respectively also be able to can be mutually compensated for obtaining with compositing 3 d images
Take the two dimensional image of high definition.
Camera mainly include camera lens, sensitive chip and circuit board, wherein sensitive chip as camera main portion
Its operation principle of part is：Extraneous light is irradiated on sensitive chip face after passing through camera lens, and camera lens is uploaded what is come by sensitive chip
Light is converted to electric signal, then is converted to data signal by analog-to-digital conversion.
Current dual camera includes two camera lenses and two sensitive chips, and a camera lens corresponds to a sensitive chip, because
This causes the cost of camera higher and camera module volume is larger.
The content of the invention
The embodiment of the present invention provides a kind of CCD camera assembly and electronic equipment, can reduce the volume of camera module.
In a first aspect, the embodiment of the present invention provides a kind of CCD camera assembly, including camera lens, the first sensitive chip, the second sense
Optical chip and Optical devices；The Optical devices, it is photosensitive that the optical signal for the camera lens to be gathered is sent to described first
Chip and/or second sensitive chip；First sensitive chip, for the optical signal received to be converted into corresponding figure
As signal；Second induction chip, for the optical signal received to be converted into corresponding picture signal.
Second aspect, the embodiment of the present invention additionally provides a kind of electronic equipment, including housing and CCD camera assembly, described to take the photograph
Picture head assembly is arranged on the enclosure interior, and the CCD camera assembly is the CCD camera assembly of any offer of the embodiment of the present invention.
CCD camera assembly of the embodiment of the present invention includes camera lens, the first sensitive chip, the second sensitive chip and optical strobe
Element；The optical signal that Optical devices are used to gather on the camera lens is sent to the first sensitive chip and/or the second sensitive chip；The
One sensitive chip and the second induction chip are used to the optical signal received being converted into corresponding picture signal；The program can lead to
Cross two kinds of sensitive chips and share a camera lens (two kinds of different sensitive chips of i.e. one camera lens correspondence) realization two kinds of differences of acquisition
Image such as different resolution image, can with the volume of camera module and save cost.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached
Figure.
Fig. 1 is the structural representation of a kind of electronic equipment provided in an embodiment of the present invention.
Fig. 2 is the structural representation of another electronic equipment provided in an embodiment of the present invention.
Fig. 3 is the first structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 4 is second of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 5 is the third structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 6 is the 4th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 7 is the 5th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 8 is the 6th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Fig. 9 is the 7th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Figure 10 is the 8th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Figure 11 is the structural representation of sensitive chip provided in an embodiment of the present invention.
Figure 12 is the 9th kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Figure 13 is the tenth kind of structural representation of CCD camera assembly provided in an embodiment of the present invention.
Figure 14 is the another structural representation of electronic equipment provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.Obviously, described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present invention provides a kind of electronic equipment.The electronic equipment can be the equipment such as smart mobile phone, tablet personal computer.
With reference to Fig. 1, electronic equipment 100 includes cover plate 101, display screen 102, circuit board 103 and housing 104.
Wherein, cover plate 101 is installed on display screen 102, to cover display screen 102.Cover plate 101 can be transparent glass cover
Plate.In certain embodiments, cover plate 101 can be the glass cover-plate being made of materials such as sapphires.
Display screen 102 is arranged on housing 104, to form the display surface of electronic equipment 100.Display screen 102 can include
Viewing area 102A and non-display area 102B.Viewing area 102A is used for the information such as display image, text.Non-display area
102B not display informations.Non-display area 102B bottom can set the functional units such as fingerprint module, touch-control circuit.
Circuit board 103 is arranged on inside housing 104.Circuit board 103 can be the mainboard of electronic equipment 100.Circuit board 103
On can be integrated with the functional units such as camera, proximity transducer and processor.Meanwhile, display screen 102 can be electrically connected to
Circuit board 103.
In certain embodiments, radio frequency (RF, Radio Frequency) circuit is provided with circuit board 103.Radio circuit
Wireless network and the network equipment (for example, server, base station etc.) or other electronic equipments (for example, smart mobile phone etc.) can be passed through
Communication, with the information transmit-receive completed and between the network equipment or other electronic equipments.
In certain embodiments, as shown in Fig. 2 the electronic equipment also includes rear camera 105 and flash lamp 106,
Wherein, the camera 105 can be single camera, such as respectively 16,000,000 pixel wide-angle cameras or 20,000,000 pixels are long
Burnt camera.Can be with shooting image by the electronic equipment of camera 105.
In one embodiment, with reference to Fig. 3, Fig. 3 is that a kind of structure of CCD camera assembly 200 provided in an embodiment of the present invention is shown
It is intended to, the CCD camera assembly 200 includes：Camera lens 201, Optical devices 202, the first sensitive chip 203 and the second sensitive chip
204。
Wherein, Optical devices 202 are arranged in the light path of camera lens 201, are such as arranged on the lower section of camera 201, optics dress
Put 202 optical signals for being used to gather on camera lens 201 and be sent to first sensitive chip 203 and/or second sensitive chip
204。
First sensitive chip 203, the second sensitive chip 204, corresponding image letter is converted into for that will receive optical signal
Number, to form image.
In one embodiment, the image parameter of the first sensitive chip 203 and the second sensitive chip 204 is differed, and is such as differentiated
Rate is differed；Therefore, the image of the photosensitive formation of the first sensitive chip 203, with the image of the photosensitive formation of the second sensitive chip 204 not
It is identical, as resolution ratio is differed.
In one embodiment, with reference to Fig. 4, a camera lens is used while shooting two kinds of different images in order to realize, should
Optical element 202 can include：Beam splitter 2021.
Wherein, beam splitter 2021 can be used for the optical signal that camera lens 201 is gathered being divided into two parts optical signal, and by one
Part optical signals are sent to first sensitive chip 203, another part optical signal are sent into second sensitive chip
204.So just it can distinguish photosensitive by the first sensitive chip 203 and the second sensitive chip 204, to form two kinds of different figures
As the image that such as resolution ratio, brightness image parameter are differed.
Wherein, light splitting can include optical signal is divided into the optical signal of varying strength, optical signal is divided into different wave length model
The optical signal enclosed.Such as, it is possible to use dispersion phenomenon can spread out wave-length coverage very wide complex light, as many ripples
Long incomprehensive " monochromatic light ".
In one embodiment, the optical signal that beam splitter 2021 can gather camera lens 201 is divided into two parts intensity not phase
Same optical signal, then, the first sensitive chip 203 and the second sensitive chip is sent respectively to by the optical signal that intensity is differed
204.In practical application, the image of different brightness or gray scale can be formed by means of which.
In one embodiment, the optical signal that light splitting part 2021 can also gather camera lens 201 is divided into two parts wave-length coverage
The optical signal differed；Then, the optical signal that wave-length coverage is differed is sent respectively to the first sensitive chip 203 and the second sense
Optical chip 204.In practical application, the image of different colours can be formed by means of which.The light splitting part 2021 can be rib
The light splitting part such as mirror, such as dispersing prism.
In one embodiment, the image formed is shot for ease of selection, can also optionally will by optical element 202
The optical signal that camera lens 201 is gathered is oriented to sensitive chip corresponding in the first sensitive chip 203 and the second sensitive chip 204, with
Image needed for being formed.Wherein, optical element 202 can include optical gating elements.
Such as, with reference to Fig. 5 and Fig. 6, Optical devices 202 can include optical gating elements 2022；The optical strobe element
2022 are set in the light path of camera lens 201, and such as the lower section of camera lens 201 as described in, the optical signal for the camera lens 201 to be gathered is led
To the first sensitive chip 203 or the second sensitive chip 204.
With reference to Fig. 5 and Fig. 6, can by optical gating elements 2022 by optical signal launch give the first sensitive chip 203, second
A sensitive chip in both sensitive chips 204 forms image, and when one of sensitive chip is photosensitive, another is photosensitive
Chip is not photosensitive.
In one embodiment, it can be selected by controlling the rotation of light guide structure to corresponding sensitive chip transmitting light letter
Number；Such as, with reference to Fig. 7, optical strobe element 2022 includes：Driving structure (not shown) and light guide structure 2022b.
Wherein, the light guide structure 2022b is arranged on the lower section of camera lens 201；
First sensitive chip 203 and second sensitive chip 204 are located at below the light guide structure 2022b；
The driving structure is connected with the light guide structure 2022b, for driving the light guide structure 2022b rotations corresponding
Angle, to cause the light guide structure 2022b by the first sensitive chip 203 described in optical signal directive or the second photosensitive core
Piece 204.
Wherein, the angle of light guide structure 2022b rotations, for the folder between light guide structure after light guide structure before rotation and rotation
Angle.Angle such as on horizontal plane or vertical plane.
In one embodiment, driving structure can be with driving elements such as motors.The set location of the driving structure can have many
Kind.
In one embodiment, light guide structure 2022b can be refracting telescope or speculum.
With reference to Fig. 8, when light guide structure 2022b is speculum (now 2022b represents speculum), in speculum 2022b
Before not rotating, the optical signal that camera lens 201 is gathered is reflected to the first sensitive chip 203, the first sensitive chip by speculum 2022b
203 bases receive optical signal and form the first image.When needing to change shooting image, driving structure can drive speculum
2022b rotates A angles on vertical plane (such as perpendicular to the plane of sensitive chip), and now, speculum 2022b is just by camera lens
The optical signal of 201 collections is reflected to the second sensitive chip 204, and the second sensitive chip 204 forms second according to optical signal is received
Plant image.If necessary to the first image, be able to can be driven with driving structure speculum 2022b vertical plane (such as perpendicular to
The plane of sensitive chip) on opposite direction rotation A angles.
With reference to Fig. 9, when light guide structure 2022b is refracting telescope (now 2022b represents refracting telescope), in refracting telescope 2022b
Before not rotating, the optical signal that camera lens 201 is gathered is reflected in refracting telescope 2022b, and refracted optical signal is transmitted to first
Sensitive chip 203, the first sensitive chip 203 forms the first image according to optical signal is received.When need change shooting image
When, driving structure can drive refracting telescope 2022b to rotate B angles on vertical plane (such as perpendicular to the plane of sensitive chip),
Now, the optical signal that refracting telescope 2022b just gathers camera lens 201 is reflected to the second sensitive chip 204, the second sensitive chip 204
Second of image is formed according to optical signal is received.If necessary to the first image, refracting telescope can be driven with driving structure
2022b opposite directions on vertical plane (such as perpendicular to the plane of sensitive chip) rotate B angles.
One camera lens sensitive chip different with two kinds, i.e., one are passed through using the CCD camera assembly 200 of the embodiment of the present invention
Two kinds of different sensitive chips of individual camera lens correspondence, realize that the image for obtaining two kinds of difference such as different resolutions improves image taking
Diversity and flexibility.Such as, can be a certain in the first sensitive chip 203, both the second sensitive chips 204 by selecting
The photosensitive image that can be formed needed for user of individual sensitive chip, and such as, can also the first sensitive chip 203, second sense simultaneously
Optical chip 204 is photosensitive to form two kinds of different images.
In addition, compared to two camera lenses correspond to the CCD camera assembly of two kinds of sensitive chips respectively, cost can also be reduced, is reduced
The volume of camera module.
In one embodiment, refering to Figure 10, CCD camera assembly provided in an embodiment of the present invention also includes camera circuit board
205, the first sensitive chip 203, second sensitive chip 204 are fixedly installed on camera circuit board 205.In an embodiment
In, driving structure 2022a is also disposed on camera circuit board 205, and positioned at the first sensitive chip 203, the second photosensitive core
Between piece 204.Wherein, the first sensitive chip 203, second sensitive chip 204 can be symmetricly set on camera circuit board
On 205.
As shown in figure 11, the sensitive chip in the embodiment of the present invention includes chip body, photosurface, shady face；Such as
One sensitive chip 203 includes chip body 2031, and chip body 2031, which has, to be received by light guide structure direction directive chip body
The photosurface 2032 of 2031 light, and the shady face 2033 relative with photosurface 2032, photosurface 2032 and shady face
2033 are disposed in parallel relation to one another.
In one embodiment, as shown in figure 12, CCD camera assembly provided in an embodiment of the present invention also includes camera bracket
206, the camera bracket 206 is used to place camera lens 201.
Among an embodiment, as shown in figure 13, CCD camera assembly provided in an embodiment of the present invention also includes optical filter
207, the optical filter 207 is arranged at the lower section of camera lens 201.Wherein optical filter 207 can be smalt optical filter, and its effect is exactly
Mode by " absorption " carrys out filtering infrared light.Because blue wavelength has higher penetrance, the glass filters compared with reddish orange have
More preferable penetrability, may filter that more than 630nm infrared light, the true colors of object be reduced, so as to solve image color distortion
The problem of.
In one embodiment, the horizontal range between the first sensitive chip 203, the second sensitive chip 204 be 75mm extremely
110mm.Horizontal range between first sensitive chip 203, the second sensitive chip 204 is the first sensitive chip 203 and the second sense
The centre distance of optical chip 204.Wherein, the photosurface of the first sensitive chip 203 can be more than or less than the second sensitive chip
204。
The embodiment of the present invention also provides a kind of electronic equipment, including housing and CCD camera assembly, and CCD camera assembly is arranged on
Enclosure interior, CCD camera assembly is the CCD camera assembly 200 of any offer of the embodiment of the present invention.
With reference to Figure 14, the another structural representation of Figure 14 electronic equipments 100 provided in an embodiment of the present invention.Electronic equipment
100 include antenna assembly 10, memory 20, display unit 30, power supply 40 and processor 50.Those skilled in the art can manage
The structure of the electronic equipment 100 shown in solution, Figure 14 does not constitute the restriction to electronic equipment 100.Electronic equipment 100 can be wrapped
Include than illustrating more or less parts, either combine some parts or different parts arrangement.
Wherein, antenna assembly 10 can pass through wireless network and the network equipment (for example, server) or other electronic equipments
(for example, smart mobile phone) communicates, and completes and the information transmit-receive between the network equipment or other electronic equipments.
Memory 20 can be used for storage application program and data.Include executable in the application program that memory 20 is stored
Program code.Application program can constitute various functions module.Processor 50 is stored in the application journey of memory 20 by operation
Sequence, so as to perform various function application and data processing.
Display unit 30 can be used for display the information of electronic equipment 100 is input to by user or be supplied to the information of user with
And the various graphical user interface of electronic equipment 100.These graphical user interface can by figure, text, icon, video and its
It is combined to constitute.Display unit 30 may include display panel.
The all parts that power supply 40 is used for electron equipment 100 are powered.In certain embodiments, power supply 40 can pass through electricity
Management system and processor 50 are logically contiguous, so as to realize management charging, electric discharge and power consumption pipe by power-supply management system
The functions such as reason.
Processor 50 is the control centre of electronic equipment 100.Processor 50 is entirely electric using various interfaces and connection
The various pieces of sub- equipment 100, by operation or perform and are stored in application program in memory 20, and call and be stored in
Data in reservoir 20, perform the various functions and processing data of electronic equipment 100, so as to carry out entirety to electronic equipment 100
Monitoring.
In addition, electronic equipment 100 can also include camera module, bluetooth module etc., it will not be repeated here.Wherein, take the photograph
As head module can include the CCD camera assembly 200 of any offer of the embodiment of the present invention.
It when it is implemented, above modules can be realized as independent entity, can also be combined, be made
Realized for same or several entities, the specific implementation of above modules can be found in embodiment of the method above, herein not
Repeat again.
A kind of CCD camera assembly and electronic equipment provided in an embodiment of the present invention are described in detail above, its each work(
Energy module can be integrated in a process chip or modules are individually physically present, can also be two or two
It is integrated in upper module in a module.Above-mentioned integrated module can both be realized in the form of hardware, it would however also be possible to employ soft
The form of part functional module is realized.Specific case used herein is set forth to the principle and embodiment of the present invention,
The explanation of above example is only intended to the method and its core concept for helping to understand the present invention；Simultaneously for the skill of this area
Art personnel, according to the thought of the present invention, will change in specific embodiments and applications, in summary, this
Description should not be construed as limiting the invention.
Claims (10)
1. a kind of CCD camera assembly, it is characterised in that including camera lens, the first sensitive chip, the second sensitive chip and optics dress
Put；
The Optical devices, the optical signal for the camera lens to be gathered is sent to first sensitive chip and/or described
Two sensitive chips；
First sensitive chip, for the optical signal received to be converted into corresponding picture signal；
Second induction chip, for the optical signal received to be converted into corresponding picture signal.
2. CCD camera assembly as claimed in claim 1, it is characterised in that the Optical devices include：Beam splitter；
The beam splitter, the optical signal for the camera lens to be gathered is divided into two parts optical signal, and by a part of optical signal
It is sent to first sensitive chip, another part optical signal is sent to second sensitive chip.
3. CCD camera assembly as claimed in claim, it is characterised in that the Optical devices include：Optical strobe element；
The optical strobe element, below the camera lens, the optical signal for the camera lens to be gathered is oriented to described first
Sensitive chip or second sensitive chip.
4. CCD camera assembly as claimed in claim 3, it is characterised in that the optical strobe element includes：Driving structure and
Light guide structure；
The light guide structure is arranged on below the camera lens；
First sensitive chip and second sensitive chip are located at below the light guide structure；
The driving structure is connected with the light guide structure, for driving the light guide structure rotation respective angles, to cause
Light guide structure is stated by the first sensitive chip described in the optical signal directive or second sensitive chip.
5. CCD camera assembly as claimed in claim 3, it is characterised in that the light guide structure includes refracting telescope or speculum.
6. CCD camera assembly as claimed in claim 3, it is characterised in that also include：Camera circuit board；
First sensitive chip and second sensitive chip are separately positioned on the camera circuit board；
Described in the drive module setting on camera circuit board, and positioned at first sensitive chip and the second photosensitive core
Between piece.
7. CCD camera assembly as claimed in claim 1, it is characterised in that also include：Camera circuit board；Described first is photosensitive
Chip and second sensitive chip are symmetricly set on the camera circuit board.
8. CCD camera assembly as claimed in claim 1, it is characterised in that the CCD camera assembly also includes camera bracket,
The camera lens is arranged on the camera bracket.
9. the CCD camera assembly as described in claim any one of 1-8, it is characterised in that first sensitive chip and described the
The resolution ratio of two sensitive chips is different.
10. a kind of electronic equipment, it is characterised in that including housing and CCD camera assembly, the CCD camera assembly is arranged on described
Enclosure interior, the CCD camera assembly is the CCD camera assembly as described in claim any one of 1-9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201720944542 | 2017-07-31 | ||
| CN2017209445423 | 2017-07-31 |
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| CN107295239A true CN107295239A (en) | 2017-10-24 |
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| CN201721055004.5U Expired - Fee Related CN207150710U (en) | 2017-07-31 | 2017-08-22 | A kind of CCD camera assembly and electronic equipment |
| CN201710725270.2A Pending CN107295239A (en) | 2017-07-31 | 2017-08-22 | A kind of CCD camera assembly and electronic equipment |
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| WO2021042306A1 (en) * | 2019-09-04 | 2021-03-11 | 深圳市海谱纳米光学科技有限公司 | Optical lens and optical device |
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| JP3209652U (en) * | 2017-01-19 | 2017-03-30 | 奇▲こう▼科技股▲ふん▼有限公司 | Shooting module |
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| CN205356521U (en) * | 2016-02-19 | 2016-06-29 | 信利光电股份有限公司 | Module and mobile communication device make a video recording |
| CN106506915A (en) * | 2016-11-15 | 2017-03-15 | 深圳天珑无线科技有限公司 | A kind of camera module and digital equipment |
| JP3209652U (en) * | 2017-01-19 | 2017-03-30 | 奇▲こう▼科技股▲ふん▼有限公司 | Shooting module |
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| CN107872664A (en) * | 2017-11-21 | 2018-04-03 | 上海兴芯微电子科技有限公司 | A kind of 3-D imaging system and 3-D view construction method |
| CN107888961A (en) * | 2017-11-27 | 2018-04-06 | 信利光电股份有限公司 | A kind of camera function management method and relevant apparatus based on intelligent television |
| CN107734243A (en) * | 2017-11-28 | 2018-02-23 | 信利光电股份有限公司 | A kind of cam device and electronic equipment |
| WO2019114301A1 (en) * | 2017-12-11 | 2019-06-20 | 格力电器（武汉）有限公司 | Dual-camera module, and electronic apparatus |
| CN107911589A (en) * | 2017-12-11 | 2018-04-13 | 珠海格力电器股份有限公司 | It is double to take the photograph module and electronic equipment |
| CN107835352A (en) * | 2017-12-14 | 2018-03-23 | 信利光电股份有限公司 | A kind of camera module and terminal |
| CN108989641A (en) * | 2018-08-03 | 2018-12-11 | Oppo广东移动通信有限公司 | Imaging modules and electronic device |
| CN109361786A (en) * | 2018-10-22 | 2019-02-19 | 维沃移动通信（杭州）有限公司 | Mobile terminal |
| CN110690238A (en) * | 2019-09-30 | 2020-01-14 | 芯盟科技有限公司 | Image sensor module |
| CN110798604A (en) * | 2019-11-29 | 2020-02-14 | 维沃移动通信有限公司 | Camera module, electronic equipment, shooting control method and device |
| CN110798604B (en) * | 2019-11-29 | 2021-06-22 | 维沃移动通信有限公司 | Camera module, electronic equipment, shooting control method and device |
| WO2021249077A1 (en) * | 2020-06-11 | 2021-12-16 | 中兴通讯股份有限公司 | Camera, zoom method, terminal and storage medium |
| CN111787198A (en) * | 2020-06-22 | 2020-10-16 | 上海摩象网络科技有限公司 | Double-camera system and double-camera |
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