CN107291192A - A kind of heat sink of computer - Google Patents

A kind of heat sink of computer Download PDF

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Publication number
CN107291192A
CN107291192A CN201710496009.XA CN201710496009A CN107291192A CN 107291192 A CN107291192 A CN 107291192A CN 201710496009 A CN201710496009 A CN 201710496009A CN 107291192 A CN107291192 A CN 107291192A
Authority
CN
China
Prior art keywords
heat sink
plate body
computer
main frame
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710496009.XA
Other languages
Chinese (zh)
Inventor
府仁芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Dongcheng Office Technology Co Ltd
Original Assignee
Suzhou Dongcheng Office Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Dongcheng Office Technology Co Ltd filed Critical Suzhou Dongcheng Office Technology Co Ltd
Priority to CN201710496009.XA priority Critical patent/CN107291192A/en
Publication of CN107291192A publication Critical patent/CN107291192A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application is related to a kind of heat sink of computer, described heat sink is used to set up on the main frame of described computer, described heat sink includes plate body, multiple through holes are provided with described plate body, fan is provided with described through hole, described fan is provided with multiple blades, and described fan is driven by a driving machine.A kind of heat sink of computer described herein, is to be used for secondary computer main frame heat transmission, the heat sink of whiz whiz whiz is arranged on described main frame, it is possible to reduce the temperature of main frame.

Description

A kind of heat sink of computer
Technical field
The application belongs to a kind of heat sink of computer.
Background technology
In the prior art, radiating effect is deteriorated the main frame of computer after long-term use, and the fan that main frame is carried can not Radiating well, therefore it is badly in need of a kind of device of auxiliary heat dissipation.
The content of the invention
The application is related to a kind of heat sink of computer, and described heat sink is used to set up in described calculating On the main frame of machine, described heat sink includes being provided with multiple through holes on plate body, described plate body, is set in described through hole There is fan, described fan is provided with multiple blades, and described fan is driven by a driving machine.
Preferably, the surface of described plate body is provided with multiple heat emission holes.
Preferably, described multiple heat emission holes are evenly distributed in the surface of described plate body.
Preferably, three through holes are provided with described plate body.
Preferably, described plate body is made up of metal material.
Preferably, described blade is made up of plastic material.
Technical scheme more than, the beneficial effect of the application is:
A kind of heat sink of computer described herein, is to be used for secondary computer main frame heat transmission, by whiz whiz whiz Heat sink is arranged on described main frame, it is possible to reduce the temperature of main frame.
With reference to explanation hereinafter and accompanying drawing, the particular implementation of the application is disclose in detail, the original of the application is specified Reason can be in adopted mode.It should be understood that presently filed embodiment is not so limited in scope.In appended power In the range of the spirit and terms that profit is required, presently filed embodiment includes many changes, modifications and equivalent.
The feature for describing and/or showing for a kind of embodiment can be in same or similar mode one or more Used in individual other embodiment, it is combined with feature in other embodiment, or substitute the feature in other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when being used herein, but simultaneously It is not excluded for the presence or additional of one or more further features, one integral piece, step or component.
Brief description of the drawings
Accompanying drawing described here is only used for task of explanation, and is not intended in any way limit model disclosed in the present application Enclose.In addition, shape and proportional sizes of each part in figure etc. are only schematical, the understanding to the application is used to help, and It is not the specific shape and proportional sizes for limiting each part of the application.Those skilled in the art, can under teachings of the present application To select various possible shapes and proportional sizes to implement the application as the case may be.In the accompanying drawings:
Fig. 1 is a kind of structural representation of heat sink described herein;
Wherein:1st, plate body;2nd, heat emission hole;3rd, through hole;4th, fan.
Embodiment
Below in conjunction with the accompanying drawing in the application embodiment, the technical scheme in the application embodiment is carried out clear Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under the premise of creative work is not made The every other embodiment obtained, belongs to the scope of the application protection.
It should be noted that when element is referred to as " being arranged at " another element, it can be directly on another element Or can also have element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left side ", For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article and the technical field of the application is belonged to The implication that technical staff is generally understood that is identical.The term used in the description of the present application is intended merely to description tool herein The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more The arbitrary and all combination of related Listed Items.
As illustrated, the application is related to a kind of heat sink of computer, described heat sink is used to set up On the main frame of described computer, described heat sink includes being provided with multiple through holes 3, institute on plate body 1, described plate body 1 Fan 4 is provided with the through hole 3 stated, described fan 4 is provided with multiple blades, and described fan 4 is driven by a driving machine.Institute The surface for the plate body 1 stated is provided with multiple heat emission holes 2.Described multiple heat emission holes 2 are evenly distributed in the table of described plate body 1 Face.Three through holes 3 are provided with described plate body 1.Described plate body 1 is made up of metal material.Described blade is plastics material Matter is made.
A kind of heat sink of computer described herein, is to be used for secondary computer main frame heat transmission, by whiz whiz The heat sink of whiz is arranged on described main frame, it is possible to reduce the temperature of main frame.
It should be noted that in the description of the present application, in the description of the present application, unless otherwise indicated, " multiples' " It is meant that two or more.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot Together in this.Describe the term " substantially by ... constitutes " of combination should include determined by element, composition, part or step and reality There is no other elements, composition, part or the step of the basic novel feature for influenceing the combination in matter.Using term "comprising" or " comprising " describes the combination of element here, composition, part or step it is also contemplated that basic by these elements, composition, part Or the embodiment that step is constituted.Here by using term " can with ", it is intended to which illustrate that " can with " include is described any Attribute is all optional.
Multiple element, composition, part or step can be provided by single integrated component, composition, part or step.It is alternative Ground, single integrated component, composition, part or step can be divided into multiple element, composition, part or the step of separation.It is used for The open "a" or "an" for describing element, composition, part or step is not said to exclude other elements, composition, part Or step.
It should be understood that above description is to be limited in order to illustrate rather than.By reading above-mentioned retouch State, many embodiments and many applications outside the example provided all will be aobvious and easy for a person skilled in the art See.Therefore, the scope of this teaching should not be determined with reference to foregoing description, but should with reference to preceding claims and this The four corner of the equivalent that a little claims are possessed is determined.It is for comprehensive purpose, all articles and special with reference to including The disclosure of profit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims Any aspect is not intended to abandon the body matter, also should not be considered as applicant the theme is not thought of as it is disclosed Apply for a part for theme.

Claims (6)

1. a kind of heat sink of computer, it is characterised in that:Described heat sink is used to set up in described calculating On the main frame of machine, described heat sink includes being provided with multiple through holes on plate body, described plate body, is set in described through hole There is fan, described fan is provided with multiple blades, and described fan is driven by a driving machine.
2. a kind of heat sink of computer according to claim 1, it is characterised in that:The surface of described plate body is set It is equipped with multiple heat emission holes.
3. a kind of heat sink of computer according to claim 1, it is characterised in that:Described multiple heat emission holes are equal The even surface for being distributed in described plate body.
4. a kind of heat sink of computer according to claim 1, it is characterised in that:It is provided with described plate body Three through holes.
5. a kind of heat sink of computer according to claim 1, it is characterised in that:Described plate body is metal material Material is made.
6. a kind of heat sink of computer according to claim 1, it is characterised in that:Described blade is plastics material Matter is made.
CN201710496009.XA 2017-06-26 2017-06-26 A kind of heat sink of computer Pending CN107291192A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710496009.XA CN107291192A (en) 2017-06-26 2017-06-26 A kind of heat sink of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710496009.XA CN107291192A (en) 2017-06-26 2017-06-26 A kind of heat sink of computer

Publications (1)

Publication Number Publication Date
CN107291192A true CN107291192A (en) 2017-10-24

Family

ID=60098579

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710496009.XA Pending CN107291192A (en) 2017-06-26 2017-06-26 A kind of heat sink of computer

Country Status (1)

Country Link
CN (1) CN107291192A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203838644U (en) * 2014-05-08 2014-09-17 南京理工大学 Multifunctional adjustable and controllable notebook cooler
CN205065214U (en) * 2015-10-15 2016-03-02 李兆鹏 This computer cooling of multifunctional pen note support
CN205959150U (en) * 2016-07-19 2017-02-15 苏州高等职业技术学校 Novel computer cooler

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203838644U (en) * 2014-05-08 2014-09-17 南京理工大学 Multifunctional adjustable and controllable notebook cooler
CN205065214U (en) * 2015-10-15 2016-03-02 李兆鹏 This computer cooling of multifunctional pen note support
CN205959150U (en) * 2016-07-19 2017-02-15 苏州高等职业技术学校 Novel computer cooler

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Application publication date: 20171024

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