CN107278060A - A kind of preparation method for the aluminum-based circuit board protected with aluminium base face - Google Patents
A kind of preparation method for the aluminum-based circuit board protected with aluminium base face Download PDFInfo
- Publication number
- CN107278060A CN107278060A CN201710373897.6A CN201710373897A CN107278060A CN 107278060 A CN107278060 A CN 107278060A CN 201710373897 A CN201710373897 A CN 201710373897A CN 107278060 A CN107278060 A CN 107278060A
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- Prior art keywords
- wiring board
- aluminium base
- spray tin
- circuit
- adhesive tape
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of preparation method for the aluminum-based circuit board protected with aluminium base face, comprise the following steps：Sawing sheet → drilling → outer-layer circuit → outer layer etching → outer layer erosion inspection → welding resistance making → patch spray tin adhesive tape → spray tin → electrical testing → shaping → finished product inspection → packaging and storage.The present invention mainly pastes one layer of red masking tape of high temperature resistant in the circuit board before spray tin; the red masking tape of high temperature resistant is combined together with overcoat; wiring board can not only protected under the condition of high temperature of spray tin; ring wiring board will not be broken because of high temperature; and the red masking tape of high temperature resistant stick after when using just adhesive tape is torn, can effectively prevent wiring board plate face during production and processing and transport wiping spend phenomenon；Using the red masking tape of high temperature resistant the production of wiring board can also be made to simplify work flow, improve processing efficiency, reduction processing cost.
Description
Technical field
The present invention relates to wiring board protection technology field, the system of specially a kind of aluminum-based circuit board protected with aluminium base face
Preparation Method.
Background technology
Circuit can produce heat with surface device when printed substrate works, in order to which heat can be discharged faster, prevent
Only circuit board burns, and portioned product has selected the aluminium base of high heat conduction（It is made up of copper face, insulating barrier, aluminium base, protecting film）, when this
Kind of aluminium base product surface handling process selection soldering reliability can preferably tin spray process when, spray tin processing temperature is 260 degree high
Destruction can be polymerize under temperature, original aluminium base protecting film high temperature, it is difficult to peel off.As shown in Figure 4 and Figure 5, it is universal in usual industry
Way is：Before aluminium base spray tin processing, the aluminium base diaphragm of non-refractory is torn, increases resistant to elevated temperatures blue glue to protect
Aluminium base face, because aluminium material is softer, tears after original aluminium base protecting film, aluminium base plate surface can repeatedly be exposed, and easily make aluminium
Substrate surface formation oxide-film, and so that plate is easily contacted with plate in the operating process for tearing original aluminium base protecting film,
Easily cause aluminium base plate surface and wiped flower, influence outward appearance；After aluminium base sprays tin, the blue glue in aluminium base plate surface easily comes off,
Need to print blue glue, aluminium base stress during shaping so that blue glue can come off again again again before the forming, therefore going out
Need to print aluminium base in blue glue protection, prevention transportation before goods again again and wiped flower, even in the process of aluminium base
It is middle using the repeatedly blue adhesive process of print, also can not completely unavoidable aluminium base plate surface occur wiping flower phenomenon, so product makes to client
With preceding tearing after blue glue, surface can be exposed to by wiping the aluminium base face of flower, had a strong impact on outward appearance, frequently resulted in customer complaint with scrapping,
So aluminium base plate surface is wiped flower proactive problem and unanimously perplexs whole industry.
The content of the invention
Manufacture method is protected it is an object of the invention to provide a kind of aluminium base, the wiping of PCB surface can be not only prevented
Flower and oxidation；And the production and processing process of wiring board can be simplified, processing efficiency, reduction processing cost is improved.
The present invention can be achieved through the following technical solutions：
A kind of preparation method for the aluminum-based circuit board protected with aluminium base face, it is characterised in that：Comprise the following steps：
（1）Preamble processing：By normal circuit board manufacturing process flow, wiring board is carried out to sawing sheet, drilling, outer layer line successively
Road, outer layer etching, outer layer erosion inspection and welding resistance make；
（2）Patch spray tin adhesive tape：After the completion of the preamble processing of first step wiring board, in circuit back prepared by above-mentioned steps
One layer of spray tin adhesive tape of patch；
（3）Spray tin processing：The back side of above-mentioned wiring board is completed after patch spray tin adhesive tape, and wiring board prepared by above-mentioned steps is placed in into spray
In tin machine, to wiring board front on circuit pack carry out spray tin processing, while allow spray tin adhesive tape at high temperature with circuit
The overcoat of back is closely combined together；
（4）Electrical testing processing：Electricity is carried out to the circuit pack on wiring board prepared by above-mentioned steps using electron detection device
Performance detection processing；
（5）Forming processes：Required wiring board external form is processed using former；
（6）Finished product inspection：Finished product inspection is carried out to wiring board prepared by above-mentioned steps；
（7）Packaging and storage：By the wiring board of passed examination packaging and storage on request.
Before the present invention is mainly by assist side progress spray tin processing, one layer of spray tin is pasted on the back side of assist side
Adhesive tape, can bear to spray high temperature during tin due to spray tin adhesive tape, on the one hand can avoid the overcoat of wiring board at high temperature by
Destruction so that wiring board is damaged by high temperature, on the other hand can allow spray tin adhesive tape at high temperature with circuit back
Overcoat is closely combined together, for preventing the overcoat of circuit back from polymerization destruction occurring at high temperature, it is difficult to shell
From wiring board, so spray tin adhesive tape just can play a part of protection circuit plate and overcoat when spraying tin；And spray tin adhesive tape
Come after being attached on the back side of wiring board until can be just torn before, during the production and processing and transport of assist side,
Spray tin adhesive tape, which is attached to, can avoid the back side of wiring board from wiping flower surface by foreign object on the back side of wiring board, reduce scrapping for wiring board
Rate.It can cancel overcoat and print orchid that spray tin before processing tears non-refractory using the invention enables the procedure of processing of wiring board
The steps such as the blue glue of substrate back polishing print before glue step, and cancellation shaping, before shipment, realize the simplification of work flow,
Shorten the cycle of the production and processing of wiring board, save processing cost, improve processing efficiency.
Further, the step（1）In wiring board be made of aluminium material, including substrate body and overcoat, institute
The one side that overcoat is covered in substrate body is stated, the one side covered with overcoat is the circuit back.Due to assist side
Substantial amounts of heat can be produced when upper printed wire and finished surface device, wiring board is made from the aluminium material of high heat conduction can be by
Heat is quickly conducted, and effectively avoids wiring board from being burnt out by the heat discharged in process of manufacture；The overcoat
Close over the one side in substrate body, substrate body can be avoided to be contacted with air contact or foreign object, prevent substrate body quilt
F. O. D wipes flower, or oxidation reaction occurs for substrate body itself, overcoat is played a part of protective substrate body.
Further, the another side of the substrate body is covered with High-heat-conductiviinsulation insulation material layer, High-heat-conductiviinsulation insulation material layer
Upper surface provided with one layer of copper foil, the one side provided with copper foil is wiring board front.High-heat-conductiviinsulation insulation material layer can be with
Accelerate the heat produced during transmission wiring board production and processing, it is to avoid damage of the wiring board during production and processing to substrate body
It is bad, play a part of protective substrate body；The copper foil is for making the circuit pack on wiring board.
Further, the step（1）Comprise the following steps：
A, sawing sheet：Satisfactory fritter aluminium base is cut on the aluminium base sheet material of bulk；
B, drilling：As requested, get out what is be pre-designed on aluminium base using drilling machine on satisfactory relevant position
Hole；
C, outer-layer circuit：Designed line pattern is transferred on the copper-clad surface of aluminium base by pattern transfer；
D, outer layer etching：Aluminium base is put into etching solution, etching off logicalnot circuit layers of copper is exposed circuit pack, shaped
Line map, makes aluminium base formation wiring board；
E, outer layer erosion inspection：The circuit pack on wiring board prepared to above-mentioned steps carries out open circuit and short-circuit detecting；
F, welding resistance make：The solder mask on the positive logicalnot circuit printed portions of the wiring board prepared by above-mentioned steps.
Further, the step（2）Spray tin adhesive tape be attached to the outer surface of overcoat, complete after patch spray tin adhesive tape, root
According to the hole position position on wiring board corresponding hole position is made on spray tin adhesive tape.It is described that making hole position can be square on spray tin adhesive tape
To the positioning of wiring board when just using.
Further, the spray tin adhesive tape uses the red masking tape of high temperature resistant, and temperature resistant range is 260 DEG C~280 DEG C.
The long-term temperature tolerance of the red masking tape of high temperature resistant can reach 260 DEG C, and short-term temperature tolerance can reach 280 DEG C, therefore will
Wiring board be placed under 260 DEG C of hot environment carry out spray tin when, the red masking tape of high temperature resistant can in high temperature environments with overcoat
Be combined together, make that overcoat contacts with the red masking tape of high temperature resistant is more close, and overcoat when spraying tin processing by
To the protection of the red masking tape of high temperature resistant, it will not make overcoat can be with by its adhesion between substrate body of high temperature
Sustainable protection substrate body.
Further, in step（2）And step（3）Between also include pre-treatment and upper scaling powder, the pre-treatment be
Wiring board is cleaned using liquid medicine before spray tin；The upper scaling powder is that assist side is not pasting spray tin adhesive tape just before spray tin
Upper scaling powder is coated with face.The pre-treatment can remove the debris remained on aluminium base, prevent the residual of debris and can cause line
There is the failures such as short interruption, the progress of convenient spray tin processing in road plate.
The preparation method for the aluminum-based circuit board that the present invention is protected with aluminium base face, compared with prior art, with following
Beneficial effect：
Firstth, wiring board is avoided to be destroyed at high temperature, before the present invention is mainly by assist side progress spray tin processing,
One layer of spray tin adhesive tape is pasted on the back side of wiring board, can bear to spray high temperature during tin due to spray tin adhesive tape, it is to avoid wiring board
Overcoat is corrupted such that wiring board is damaged by high temperature at high temperature, and so spray tin adhesive tape just can play guarantor when spraying tin
Protect the effect of wiring board；
Secondth, avoid wiping colored problem, spray tin adhesive tape comes after being attached on the back side of wiring board until can just be torn before, online
During the production and processing and transport of road plate, spray tin adhesive tape, which is attached to, can avoid the back side quilt of wiring board on the back side of wiring board
Foreign object wipes flower surface, reduces the scrappage of wiring board；
3rd, simplify work flow, using the invention enables the procedure of processing of wiring board can cancel spray tin before tear intolerant to height
Substrate surface polishing of the overcoat of temperature with printing before blue glue step, and cancellation shaping, before shipment prints the steps such as blue glue, realizes
The simplification of work flow；
3rd, processing efficiency is improved, the present invention can cancel the blue glue step of multiple print, and during production and processing,
Patch spray tin adhesive tape only need to patch once both can, be effectively reduced process time, shorten the production cycle, improve processing efficiency；
4th, processing cost is reduced, the present invention only needs to one layer of spray tin adhesive tape of patch, it is possible to cancel the blue adhesive process of print of multilayer,
And the red masking tape of high temperature resistant is conventional spray tin adhesive tape, its abundance is with low cost, can effectively reduce and be processed into
This.
Brief description of the drawings
The schematic cross-section of substrate when Fig. 1 is supplied materials；
Schematic cross-section after the circuit sheet metal forming that Fig. 2 processes for the present invention；
Fig. 3 is wiring board work flow schematic diagram of the invention；
Fig. 4 is the schematic cross-section after the circuit sheet metal forming of original processing method；
Fig. 5 is first original circuit plate work flow schematic diagram；
Brief description of the drawings：1 substrate, 2 overcoats, 3 High temperature-resistanadhesive adhesive tapes, 4 High-heat-conductiviinsulation insulation materials, 5 copper foils, 6 circuit packs, 7 blue glue.
Embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and accompanying drawing
Product of the present invention is described in further detail.
As depicted in figs. 1 and 2, wiring board of the invention is made of aluminium material, including substrate body 1 and overcoat 2, institute
The one side that overcoat 2 is covered in substrate body 1 is stated, the one side covered with overcoat is circuit back；The substrate body 1
Another side is covered with High-heat-conductiviinsulation insulation material layer 4, and the upper surface of High-heat-conductiviinsulation insulation material layer 4 is provided with one layer of copper foil 5, provided with copper foil
One side for wiring board front；After circuit sheet metal forming, circuit pack 6 can be formed on High-heat-conductiviinsulation insulation material layer 4, and is protected
One layer of spray tin adhesive tape 3 for sticking of spray tin before processing is covered with the outer surface of layer 2, allow spray tin adhesive tape 3 at high temperature with line
The overcoat 2 of road back is closely combined together, for preventing the overcoat 2 of circuit back from polymerizeing at high temperature
Destruction, it is difficult to peel off wiring board.
As shown in figure 3, a kind of preparation method for the aluminum-based circuit board protected with aluminium base face, comprises the following steps：
（1）Preamble processing：By normal circuit board manufacturing process flow, wiring board is carried out to sawing sheet, drilling, outer layer line successively
Road, outer layer etching, outer layer erosion inspection and welding resistance make, and comprise the following steps that：
A, sawing sheet：Satisfactory fritter aluminium base is cut on the aluminium base sheet material of bulk；
B, drilling：According to engine request, on satisfactory relevant position using drilling machine on the aluminium base of above-mentioned gained
Get out the hole being pre-designed；
C, outer-layer circuit：Aluminium base after above-mentioned completion is drilled is put into cleaning machine and cleaned, and can so remove aluminium base
Debris on surface, then prints one layer of photosensitive-ink in aluminium base plate surface again, will be designed after photosensitive-ink is dried
The circuit diagram film is placed on both sides above and below aluminium base, and is exposed, so as to form line map on aluminium base, then develops,
Unexposed photosensitive material dissolution is fallen, staying for having exposed just forms line gap, and finally the aluminium base of gained is tested,
Enter next process after qualified aluminium base cleaning, drying by examining；
D, outer layer etching：The aluminium base of above-mentioned gained is put into the liquid medicine such as ammoniacal copper complex ion, chlorion, etching off logicalnot circuit copper
Layer, leaves circuit pack, then aluminium base is put into sodium hydroxide again, removes the film, exposes logicalnot circuit layers of copper；Finally exist
Aluminium base is put into tin stripper and soaked, the tin layers of circuit pack are removed, etch process is completed, obtains complete circuit
Figure, makes aluminium base formation wiring board, and the wiring board of above-mentioned gained is tested, and then qualified wiring board will be examined to clean
Enter next process after drying；
E, outer layer erosion inspection：The circuit pack on wiring board prepared to above-mentioned steps carries out open circuit and short-circuit detecting；
F, welding resistance make：Solder mask on the qualified positive logicalnot circuit printed portions of wiring board is detected in above-mentioned steps.
（2）Patch spray tin adhesive tape：After the wiring board of above-mentioned steps completes preamble processing, the wiring board prepared in above-mentioned steps
One layer of spray tin adhesive tape is pasted on the back side, overcoat of the spray tin adhesive tape at high temperature with circuit back is closely combined one
Rise, for preventing the overcoat of circuit back from polymerization destruction occurring at high temperature, it is difficult to peel off wiring board；When the resistance to height of completion patch
, it is necessary to make corresponding hole position on the red masking tape of high temperature resistant according to the hole position position on wiring board after the red masking tape of temperature.
（3）Spray tin：Mainly include pre-treatment, upper scaling powder and spray tin, comprise the following steps that：
Pre-treatment：The wiring board of above-mentioned preparation is cleaned using the liquid medicine containing sodium peroxydisulfate before spray tin, wiring board is removed
The organic pollution of upper residual, makes the copper face of circuit pack really clean and can effectively be contacted with tin is melted；
Upper scaling powder：By after above-mentioned cleaning wiring board preheating, preheating can effectively prevent preheating section metal part because
Drip to scaling powder and get rusty or burn out, when wiring board plate face temperature reaches suitable temperature, assist side does not paste spray tin adhesive tape
Upper scaling powder is coated with front；
Spray tin：Wiring board prepared by above-mentioned steps is placed in tin-spraying machine, and regulation temperature makes tin-spraying machine to wiring board to 260 DEG C
Circuit pack on front carries out spray tin processing, is conducive to welding and protecting copper face.
（4）Electrical testing：The wiring board of above-mentioned gained is carried out after cleaning, drying, is put into automatic optical detector to line
Circuit pack on the plate of road carries out electrical property detection, and the wiring board for detecting qualified is carried out into chemical medicinal liquid oil removing, microetch, acid successively
After washing, then wiring board is put into anti-oxidant organic film reactive tank, one layer is formed on the copper face of the circuit pack of assist side
Close diaphragm, then clean the wiring board of above-mentioned gained with deionized water again, and into next road after wiring board is dried up
Process.
（5）Shaping：After above-mentioned wiring board cleaning, drying, high-precision numerical control machine is put into, according to designed data
Wiring board is processed into predetermined specification, wiring board specification tested after machining, it is to be tested after the completion of by examine close
Enter next process after the wiring board cleaning, drying of lattice.
（6）Product inspection：Whether occur wiping colored phenomenon in the PCB surface of the above-mentioned preparation of hand inspection, check various
Whether electronic component has omission and wrong plug etc., checks wiring board with the presence or absence of defects such as list edge, rosin joint and dry joints.
（7）Packaging and storage：By above-mentioned wiring board packaging and storage on request after the assay was approved.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification accompanying drawing and described above and swimmingly implement the present invention；But, it is all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations for a little variation, modification and evolution made, are the equivalent embodiment of the present invention；Meanwhile, it is all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical scheme.
Claims (7)
1. a kind of preparation method for the aluminum-based circuit board protected with aluminium base face, it is characterised in that：Comprise the following steps：
（1）Preamble processing：By normal circuit board manufacturing process flow, wiring board is carried out to sawing sheet, drilling, outer layer line successively
Road, outer layer etching, outer layer erosion inspection and welding resistance make；
（2）Patch spray tin adhesive tape：After the completion of the preamble processing of first step wiring board, in circuit back prepared by above-mentioned steps
One layer of spray tin adhesive tape of patch；
（3）Spray tin processing：The back side of above-mentioned wiring board is completed after patch spray tin adhesive tape, and wiring board prepared by above-mentioned steps is placed in into spray
In tin machine, to wiring board front on circuit pack carry out spray tin processing, while allow spray tin adhesive tape at high temperature with circuit
The overcoat of back is closely combined together；
（4）Electrical testing processing：Electricity is carried out to the circuit pack on wiring board prepared by above-mentioned steps using electron detection device
Performance detection processing；
（5）Forming processes：Required wiring board external form is processed using former；
（6）Finished product inspection：Finished product inspection is carried out to wiring board prepared by above-mentioned steps；
（7）Packaging and storage：By the wiring board of passed examination packaging and storage on request.
2. the preparation method of the aluminum-based circuit board according to claim 1 protected with aluminium base face, it is characterised in that：It is described
Step（1）In wiring board be made of aluminium material, including substrate body and overcoat, the overcoat are covered in substrate body
One side, the one side covered with overcoat be the circuit back.
3. the preparation method of the aluminum-based circuit board according to claim 2 protected with aluminium base face, it is characterised in that：It is described
The another side of substrate body is provided with one layer of copper foil covered with High-heat-conductiviinsulation insulation material layer, the upper surface of High-heat-conductiviinsulation insulation material layer,
One side provided with copper foil is wiring board front.
4. the preparation method of the aluminum-based circuit board according to claim 1 protected with aluminium base face, it is characterised in that：It is described
Step（1）Comprise the following steps：
A, sawing sheet：Satisfactory fritter aluminium base is cut on the aluminium base sheet material of bulk；
B, drilling：As requested, get out what is be pre-designed on aluminium base using drilling machine on satisfactory relevant position
Hole；
C, outer-layer circuit：Designed line pattern is transferred on the copper-clad surface of aluminium base by pattern transfer；
D, outer layer etching：Aluminium base is put into etching solution, etching off logicalnot circuit layers of copper is exposed circuit pack, shaped
Line map, makes aluminium base formation wiring board；
E, outer layer erosion inspection：The circuit pack on wiring board prepared to above-mentioned steps carries out open circuit and short-circuit detecting；
F, welding resistance make：The solder mask on the positive logicalnot circuit printed portions of the wiring board prepared by above-mentioned steps.
5. the preparation method of the aluminum-based circuit board according to claim 1 protected with aluminium base face, it is characterised in that：It is described
Step（2）Spray tin adhesive tape be attached to the outer surface of overcoat, complete after patch spray tin adhesive tape, existed according to the hole position position on wiring board
Corresponding hole position is made on spray tin adhesive tape.
6. the preparation method of the aluminum-based circuit board according to claim 5 protected with aluminium base face, it is characterised in that：It is described
Spray tin adhesive tape uses the red masking tape of high temperature resistant, and temperature resistant range is 260 DEG C~280 DEG C.
7. the preparation method of the aluminum-based circuit board according to claim 1 protected with aluminium base face, it is characterised in that：In step
Suddenly（2）And step（3）Between also include pre-treatment and upper scaling powder, the pre-treatment be spray tin before using liquid medicine to wiring board
Cleaned；The upper scaling powder be spray tin before assist side do not paste spray tin adhesive tape front on coating on scaling powder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373897.6A CN107278060B (en) | 2017-05-24 | 2017-05-24 | A kind of preparation method of the aluminum-based circuit board with the protection of aluminium base face |
| PCT/CN2017/106651 WO2018214392A1 (en) | 2017-05-24 | 2017-10-18 | Method for preparing aluminum-based circuit board having aluminum-based surface protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710373897.6A CN107278060B (en) | 2017-05-24 | 2017-05-24 | A kind of preparation method of the aluminum-based circuit board with the protection of aluminium base face |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107278060A true CN107278060A (en) | 2017-10-20 |
| CN107278060B CN107278060B (en) | 2019-11-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710373897.6A Active CN107278060B (en) | 2017-05-24 | 2017-05-24 | A kind of preparation method of the aluminum-based circuit board with the protection of aluminium base face |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107278060B (en) |
| WO (1) | WO2018214392A1 (en) |
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| CN107683029A (en) * | 2017-10-26 | 2018-02-09 | 东莞联桥电子有限公司 | A kind of negative film pcb board tin spray process |
| CN108917825A (en) * | 2018-05-11 | 2018-11-30 | 广东世运电路科技股份有限公司 | A kind of PCB solder mask performance test methods |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110351946A (en) * | 2019-07-30 | 2019-10-18 | 佛山市顺德区冠宇达电源有限公司 | A kind of processing technology of the radiating circuit module of power supply adaptor component |
| CN110351947A (en) * | 2019-07-30 | 2019-10-18 | 佛山市顺德区冠宇达电源有限公司 | A kind of radiating circuit module of power supply adaptor component |
| CN111654977A (en) * | 2020-06-22 | 2020-09-11 | 广德众泰科技有限公司 | Method for manufacturing oxidation-resistant circuit board |
| CN114025490A (en) * | 2021-11-02 | 2022-02-08 | 恩达电路(深圳)有限公司 | Production method of single-sided steel-based circuit board |
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| CN112074100B (en) * | 2020-09-11 | 2024-03-22 | 奥士康科技股份有限公司 | Method for preventing tin plating of golden finger from being scrapped |
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|---|---|---|---|---|
| CN107683029A (en) * | 2017-10-26 | 2018-02-09 | 东莞联桥电子有限公司 | A kind of negative film pcb board tin spray process |
| CN108917825A (en) * | 2018-05-11 | 2018-11-30 | 广东世运电路科技股份有限公司 | A kind of PCB solder mask performance test methods |
| CN108917825B (en) * | 2018-05-11 | 2020-09-11 | 广东世运电路科技股份有限公司 | PCB solder mask ink performance testing method |
| CN110324980A (en) * | 2019-05-02 | 2019-10-11 | 深圳市星河电路股份有限公司 | A kind of turmeric adds the processing method of spray two kinds of different surface treatment pcb boards of tin finger |
| CN110324980B (en) * | 2019-05-02 | 2021-06-01 | 深圳市星河电路股份有限公司 | Processing method for PCB with gold immersion and tin spraying fingers through two different surface treatments |
| CN110351946A (en) * | 2019-07-30 | 2019-10-18 | 佛山市顺德区冠宇达电源有限公司 | A kind of processing technology of the radiating circuit module of power supply adaptor component |
| CN110351947A (en) * | 2019-07-30 | 2019-10-18 | 佛山市顺德区冠宇达电源有限公司 | A kind of radiating circuit module of power supply adaptor component |
| CN111654977A (en) * | 2020-06-22 | 2020-09-11 | 广德众泰科技有限公司 | Method for manufacturing oxidation-resistant circuit board |
| CN114025490A (en) * | 2021-11-02 | 2022-02-08 | 恩达电路(深圳)有限公司 | Production method of single-sided steel-based circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107278060B (en) | 2019-11-15 |
| WO2018214392A1 (en) | 2018-11-29 |
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