CN107278033A - A kind of method of anti-dust suction blockage in copper base boring procedure - Google Patents

A kind of method of anti-dust suction blockage in copper base boring procedure Download PDF

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Publication number
CN107278033A
CN107278033A CN201710560421.3A CN201710560421A CN107278033A CN 107278033 A CN107278033 A CN 107278033A CN 201710560421 A CN201710560421 A CN 201710560421A CN 107278033 A CN107278033 A CN 107278033A
Authority
CN
China
Prior art keywords
drilling
copper base
dust suction
apertures
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710560421.3A
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Chinese (zh)
Inventor
邓万权
蒋善刚
周睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aoshikang Precision Circuit Huizhou Co Ltd
Original Assignee
Aoshikang Precision Circuit Huizhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aoshikang Precision Circuit Huizhou Co Ltd filed Critical Aoshikang Precision Circuit Huizhou Co Ltd
Priority to CN201710560421.3A priority Critical patent/CN107278033A/en
Publication of CN107278033A publication Critical patent/CN107278033A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)

Abstract

A kind of method of anti-dust suction blockage in copper base boring procedure, including improvement drilling and improvement copper base drilling program, by carrying out bore process improvement to the hole and explosionproof hole of choosing particular size, reduce the generation of bulk copper junk such as copper wire etc. in drilling, ensure the smooth of dust sucting pipeline, maintain board production stability, it is to avoid deadlock, maintenance of equipment cost.

Description

A kind of method of anti-dust suction blockage in copper base boring procedure
Technical field
The present invention relates to PCB production fields, and in particular to a kind of method of anti-dust suction blockage in copper base boring procedure.
Background technology
With the development of electronics industry, the development of PCB is with reforming also in change slowly, especially China's Mainland On pcb board accounting it is increasing, while daily necessities, science and technology, automobile industry high speed development drive on, PCB As the carrier of electronic product, also constantly it can update and change, such as:Copper base, one kind is applied to high-frequency circuit and height In the radiating and architectural decoration of the regional and accurate communication equipment of low temperature change greatly, thicker copper foil plus metal is it used Basal plate is combined, and copper base metal-based layer is the supporting member of copper base, it is desirable to high-termal conductivity, usually copper coin, Gu Many challenges are brought in drilling production difficulty, especially producing copper base process needs to bore the different hole of various sizes and a large amount of anti- Blast hole(For mitigating the hole of impulsive force during mould punching in PCB productions), due to adopting when usual copper-based twist drill macropore and explosionproof hole Nozzle is bored with large scale disposably to drill, and a large amount of block dust and copper wire that produce can cause dust suction blockage, this research master To be improved around a kind of anti-sweep-up pipe obstruction method research of boring procedure with reference to actual producing line condition, it is ensured that production is smooth.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of method of anti-dust suction blockage in copper base boring procedure.
The technical problems to be solved by the invention are achieved by the following technical programs:
The method of anti-dust suction blockage, comprises the following steps in a kind of copper base boring procedure:
(1)Improve drilling:When carrying out the drilling design of copper base drilling, the macropore of all diameter >=3.0mm in drilling is chosen, Design four apertures in macroporous regions, four apertures and macropore is tangent and four apertures between adjacent two apertures Distance >=0.1mm;The explosionproof hole of all a diameter of 1.4-3.0mm in drilling is chosen, a mesopore is designed in explosion-proof bore region, The mesopore not with explosionproof hole is tangent and area is more than the half of explosionproof hole;
(2)Improve copper base drilling program:When being drilled to copper base, macropore and explosionproof hole are bored after subdrilling aperture and mesopore again, it is right The side that nozzle stops one turn of switching using multistage drilling program one is bored using segmentation driller's skill, i.e. setting in all diameter > 1.8mm hole Formula drills.
Further, described multistage drilling program is four sections of drilling programs, i.e., to stop, drilling, stop, drilling, stop Only, drill, stop, the mode of drilling manipulates brill nozzle.
The present invention has the advantages that:
This method subdrilling aperture and mesopore then bore macropore and explosionproof hole again, and the small size that middle aperture is used bores nozzle can effectively chip Base material further reduces the block dust for boring and being produced during macropore without forming block, then, while using segmentation driller's skill, can Incision copper wire, which is not formed, twines silk.Load forces and the master of sweep-up pipe are effectively reduced due to not producing a large amount of copper wires, block dust Axle torsion, also ensures the smooth of dust sucting pipeline, maintains board production stability, it is to avoid deadlock, maintenance of equipment cost.
Embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention, It is not limitation of the invention.
The method of anti-dust suction blockage, comprises the following steps in a kind of copper base boring procedure:
(1)Improve drilling:When carrying out the drilling design of copper base drilling, the macropore of all diameter >=3.0mm in drilling is chosen, Design four apertures in macroporous regions, four apertures and macropore is tangent and four apertures between adjacent two apertures Distance >=0.1mm;The explosionproof hole of all a diameter of 1.4-3.0mm in drilling is chosen, a mesopore is designed in explosion-proof bore region, The mesopore not with explosionproof hole is tangent and area is more than the half of explosionproof hole;
(2)Improve copper base drilling program:When being drilled to copper base, macropore and explosionproof hole are bored after subdrilling aperture and mesopore again, it is right The side that nozzle stops one turn of switching using multistage drilling program one is bored using segmentation driller's skill, i.e. setting in all diameter > 1.8mm hole Formula drills.I.e. with stop, drilling, stop, drilling, stop, drilling, stop, drilling four sections of drilling program modes manipulate brill nozzle.
I takes charge of the area of copper base, power supply with a large amount of explosion-proof orifice plates and monthly accounts for 1.5% at present, is bored by using this one kind The anti-sweep-up pipe obstruction method of hole process, it is to avoid deadlock, maintenance of equipment cost, its explosion-proof orifice plate lamination number adds 1PNL, is taken charge of by me Drill the monthly Wan ㎡ of output 9, and synthesis can save 800,000 yuans every year.

Claims (2)

1. the method for anti-dust suction blockage, comprises the following steps in a kind of copper base boring procedure:
(1)Improve drilling:When carrying out the drilling design of copper base drilling, the macropore of all diameter >=3.0mm in drilling is chosen, Design four apertures in macroporous regions, four apertures and macropore is tangent and four apertures between adjacent two apertures Distance >=0.1mm;The explosionproof hole of all a diameter of 1.4-3.0mm in drilling is chosen, a mesopore is designed in explosion-proof bore region, The mesopore not with explosionproof hole is tangent and area is more than the half of explosionproof hole;
(2)Improve copper base drilling program:When being drilled to copper base, macropore and explosionproof hole are bored after subdrilling aperture and mesopore again, it is right The side that nozzle stops one turn of switching using multistage drilling program one is bored using segmentation driller's skill, i.e. setting in all diameter > 1.8mm hole Formula drills.
2. the method for anti-dust suction blockage in copper base boring procedure is obtained according to claim 1, it is characterised in that described Multistage drilling program be four sections of drilling programs, i.e., to stop, drilling, stop, drilling, stop, drilling, the side for stopping, drilling Nozzle is bored in formula manipulation.
CN201710560421.3A 2017-07-11 2017-07-11 A kind of method of anti-dust suction blockage in copper base boring procedure Pending CN107278033A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710560421.3A CN107278033A (en) 2017-07-11 2017-07-11 A kind of method of anti-dust suction blockage in copper base boring procedure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710560421.3A CN107278033A (en) 2017-07-11 2017-07-11 A kind of method of anti-dust suction blockage in copper base boring procedure

Publications (1)

Publication Number Publication Date
CN107278033A true CN107278033A (en) 2017-10-20

Family

ID=60072396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710560421.3A Pending CN107278033A (en) 2017-07-11 2017-07-11 A kind of method of anti-dust suction blockage in copper base boring procedure

Country Status (1)

Country Link
CN (1) CN107278033A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101692757A (en) * 2009-09-07 2010-04-07 皆利士多层线路版(中山)有限公司 Process for manufacturing 12OZ thick copper multilayer circuit board
CN101862843A (en) * 2010-06-13 2010-10-20 大连太平洋多层线路板有限公司 Drilling method of thick copper power circuit board of 5-12oz
CN102098879A (en) * 2011-03-04 2011-06-15 奥士康精密电路(惠州)有限公司 Method for drilling internal layer thick copper plate
CN202406383U (en) * 2012-01-09 2012-08-29 苏州艾迪亚电子科技有限公司 High-density multilayer PCB capable of rapidly removing scraps and preventing drill bit from being damaged
CN104427768A (en) * 2013-08-29 2015-03-18 北大方正集团有限公司 Circuit board drilling method and circuit board manufactured by method
CN104874826A (en) * 2015-05-04 2015-09-02 深圳崇达多层线路板有限公司 Drilling method of thick copper circuit board
CN205029957U (en) * 2015-09-24 2016-02-10 广州兴森快捷电路科技有限公司 Drilling structure of lamination board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101692757A (en) * 2009-09-07 2010-04-07 皆利士多层线路版(中山)有限公司 Process for manufacturing 12OZ thick copper multilayer circuit board
CN101862843A (en) * 2010-06-13 2010-10-20 大连太平洋多层线路板有限公司 Drilling method of thick copper power circuit board of 5-12oz
CN102098879A (en) * 2011-03-04 2011-06-15 奥士康精密电路(惠州)有限公司 Method for drilling internal layer thick copper plate
CN202406383U (en) * 2012-01-09 2012-08-29 苏州艾迪亚电子科技有限公司 High-density multilayer PCB capable of rapidly removing scraps and preventing drill bit from being damaged
CN104427768A (en) * 2013-08-29 2015-03-18 北大方正集团有限公司 Circuit board drilling method and circuit board manufactured by method
CN104874826A (en) * 2015-05-04 2015-09-02 深圳崇达多层线路板有限公司 Drilling method of thick copper circuit board
CN205029957U (en) * 2015-09-24 2016-02-10 广州兴森快捷电路科技有限公司 Drilling structure of lamination board

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Application publication date: 20171020