CN107273962B - Smart card middle material manufacturing method and middle material structure - Google Patents
Smart card middle material manufacturing method and middle material structure Download PDFInfo
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- CN107273962B CN107273962B CN201610423738.8A CN201610423738A CN107273962B CN 107273962 B CN107273962 B CN 107273962B CN 201610423738 A CN201610423738 A CN 201610423738A CN 107273962 B CN107273962 B CN 107273962B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
- G06K19/0702—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including a battery
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
- G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
- G06K19/07707—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual the visual interface being a display, e.g. LCD or electronic ink
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a smart card middle material manufacturing method and a smart card middle material structure.A transparent sheet is adopted to manufacture an electronic module wall-patching board, key holes corresponding to keys of an electronic module and punched holes corresponding to components of the electronic module are formed on the transparent sheet, and a key protection film is attached to the key holes to prevent the keys from being exposed after a smart card is manufactured; after the electronic module wall repairing plate is completed, the electronic module and the electronic module wall repairing plate are overlapped and fixed through glue, a reinforced electronic module after reinforcement is obtained, and then the reinforced electronic module is embedded into the middle material frame to form a middle material structure. Because the electronic module is firstly filled and leveled and is embedded into the material shell of the visible card, the problem that the visible card is compatible with the common card process is effectively solved; the problem of unevenness of the middle layer caused by glue shrinkage after traditional gluing is solved; the flexibility of the card is enhanced, the glue applying amount is reduced, and various difficult problems of glue feeding of a labeling/strip-sticking key and the like are solved.
Description
Technical Field
The invention relates to the technology of smart cards, in particular to a smart card middle material manufacturing method and a smart card middle material structure.
Background
Smart cards (smartcards), a generic term for plastic cards (usually the size of a credit card) with a microchip embedded therein, such as video cards. The intermediate layer or the intermediate structure of the smart card has an electronic module, which in some smart cards is generally a flexible electronic module.
The invention patent application document (publication number is CN104527202A) disclosed by the Chinese patent office discloses a method for manufacturing a card intermediate layer, which is a brand-new method for manufacturing the card intermediate layer at low temperature and low pressure. The method comprises the steps of manufacturing a middle material shell, filling the flexible electronic module, and directly filling and sealing with glue to manufacture a middle material structure. The flatness of the electronic module completely depends on glue filling, the electronic module is poor in toughness and easy to damage and deform, and the keys are easy to glue. The flatness is difficult to guarantee, and the medium material is easy to be uneven and is not easy to be pasted with holographic labels and signature strips.
Disclosure of Invention
The invention provides a smart card middle material manufacturing method and a smart card middle material structure, which solve the technical problem in the traditional process.
In order to solve the problems, the invention provides a method for manufacturing a smart card middle material, which comprises the following steps:
providing a transparent sheet, wherein a key hole is formed in the transparent sheet;
forming a first adhesive layer on at least a key hole area on the first surface of the transparent sheet, forming a key protection film on the first adhesive layer, and punching the transparent sheet, wherein the punching position corresponds to the position of an intelligent card component;
cutting the transparent sheet to obtain at least one filling piece, wherein the filling piece is consistent with the electronic module of the intelligent card in shape and size, and a second adhesive layer is formed on the first surface or the second surface of the filling piece to obtain the electronic module wall repairing plate;
superposing the electronic module on the second adhesive layer of the electronic module wall-repairing plate to obtain a wall-repairing electronic module;
and embedding the wall-repairing electronic module into the middle material frame shell, and completely coating or coating a fixed point with a third adhesive layer on the upper edges of the wall-repairing electronic module and the middle material frame shell along the gap between the wall-repairing electronic module and the middle material frame shell so as to fix the wall-repairing electronic module in the middle material frame shell and obtain a middle material structure.
According to an embodiment of the invention, further comprising the steps of:
putting the medium material structure into glue driving equipment for glue driving; and
and curing the glue layer of the medium material structure after glue removing.
According to one embodiment of the invention, the step of curing the glue layer of the medium material structure after glue removing comprises the following steps: placing the medium material structure subjected to glue removing into laminating equipment for laminating; and baking the laminated intermediate material structure for a certain time.
According to one embodiment of the present invention, the substrate of the third glue layer is epoxy glue.
According to one embodiment of the present invention, the substrate of the second adhesive layer is UV glue.
According to an embodiment of the invention, the thickness of the second glue layer is between 0.01mm and 0.05 mm.
According to one embodiment of the invention, after the electronic module is laminated on the second adhesive layer of the electronic module wall repairing plate, the laminated electronic module and the electronic module wall repairing plate are placed into a glue driving device for driving glue, and the glue is driven and then cured to obtain the wall repairing electronic module.
According to one embodiment of the invention, the curing step of curing after glue driving comprises the following steps: and (4) placing the mixture into a low-temperature UV furnace for curing for 1-3 minutes.
According to one embodiment of the invention, the transparent sheet is a PVC, PET, PC, or ABS sheet.
The invention also provides a smart card middle material structure, which comprises:
the intelligent card comprises a transparent sheet, a key hole and a punched hole are formed in the transparent sheet, the punched hole corresponds to the position of an intelligent card component, and the shape and the size of the electronic module of the transparent sheet are consistent with those of the electronic module of the intelligent card;
a first adhesive layer formed on at least a key hole region on a first surface of the transparent sheet;
the key protection film is formed on the first adhesive layer, and the transparent sheet, the first adhesive layer and the key protection film form a filling sheet;
the second adhesive layer is formed on the first surface or the second surface of the filling sheet, and the filling sheet and the second adhesive layer form the electronic module wall repairing plate;
the electronic module is superposed on the second adhesive layer of the electronic module wall repairing plate;
the wall-repairing electronic module is embedded into the middle material frame shell;
and the third adhesive layer is completely coated or coated at fixed points along the gap between the wall-repairing electronic module and the middle material frame shell and is used for fixing the wall-repairing electronic module in the middle material frame shell.
After the technical scheme is adopted, compared with the prior art, the invention has the following beneficial effects: the method comprises the following steps of manufacturing an electronic module wall repairing plate by adopting a transparent sheet, forming a key hole corresponding to a key of the electronic module and a punched hole corresponding to an electronic module component on the transparent sheet, and attaching a key protection film at the key hole to prevent the key from being exposed after the smart card is manufactured; after the electronic module wall repairing plate is completed, the electronic module and the electronic module wall repairing plate are overlapped and fixed through glue, a reinforced electronic module after reinforcement is obtained, and then the reinforced electronic module is embedded into the middle material frame to form a middle material structure. Because the electronic module is firstly filled and leveled and is embedded into the material shell of the visible card, the problem that the visible card is compatible with the common card process is effectively solved; the problem of unevenness of the middle layer caused by glue shrinkage after traditional gluing is solved; the flexibility of the card is enhanced, the glue applying amount is reduced, and various difficult problems of glue feeding of a labeling/strip-sticking key and the like are solved.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a smart card material according to an embodiment of the present invention;
FIG. 2a is a schematic structural diagram of an electronic module wall patch panel of a smart card material-in-material configuration according to an embodiment of the present invention;
FIG. 2b is a schematic structural diagram of an electronic module of the smart card material structure according to an embodiment of the present invention;
FIG. 2c is a schematic structural diagram of a wall-patching electronic module of the smart card material structure according to an embodiment of the present invention;
fig. 2d is a schematic structural diagram of a material structure in a smart card according to an embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather construed as limited to the embodiments set forth herein.
The invention can be used for manufacturing the visual card. The visual card (also known as visual copying card, easy-to-see card, changing card, rewriting card, digital copying card, window IT card, heat sensitive copying card, thermomagnetic strip card, etc.) is one kind of heat sensitive material.
Referring to fig. 1, the method for manufacturing the smart card middle material of the embodiment includes the following steps:
s1: providing a transparent sheet, wherein a key hole is formed in the transparent sheet;
s2: forming a first adhesive layer on at least a key hole area on the first surface of the transparent sheet, forming a key protection film on the first adhesive layer, and punching the transparent sheet, wherein the punching position corresponds to the position of an intelligent card component;
s3: cutting the transparent sheet to obtain at least one filling piece, wherein the filling piece is consistent with the electronic module of the intelligent card in shape and size, and a second adhesive layer is formed on the first surface or the second surface of the filling piece to obtain the electronic module wall repairing plate;
s4: superposing the electronic module on the second adhesive layer of the electronic module wall-repairing plate to obtain a wall-repairing electronic module;
s5: and embedding the wall-repairing electronic module into the middle material frame shell, and completely coating or coating a fixed point with a third adhesive layer on the upper edges of the wall-repairing electronic module and the middle material frame shell along the gap between the wall-repairing electronic module and the middle material frame shell so as to fix the wall-repairing electronic module in the middle material frame shell and obtain a middle material structure.
The method for manufacturing the smart card middle material of the embodiment is described in detail below.
In step S1, a transparent sheet is made of a transparent material, and a key hole is formed in the transparent sheet, where the position of the key hole is determined according to the position of the key of the electronic module to be overlapped, and the key data is also determined according to the number of keys required, without limitation. The transparent sheet is in a large sheet, and can be cut into a plurality of filling sheets after the previous steps are uniformly manufactured. Optionally, the PVC sheet and the accessory material (material for assisting in forming the key hole) are taken and placed into the punching equipment, and the key hole is punched out.
The transparent sheet may be, for example, a sheet of PVC (polyvinyl chloride), PET (polyethylene terephthalate), PC (polycarbonate), or ABS (acrylonitrile-styrene-butadiene copolymer), and may be made thin and transparent to the extent that the other side of the sheet can be seen through the transparent sheet. The transparent sheet has certain flexibility, and can play a certain supporting role on the flexible electronic module.
In step S2, a first adhesive layer is formed on at least a key hole area on a first surface of the transparent sheet, which may be an upper surface or a lower surface of the transparent sheet. For example, an aqueous adhesive or a satellite glue may be printed on the first surface of the transparent sheet. A key protection film is formed on the first adhesive layer for protecting keys of the electronic module. Since the key protective film can be placed only in the key region, the first adhesive layer can be formed only in the key region, which is a region where a plurality of key holes are concentrated or only a hole region of each key hole. The transparent sheet can be punched by adopting punching equipment, and the punching position corresponds to the position of the intelligent card component. The smart card components, that is, components on the electronic module, may include, but are not limited to, a chip, a battery, a resistor, a capacitor, an LCD (liquid crystal display), and the like. The shape and number of the punched holes can be determined according to actual needs.
In step S3, the transparent sheet is cut by a die cutting device to obtain at least one filling sheet, and multiple filling sheets can be cut, wherein the filling sheets are the same as the electronic module of the smart card in shape and size. Referring to fig. 2a, a second adhesive layer is formed on the first surface or the second surface of the filler sheet to obtain the electronic module wall repairing plate 1. The second adhesive layer avoids the corresponding hole areas of the key holes 11 and the punched holes 12.
In one embodiment, the substrate of the second adhesive layer is a UV (resin that needs to absorb UV light to be fully cured) glue. Optionally, the thickness of the second adhesive layer is between 0.01mm and 0.05 mm. Preferably, a layer of UC glue with a thickness of about 0.01mm is silk-printed on one surface of the filler sheet to form the electronic module wall-repairing plate 1.
In step S4, referring to fig. 2b, an electronic module 2 is provided, the electronic module 2 preferably being a flexible electronic module. Referring to fig. 2c, the electronic module 2 is laminated on the second glue layer of the electronic module wall-repairing plate 1 to obtain the wall-repairing electronic module 3. The superposition makes the key hole 11, the punching hole 12 of the electronic module wall patching board 1 correspond to the key 21, the component 22 of the electronic module 2 one by one, and the boundaries of the electronic module wall patching board 1 and the electronic module 2 are almost coincident.
Can adopt accurate counterpoint equipment to mend 1 coincide of wallboard with electronic module 2, electronic module 1 and electronic module mends wallboard 2 and get up through the laminating of second glue film, form to mend wall electronic module (BDM) 3. The flatness of the wall-repairing electronic module 3 is guaranteed by the fact that the wall-repairing plate 2 of the electronic module is filled, the electronic module can be kept flat, the problem that in the prior art, the middle layer after gluing is uneven due to contraction of glue is solved, and flexibility of the card can be enhanced.
In step S5, referring to fig. 2d, the wall-repairing electronic module 3 is embedded into the middle material frame shell 4, and then a third glue layer is formed on the wall-repairing electronic module 3 and the middle material frame shell 4, and a strip of glue or a spot of glue is applied along a gap between the wall-repairing electronic module 3 and the middle material frame shell 4 by using a potting device, so as to fix the wall-repairing electronic module in the middle material frame shell 4, thereby obtaining a middle material structure. The middle material frame shell 4 can be a universal shell, so that the trouble of manufacturing an upper shell and a lower shell in the prior art is avoided.
Preferably, the substrate of the third glue layer is epoxy glue. The base material of the second adhesive layer is UV adhesive. Meanwhile, the UV glue and the epoxy glue are mixed to fill and seal the middle material structure, so that the gluing amount is reduced, and the problems of labeling, sticking strips, key glue feeding and the like are solved. The direct factor influencing labeling and strip pasting is the flatness of the card, so that the electronic module is relatively flat, the intermediate material structure and the formed card are more flat, and the tolerance of the intermediate material can be controlled to be +/-0.02. Increased electronic module and mended the wallboard, the thickness of card can not receive the influence, needs glue among the prior art to fill thickly, and the thickness size is difficult control more, and electronic module mends wallboard 1 and is the solid, therefore thickness control is easier and convenient operation.
In one embodiment, after step S5, step S6 may be further included: putting the medium material structure into glue driving equipment for glue driving; and curing the glue layer of the medium material structure after glue removing. Before glue driving, a material structure in the clamp clamping of the release clamp can be adopted, glue driving equipment is put into the glue driving equipment again to drive glue, and the release clamp is removed after solidification is completed.
Further, the step of curing the glue layer of the medium material structure after glue removing comprises the following steps: placing the medium material structure subjected to glue removing into laminating equipment for laminating; and baking the laminated intermediate material structure for a certain time. Preferably, the curing agent can be placed in a curing barn for curing for about 10 hours.
In one embodiment, after the electronic module 2 is stacked on the second adhesive layer of the electronic module wall-repairing board 1, the stacked electronic module 2 and the electronic module wall-repairing board 1 are placed into a glue driving device for driving glue, and the glue is cured after being driven, so as to obtain the wall-repairing electronic module 3.
Further, the solidification step that carries out the solidification after coincide electronic module 2 and the 1 glue of driving of electronic module benefit wallboard includes: and (4) placing the mixture into a low-temperature UV furnace for curing for 1-3 minutes. The wall-repairing electronic module 3 with uniform thickness and better toughness can be obtained.
The invention also provides a smart card middle material structure, which comprises:
the intelligent card comprises a transparent sheet, a key hole and a punched hole are formed in the transparent sheet, the punched hole corresponds to the position of an intelligent card component, and the shape and the size of the electronic module of the transparent sheet are consistent with those of the electronic module of the intelligent card;
a first adhesive layer formed on at least a key hole region on a first surface of the transparent sheet;
the key protection film is formed on the first adhesive layer, and the transparent sheet, the first adhesive layer and the key protection film form a filling sheet;
the second adhesive layer is formed on the first surface or the second surface of the filling sheet, and the filling sheet and the second adhesive layer form the electronic module wall repairing plate;
the electronic module is superposed on the second adhesive layer of the electronic module wall repairing plate;
the wall-repairing electronic module is embedded into the middle material frame shell;
and the third adhesive layer is completely coated or coated at fixed points along the gap between the wall-repairing electronic module and the middle material frame shell and is used for fixing the wall-repairing electronic module in the middle material frame shell.
For the specific implementation of the structure of the smart card material of the present invention, reference may be made to the foregoing detailed description of the method for manufacturing the smart card material, which is not repeated herein.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the scope of the claims, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention.
Claims (10)
1. A manufacturing method of a smart card medium material is characterized by comprising the following steps:
providing a transparent sheet, wherein a key hole is formed in the transparent sheet, and the position of the key hole corresponds to the position of a key on an electronic module of the smart card;
forming a first adhesive layer on at least a key hole area on the first surface of the transparent sheet, forming a key protection film on the first adhesive layer, and punching the transparent sheet, wherein the punching position corresponds to the position of a component on the intelligent card electronic module;
cutting the transparent sheet to obtain at least one filling piece, wherein the filling piece is consistent with the electronic module of the intelligent card in shape and size, and a second adhesive layer is formed on the first surface or the second surface of the filling piece to obtain the electronic module wall repairing plate;
superposing the electronic module on the second adhesive layer of the electronic module wall-repairing plate to obtain a wall-repairing electronic module, wherein the superposition enables the key holes and the punched holes of the electronic module wall-repairing plate to correspond to the keys and the components of the electronic module one by one;
and embedding the wall-repairing electronic module into the middle material frame shell, and completely coating or coating a fixed point with a third adhesive layer on the upper edges of the wall-repairing electronic module and the middle material frame shell along the gap between the wall-repairing electronic module and the middle material frame shell so as to fix the wall-repairing electronic module in the middle material frame shell and obtain a middle material structure.
2. The method for manufacturing the smart card medium as claimed in claim 1, further comprising the steps of:
putting the medium material structure into glue driving equipment for glue driving; and
and curing the glue layer of the medium material structure after glue removing.
3. The method for manufacturing the smart card middle material according to claim 2, wherein the step of curing the glue layer of the middle material structure after glue removing comprises the following steps: placing the medium material structure subjected to glue removing into laminating equipment for laminating; and baking the laminated intermediate material structure for a certain time.
4. The method for manufacturing a smart card medium of claim 2, wherein the substrate of the third adhesive layer is epoxy glue.
5. The method for manufacturing the smart card medium of claim 1 or 4, wherein the substrate of the second adhesive layer is UV glue.
6. The method for manufacturing the smart card medium material of claim 5, wherein the thickness of the second adhesive layer is between 0.01mm and 0.05 mm.
7. The method for manufacturing the smart card medium material according to claim 1, wherein after the electronic module is laminated on the second adhesive layer of the electronic module wall-repairing plate, the laminated electronic module and the electronic module wall-repairing plate are placed into a glue-driving device for driving glue, and the glue is driven and then cured to obtain the wall-repairing electronic module.
8. The method of claim 7, wherein the curing step of curing after the glue removing step comprises: and (4) placing the mixture into a low-temperature UV furnace for curing for 1-3 minutes.
9. The method of claim 1, wherein the transparent sheet is a PVC, PET, PC, or ABS sheet.
10. A smart card middle material structure, which is obtained by the smart card middle material manufacturing method of any one of claims 1 to 9; the method comprises the following steps:
the intelligent card electronic module comprises a transparent sheet, a key hole and a punched hole are formed in the transparent sheet, the punched hole corresponds to the position of an element on the intelligent card electronic module, and the shape and the size of the transparent sheet are consistent with those of the intelligent card electronic module;
a first adhesive layer formed on at least a key hole region on a first surface of the transparent sheet;
the key protection film is formed on the first adhesive layer, and the transparent sheet, the first adhesive layer and the key protection film form a filling sheet;
the second adhesive layer is formed on the first surface or the second surface of the filling sheet, and the filling sheet and the second adhesive layer form the electronic module wall repairing plate;
the electronic module is superposed on the second adhesive layer of the electronic module wall repairing plate, and the electronic module wall repairing plate form a wall repairing electronic module;
the wall-repairing electronic module is embedded into the middle material frame shell;
and the third adhesive layer is completely coated or coated at fixed points along the gap between the wall-repairing electronic module and the middle material frame shell and is used for fixing the wall-repairing electronic module in the middle material frame shell.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610423738.8A CN107273962B (en) | 2016-06-15 | 2016-06-15 | Smart card middle material manufacturing method and middle material structure |
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| CN201610423738.8A CN107273962B (en) | 2016-06-15 | 2016-06-15 | Smart card middle material manufacturing method and middle material structure |
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| CN107273962B true CN107273962B (en) | 2021-08-06 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11270183B2 (en) * | 2017-12-29 | 2022-03-08 | Wu-Hsu Lin | Transitional layer for electronic modules and producing method thereof |
| CN111178481B (en) * | 2019-12-27 | 2023-09-05 | 苏州海博智能系统有限公司 | Manufacturing method of metal visual card |
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| CN101189626A (en) * | 2005-04-06 | 2008-05-28 | 因诺瓦蒂尔公司 | A smart card and method for manufacturing a smart card |
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| WO2008009796A2 (en) * | 2006-07-17 | 2008-01-24 | Oberthur Technologies | Method for casting a portable electronic unit and thus obtained unit |
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| CN107273962A (en) | 2017-10-20 |
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