CN107262933A - A kind of parts machining method and system - Google Patents
A kind of parts machining method and system Download PDFInfo
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- CN107262933A CN107262933A CN201710482144.9A CN201710482144A CN107262933A CN 107262933 A CN107262933 A CN 107262933A CN 201710482144 A CN201710482144 A CN 201710482144A CN 107262933 A CN107262933 A CN 107262933A
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- etching
- laser light
- parts
- parts sample
- exploring laser
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a kind of parts machining method and system.This method includes：From parts sample side emission detection laser, control exploring laser light moves and irradiates parts sample；In parts sample opposite side, the exploring laser light after being blocked by parts sample is received, its intensity is detected, if intensity falls within a preset range, judged the profile contacts of exploring laser light and parts sample, complete the detection of parts one profile point of sample；Exploring laser light is continued to move to, is repeated the above steps, the detection to all profile points of parts sample is completed；According to the profile point of the parts sample detected, machining blanks part produces the duplicate of parts sample.The exploring laser light after being blocked is received by being irradiated in parts sample side using exploring laser light, and in opposite side, the profile point of parts sample is determined by detecting the laser intensity received, process component is used for the outline data for obtaining high precision.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to a kind of parts machining method and system.
Background technology
At present, the parts of high precision are obtained, traditional mechanical system mainly uses the CNC machine of high precision
(Computer numerical control, computer digital control machine tool) is processed, and have also been developed in recent years
Other modern means, such as by direct writes such as photoetching, etching, ion beam or electron beams, or by micro-nano 3D printing and
Chemical mode etc. is processed.
But, the current above method can only be carried out in the case of with parts design data, that is, first have to obtain
After the data such as the outline data to parts, the processing of high precision is carried out further according to outline data.And in no parts
On the premise of design data, for example, in some special damage of components, it is necessary to be answered by other existing identical parts
System make when, how to realize spare part profile data high precision obtain, or even be directly realized by parts high precision it is straight
Duplication is connect, is this area major issue to be solved.
The content of the invention
The present invention proposes a kind of parts machining method and system, and parts are obtained by way of laser scanning
High precision profile, for process component.
To achieve these goals, present invention employs following technical scheme：
According to one aspect of the present invention there is provided a kind of parts machining method, this method includes：
From parts sample side emission detection laser, the exploring laser light is controlled to move and irradiate the parts sample
Product；In the parts sample opposite side, the exploring laser light after being blocked by the parts sample is received, its intensity is detected, if
The intensity falls within a preset range, then judges the profile contacts of the exploring laser light and the parts sample, completes described
The detection of one profile point of parts sample；
The exploring laser light is continued to move to, is repeated the above steps, the spy to all profile points of parts sample is completed
Survey；
According to the profile point of the parts sample detected, machining blanks part produces the parts sample
Duplicate.
Alternatively, the exploring laser light after being blocked by the parts sample is received, is specially：Received using imaging sensor
Exploring laser light after being blocked by the parts sample；
Before the exploring laser light is received, shaping amplification is carried out to the exploring laser light, the exploring laser light is irradiated
The hot spot uniformly amplified is formed, the hot spot is consistent with the photosensitive surface geomery of described image sensor.
Alternatively, according to the profile point of the parts sample detected, machining blanks part produces the parts
The duplicate of sample, be specially：
The parts sample and the blank are fixed, control etching laser beam emitting device is launched with exploring laser light to be filled
Linkage is put, after exploring laser light detects a profile point of the parts sample every time, the exploring laser light emitter
Etching instructions are sent to the etching laser beam emitting device；The etching laser beam emitting device sends quarter under the etching instructions
Laser is lost, the once etching to the blank is completed, and etching is completed into feedback of the information to the exploring laser light emitter；
After the completion of once etching, continue to control the etching laser beam emitting device to link with exploring laser light emitter, repeat above-mentioned step
Suddenly, the etching to all profile points of the blank is completed, the duplicate is produced.
Alternatively, according to the profile point of the parts sample detected, machining blanks part produces the parts
The duplicate of sample, be specially：
Etching laser beam emitting device and exploring laser light emitter are fixed, the parts sample and the blank is controlled
Part links, after exploring laser light detects a profile point of the parts sample every time, the exploring laser light emitter
Etching instructions are sent to the etching laser beam emitting device；The etching laser beam emitting device sends quarter under the etching instructions
Laser is lost, the once etching to the blank is completed, and etching is completed into feedback of the information to the exploring laser light emitter；
After the completion of once etching, continue to control the parts sample and blank linkage, repeat the above steps, complete to described
The etching of all profile points of blank, produces the duplicate.
Alternatively, this method also includes：
While the exploring laser light detects the parts sample profile, the parts sample wheel obtained is stored
Wide data.
According to another aspect of the present invention there is provided a kind of parts machining system, the system includes：Exploring laser light is sent out
Injection device, imaging sensor and blank processing unit (plant)；
The exploring laser light emitter, for from parts sample side emission detection laser, controlling the detection to swash
Light moves and irradiates the parts sample；
Described image sensor, in the parts sample opposite side, receiving after being blocked by the parts sample
Exploring laser light, detect its intensity, if the intensity falls within a preset range, judge the exploring laser light and the parts
The profile contacts of sample, complete the detection of one profile point of parts sample；Continue in the exploring laser light emitter
Under movement, said process is repeated, the detection to all profile points of parts sample is completed；
The blank processing unit (plant), the profile point of the parts sample detected for basis, machining blanks part,
Produce the duplicate of the parts sample.
Alternatively, the system also includes diffractive-optical element；
The diffractive-optical element, for before described image sensor receives the exploring laser light, to the detection
Laser carries out shaping amplification, the exploring laser light is irradiated the hot spot to be formed and uniformly amplified, the hot spot and described image sensor
Photosensitive surface geomery it is consistent.
Alternatively, the blank processing unit (plant) is etching laser beam emitting device, the etching laser beam emitting device and institute
State exploring laser light emitter to be fixed on same support, realize linkage；
The parts sample and the blank are fixed, the etching laser beam emitting device and exploring laser light transmitting
Device is moved relative to the parts sample and the blank respectively in an identical manner under support drive；In detection
Laser is detected after a profile point of the parts sample every time, and the exploring laser light emitter is to the etching laser
Emitter sends etching instructions；The etching laser beam emitting device sends etching laser, completion pair under the etching instructions
The once etching of the blank, and etching is completed into feedback of the information to the exploring laser light emitter；Once etching is completed
Afterwards, the etching laser beam emitting device continues to link with the exploring laser light emitter under support drive, in repetition
Step is stated, the etching to all profile points of the blank is completed, produces the duplicate.
Alternatively, the blank processing unit (plant) is etching laser beam emitting device, the etching laser beam emitting device and institute
State exploring laser light emitter to fix, the parts sample and the blank are fixed on same support, realize linkage；
The parts sample and the blank are relatively described respectively in an identical manner under support drive to be carved
Lose laser beam emitting device and exploring laser light emitter movement；The parts sample is detected every time in exploring laser light
After one profile point, the exploring laser light emitter sends etching instructions to the etching laser beam emitting device；The etching
Laser beam emitting device sends etching laser under the etching instructions, completes the once etching to the blank, and will etching
Feedback of the information is completed to the exploring laser light emitter；After the completion of once etching, the parts under support drive
Sample and the blank continue to link, and repeat the above steps, and complete the etching to all profile points of the blank, produce
The duplicate.
Alternatively, the system also includes storage device；
The storage device, for while the exploring laser light detects the parts sample profile, storage to be obtained
The parts sample outline data.
In summary, technical scheme is in parts sample side using exploring laser light by being irradiated, and
The exploring laser light after being blocked is received in opposite side, the profile of parts sample is determined by detecting the laser intensity received
Point, is used for process component with the outline data for obtaining high precision.
Brief description of the drawings
A kind of parts machining method flow schematic diagram that Fig. 1 provides for one embodiment of the invention；
A kind of parts machining Method And Principle schematic diagram that Fig. 2 provides for one embodiment of the invention；
Fig. 3 is exploring laser light of the present invention and the tangent view of parts sample；
Fig. 4 is exploring laser light of the present invention and parts sample overlap condition schematic diagram；
Fig. 5 is the process schematic diagram using laser joint-action mechanism process component；
A kind of parts machining system structure diagram that Fig. 6 provides for one embodiment of the invention；
A kind of end of probe structural representation for parts machining system that Fig. 7 provides for one embodiment of the invention；
A kind of imaging sensor sensitized lithography signal for parts machining system that Fig. 8 provides for one embodiment of the invention
Figure.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to embodiment party of the present invention
Formula is described in further detail.
The design concept of the present invention is, parts sample is irradiated from side using exploring laser light in end of probe, and another
Side receives the exploring laser light after being blocked, and the profile point of parts sample is determined by detecting the laser intensity received, with
Obtaining the outline data of high precision is used for process component.
A kind of parts machining method flow schematic diagram that Fig. 1 provides for one embodiment of the invention, as shown in figure 1, should
Method includes：
Step S110, from parts sample side emission detection laser, control exploring laser light moves and irradiates parts sample
Product；In parts sample opposite side, the exploring laser light after being blocked by parts sample is received, its intensity is detected, if intensity falls
In preset range, then the profile contacts of exploring laser light and parts sample are judged, complete the spy of parts one profile point of sample
Survey.
Step S120, continues to move to exploring laser light, repeats the above steps, and completes the spy to all profile points of parts sample
Survey.
Step S130, according to the profile point of the parts sample detected, machining blanks part produces parts sample
Duplicate.
With reference to shown in Fig. 2 schematic diagrams, exploring laser light (in directive paper) moves right to terminal E since starting point C points
Point, completes the detection to parts sample profile.Fig. 3 and Fig. 4 respectively illustrate Fig. 2 circle bit selectings and put place, exploring laser light and zero
Tangent and overlapping view in part sample contact process.It is visible with reference to Fig. 3 and Fig. 4, exploring laser light and parts sample
Just tangent state, exploring laser light is blocked seldom, and overlap condition, and exploring laser light is blocked excessive, passes through detection detection
Laser intensity, and contrasted with given threshold, for example threshold range is set as 95%-99%, it is possible to whether judge exploring laser light
Contacted just with parts sample, so that it is determined that the profile point of parts sample, because laser beam can be very thin, therefore it is visited
Survey precision also higher.
Preferably, in some embodiments of the invention, the exploring laser light after being blocked by parts sample is received, specifically
For：The exploring laser light after being blocked by parts sample is received using imaging sensor.Also, it is right before exploring laser light is received
Exploring laser light carries out shaping amplification, exploring laser light is irradiated the hot spot to be formed and uniformly amplified, the sense of the hot spot and imaging sensor
Optical surface geomery is consistent.
By the way that before reception, exploring laser light is homogenized, amplified and shaping so that the hot spot of exploring laser light reaches and image
The photosensitive surface geomery of sensor is consistent, therefore all photosensitive units of imaging sensor can participate in photosensitive, lifting
The degree of accuracy to exploring laser light intensity detection, it is ensured that get the outline data of high precision.Wherein, to the even of exploring laser light
Change, amplification and shaping can use diffractive-optical element, the spot diameter ultimately formed can be in several millimeter magnitudes.Imaging sensor
Cmos image sensor can be used, vertical sounding laser is set, and cmos image sensor is capable of detecting when exploring laser light 1%
Brightness changes.
Preferably, in some embodiments of the invention, according to the profile point of the parts sample detected, machining blanks
Part, produces the duplicate of parts sample, is specially：
Parts sample and blank are fixed, control etching laser beam emitting device links with exploring laser light emitter,
After exploring laser light detects a profile point of parts sample every time, exploring laser light emitter is filled to etching Laser emission
Put and send etching instructions；Etching laser beam emitting device sends etching laser under etching instructions, completes the once quarter to blank
Erosion, and give exploring laser light emitter by etching completion feedback of the information；After the completion of once etching, continue to control etching Laser emission
Device links with exploring laser light emitter, repeats the above steps, and completes the etching to all profile points of blank, produces multiple
Product.
With continued reference to Fig. 2 schematic diagrams, parts sample and blank are fixed on the table, exploring laser light emitter with
Etching laser beam emitting device is installed on same rigid support, realizes exploring laser light emitter and etching laser beam emitting device
Linkage, so that motion of the exploring laser light relative to the motion mode of parts sample, state and etching laser relative to blank
Mode, state are completely the same.Exploring laser light is moved to terminal E points from starting point C points, accordingly, etches laser from starting point D points
It is moved to terminal F points.In the process, whenever exploring laser light detects a profile point of parts sample, etching is just sent
Instruction control etching laser beam emitting device transmitting etching laser, completion is once etched.After the completion of once etching, return has been etched
Exploring laser light emitter is given into message, so as to re-address, next profile point position is found, repeats above-mentioned lithography mistake
Journey, the above-mentioned layout is as shown in Figure 5.Finally, while all profile points of parts sample are detected, etching swashs
Light also completes the etching to all profile points of blank.
By above-mentioned joint-action mechanism, its duplicate can be directly produced by parts sample, is swept with separate
Retouch process to compare with laser ablation process, eliminate and Lithographic template is made according to outline data and the processes such as Lithographic template are installed,
The disturbing factors such as bit errors therein are appeared in so as to avoid, higher machining accuracy can be accomplished.Wherein, exploring laser light
Seek an algorithm can be gone according to the parts shape to be processed design.
In other embodiments of the present invention, joint-action mechanism can be also realized by the way of opposite with aforesaid way, i.e.,
Etching laser beam emitting device and exploring laser light emitter are fixed, control parts sample and blank linkage swash in detection
Light is detected after a profile point of parts sample every time, and exploring laser light emitter sends quarter to etching laser beam emitting device
Erosion instruction；Etching laser beam emitting device sends etching laser under etching instructions, completes the once etching to blank, and will carve
Erosion completes feedback of the information and gives exploring laser light emitter；After the completion of once etching, continue to control parts sample and blank connection
It is dynamic, repeat the above steps, complete the etching to all profile points of blank, produce duplicate.
In addition, in some embodiments of the invention, can also be according to the high precision outline data got, using existing
There are the modes such as CNC machine, ion beam or the electron-beam direct writing commonly used in technology to make duplicate, will not be repeated here.
Preferably, in some embodiments of the invention, this method also includes：Parts sample wheel is detected in exploring laser light
While wide, the parts sample outline data obtained is stored.
The invention also discloses a kind of parts machining system, the structural scheme of mechanism of the system as shown in fig. 6, including：Visit
Survey laser beam emitting device 210, imaging sensor 220 and blank processing unit (plant) 230.
Exploring laser light emitter 210, for from parts sample side emission detection laser, control exploring laser light to be moved
And irradiate parts sample 240.
Imaging sensor 220, in parts sample opposite side, receiving the detection after being blocked by parts sample and swashing
Light, detects its intensity, if intensity falls within a preset range, judges the profile contacts of exploring laser light and parts sample, completes
The detection of one profile point of parts sample；In the case where exploring laser light emitter 210 is continued to move to, said process is repeated, is completed
Detection to all profile points of parts sample.
Blank processing unit (plant), for the profile point according to the parts sample 240 detected, machining blanks part makes
Go out the duplicate of parts sample 240.
Preferably, as shown in Fig. 7 end of probe structural representations, in some embodiments of the invention, the system also includes
Diffractive-optical element 230.
Diffractive-optical element 230, for before imaging sensor 220 receives exploring laser light, being carried out to exploring laser light whole
Shape is amplified, and exploring laser light is irradiated the hot spot to be formed and uniformly amplified, the photosensitive surface shape chi of the hot spot and imaging sensor 220
It is very little consistent.Specifically as shown in Figure 7, parts sample 240 is put in exploring laser light emitter 210 and diffractive-optical element 230
Between, imaging sensor 220 receives the uniform light spots after being sent out greatly by the shaping of diffractive-optical element 230.
Imaging sensor photosensitive surface with reference to shown in Fig. 8 understands that imaging sensor 220 is square, its photosensitive surface row
Many photosensitive units 221 are furnished with, after shaping hair is big, the photosensitive surface geomery of exploring laser light hot spot and imaging sensor 220
Unanimously, many photosensitive units 221 of imaging sensor 220 each may participate in luminous intensity detection, so as to obtain higher accuracy of detection.
The imaging sensor 220 is, for example, cmos image sensor, is capable of detecting when the brightness change of exploring laser light 1%.
Preferably, in some embodiments of the invention, blank processing unit (plant) 230 is etching laser beam emitting device, should
Etching laser beam emitting device and exploring laser light emitter are fixed on same support, realize linkage.
Its principle and process are referring still to shown in Fig. 2 and Fig. 5, and parts sample and blank are fixed, and etch Laser emission
Device and exploring laser light emitter are moved relative to parts sample and blank respectively in an identical manner under support drive；
After exploring laser light detects a profile point of parts sample every time, exploring laser light emitter is filled to etching Laser emission
Put and send etching instructions；Etching laser beam emitting device sends etching laser under etching instructions, completes the once quarter to blank
Erosion, and give exploring laser light emitter by etching completion feedback of the information；After the completion of once etching, laser is etched under support drive
Emitter continues to link with exploring laser light emitter, repeats the above steps, completes the etching to all profile points of blank,
Produce duplicate.
In other embodiments of the present invention, etching laser beam emitting device and exploring laser light emitter can also be consolidated
It is fixed, parts sample and blank are fixed on same support, linkage is realized.Its operation principle is as follows：
Parts sample and blank under support drive in an identical manner respectively relative etching laser beam emitting device and
Exploring laser light emitter is moved；After exploring laser light detects a profile point of parts sample every time, exploring laser light hair
Injection device sends etching instructions to etching laser beam emitting device；Etching laser beam emitting device sends etching under etching instructions and swashed
Light, completes the once etching to blank, and etching is completed into feedback of the information to give exploring laser light emitter；Once etching is completed
Afterwards, parts sample and blank continue to link under support drive, repeat the above steps, and complete to all profile points of blank
Etching, produce duplicate.
In some embodiments of parts machining system of the present invention, it would however also be possible to employ existing blank processing unit (plant),
It will not be repeated here.
Preferably, in some embodiments of the invention, the system also includes storage device (not shown).
Storage device, for while exploring laser light detects parts sample profile, storing the parts sample obtained
Outline data.
It is described above, only some embodiments of the present invention, under the above-mentioned teaching of the present invention, those skilled in the art
Other improvement or deformation can be carried out on the basis of above-described embodiment.It will be understood by those skilled in the art that above-mentioned tool
The purpose of the present invention is simply preferably explained in body description, and protection scope of the present invention should be defined by scope of the claims.
Claims (10)
1. a kind of parts machining method, it is characterised in that this method includes：
From parts sample side emission detection laser, the exploring laser light is controlled to move and irradiate the parts sample；
The parts sample opposite side, receives the exploring laser light after being blocked by the parts sample, detects its intensity, if described strong
Degree falls within a preset range, then judges the profile contacts of the exploring laser light and the parts sample, completes the parts
The detection of one profile point of sample；
The exploring laser light is continued to move to, is repeated the above steps, the detection to all profile points of parts sample is completed；
According to the profile point of the parts sample detected, machining blanks part produces the duplication of the parts sample
Part.
2. parts machining method as claimed in claim 1, it is characterised in that after reception is blocked by the parts sample
Exploring laser light, be specially：The exploring laser light after being blocked by the parts sample is received using imaging sensor；
Before the exploring laser light is received, shaping amplification is carried out to the exploring laser light, makes the exploring laser light irradiate to be formed
The hot spot uniformly amplified, the hot spot is consistent with the photosensitive surface geomery of described image sensor.
3. parts machining method as claimed in claim 1, it is characterised in that according to the parts sample detected
Profile point, machining blanks part produces the duplicate of the parts sample, is specially：
The parts sample and the blank are fixed, control etching laser beam emitting device joins with exploring laser light emitter
Dynamic, after exploring laser light detects a profile point of the parts sample every time, the exploring laser light emitter is to institute
State etching laser beam emitting device and send etching instructions；The etching laser beam emitting device sends etching under the etching instructions and swashed
Light, completes the once etching to the blank, and etching is completed into feedback of the information to the exploring laser light emitter；Once
After the completion of etching, continue to control the etching laser beam emitting device to link with exploring laser light emitter, repeat the above steps, it is complete
The etching of paired all profile points of blank, produces the duplicate.
4. parts machining method as claimed in claim 1, it is characterised in that according to the parts sample detected
Profile point, machining blanks part produces the duplicate of the parts sample, is specially：
Etching laser beam emitting device and exploring laser light emitter are fixed, the parts sample and blank connection is controlled
Dynamic, after exploring laser light detects a profile point of the parts sample every time, the exploring laser light emitter is to institute
State etching laser beam emitting device and send etching instructions；The etching laser beam emitting device sends etching under the etching instructions and swashed
Light, completes the once etching to the blank, and etching is completed into feedback of the information to the exploring laser light emitter；Once
After the completion of etching, continue to control the parts sample and blank linkage, repeat the above steps, complete to the blank
The etching of all profile points of part, produces the duplicate.
5. parts machining method as claimed in claim 1, it is characterised in that this method also includes：
While the exploring laser light detects the parts sample profile, the parts sample number of contours obtained is stored
According to.
6. a kind of parts machining system, it is characterised in that the system includes：Exploring laser light emitter, imaging sensor and
Blank processing unit (plant)；
The exploring laser light emitter, for from parts sample side emission detection laser, controlling the exploring laser light to move
Move and irradiate the parts sample；
Described image sensor, in the parts sample opposite side, receiving the spy after being blocked by the parts sample
Laser is surveyed, its intensity is detected, if the intensity falls within a preset range, judges the exploring laser light and the parts sample
Profile contacts, complete the detection of one profile point of parts sample；Continued to move in the exploring laser light emitter
Under, said process is repeated, the detection to all profile points of parts sample is completed；
The blank processing unit (plant), for the profile point according to the parts sample detected, machining blanks part makes
Go out the duplicate of the parts sample.
7. parts machining system as claimed in claim 6, it is characterised in that the system also includes diffractive-optical element；
The diffractive-optical element, for before described image sensor receives the exploring laser light, to the exploring laser light
Shaping amplification is carried out, the exploring laser light is irradiated the hot spot to be formed and uniformly amplified, the sense of the hot spot and described image sensor
Optical surface geomery is consistent.
8. parts machining system as claimed in claim 6, it is characterised in that the blank processing unit (plant) is etching laser
Emitter, the etching laser beam emitting device and the exploring laser light emitter are fixed on same support, realize linkage；
The parts sample and the blank are fixed, the etching laser beam emitting device and the exploring laser light emitter
Moved respectively relative to the parts sample and the blank in an identical manner under support drive；In exploring laser light
After a profile point for detecting the parts sample every time, the exploring laser light emitter is to the etching Laser emission
Device sends etching instructions；The etching laser beam emitting device sends etching laser under the etching instructions, completes to described
The once etching of blank, and etching is completed into feedback of the information to the exploring laser light emitter；After the completion of once etching,
The support etching laser beam emitting device and exploring laser light emitter continuation linkage under driving, repeat above-mentioned step
Suddenly, the etching to all profile points of the blank is completed, the duplicate is produced.
9. parts machining system as claimed in claim 6, it is characterised in that the blank processing unit (plant) is etching laser
Emitter, the etching laser beam emitting device and the exploring laser light emitter are fixed, the parts sample and described
Blank is fixed on same support, realizes linkage；
Relatively described etching swashs respectively in an identical manner under support drive for the parts sample and the blank
Light emitting devices and exploring laser light emitter movement；One of the parts sample is detected every time in exploring laser light
After profile point, the exploring laser light emitter sends etching instructions to the etching laser beam emitting device；The etching laser
Emitter sends etching laser under the etching instructions, completes the once etching to the blank, and etching is completed
Feedback of the information gives the exploring laser light emitter；After the completion of once etching, the parts sample under support drive
Continue to link with the blank, repeat the above steps, complete the etching to all profile points of the blank, produce described
Duplicate.
10. parts machining system as claimed in claim 6, it is characterised in that the system also includes storage device；
The storage device, for while the exploring laser light detects the parts sample profile, storing the institute obtained
State parts sample outline data.
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| CN108534673A (en) * | 2018-04-04 | 2018-09-14 | 湖州旭源电气科技有限公司 | A kind of verifying unit of auto parts and components |
| CN111521116A (en) * | 2020-05-25 | 2020-08-11 | 广州冠粤路桥检测有限公司 | Laser projection detection device and detection method for alternate installation |
| CN115228975A (en) * | 2022-09-26 | 2022-10-25 | 山东胜宁电器有限公司 | Shaping device for processing hot water kettle |
| US11914352B2 (en) | 2019-02-27 | 2024-02-27 | Amada Co., Ltd. | Machining estimation apparatus, machining estimation method, and machining estimation program |
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