CN107258088B - Signal processing for acoustic sensor bi-directional communication channel - Google Patents

Abstract

Signal processing for an acoustic sensor bi-directional communication channel is described herein. The acoustic sensor may include a microelectromechanical system (MEMS) transducer configured to generate an audio output based on the acoustic pressure; and a bi-directional communication component configured to transmit and/or receive data superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation. In an example, the signal processing component is configured to send audio output directed to the external device using differential mode signaling between respective pins of the acoustic sensor; and transmitting data using common mode signaling comprising a sum of voltages of the respective pins. In other examples, the signal processing component is configured to transmit and/or receive data and transmit audio output during different time periods; or transmit data based on a frequency range outside the audio band.

Description

Signal processing for acoustic sensor bi-directional communication channel

Cross Reference to Related Applications

This patent application claims priority of U.S. non-provisional patent application serial No. 14/975,155 entitled "SIGNAL PROCESSING FOR and acquisition exterior SENSOR BI-direction COMMUNICATION CHANNEL" filed on 18.12.2015, which is a continuation of the portion of U.S. non-provisional patent application No. 14/074,587 entitled "multiple-FUNCTION PINS PROCESSING available exterior SENSOR" filed on 7.11.2013. In addition, the present application claims priority from U.S. provisional patent application No. 62/095,108 entitled "Signal PROCESSING FOR ACOUSTICISENSOR BI-DIRECTIONAL COMMUNICATION CHANNELS" filed 12, 22/2014. The entirety of the above application is incorporated herein by reference.

Technical Field

The subject disclosure relates generally to acoustic sensors, but is not limited to signal processing for acoustic sensor bi-directional communication channels.

Background

A number of acoustic sensors, i.e. micro-electromechanical systems (MEMS) microphones, are used in consumer electronics devices. The placement of such devices on the circuit board is driven by acoustic properties and may limit electrical connectivity, i.e., the number of pins used in the sensor device. In this regard, while conventional acoustic sensor technology utilizes a standard bi-directional communication interface, i.e., inter-integrated circuit (I2C), Serial Peripheral Interface (SPI), or SoundWire, to communicate information in addition to the audio output, such interfaces require 2 to 4 additional dedicated pins per device. Accordingly, conventional acoustic sensor technology has had some drawbacks, some of which may be noted with reference to the various embodiments described below.

Brief Description of Drawings

Non-limiting embodiments of the subject disclosure are described with reference to the following figures, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified.

FIG. 1 illustrates a block diagram of an acoustic sensor including a bi-directional communication component configured to transmit and/or receive data superimposed on an audio output, in accordance with various embodiments;

FIG. 2 illustrates a block diagram of an acoustic sensor including a common-mode signal component for transmitting data superimposed on an audio output, in accordance with various embodiments;

FIG. 3 illustrates waveforms representing differential mode audio output signaling for respective pins and common mode data signaling on respective pins in accordance with various embodiments;

FIG. 4 illustrates a block diagram of an acoustic sensor including a time-division multiplexing component for transmitting and/or receiving data superimposed on an audio output, in accordance with various embodiments;

FIG. 5 illustrates waveforms representing data superimposed on an audio output using time division multiplexing, in accordance with various embodiments;

FIG. 6 illustrates a block diagram of an acoustic sensor including a signal processing component for transmitting audio output using a pin and transmitting and/or receiving data using another pin based on time division multiplexing;

FIG. 7 illustrates a block diagram of an acoustic sensor that includes a frequency separation component for transmitting and/or receiving data based on a defined frequency range that is outside/substantially outside an audio band corresponding to an audio output;

FIG. 8 illustrates waveforms representing a spectrum of data superimposed on an audio output based on a decimation filter employed in a host system and a transfer function of the decimation filter, respectively, in accordance with various embodiments;

FIG. 9 illustrates a block diagram of an acoustic sensor including a frequency separation component for transmitting and/or receiving data via a first pin based on a defined frequency range outside/substantially outside an audio band corresponding to an audio output of a second pin;

FIG. 10 illustrates a block diagram of an acoustic sensor including a power line communication assembly for transmitting/receiving data via a power pin and/or a ground pin, in accordance with various embodiments; and

fig. 11 illustrates a flow diagram of a method associated with an acoustic sensor, in accordance with various embodiments.

Detailed Description

Aspects of the subject disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which example embodiments are shown. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments. The subject disclosure may, however, be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein.

As described above, conventional acoustic sensor technology has some drawbacks in using dedicated pins on the sensor device to transmit, for example, non-audio information. Various embodiments disclosed herein may improve the use of valuable circuit board real estate (real estate) by using signal processing techniques to transmit/receive data superimposed on an audio output signal.

For example, the acoustic sensor may include a MEMS transducer (e.g., a MEMS microphone) and a bi-directional communication component. The MEMS transducer may be configured to generate an audio output based on the acoustic pressure. The bi-directional communication component may be configured to transmit and/or receive data superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation.

In an embodiment, the MEMS transducer may include a signal processing component that may be configured to utilize differential mode signaling between a first pin of the acoustic sensor and a second pin of the acoustic sensor to transmit audio output directed to an external device (e.g., a coder-decoder (codec), a Digital Signal Processor (DSP), etc.). Further, the signal processing component may be configured to transmit data using common mode signaling according to a sum of respective voltages of the first pin and the second pin.

In one embodiment, the signal processing component may be configured to transmit audio output directed to the external device during a first defined time period and to transmit or receive data during a second defined time period based on time division multiplexing, e.g., during which loss of audio information may be substantially compensated, minimized, etc.

In another embodiment, the signal processing component may be configured to transmit audio output directed to the external device using pins of the acoustic sensor based on time division multiplexing. Further, the signal processing components may be configured to transmit and/or receive data using the pins.

In yet another embodiment, the signal processing component may be configured to transmit audio output directed to the external device using a first pin of the acoustic sensor and transmit or receive data using a second pin of the acoustic sensor based on time division multiplexing.

In an embodiment, the signal processing component may be configured to transmit or receive data based on the frequency separation based on a defined frequency range that is outside and/or substantially outside an audio band corresponding to the audio output.

In one embodiment, the defined frequency range corresponds to a notch (notch) of a decimation filter of an external device coupled to the acoustic sensor, a defined stopband of a bandstop filter of the external device, and the like.

In another embodiment, the signal processing component may be configured to transmit audio output directed to the external device using pins of the acoustic sensor based on the frequency separation and to transmit or receive data using the pins.

In yet another embodiment, the signal processing component may be configured to transmit audio output directed to an external device using a first pin of the acoustic sensor and transmit or receive data using a second pin based on the frequency separation.

In an embodiment, the acoustic sensor may include a power line communication component configured to transmit and/or receive communication data using a power pin and/or a ground pin of the acoustic sensor.

In one embodiment, a method may include generating, by an acoustic sensor, an audio output corresponding to an acoustic pressure applied to a MEMS transducer; and transmitting and/or receiving data superimposed on the audio output by the acoustic sensor based on common mode signaling, time division multiplexing, or frequency separation.

In another embodiment, a method may include sending an audio output directed to an external device through an acoustic sensor using differential signaling between a first pin of a system and a second pin of the system, and sending data based on a sum of respective voltages of the first pin and the second pin based on common mode signaling.

In yet another embodiment, transmitting and/or receiving data based on time division multiplexing may include transmitting audio output directed to an external device during a first time period and transmitting or receiving data during a second time period.

In an embodiment, sending the audio output includes using a pin of the acoustic sensor to send the audio output directed to the external device during the first time period. Further, transmitting or receiving data during the second time period includes using the pin to transmit or receive data during the second time period.

In one embodiment, separating the transmission or reception of data based on frequency includes transmitting or receiving data based on a defined frequency range that is outside or substantially outside an audio band corresponding to the audio output.

In another embodiment, transmitting or receiving data based on the defined frequency range includes transmitting or receiving data based on a defined stopband of a bandstop filter of an external device coupled to the acoustic sensor, a notch of a decimation filter of the external device, and the like.

In yet another embodiment, transmitting or receiving data based on the defined frequency range may include transmitting audio output directed to an external device using a pin of the acoustic sensor and transmitting or receiving data using the pin.

In an embodiment, the method may further include transmitting and/or receiving, for example, communication data associated with the data, the bi-directional communication component 130, etc. through the acoustic sensor using a power pin of the acoustic sensor and/or a ground pin of the acoustic sensor.

In one embodiment, a system may comprise: an acoustic transducer configured to convert an acoustic signal into an audio output; and a bi-directional communication component configured to transmit and/or receive data superimposed on the audio output based on common mode transmission, time division multiplexed transmission, or frequency separation.

In another embodiment, a system may comprise: a signal processing component configured to transmit audio output directed to an external device via a pin of the system and to transmit and/or receive data via the pin based on at least one of time division multiplexed transmission or frequency separation.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Furthermore, to the extent that the terms "includes," "has," "contains," and other similar words are used in either the detailed description or the appended claims, such terms are intended to be inclusive in a manner similar to the term "comprising" as an open transition word without precluding any additional or other elements. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". That is, unless specified otherwise, or clear from context, "X employs A or B" is intended to mean any of the naturally inclusive permutations. That is, if X employs A; x is B; or X employs both A and B, then "X employs A or B" is satisfied under any of the foregoing circumstances. In addition, the articles "a" and "an" as used in this application and the appended claims should generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.

Aspects of the devices, apparatus, systems, processes, and process blocks explained herein may constitute machine-executable instructions embodied within a machine, such as in a computer-readable medium (or media), a memory device associated with the machine. Such instructions, when executed by a machine, may cause the machine to perform the operations described. Additionally, aspects of the apparatus, devices, systems, processes, and process blocks may be implemented within hardware, such as an Application Specific Integrated Circuit (ASIC). Further, the order in which some or all of the process blocks appear in each process should not be construed as limiting. Rather, persons of ordinary skill in the art having benefit of the present disclosure should appreciate that some of the process blocks may be executed in a variety of orders not illustrated.

Moreover, the words "exemplary" and/or "illustrative" are used herein to mean serving as an example, instance, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited by such examples. Additionally, any aspect or design described herein as "exemplary" and/or "illustrative" is not necessarily to be construed as preferred or advantageous over other aspects or designs, nor is it necessarily meant to exclude equivalent exemplary structures and techniques known to those skilled in the art having the benefit of the present disclosure.

Conventional acoustic sensor technology has some drawbacks in using dedicated pins to convey, for example, non-audio information. On the other hand, various embodiments disclosed herein may preserve valuable circuit board real estate and significantly reduce interference between communication signaling and audio output signaling by superimposing the communication signaling over the audio output signaling via a common pin using various signal processing techniques.

In this regard, referring now to fig. 1, the acoustic sensor 110 includes a MEMS transducer 120, a bi-directional communication component 130, a signal processing component 140, and an input/output (I/O) 150. The MEMS transducer 120 may be in contact with acoustic pressure, and a change in the acoustic pressure may cause a change in an electrical parameter of the MEMS transducer 120. In an embodiment, the MEMS transducer 120 may be formed from, for example, a diaphragm, a suspension plate, or the like. In this regard, an increase or decrease in acoustic pressure may bend the diaphragm or cause a translational displacement of the suspension plate, and the MEMS transducer 120 may represent a corresponding change in the electrical parameter via the audio output signal. In an embodiment, the electrical parameter may comprise a change in capacitance indicative of a bending of the diaphragm or a displacement of the suspension plate.

The signal processing component 140 may generate an electrical output signal representative of the sound pressure, audio data, audio output, etc., based on the audio output signal generated by the MEMS transducer 120. Further, the signal processing component 140 may send audio data to various components of the acoustic sensor 110, such as, for example, an amplifier, a non-volatile memory, a Digital Interface (DIF), etc. (not shown) (see, e.g., related text of parent U.S. patent application No. 14/074,587, incorporated herein by reference), and exchange the audio data with devices external to the acoustic sensor 110 (e.g., a host, a DSP, a processor, etc. (not shown)) using electrical interface pins (e.g., 250, 260, 420, 610) (see below) of the I/O150.

The bi-directional communication component 130 may include a DIF, which may be used to send/receive data, communication data, etc. to/from registers, non-volatile memory, etc. (not shown) of the acoustic sensor 110, e.g., for testing, configuring, trimming various components of the acoustic sensor 110, obtaining information therefrom, etc. In addition, the signal processing component 140 may use the common electrical interface pins of the I/O150 to send/receive communication DATA (e.g., DATA (DATA), DATA output (DATA OUT), etc.) between the acoustic sensor 110 and an external device (not shown). In this regard, the signal processing component 140 may superimpose the communication data on the audio data using common mode signaling, time division multiplexing, or frequency separation, for example, using logic circuits, switches, multiplexers, demultiplexers, etc. (not shown).

Referring now to fig. 2 and 3, a block diagram (200) of an acoustic sensor including a common-mode signal component (210) for transmitting data, communication data, etc., superimposed on an audio output, and waveforms representing associated differential-mode signaling and common-mode signaling, respectively, is illustrated, in accordance with various embodiments. In this regard, the signal processing component 140 may use the electrical interface pins 250 and 260 to send AUDIO outputs as differential output signals, e.g., "+ AUDIO OUT" (+ AUDIO OUT) and "-AUDIO OUT" (-AUDIO OUT), based on the AUDIO output received from the MEMS transducer 120. In addition, common mode signal component 210 may send communication DATA (e.g., "DATA OUT") to an external device (not shown) using common mode signaling that includes a sum of respective voltages of electrical interface pins 250 and 260. As illustrated in fig. 3, the AUDIO output (e.g., "AUDIO OUT") includes a voltage difference between the differential output signals "+ AUDIO OUT" and "-AUDIO OUT". In addition, the communication DATA (e.g., "DATA OUT") includes the sum of the waveforms of "+ AUDIO OUT" and "— AUDIO OUT".

IN other embodiments (not shown), the signal processing component may receive communication DATA, such as "DATA," "DATA IN," etc., from an external device using common mode signaling. In this regard, the electrical interface pins 250 and 260 may comprise bi-directional input/output pins, and the acoustic sensor may comprise a receiver, amplifier, comparator, analog-to-digital converter, etc. (not shown) to decode the common mode data, convert it to a standard logic level signal, etc., that may be input to the bi-directional communication component 130.

In an embodiment, the power line communication component 220 may be configured to receive communication data from an external device via a power pin 240 (e.g., a power pin or a ground pin of a power interface (PWR) 230). In this regard, the power line communication assembly 220 may include data and clock conditioning circuitry (not shown) (see, for example, the associated text of parent U.S. patent application No. 14/074,587, incorporated by reference herein) that may convert communication data encoded onto the power pins 240 into standard logic level signals that may be input to the bi-directional communication assembly 130.

In one embodiment, the data and clock conditioning circuitry may utilize a high frequency carrier superimposed on the power supply and an amplitude shift keying signaling scheme. (see, e.g., FIG. 3 and related text for parent U.S. patent application No. 14/074,587, which is incorporated herein by reference). In another embodiment, the data and clock conditioning circuitry may utilize a passband signaling scheme superimposed on the power supply. (see, e.g., FIG. 4 and related text for parent U.S. patent application No. 14/074,587, which is incorporated herein by reference). In yet another embodiment, the data and clock conditioning circuitry may utilize a baseband signaling scheme superimposed on the power supply. (see, e.g., FIG. 5 and related text for parent U.S. patent application No. 14/074,587, which is incorporated herein by reference).

Fig. 4 illustrates a block diagram (400) of an acoustic sensor including a time division multiplexing component (410) for transmitting and/or receiving data superimposed on an audio output, in accordance with various embodiments. In this regard, referring now to fig. 5, time-division multiplexing component 410 may be configured to transmit AUDIO OUTPUT, e.g., "AUDIO OUTPUT," directed to an external device (not shown) during a first defined period of time. Further, the time-division multiplexing component 410 may be configured to utilize the bi-directional electrical interface pins 420 to transmit or receive communication DATA, e.g., "DATA," "DATA IN," "DATA OUT," etc., during a second defined time period, e.g., to reduce or substantially reduce interference between the communication DATA and the audio output DATA, e.g., due to layout imperfections IN power supplies, grounds, etc., packaging limitations, etc.

In one embodiment, the time division multiplexing component 410 may be configured to transmit audio output directed to an external device using a pin (e.g., electrical interface pin 410) and transmit or receive communication data using the same pin.

In another embodiment illustrated in fig. 6, the time-division multiplexing component 410 may be configured to transmit audio output directed to an external device using a first pin (e.g., electrical interface pin 610) and to transmit or receive data using a different pin or a second pin (e.g., bidirectional electrical interface pin 620).

Referring now to fig. 7, a block diagram (700) of an acoustic sensor including a frequency separation component (710) according to various embodiments is illustrated, the frequency separation component 710 for transmitting and/or receiving data based on a defined frequency range that is outside or substantially outside of an audio band (e.g., 20Hz to 20kHz) corresponding to an audio output. In this regard, the frequency separation component 710 may be configured to transmit or receive data, such as Pulse Density Modulated (PDM) audio data, based on a defined frequency range that is outside or substantially outside of an audio frequency band corresponding to the audio output. In the embodiment illustrated in fig. 8, the defined frequency range may correspond to a notch of a decimation filter of an external device (not shown) coupled to the acoustic sensor, a defined stopband of a bandstop filter of the external device, and so on.

In one embodiment, the frequency separation component 710 can receive frequency information representing a notch, defined stop band, etc. from an external device via communication data, e.g., in the form of a clock signal. Further, frequency separation component 710 can transmit or receive data based on frequency information.

As illustrated in fig. 7, the signal processing component 140 may be configured to transmit audio output directed to an external device using the bi-directional electrical interface pin 420 and to transmit or receive communication data using the same pin-according to a defined frequency range. In another embodiment illustrated in fig. 9, the signal processing component 140 may be configured to transmit audio output directed to an external device using a first pin (e.g., electrical interface pin 610) and to transmit or receive communication data using a second pin (e.g., bidirectional electrical interface pin 620) -according to a defined frequency range.

Fig. 10 illustrates a block diagram (1000) of an acoustic sensor including a power line communication component (220), the power line communication component 220 for transmitting and/or receiving data via a power pin (240), in accordance with various embodiments. In this regard, as described above, the power line communication component 220 may include data and clock conditioning circuitry for converting communication data encoded onto the power pins 240 into standard logic level signals that may be input to the bi-directional communication component 130.

In the case of transmitting data, outputting data, or the like via the power pin 240, the power line communication component 220 can transmit, for example, communication data, or the like received from the bi-directional communication component 130 in the form of a data output converted into a current pulse by the load current of the power pin 240. In one embodiment, the data input and/or the data clock may be received via power pin 240 as a superimposed voltage signal. (see, e.g., the relevant text and drawings of parent U.S. patent application No. 14/074,587, which is incorporated herein by reference).

In an embodiment, the MEMS transducer 120 and other components of the acoustic sensor 110 may be fully integrated in a single die, implemented on separate dies, with the MEMS transducer 120 and other components interconnected via additional pins and bond wires, or the like. Further, the acoustic sensor 110 may be coupled to a host system (not shown), e.g., a codec, a DSP, a processor, etc., via the I/O150. For example, the host system may be a tester used during production and characterization of the acoustic sensor 110, an external device that collects/transmits the output of the acoustic sensor, communicates data, and the like.

FIG. 11 illustrates a method in accordance with the disclosed subject matter. For simplicity of explanation, the methodologies are depicted and described as a series of acts. It is to be understood and appreciated that the various embodiments disclosed herein are not limited by the acts illustrated and/or by the order of acts. For example, acts can occur in various orders and/or concurrently, and with other acts not presented or described herein. Moreover, not all illustrated acts may be required to implement a methodology in accordance with the disclosed subject matter. In addition, those skilled in the art will understand and appreciate that the methodologies could alternatively be represented as a series of interrelated states via a state diagram or events. Additionally, it should be further appreciated that one or more acts of the methodologies disclosed hereinafter and throughout this specification are capable of being stored on an article of manufacture to facilitate transporting and transferring such methodologies to computers, processors, processing components and the like. The term article of manufacture, as used herein, is intended to encompass a computer program accessible from any computer-readable device, carrier, or media.

Referring now to fig. 11, a process 1100 performed by an acoustic sensor (e.g., 110) is illustrated, in accordance with various embodiments. At 1110, the acoustic sensor may generate an audio output corresponding to the acoustic pressure applied to the MEMS transducer. At 1120, the acoustic sensor may transmit and/or receive data superimposed on the audio output based on common mode signaling, time division multiplexing, or frequency separation.

As used in this specification, the terms "processor," "processing component," and the like may generally refer to any computing processing unit or device, including, but not limited to including, a single-core processor; a single processor with software multi-threaded execution capability; a multi-core processor; a multi-core processor having software multi-thread execution capability; a multi-core processor having hardware multithreading; a parallel platform; and parallel platforms with distributed shared memory. Additionally, a processor may refer to an integrated circuit, a codec, an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), a Programmable Logic Controller (PLC), a Complex Programmable Logic Device (CPLD), discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions and/or processes described herein. Further, processors may utilize nanoscale architectures such as, but not limited to, molecular and quantum dot based transistors, switches, and gates, for example, to optimize space usage or enhance performance of mobile devices. A processor may also be implemented as a combination of computing processing units, devices, etc.

In this specification, terms such as "memory," "non-volatile memory," and any other information storage components that are substantially related to the operation and function of the MEMS microphones and/or devices disclosed herein refer to "memory components" or entities contained in "memory" or components that include memory. It will be appreciated that the memory can include volatile memory and/or nonvolatile memory. By way of illustration, and not limitation, volatile memory can include Random Access Memory (RAM), which can act as external cache memory. By way of illustration and not limitation, RAM may include Synchronous RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), Direct Rambus Dynamic RAM (DRDRAM), and/or Rambus Dynamic RAM (RDRAM). In other embodiments, non-volatile memory may include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), electrically erasable ROM (EEPROM), or flash memory. Additionally, the systems and/or devices disclosed herein may include, but are not limited to including, these memories and any other suitable types of memories.

The above description of illustrated embodiments of the disclosure, including what is described in the abstract, is not intended to be exhaustive or to limit it to the precise forms disclosed. Although specific embodiments and examples are described herein for illustrative purposes, various modifications are possible within the scope of such embodiments and examples, as those skilled in the relevant art will recognize.

In this regard, while the disclosed subject matter has been described in connection with various embodiments and corresponding figures, it is to be understood that other similar embodiments may be used or modifications and additions may be made to the described embodiment for performing the same, similar, alternative or substitute function thereof without deviating therefrom. Accordingly, the disclosed subject matter should not be limited to any single embodiment described herein, but rather should be construed in breadth and scope in accordance with the following appended claims.

Claims (19)

1. An acoustic sensor, comprising:

a microelectromechanical system (MEMS) transducer configured to generate an audio output based on an acoustic pressure;

a bi-directional communication component configured to at least one of transmit data superimposed on the audio output or receive data superimposed on the audio output using common mode signaling, time division multiplexing, or frequency separation, the common mode signaling comprising a sum of a first voltage of a first pin and a second voltage of a second pin; and

a signal processing component configured to simultaneously:

sending the audio output directed to an external device during differential mode configuration via the first pin and the second pin with differential mode signaling between the first pin and the second pin, an

Sending the data directed to the external device during the differential mode configuration via the first pin and the second pin with the common mode signaling comprising a sum of the first voltage and the second voltage.

2. The acoustic sensor of claim 1, wherein the signal processing component is configured to transmit the audio output directed to the external device during a first defined time period based on the time-division multiplexing during a time-division multiplexing configuration.

3. The acoustic sensor of claim 2, wherein the signal processing component is configured to transmit or receive the data during a second defined time period different from the first defined time period based on the time-division multiplexing during the time-division multiplexing configuration.

4. The acoustic sensor of claim 3, wherein, during the time division multiplexing configuration, the signal processing component is configured to:

sending the audio output directed to the external device with the first pin of the acoustic sensor; and

and transmitting or receiving the data by utilizing the first pin.

5. The acoustic sensor of claim 3, wherein, during the time division multiplexing configuration, the signal processing component is configured to:

sending the audio output directed to the external device with the first pin of the acoustic sensor; and

transmitting or receiving the data with the second pin of the acoustic sensor.

6. The acoustic sensor of claim 1, wherein the signal processing component is configured to transmit or receive the data based on a defined frequency range that is outside or substantially outside an audio band corresponding to the audio output during a frequency separation configuration based on the frequency separation.

7. The acoustic sensor of claim 6, wherein the defined frequency range corresponds to a notch of a decimation filter of another external device coupled to the acoustic sensor.

8. The acoustic sensor of claim 6, wherein, during the frequency separation configuration, the signal processing component is configured to:

sending the audio output directed to the external device with the first pin of the acoustic sensor; and

and transmitting or receiving the data by utilizing the first pin.

9. The acoustic sensor of claim 6, wherein, during the frequency separation configuration, the signal processing component is configured to:

sending the audio output directed to the external device with the first pin of the acoustic sensor; and

and transmitting or receiving the data by utilizing the second pin.

10. The acoustic sensor of claim 1, further comprising a power line communication component configured to at least one of transmit communication data or receive communication data using at least one of a power pin of the acoustic sensor or a ground pin of the acoustic sensor.

11. A method for signal processing, comprising:

generating, by an acoustic sensor, an audio output corresponding to an acoustic pressure applied to a microelectromechanical (MEMS) transducer;

performing, by the acoustic sensor, at least one of sending data superimposed on the audio output or receiving data superimposed on the audio output based on common mode signaling, time division multiplexing, or frequency separation, the common mode signaling comprising a sum of respective voltages of a first pin of the acoustic sensor and a second pin of the acoustic sensor; and

transmitting the audio output directed to an external device using differential signaling between the first pin and the second pin using the first pin and the second pin during a differential signaling configuration, wherein the transmitting or receiving the data based on the common mode signaling comprises simultaneously transmitting the data directed to the external device using the first pin and the second pin during the differential signaling configuration, and wherein the data comprises a sum of the respective voltages of the first pin and the second pin.

12. The method for signal processing according to claim 11, wherein said transmitting or said receiving the data based on the time division multiplexing comprises:

transmitting the audio output directed to the external device during a first time period during a time division multiplexing configuration; and

transmitting or receiving the data during a second time period different from the first time period during the time division multiplexing configuration.

13. The method for signal processing according to claim 12, wherein the transmitting the audio output directed to the external device during the first time period comprises transmitting the audio output using the first pin, and wherein the transmitting or the receiving the data during the second time period comprises transmitting or receiving the data during the second time period using the first pin.

14. The method for signal processing according to claim 11, wherein said transmitting or said receiving the data based on the frequency separation comprises:

transmitting or receiving the data based on a defined frequency range that is outside or substantially outside an audio band corresponding to the audio output.

15. The method for signal processing according to claim 14, wherein the transmitting or the receiving the data based on the defined frequency range comprises transmitting or receiving the data based on a defined stopband of a bandstop filter of another external device coupled to the acoustic sensor.

16. The method for signal processing according to claim 14, wherein the transmitting or receiving the data based on the defined frequency range comprises:

sending the audio output directed to the external device using the first pin; and

the data is sent or received using the first pin.

17. The method for signal processing according to claim 11, further comprising:

at least one of transmitting communication data or receiving communication data through the acoustic sensor using at least one of a power pin of the acoustic sensor or a ground pin of the acoustic sensor.

18. A system for signal processing, comprising:

an acoustic transducer configured to convert an acoustic signal into an audio output;

a bi-directional communication component configured to at least one of transmit data superimposed on the audio output or receive data superimposed on the audio output based on a common mode transmission, a time division multiplexed transmission, or a frequency separation, the common mode transmission comprising a sum of a first voltage at a first pin of the system and a second voltage at a second pin of the system; and

a signal processing component configured to transmit the audio output directed to an external device using differential signaling between the first pin and the second pin during a differential mode configuration, and to simultaneously transmit the data directed to the external device via the common mode transmission comprising a sum of the first voltage and the second voltage during the differential mode configuration.

19. The system for signal processing according to claim 18, wherein the signal processing component is configured to:

based on at least one of the time division multiplexed transmission or the frequency separation:

transmitting or receiving the data using the first pin; and

sending the audio output directed to the external device using the first pin.

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