CN107258088A - Signal transacting for sonic transducer bi-directional communication channel - Google Patents
Signal transacting for sonic transducer bi-directional communication channel Download PDFInfo
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- CN107258088A CN107258088A CN201580069718.9A CN201580069718A CN107258088A CN 107258088 A CN107258088 A CN 107258088A CN 201580069718 A CN201580069718 A CN 201580069718A CN 107258088 A CN107258088 A CN 107258088A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Circuit For Audible Band Transducer (AREA)
Abstract
The signal transacting for sonic transducer bi-directional communication channel is described herein.Sonic transducer may include MEMS (MEMS) transducer, and it is configured as being based on acoustic pressure, generates audio output；And intercommunication component, it is configured with common mode signaling, time division multiplexing or frequency separation to send and/or receive the data being superimposed upon in audio output.In this example, the differential mode signaling that signal processing component is configured to, between the respective pins of sonic transducer sends the audio output for being externally oriented equipment；And send data using the common mode signaling for the voltage sum for including respective pins.In other examples, signal processing component is configured as sending during different time sections and/or reception Data Concurrent send audio output；Or based on voiced band outside frequency range send data.
Description
The cross reference of related application
Entitled " the SIGNAL PROCESSING FOR AN that patent application claims were submitted on December 18th, 2015
ACOUSTIC SENSOR BI-DIRECTIONAL COMMUNICATION CHANNEL " U.S. Non-provisional Patent application sequence
Number be 14/975,155 priority, it is entitled " the MULTI-FUNCTION PINS FOR submitted on November 7th, 2013
The part of A PROGRAMMABLE ACOUSTIC SENSOR " U.S. Non-provisional Patent Application No. 14/074,587 continues.
In addition, this application claims entitled " the SIGNAL PROCESSING FOR ACOUSTIC submitted on December 22nd, 2014
SENSOR BI-DIRECTIONAL COMMUNICATION CHANNELS " U.S. Provisional Patent Application No. is 62/095,108
Priority.Above-mentioned application is incorporated herein by reference.
Technical field
This theme, which is disclosed, relates generally to sonic transducer, but is not limited to use at the signal of sonic transducer bi-directional communication channel
Reason.
Background
Multiple sonic transducers, i.e. MEMS (MEMS) microphone, in consumer-elcetronics devices.Such equipment
Placement on circuit boards is driven by acoustic characteristic, and can limit electrical connectivity, i.e. the pin used in sensor device
Number.In this respect, although conventional acoustic sensor technologies utilize standard bi-directional communication interface, i.e., internal integrated circuit (I2C),
Serial Peripheral Interface (SPI) (SPI) or SoundWire, to transmit the information in addition to audio output, but such interface is each set
It is standby to need 2 to 4 extra dedicated pins.Therefore, conventional acoustic sensor technologies have some defects, and some of them can
Aroused attention with reference to various embodiments discussed below.
Brief description
Non-limiting example disclosed in theme is described with reference to the following drawings, wherein unless otherwise stated,
Similar reference numeral refers to like in each view.
Fig. 1 is illustrated to be superimposed upon in audio output according to each embodiment including being configured as sending and/or receiving
The block diagram of the sonic transducer of the intercommunication component of data；
Fig. 2 illustrates the common-mode signal for including being used to send the data being superimposed upon in audio output according to each embodiment
The block diagram of the sonic transducer of component；
Fig. 3 is illustrated in differential mode audio output signaling and respective pins according to the expression respective pins of each embodiment
The waveform of common-mode data signaling；
Fig. 4 illustrates including for sending and/or receiving the data being superimposed upon in audio output according to each embodiment
Time division multiplexing component sonic transducer block diagram；
Fig. 5 illustrates the ripple for being superimposed upon the data in audio output using time division multiplexing according to the expression of each embodiment
Shape；
Fig. 6 illustrates the block diagram of the sonic transducer including signal processing component, and the signal processing component is used to use pin
To send audio output and send and/or receive data using another pin based on time division multiplexing；
Fig. 7 illustrates the block diagram of the sonic transducer including frequency separation component, and the frequency separation component is used to be based on right
Should beyond the voiced band of audio output/substantially beyond definition frequency range send and/or receive data；
Fig. 8 is illustrated represents that the decimation filter used in Intrusion Detection based on host system is superimposed upon respectively according to each embodiment
The waveform of the frequency spectrum of data in audio output and the transmission function of decimation filter；
Fig. 9 illustrates the block diagram of the sonic transducer including frequency separation component, and the frequency separation component is used to be based on right
Should beyond the voiced band of the audio output of second pin/substantially beyond definition frequency range come via the first pin send out
Send and/or receive data；
Figure 10 illustrates the block diagram of the sonic transducer including power line communication component according to each embodiment, the power line
Communication component is used to sending via power pins and/or grounding pin/receive data；And
Figure 11 illustrates the flow chart of the method associated with sonic transducer according to each embodiment.
It is described in detail
Now hereinafter with reference to there is shown with the accompanying drawing of example embodiment more fully to disclosed in this theme aspect
It is described.In the following description, for illustrative purposes, many details are elaborated, to provide to each implementation
The thorough understanding of example.It can in many different forms embody, and be should not be construed as limited to herein however, this theme is disclosed
Middle illustrated example embodiment.
As described above, conventional acoustic sensor technologies transmit such as non-audio on sensor device using dedicated pin
Message context has some defects.Each embodiment disclosed herein can be sent/be connect by using signal processing technology
Receipts are superimposed upon the data on audio output signal to improve the use to valuable circuit board real estate (real estate).
For example, sonic transducer may include MEMS transducer (for example, MEMS microphone) and intercommunication component.MEMS transducings
Device can be configured as generating audio output based on acoustic pressure.Intercommunication component can be configured with common mode signaling, time division multiplexing
Or frequency separation sends and/or received the data being superimposed upon in audio output.
In embodiment, MEMS transducer may include signal processing component, and it can be configured to, with the of sonic transducer
Differential mode signaling between one pin and the second pin of sonic transducer is externally oriented equipment (for example, encoder-decoding to send
Device (codec), digital signal processor (DSP) etc.) audio output.In addition, signal processing component can be configured as basis
The relevant voltage sum of first pin and second pin sends data using common mode signaling.
In one embodiment, signal processing component can be configured as based on time division multiplexing, in the period of the first definition
Period sends the audio output for being externally oriented equipment, and sends or receive data during the period of the second definition, for example,
The loss of audio-frequency information can substantially be compensated, minimize during this period.
In another embodiment, signal processing component can be configured as, based on time division multiplexing, utilizing the pin of sonic transducer
Send the audio output for being externally oriented equipment.Send and/or receive in addition, signal processing component can be configured to, with pin
Data.
In yet another embodiment, signal processing component can be configured as, based on time division multiplexing, utilizing the of sonic transducer
One pin sends the audio output for being externally oriented equipment, and is sent or reception data using the second pin of sonic transducer.
In embodiment, signal processing component can be configured as being based on frequency separation, and the frequency range based on definition is sent
Or receive data, the frequency range of this definition beyond the voiced band corresponding to audio output and/or substantially voiced band with
Outside.
In one embodiment, the frequency range of definition corresponds to the filtering extraction for the external equipment for being coupled to sonic transducer
Trap (notch), stopband of the definition of the bandstop filter of external equipment of device etc..
In another embodiment, signal processing component can be configured as based on frequency separation using the pin of sonic transducer come
The audio output for being externally oriented equipment is sent, and is sent or reception data using pin.
In yet another embodiment, signal processing component can be configured as utilizing the first of sonic transducer based on frequency separation
Pin is externally oriented the audio output of equipment to send, and is sent or reception data using second pin.
In embodiment, sonic transducer may include power line communication component, and it is configured to, with the power supply of sonic transducer
Pin and/or grounding pin send and/or received communication data.
In one embodiment, method, which may include to generate by sonic transducer, corresponds to the acoustic pressure for being applied to MEMS transducer
Audio output；And based on common mode signaling, time division multiplexing or frequency separation, send and/or receive folded by sonic transducer
It is added in the data in audio output.
In another embodiment, method may include using the difference between the first pin of system and the second pin of system
Signaling, is sent by sonic transducer and is externally oriented the audio output of equipment, and based on common mode signaling, based on the first pin and
The relevant voltage sum of second pin sends data.
In yet another embodiment, being sent and/or received data based on time division multiplexing may include during first time period
The audio output for being externally oriented equipment is sent, and is sent or reception data during second time period.
In embodiment, send audio output and come to send fixed during first time period including the use of the pin of sonic transducer
To the audio output to external equipment.In addition, being sent during second time period or received data packet is included using pin come the
Data are sent or received during two periods.
In one embodiment, sent based on frequency separation or received data packet include frequency range based on definition send or
Data are received, the frequency range of this definition is beyond the voiced band corresponding to audio output or substantially beyond voiced band.
In another embodiment, the frequency range based on definition is sent or received data packet includes and is based on being coupled to sonic transducer
Stopband, the trap of the decimation filter of external equipment of definition of bandstop filter of external equipment etc., send or receive number
According to.
In yet another embodiment, the frequency range based on definition sends or received data and may include using sonic transducer
Pin, which is sent, is externally oriented the audio output of equipment, and using the pin is sent or received data.
In embodiment, method may also include the power pins using sonic transducer and/or the grounding pin of sonic transducer,
Communication data associated such as with data, intercommunication component 130 is sent and/or received by sonic transducer.
In one embodiment, system may include：Sonic transducer, it is configured as acoustical signal being converted to audio output；
And intercommunication component, it is configured as sending and/or receiving based on common mode transmission, time multiplexed transmission or frequency separation
It is superimposed upon the data in audio output.
In another embodiment, system may include：Signal processing component, it is configured as sending fixed via the pin of system
To the audio output to external equipment, and based at least one in time multiplexed transmission or frequency separation, sent via pin
And/or receive data.
The reference to " one embodiment " or " embodiment " in this specification means in conjunction with the embodiments described
Specific feature, structure or characteristic are included at least one embodiment.Therefore, in each place through this specification
The phrase " in one embodiment " of appearance or " in embodiment " are not necessarily all referring to identical embodiment.In addition, specific special
Levy, structure or characteristic can in any suitable manner be combined in one or more embodiments.
In addition, with regard to term " including (includes) ", " having (has) ", " including (contains) " word similar with other
For pragmatic is in detailed description or appended claims, such term be intended to similar to term " including
(comprising) mode that any additional or other elements " are not excluded for as open transition word is inclusive.In addition,
Term "or" is intended to indicate that the "or" rather than exclusive "or" of pardon.That is, unless otherwise indicated or above and below
Clear in text, " X is intended to indicate that the arrangement of any natural pardon using A or B ".If that is, X uses A；X is adopted
Use B；Or X use A and B both, then under any afore-mentioned meet " X use A or B ".In addition, the application and appended right will
Article " one (a) " and " one (an) " used in asking should generally be interpreted to represent " one or more ", unless separately
It is described or clear sensing singulative from the context.
Implementation (the example in machine is may make up in terms of device, equipment, system, process and procedure block explained herein
Such as, in the computer-readable medium (or media) associated with machine, memory devices implement) machine-executable instruction.
Such instruction can make machine perform described operation when being performed by machine.In addition, device, equipment, system, process and process
The aspect of block can be implemented in the hardware of application specific integrated circuit (ASIC) etc..In addition, occur during each some or
The order of all processes block is not construed as restricted.On the contrary, benefiting from presently disclosed person skilled in the art
Member is it should be understood that some procedure blocks can be performed with unaccounted various orders.
In addition, word " exemplary " and/or " illustrative " are used herein to mean that and serve as example, example or explanation.For
Query is avoided, theme disclosed herein do not limited by such example.In addition, described herein as " exemplary "
And/or any aspect or design of " illustrative " are not necessarily to be construed as than other aspects or design preferably or favourable, also differ
Mean to exclude calmly and benefit from example arrangement and technology equivalent known to presently disclosed those of skill in the art.
Conventional acoustic sensor technologies have some defects in terms of such as non-audio information is transmitted using dedicated pin.
On the other hand, each embodiment disclosed herein be able to will be led to by using various signal processing technologies via common pin
Letter signaling is superimposed upon in audio output signaling to preserve valuable circuit board real estate and substantially reduce communication signaling and audio
Export the interference between signaling.
In this respect, referring now to Fig. 1, sonic transducer 110 includes MEMS transducer 120, intercommunication component 130, letter
Number processing assembly 140 and input/output end (I/O) 150.MEMS transducer 120 can be contacted with acoustic pressure, and the change of acoustic pressure
Change the change for the electric parameter that can cause MEMS transducer 120.In embodiment, MEMS transducer 120 can be by such as barrier film, outstanding
The formation such as plate.In this respect, acoustic pressure increaseds or decreases the translational displacement that can make diaphragm flexes or cause hanging deck, and MEMS changes
Energy device 120 can represent the respective change of electric parameter via audio output signal.In embodiment, electric parameter may include to represent
The bending of barrier film or the capacitance variations of the displacement of hanging deck.
Signal processing component 140 can represent acoustic pressure based on the audio output signal generation generated by MEMS transducer 120
Electrical output, voice data, audio output etc..In addition, voice data can be sent to sound sensing by signal processing component 140
The various assemblies of device 110, for example, the (not shown) such as amplifier, nonvolatile memory, digital interface (DIF) is (see, for example, logical
Cross the related text that the female case U.S. Patent Application No. being incorporated herein by reference is 14/074,587), and utilize I/O 150 electricity
Gas interface pin (for example, 250,260,420,610) (see below) is with the equipment outside sonic transducer 110 (for example, main
The (not shown) such as machine, DSP, processor) exchange voice data.
Intercommunication component 130 may include DIF, and it can be used for register, the nonvolatile memory to sonic transducer 110
Data, communication data etc./data, communication data etc. are received from it, for example, for testing, configuring, repair are sent Deng (not shown)
The various assemblies of whole sonic transducer 110, information etc. is obtained from it.In addition, I/O 150 public affairs can be used in signal processing component 140
Common-battery gas interface pin carrys out between sonic transducer 110 and external equipment (not shown) transmission/reception communication data (for example, number
According to (DATA), data output (DATA OUT) etc.).In this respect, signal processing component 140 can be multiple using common mode signaling, time-division
With or frequency separation (not shown) such as using logic circuit, switch, multiplexer, demultplexer communication data is folded
It is added on voice data.
Referring now to Fig. 2 and Fig. 3, respectively illustrate according to each embodiment including being superimposed upon audio output for transmission
On data, communication data etc. common-mode signal component (210) sonic transducer block diagram (200), and represent associated
The waveform of differential mode signaling and common mode signaling.In this respect, signal processing component 140 can be based on receiving from MEMS transducer 120
Audio output, sends the audio output as differential output signal, for example, "+audio using electric interfaces pin 250 and 260
Output " (+AUDIO OUT) and "-audio output " (- AUDIO OUT).In addition, common-mode signal component 210 is electric using including
The common mode signaling of the relevant voltage sum of interface pin 250 and 260, communication data (for example, " DATA OUT ") is sent to outer
Portion's equipment (not shown).As illustrated in fig. 3, audio output (for example, " AUDIO OUT ") include differential output signal "+
AUDIO OUT " and " voltage difference between-AUDIO OUT ".In addition, communication data (for example, " DATA OUT ") include "+
AUDIO OUT " and "-AUDIO OUT " waveform sum.
In other embodiment (not shown), signal processing component can utilize common mode signaling to receive communication number from external equipment
According to such as " DATA ", " DATA IN ".In this respect, electric interfaces pin 250 and 260 may include that two directions' inputing/output is drawn
Pin, and sonic transducer may include the (not shown) such as receiver, amplifier, comparator, analog-digital converter, to enter to common-mode data
Row decoding, standard logic levels signal of intercommunication component 130 etc. can be input into by converting thereof into.
In embodiment, power line communication component 220 can be configured as via power pins 240 (for example, power interface
(PWR) 230 power pins or grounding pin) receive communication data from external equipment.In this respect, power line communication component
220 may include data and clock adjustment circuits (not shown) (see, for example, the female case United States Patent (USP) Shen being incorporated herein by reference
Please number be 14/074,587 related text), the communication data being encoded into power pins 240 can be converted into by it can quilt
It is input to the standard logic levels signal of intercommunication component 130.
In one embodiment, data and clock adjustment circuits are using the high frequency carrier and amplitude shift key being superimposed upon on power supply
Control signaling schemes.(it is 14/074,587 see, for example, Fig. 3 and the female case U.S. Patent Application No. being incorporated herein by reference
Related text).In another embodiment, data and clock adjustment circuits are using the passband signaling side being superimposed upon on power supply
Case.It is (literary for 14/074,587 correlation see, for example, Fig. 4 and the female case U.S. Patent Application No. being incorporated herein by reference
This).In yet another embodiment, data and clock adjustment circuits are using the baseband signaling scheme being superimposed upon on power supply.(referring to
For example, the related text that Fig. 5 and the female case U.S. Patent Application No. being incorporated herein by reference are 14/074,587).
Fig. 4 illustrates including for sending and/or receiving the data being superimposed upon in audio output according to each embodiment
Time division multiplexing component (410) sonic transducer block diagram (400).In this respect, referring now to Fig. 5, be time-multiplexed component 410
It can be configured as sending the audio output for being externally oriented equipment (not shown) during the period of the first definition, for example
“AUDIO OUTPUT”.Determine in addition, time division multiplexing component 410 can be configured to, with two-way electric interfaces pin 420 second
Communication data is sent or received during the period of justice, for example, " DATA ", " DATA IN ", " DATA OUT " etc., for example, reducing
Or significantly reduce the layout defect such as due to power supply, ground connection, encapsulation limitation between communication data and audio output data
Deng caused interference.
In one embodiment, time division multiplexing component 410 can be configured to, with pin (for example, electric interfaces pin
410) audio output for being externally oriented equipment is sent, and is sent or reception communication data using same pin.
In another embodiment illustrated in Fig. 6, time division multiplexing component 410 can be configured to, with the first pin (for example,
Electric interfaces pin 610) send and be externally oriented the audio output of equipment, and using different pin or second pin (for example,
Two-way electric interfaces pin 620) send or receive data.
Referring now to Fig. 7, it is illustrated that according to the frame of the sonic transducer including frequency separation component (710) of each embodiment
Scheme (700), the frequency separation component 710 be used for based on the voiced band (for example, 20Hz to 20kHz) corresponding to audio output with
The frequency range of definition beyond outside or substantially sends and/or received data.In this respect, frequency separation component 710 can quilt
The frequency range for the definition being configured to beyond the audio band corresponding to audio output or substantially beyond voiced band
Send or receive data, such as pulse density modulated (PDM) voice data.In Fig. 8 shown embodiments, the frequency of definition
Scope may correspond to be coupled to the band resistance of the trap of the decimation filter of the external equipment (not shown) of sonic transducer, external equipment
Stopband of the definition of wave filter etc..
In one embodiment, frequency separation component 710 can via for example with the communication data of clock signal form from outer
Portion's equipment receives the frequency information for representing trap, the stopband of definition etc..In addition, frequency separation component 710 can be based on frequency information
Send or receive data.
As illustrated in figure 7, signal processing component 140 can be configured to, with two-way electric interfaces pin 420 and send fixed
To the audio output to external equipment, and using identical pin-according to frequency range-transmission of definition or receive communication number
According to.In another embodiment illustrated in Fig. 9, signal processing component 140 can be configured to, with the first pin (for example, electrically
Interface pin 610) audio output for being externally oriented equipment is sent, and using second pin (for example, two-way electric interfaces pin
620)-according to frequency range-transmission of definition or receive communication data.
Figure 10 illustrates the block diagram of the sonic transducer including power line communication component (220) according to each embodiment
(1000), the power line communication component 220 is used to data are sent and/or received via power pins (240).In this respect, such as
Upper described, power line communication component 220 may include data and clock adjustment circuits, and it is used to that power pins 240 will to be encoded into
On communication data change into and can be input into the standard logic levels signal of intercommunication component 130.
In the case where sending data, output data etc. via power pins 240, power line communication component 220 can be with
By the form transmission of the data output of the load current of power pins 240-be converted into current impulse for example, from two-way communication group
Communication data, data that part 130 is received etc..In one embodiment, data input and/or data clock can be via power pins
240 are received, and are used as the voltage signal of superposition.(it is see, for example, the female case U.S. Patent Application No. being incorporated herein by reference
14/074,587 related text and accompanying drawing).
In embodiment, other components of MEMS transducer 120 and sonic transducer 110 can be fully integrated in single tube core
In, on single tube core realize, wherein MEMS transducer 120 and other components via additional pin and closing line etc. mutually
Even.In addition, sonic transducer 110 can be coupled to host computer system (not shown) via I/O 150, for example, codec, DSP, processing
Device etc..For example, host computer system can be tester, the collection/transmission sound used during the production of sonic transducer 110 and sign
The external equipment of output, the communication data of sensor etc..
Figure 11 illustrates the method according to disclosed theme.In order to simplify explanation, this method, which is depicted and is described as one, is
Row are acted.It is understood and appreciated that, each embodiment disclosed herein by illustrated action and/or is not acted suitable
The limitation of sequence.For example, action can occur and/or while occur in various orders, and with not presenting or describing herein
Other actions occur simultaneously.Furthermore, it is possible to not need be described action to realize the method according to disclosed theme.Separately
Outside, skilled persons will understand that and recognize, this method can be alternately by state diagram or representations of events
A series of states that are mutually related.Additionally it should it is further recognized that hereafter one with the method disclosed in entire disclosure
Or more action can be stored on product, in order to transmit and be transferred to computer, processor, place by such method
Manage component etc..Product is intended to visit from any computer readable device, carrier or media as used herein, the term
The computer program asked.
Referring now to Figure 11, according to each embodiment, it is illustrated that the process 1100 performed by sonic transducer (for example, 110).
1110, sonic transducer can generate the audio output corresponding to the acoustic pressure for being applied to MEMS transducer.1120, sonic transducer can
The data being superimposed upon in audio output are sent and/or received based on common mode signaling, time division multiplexing or frequency separation.
As used in this manual, term " processor ", " processing assembly " etc. can generally refer to include but do not limit
In any calculation processing unit or equipment including single core processor；Uniprocessor with software multithread executive capability；It is many
Core processor；Polycaryon processor with software multithread executive capability；Polycaryon processor with hardware multithread technology；And
Row platform；And the parallel tables with distributed shared memory.In addition, processor can refer to integrated circuit, codec, specially
With integrated circuit (ASIC), digital signal processor (DSP), field programmable gate array (FPGA), programmable logic controller (PLC)
(PLC), CPLD (CPLD), discrete gate or transistor logic, discrete hardware components or its be designed to
Perform any combinations of function described herein and/or process.In addition, processor can utilize nano-scale architectures, such as
But the transistor based on molecule and quantum dot, switch and door are not limited to, for example, being used or enhancing mobile device to optimize space
Performance.Processor can also be implemented as the combination of calculation processing unit, equipment etc..
In this manual, such as " memory ", the term of " nonvolatile memory " and with it is disclosed herein
The operation of MEMS microphone and/or equipment and function substantially related any other information storage module refer to " memory group
Part " or the entity included in " memory " or the component including memory.It will be appreciated that, memory may include volatibility
Memory and/or nonvolatile memory.By way of illustration and not by way of limitation, volatile memory may include that arbitrary access is deposited
Reservoir (RAM), it can serve as external cache.By way of illustration and not by way of limitation, RAM may include synchronization
It is RAM (SRAM), dynamic ram (DRAM), synchronous dram (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced
SDRAM (ESDRAM), synchronization link DRAM (SLDRAM), the direct RAM of Rambus (RDRAM), direct Rambus dynamic rams
And/or Rambus dynamic rams (RDRAM) (DRDRAM).In other embodiments, nonvolatile memory may include read-only storage
Device (ROM), programming ROM (PROM), electrically programmable ROM (EPROM), electrically-erasable ROM (EEROM) (EEPROM) or flash memory.In addition, this
System and/or equipment disclosed in text may include but be not limited to include the storage of these memories and any other suitable type
Device.
The above description for being included in the embodiment of the explanation of the disclosure of the content described in summary is not intended to exhaustive
Or be limited to disclosed precise forms.As the technical staff in association area is able to recognize that, although for explanation
Purpose, specific embodiment and example are described herein, but are considered as the model in such embodiment and example
Various modifications in enclosing are possible.
In this respect, although disclosed theme is described for each combined embodiment and corresponding accompanying drawing,
But under applicable circumstances, it should be appreciated that other similar embodiments can be used, or described embodiment can be repaiied
Change and add, to perform function that is same, similar, substituting or replace in the case of without departing from disclosed theme.Therefore,
Disclosed theme should not necessarily be limited by any single embodiment described herein, and should be according to claims appended below wide
Explained in degree and scope.
Claims (20)
1. a kind of sonic transducer, including：
MEMS (MEMS) transducer, the MEMS transducer is configured as generating audio based on acoustic pressure defeated
Go out；And
Intercommunication component, the intercommunication component is configured with common mode signaling, time division multiplexing or frequency separation, carries out
At least one that the data that are superimposed upon in the audio output or reception be superimposed upon in the data in the audio output is sent to move
Make.
2. sonic transducer as claimed in claim 1, in addition to signal processing component, the signal processing component are configured as：
Using the differential mode signaling between the first pin of the sonic transducer and the second pin of the sonic transducer, orientation is sent
To the audio output of external equipment；And
The data are sent using the common mode signaling, wherein, the common mode signaling includes first pin and described second
The relevant voltage sum of pin.
3. sonic transducer as claimed in claim 1, in addition to signal processing component, the signal processing component are configured as base
In the time division multiplexing：
The audio output for being externally oriented equipment is sent during the period of the first definition；And
The data are sent or receive during different from the period of the second definition of the period of the described first definition.
4. sonic transducer as claimed in claim 3, wherein, the signal processing component is configured as：
The audio output for being directed to the external equipment is sent using the pin of the sonic transducer；And
The data are sent or received using the pin.
5. sonic transducer as claimed in claim 3, wherein, the signal processing component is configured as：
The audio output for being directed to the external equipment is sent using the first pin of the sonic transducer；And
The data are sent or receive using the second pin of the sonic transducer.
6. sonic transducer as claimed in claim 1, in addition to signal processing component, the signal processing component are configured as base
In the frequency separation：
Frequency range based on definition sends or receives the data, and the frequency range of the definition is defeated corresponding to the audio
Beyond the voiced band gone out or substantially beyond the voiced band.
7. sonic transducer as claimed in claim 6, wherein, the frequency range of the definition, which corresponds to, is coupled to the sound sensing
The trap of the decimation filter of the external equipment of device.
8. sonic transducer as claimed in claim 6, wherein, the signal processing component is configured as：
The audio output for being externally oriented equipment is sent using the pin of the sonic transducer；And
The data are sent or received using the pin.
9. sonic transducer as claimed in claim 6, wherein, the signal processing component is configured as：
The audio output for being externally oriented equipment is sent using the first pin of the sonic transducer；And
The data are sent or received using second pin.
10. sonic transducer as claimed in claim 1, in addition to power line communication component, the power line communication component by with
It is set to using at least one in the power pins of the sonic transducer or the grounding pin of the sonic transducer, is transmitted logical
At least one action in letter data or reception communication data.
11. a kind of method, including：
Audio output is generated by sonic transducer, the audio output corresponds to the sound for being applied to micro electronmechanical (MEMS) transducer
Pressure；And
Based on common mode signaling, time division multiplexing or frequency separation, by the sonic transducer, it is transmitted that to be superimposed upon the audio defeated
Data or reception on going out are superimposed upon at least one action in the data in the audio output.
12. method as claimed in claim 11, in addition to：
Using the difference signaling between the first pin of the sonic transducer and the second pin of the sonic transducer, by described
Sonic transducer, which is sent, is externally oriented the audio output of equipment, wherein, the transmission based on the common mode signaling or connect
Receiving the data includes the relevant voltage sum transmission data based on first pin and the second pin.
13. method as claimed in claim 11, wherein, based on the time-multiplexed transmission or receive the packet
Include：
The audio output for being externally oriented equipment is sent during first time period；And
The data are sent or receive during different from the second time period of the first time period.
14. method as claimed in claim 13, wherein, it is described to send the audio output including the use of the sonic transducer
Pin sends the audio output for being directed to the external equipment during the first time period, and wherein, described
The transmission or the reception data during second time period are sent out including the use of the pin during the second time period
Send or receive the data.
15. method as claimed in claim 11, wherein, the transmission or the reception packet based on the frequency separation
Include：
Frequency range based on definition sends or receives the data, and the frequency range of the definition is defeated corresponding to the audio
Beyond the voiced band gone out or substantially beyond the voiced band.
16. method as claimed in claim 15, wherein, the transmission or reception of the frequency range based on the definition are described
Data include the stopband of the definition of the bandstop filter based on the external equipment for being coupled to the sonic transducer to send or receive
The data.
17. method as claimed in claim 15, wherein, the transmission or reception of the frequency range based on the definition are described
Data include：
The audio output for being externally oriented equipment is sent using the pin of the sonic transducer；And
The data are sent or received using the pin.
18. method as claimed in claim 11, in addition to：
Using at least one in the power pins of the sonic transducer or the grounding pin of the sonic transducer, pass through the sound
Sensor, at least one for being transmitted communication data or receiving in communication data is acted.
19. a kind of system, including：
Sonic transducer, the sonic transducer is configured as converting acoustic signals into audio output；And
Intercommunication component, the intercommunication component is configured as being based on common mode transmission, time multiplexed transmission or frequency separation,
Be transmitted the data being superimposed upon in the audio output or reception be superimposed upon in the data in the audio output at least one
Individual action.
20. system as claimed in claim 19, in addition to signal processing component, the signal processing component are configured as：
Via the pin of the system, the audio output for being externally oriented equipment is sent；And
Based at least one in the time multiplexed transmission or the frequency separation, send or receive via the pin and be described
Data.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462095108P | 2014-12-22 | 2014-12-22 | |
| US62/095,108 | 2014-12-22 | ||
| US14/975,155 US9749736B2 (en) | 2013-11-07 | 2015-12-18 | Signal processing for an acoustic sensor bi-directional communication channel |
| US14/975,155 | 2015-12-18 | ||
| PCT/US2015/067413 WO2016106335A1 (en) | 2014-12-22 | 2015-12-22 | Signal processing for an acoustic sensor bi-directional communication channel |
Publications (2)
| Publication Number | Publication Date |
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| CN107258088A true CN107258088A (en) | 2017-10-17 |
| CN107258088B CN107258088B (en) | 2020-11-03 |
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| CN201580069718.9A Active CN107258088B (en) | 2014-12-22 | 2015-12-22 | Signal processing for acoustic sensor bi-directional communication channel |
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| CN (1) | CN107258088B (en) |
| WO (1) | WO2016106335A1 (en) |
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| Publication number | Publication date |
|---|---|
| WO2016106335A1 (en) | 2016-06-30 |
| CN107258088B (en) | 2020-11-03 |
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