CN107248506A - A kind of cassette pipe radiator structure - Google Patents
A kind of cassette pipe radiator structure Download PDFInfo
- Publication number
- CN107248506A CN107248506A CN201710394597.6A CN201710394597A CN107248506A CN 107248506 A CN107248506 A CN 107248506A CN 201710394597 A CN201710394597 A CN 201710394597A CN 107248506 A CN107248506 A CN 107248506A
- Authority
- CN
- China
- Prior art keywords
- flow passage
- radiating flow
- lid
- chip
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of cassette pipe radiator structure, including shell and chip, enclosure is provided with the radiating flow passage circulated for coolant, radiating flow passage is provided with liquid inlet port with junction on the left of shell, radiating flow passage is provided with liquid outlet with junction on the right side of shell, chip is provided with inside radiating flow passage, left lid and right lid are located at chip both sides, radiating flow passage is U-tube road, groove is respectively equipped with the inside of U-shaped radiating flow passage left part and on the inside of right part, left lid U-shaped radiating flow passage groove corresponding with right lid is provided with convex fixture block.The present invention is radiated by the coolant in hot channel to cassette pipe, the heat-sinking capability of IGCT is improved, the service life of IGCT is extended, the lid of chip both sides is provided with the convex fixture block matched with U-shaped radiating flow passage groove shapes size, it is simple in construction, it is easy to disassemble.
Description
Technical field
The present invention relates to radiating element technical field, more particularly to a kind of cassette pipe radiator structure.
Background technology
IGCT is a kind of switch element, can be worked under the conditions of high voltage, high current, and its course of work can be controlled
Make, be widely used in the electronic circuits such as controlled rectification, AC voltage adjusting, contactless electronic beam switch, inversion and frequency conversion, be typical case
Small current control high current equipment.Because IGCT has certain pressure drop in itself, therefore can exist when the current flows
Certain loss, electric current is bigger, and loss is bigger, and when brilliant lock chip slapper produces loss, the temperature of device can be increased, because
The heat dispersion of IGCT is poor, and internal temperature is too high so that IGCT burn out or can not normal work, service life shortens.
The electric semiconductor radiator of other prior art has a variety of, and air-cooled and two kinds of water cooling, wind can be divided into by being divided to from cooling means
Cold heat sink typically has aluminium section bar and heat-pipe radiator, operationally generally requires gas-distributing fan, and volume is larger.Water-filled radiator one
As be used for the larger occasion of power, small volume, heat radiation power is higher, can many be used in series, but need to configure cooling system.
The design and technique of existing radiator are more ripe, but the radiator and IGCT of prior art are all separated designs, not enough just
It is prompt.
The content of the invention
In view of the shortcomings of the prior art, it is an object of the invention to provide a kind of simple in construction, good heat dissipation effect, it is easy to tear open
The cassette pipe unloaded.
It is of the invention to be for the technical scheme that above-mentioned technological deficiency is used：
A kind of cassette pipe radiator structure, including shell and chip, the enclosure are provided with the radiating flow passage circulated for coolant,
The radiating flow passage is provided with liquid inlet port with junction on the left of shell, and the radiating flow passage is provided with out liquid with junction on the right side of shell
Chip is provided with inside mouth, the radiating flow passage, the left lid and right lid are located at chip both sides..
Further, the radiating flow passage is U-tube road.
Further, it is respectively equipped with groove on the inside of the U-shaped radiating flow passage left part and on the inside of right part.
Further, the left lid U-shaped radiating flow passage groove corresponding with right lid is provided with convex fixture block, and convex card
Block matches with groove shapes size.
The beneficial effects of the invention are as follows：Provided with U-shaped radiating flow passage, cassette pipe is carried out by the coolant in hot channel
Radiating, improves the heat-sinking capability of IGCT, extends the service life of IGCT, and the lid of chip both sides is provided with and U-shaped radiating
The convex fixture block that flow path groove shape size matches, it is simple in construction, it is easy to disassemble.
Brief description of the drawings
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is structural representation of the invention.
Wherein：1st, shell, 2, radiating flow passage, 3, liquid inlet port, 4, liquid outlet, 5, left lid, 6, right lid, 7, chip.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment and accompanying drawing, the invention will be further described, should
Embodiment is only used for explaining the present invention, does not constitute the restriction to protection scope of the present invention.
A kind of cassette pipe radiator structure as shown in Figure 1, including shell 1 and chip 7, the inside of shell 1, which is provided with, supplies coolant
The radiating flow passage 2 of circulation, radiating flow passage 2 is provided with liquid inlet port 3 with the left side junction of shell 1, and radiating flow passage 2 connects with the right side of shell 1
Meet place and be provided with liquid outlet 4, the inside of radiating flow passage 2 is provided with chip 7, and left lid 5 and right lid 6 are located at the both sides of chip 7.
In the present embodiment, radiating flow passage is U-tube road.
In the present embodiment, it is respectively equipped with groove on the inside of U-shaped radiating flow passage left part and on the inside of right part.
In the present embodiment, left lid U-shaped radiating flow passage groove corresponding with right lid is provided with convex fixture block, and convex card
Block matches with groove shapes size.
The beneficial effects of the invention are as follows：The present invention is provided with U-shaped radiating flow passage, by the coolant in hot channel to cassette
Pipe is radiated, and is improved the heat-sinking capability of IGCT, is extended the service life of IGCT, the lid of chip both sides is provided with and U
The convex fixture block that type radiating flow passage groove shapes size matches, it is simple in construction, it is easy to disassemble.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (4)
1. a kind of cassette pipe radiator structure, including shell and chip, it is characterised in that：The enclosure, which is provided with, supplies coolant stream
Logical radiating flow passage, the radiating flow passage is provided with liquid inlet port with junction on the left of shell, and the radiating flow passage on the right side of shell with connecting
Meet place to be provided with provided with chip inside liquid outlet, the radiating flow passage, the left lid and right lid are located at chip both sides.
2. a kind of cassette pipe radiator structure according to claim 1, it is characterised in that：The radiating flow passage is U-tube road.
3. a kind of cassette pipe radiator structure according to claim 1 and claim 2, it is characterised in that：The U-shaped radiating
Groove is respectively equipped with the inside of runner left part and on the inside of right part.
4. a kind of cassette pipe radiator structure according to claim 1 and claim 3, it is characterised in that：The left lid
U-shaped radiating flow passage groove corresponding with right lid is provided with convex fixture block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710394597.6A CN107248506A (en) | 2017-05-29 | 2017-05-29 | A kind of cassette pipe radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710394597.6A CN107248506A (en) | 2017-05-29 | 2017-05-29 | A kind of cassette pipe radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107248506A true CN107248506A (en) | 2017-10-13 |
Family
ID=60018808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710394597.6A Pending CN107248506A (en) | 2017-05-29 | 2017-05-29 | A kind of cassette pipe radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107248506A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100356A (en) * | 2004-09-28 | 2006-04-13 | Toyota Motor Corp | Cooling device for semiconductor device |
| CN101946395A (en) * | 2008-10-31 | 2011-01-12 | 日立汽车系统株式会社 | Power model, power inverter and motor vehicle |
| DE102012207470B3 (en) * | 2012-05-04 | 2013-10-10 | Infineon Technologies Ag | Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size |
-
2017
- 2017-05-29 CN CN201710394597.6A patent/CN107248506A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100356A (en) * | 2004-09-28 | 2006-04-13 | Toyota Motor Corp | Cooling device for semiconductor device |
| CN101946395A (en) * | 2008-10-31 | 2011-01-12 | 日立汽车系统株式会社 | Power model, power inverter and motor vehicle |
| DE102012207470B3 (en) * | 2012-05-04 | 2013-10-10 | Infineon Technologies Ag | Method for manufacturing semiconductor module arrangement i.e. converter, involves cooling body such that recess is reduced and composite is developed between semiconductor module and body, where sides exhibit surface of preset size |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171013 |
|
| WD01 | Invention patent application deemed withdrawn after publication |