CN107222973A - 一种快速生产合格柔性电路板的方法 - Google Patents

一种快速生产合格柔性电路板的方法 Download PDF

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CN107222973A
CN107222973A CN201710457312.9A CN201710457312A CN107222973A CN 107222973 A CN107222973 A CN 107222973A CN 201710457312 A CN201710457312 A CN 201710457312A CN 107222973 A CN107222973 A CN 107222973A
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ring
flexible pcb
tangent
technique
punch hole
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CN107222973B (zh
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金长帅
吴应官
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Suzhou Huayang Electronics Co ltd
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SUZHOU HUAYANG ELECTRONICS CO Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27Means for performing other operations combined with cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38Cutting-out; Stamping-out
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

本发明公开了一种快速生产合格柔性电路板的方法,包括步骤如下:一、运用铜蚀方法,在原材板上铜蚀出多个规则排列的柔性电路板的电路及在原材板上成对角线分布的工艺环;所述工艺环包括内铜环;二、在冲裁柔性电路板的同时,对内铜环的内环内进行冲圆冲头孔;得到柔性电路板、废料区及废料区内的工艺环中形成圆冲头孔;三、目测检查废料区中的圆冲头孔与工艺环内的内铜环是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板均不合格,反之,则合格;本发明所述的快速生产合格柔性电路板的方法,通过目测废料区的圆冲头孔与工艺环内的内铜环是否相切,简单方便,提高了生产效率。

Description

一种快速生产合格柔性电路板的方法
技术领域
本发明涉及一种柔性电路板的生产方法的改进,特指一种通过目测即可判断柔性电路板是否合格的快速生产合格柔性电路板的方法。
背景技术
目前,现有柔性电路板的生产方法为直接冲切产品,对单个产品逐一进行检测,这种方法对于大批量生产,一次性冲切下多个产品的柔性电路板制作而言,生产效率极低,浪费人力物力,且很难完全检测出不合格成品;为此,我们研发了一种通过目测即可判断柔性电路板是否合格的快速生产合格柔性电路板的方法。
发明内容
本发明目的是为了克服现有技术的不足而提供一种通过目测即可判断柔性电路板是否合格的快速生产合格柔性电路板的方法。
为达到上述目的,本发明采用的技术方案是:快速生产合格柔性电路板的方法,包括步骤如下:
一、运用铜蚀方法,在原材板上洗出相应电路及成对角线分布的工艺环;所述工艺环包括同心的内铜环和外铜环;
二、在冲切模具上增加与工艺环对应的圆冲头和外型刀;所述工艺环根据加工精度要求的不同和圆冲头和外型刀的尺寸设计大小;运用冲切方法,得到成品、废料区及废料区内的工艺环中形成圆冲头孔和刀模线;
三、根据目测检查圆冲头孔是否和内铜环相切,刀模线是否和外铜环相切,来判断这一组柔性电路板的生产是否合格。
优选的,所述圆冲头和外形孔刀同时冲切;
由于上述技术方案的运用,本发明与现有技术相比具有下列优点:
本发明所述的快速生产合格柔性电路板的方法,通过目测废料区的圆冲头孔与工艺环内的内铜环是否相切或小孔与外铜环是否相切即可判断此次冲裁的柔性电路板是否合格,简单方便,提高了生产效率。
附图说明
下面结合附图对本发明技术方案作进一步说明:
附图1为本发明所述的快速生产合格柔性电路板的方法的原材板视图;
附图2为本发明所述的快速生产合格柔性电路板的方法的铜蚀工序后视图;
附图3为本发明所述的快速生产合格柔性电路板的方法的废料视图;
附图4为本发明所述的快速生产合格柔性电路板的方法的成品视图;
附图5为图2中的工艺环放大视图;
附图6为图3中的工艺环放大视图。
其中:1、原材板;2、工艺环;3、废料区;4、柔性电路板;5、圆冲头孔;6、内铜环;7、小孔;8、外铜环。
具体实施方式
下面结合附图及具体实施例对本发明作进一步的详细说明。
附图1-6为本发明所述的快速生产合格柔性电路板的方法,包括步骤如下,以公差0.2mm的设计要求为例:
一、运用铜蚀方法,在原材板1上铜蚀出多个规则排列的柔性电路板4的电路及在原材板1上成对角线分布的工艺环2;所述工艺环2包括同心的1.4mm*1.8mm内铜环6和内径为2.4mm的外铜环8;
二、在冲裁柔性电路板4的同时,对1.4mm*1.8mm内铜环6的内环内进行冲圆冲头孔5,孔径1.0mm;及在1.4mm*1.8mm内铜环6与外铜环8之间用外形刀模冲直径2.0mm的小孔7;得到柔性电路板4、废料区3及废料区3内的工艺环2中形成1.0mm圆冲头孔5和2.0mm小孔7;
三、目测检查废料区3中的圆冲头孔5与工艺环2内的内铜环6是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板4均不合格,反之,则合格;或目测直径2.0mm的小孔7与外铜环8是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板4均不合格,反之,则合格。
本实施例是以公差0.2mm的设计要求为例设计的内铜环6、外铜环8、圆冲头孔5和外形刀模冲的小孔7的参数:如果有不同需求,也可以设计不同参数以便满足不同需求。
由于上述技术方案的运用,本发明与现有技术相比具有下列优点:
本发明所述的快速生产合格柔性电路板的方法,通过目测废料区的圆冲头孔5与工艺环2内的内铜环6是否相切或直径2.0mm的小孔7与外铜环8是否相切即可判断此次冲裁的柔性电路板4是否合格,简单方便,提高了生产效率。
以上仅是本发明的具体应用范例,对本发明的保护范围不构成任何限制。凡采用等同变换或者等效替换而形成的技术方案,均落在本发明权利保护范围之内。

Claims (2)

1.一种快速生产合格柔性电路板的方法,其特征在于:包括步骤如下:
一、运用铜蚀方法,在原材板上铜蚀出多个规则排列的柔性电路板的电路及在原材板上成对角线分布的工艺环;所述工艺环包括内铜环;
二、在冲裁柔性电路板的同时,对内铜环的内环内进行冲圆冲头孔;得到柔性电路板、废料区及废料区内的工艺环中形成圆冲头孔;
三、目测检查废料区中的圆冲头孔与工艺环内的内铜环是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板均不合格,反之,则合格。
2.根据权利要求1所述的快速生产合格柔性电路板的方法,其特征于:所述工艺环还包括与内铜环同心设置的外铜环;
在冲裁柔性电路板的同时,在内铜环与外铜环之间用外形刀模的小孔;得到柔性电路板、废料区及废料区内的工艺环中形成圆冲头孔和小孔;
目测检查废料区中的圆冲头孔与工艺环内的内铜环是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板均不合格,反之,则合格;或目测小孔与外铜环是否相切,如果相切,则可以断定此次冲裁出来的柔性电路板均不合格,反之,则合格。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113927672A (zh) * 2021-10-12 2022-01-14 东莞市硅翔绝缘材料有限公司 一种刀模快速验收方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080244897A1 (en) * 2007-04-04 2008-10-09 Unimicron Technology Corp. Apparatus for transplanting multi-board
CN102032885A (zh) * 2010-08-31 2011-04-27 北大方正集团有限公司 印制线路板、其两面线路图形层间对准度检测方法及装置
CN102045946A (zh) * 2009-10-21 2011-05-04 富葵精密组件(深圳)有限公司 冲型方法
TWI381921B (zh) * 2009-12-08 2013-01-11 Zhen Ding Technology Co Ltd 衝型方法
CN103152989A (zh) * 2013-03-01 2013-06-12 杭州新三联电子有限公司 丝网印刷线路板生产工艺
CN204604459U (zh) * 2015-03-31 2015-09-02 无锡村田电子有限公司 金属冲切模具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080244897A1 (en) * 2007-04-04 2008-10-09 Unimicron Technology Corp. Apparatus for transplanting multi-board
CN102045946A (zh) * 2009-10-21 2011-05-04 富葵精密组件(深圳)有限公司 冲型方法
TWI381921B (zh) * 2009-12-08 2013-01-11 Zhen Ding Technology Co Ltd 衝型方法
CN102032885A (zh) * 2010-08-31 2011-04-27 北大方正集团有限公司 印制线路板、其两面线路图形层间对准度检测方法及装置
CN103152989A (zh) * 2013-03-01 2013-06-12 杭州新三联电子有限公司 丝网印刷线路板生产工艺
CN204604459U (zh) * 2015-03-31 2015-09-02 无锡村田电子有限公司 金属冲切模具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113927672A (zh) * 2021-10-12 2022-01-14 东莞市硅翔绝缘材料有限公司 一种刀模快速验收方法

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