CN107217295A - A kind of method for studying phosphorus-copper anode film forming situation - Google Patents
A kind of method for studying phosphorus-copper anode film forming situation Download PDFInfo
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- CN107217295A CN107217295A CN201710390003.4A CN201710390003A CN107217295A CN 107217295 A CN107217295 A CN 107217295A CN 201710390003 A CN201710390003 A CN 201710390003A CN 107217295 A CN107217295 A CN 107217295A
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- Prior art keywords
- phosphorus
- copper anode
- copper
- film forming
- detecting device
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of method for studying phosphorus-copper anode film forming situation, methods described is to be observed and recorded phosphorus-copper anode surface filming situation using endoscopic system, the endoscopic system includes endoscope detecting device, computer, travel mechanism, wherein, the computer is connected with endoscope detecting device, travel mechanism, computer is provided with control terminal, and control terminal controls endoscope detecting device to carry out vertical and horizontal motion by travel mechanism.The method of the invention can realize the real-time monitoring to phosphorus-copper anode surface filming situation, have directive significance for electrolytic copper plating technique, it may also be used for assess phosphorus-copper anode quality.
Description
Technical field
The present invention relates to PCB field of electroplating, in particular it relates to a kind of side for studying phosphorus-copper anode film forming situation
Method.
Background technology
At present, when carrying out PCB electrolytic copper platings in commercial Application, phosphor-copper is used as anode, because using fine copper
When, copper lost electronics and is changed into monovalence copper before this in course of dissolution, then lost electronics and be changed into cupric, and monovalence copper can be sent out
Raw disproportionated reaction, easily causes the oxide of metallic copper or copper and produces, plated object, i.e., PCB to be electroplated are polluted therefrom
Substrate.During using phosphorus-copper anode, due to electrolysis, the black film being made up of the phosphide of phosphor-copper or copper is formed in anode surface, thus
The generation that cupprous disproportionated reaction avoids the oxide of metallic copper or copper can be suppressed, and control the generation of particulate.So
And, during actual electrolytic copper plating, the formation of phosphor-copper surface black film is unstable, can even be come off after some black film shapings,
The oxide of metallic copper or copper can be produced to come off or black film very thin place in black film, so as to pollute plated object, causes negative electrode
Substrate plating copper mass is not good.Whether technical staff is generally not known the black film on phosphor-copper surface and reaches during electrolytic copper plating
Enough thickness, in order to ensure the plating copper mass of negative electrode PCB substrate, often first carries out more than plating 4h, so that phosphorus with hollow plate
Copper surface forms enough black films, and the time that electrolytic copper plating technique expends is longer, and manpower and materials waste larger.At present, it there is no phase
The detection technique of pass can know phosphorus-copper anode film forming situation.
In addition, phosphorus-copper anode species now on the market is various, the formation speed and quality of phosphorus-copper anode surface black film are
One of index of phosphorus-copper anode quality is evaluated, but there is no method to assess for the superiority and inferiority of phosphorus-copper anode quality.
The content of the invention
It is contemplated that the defect of prior art is overcome there is provided a kind of method for studying phosphorus-copper anode film forming situation, it is described
Phosphorus-copper anode surface filming situation can be observed and recorded to method, realize the real-time monitoring to phosphorus-copper anode surface filming situation,
There is directive significance for electrolytic copper plating technique, be that the further chemical-copper-plating process for improving pcb board establishes theoretical research foundation,
The quality of phosphorus-copper anode can be also estimated.
Technical scheme is as follows：
A kind of method for studying phosphorus-copper anode film forming situation, observes and records phosphorus-copper anode surface filming feelings using endoscopic system
Condition.
Endoscope is a kind of multidisciplinary general instrument, and its function is that crooked pipeline depths can be detected, and can observe can not
The position looked at straight, moreover it is possible to interior spatial structure and state are observed in sealing cavity, can realize distant surveillance and operation.This
Endoscopic system is used to observing and recording phosphorus-copper anode surface filming situation by invention using the excellent specific property of endoscope, so that
Realize the real-time monitoring to phosphorus-copper anode surface filming situation.
In one of the embodiments, the endoscopic system includes endoscope detecting device, computer, travel mechanism,
Wherein described computer is connected with endoscope detecting device, travel mechanism, and computer is provided with control terminal, and control terminal is by moving
Dynamic mechanism controls endoscope detecting device carries out vertical and horizontal motion.
In one of the embodiments, the method for the research phosphorus-copper anode film forming situation comprises the following steps：
S1, endoscope detecting device collection phosphorus-copper anode film forming image information, computer is transferred to by the image information collected,
Computer carries out the picture that processing obtains phosphorus-copper anode surface filming to image, while signal is fed back into control terminal；
S2, control terminal receive signal after, indicate travel mechanism motion, endoscope detecting device in the presence of travel mechanism
Moved up and down near phosphorus-copper anode, gather phosphorus-copper anode film forming image information everywhere；
S3, repeat the above steps, realize the Real Time Observation and record to phosphorus-copper anode film forming situation.
In one of the embodiments, the color of the phosphorus-copper anode film forming image information including phosphorus-copper anode film forming, into
Film speed and thickness.
In one of the embodiments, the endoscope detecting device includes industrial endoscope, camera lens, digital camera, light
Source.
In one of the embodiments, the phosphorus content of the phosphorus-copper anode is 100~2000wtppm.
The invention discloses application of the methods described in PCB copper facing.During using phosphorus-copper anode, by the phosphatization of phosphor-copper or copper
The black film formation of thing composition can suppress the oxidation of metallic copper or copper as caused by cupprous disproportionated reaction in anode surface
The generation of thing, and the generation of particulate is controlled, plating copper mass is thereby may be ensured that, however, in electrolytic copper plating process, technical staff
When the black film for being generally not known phosphor-copper surface reaches that plating is required, phosphor-copper can be monitored in real time using the method for the invention
Anode film forming situation, when meeting the requirements, you can carry out electrolytic copper plating technique and carry out electro-coppering to pcb board, is shortening PCB productions
PCB copper-plated quality is ensure that while time.
The invention discloses application of the methods described in phosphorus-copper anode quality is assessed.The formation of phosphorus-copper anode surface black film
Speed and quality are to evaluate one of index of phosphorus-copper anode quality, can be monitored in real time with the method for the invention phosphorus-copper anode into
Film situation, knows the speed of phosphorus-copper anode surface filming and the stability of film, realizes the detection to phosphorus-copper anode quality.
Compared with prior art, the present invention has the advantages that：The invention discloses one kind research phosphorus-copper anode into
The method of film situation, observes and records phosphorus-copper anode surface filming situation by using endoscopic system, realizes to phosphor-copper sun
The real-time monitoring of pole surface filming situation, has directive significance for electrolytic copper plating technique, to further improving the copper facing of pcb board
Technique establishes theoretical research foundation, and also the quality of phosphorus-copper anode can be estimated.
Brief description of the drawings
Fig. 1 is that phosphorus-copper anode surface filming situation schematic diagram is observed and recorded to endoscopic system.
1st, endoscope detecting device；2nd, computer；3rd, travel mechanism, 4, phosphorus-copper anode.
Embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.Following examples only express the present invention's
Embodiment, it describes more specific and detailed, but therefore can not be interpreted as the limitation to the scope of the claims of the present invention, in every case
The technical scheme obtained using the form of equivalent substitution or equivalent transformation, all should fall within the scope and spirit of the invention.
Embodiment 1
As shown in figure 1, a kind of method for studying phosphorus-copper anode film forming situation, observes and records phosphorus-copper anode using endoscopic system
Surface filming situation, the endoscopic system includes endoscope detecting device, computer, travel mechanism, wherein the computer
It is connected with endoscope detecting device, travel mechanism, computer is provided with control terminal, and control terminal in travel mechanism's control by peeping
Mirror detection means carries out vertical and horizontal motion, and methods described specifically includes following steps：
S1, using endoscope detecting device gather phosphorus-copper anode film forming image information, the image information collected is transferred to meter
Calculation machine, computer carries out the picture that processing obtains phosphorus-copper anode surface filming to image, while signal is fed back into control terminal.
S2, control terminal are received after signal, indicate travel mechanism's motion, effect of the endoscope detecting device in travel mechanism
Under moved up and down near phosphorus-copper anode, collection phosphorus-copper anode film forming image information everywhere.
S3, repeat the above steps, realize the Real Time Observation and record to phosphorus-copper anode film forming situation.
The above method is used in PCB electro-copperings, when COMPUTER DETECTION to phosphorus-copper anode surface forms brownish black or black
Film after, PCB substrate to be electroplated is inserted as negative electrode, when COMPUTER DETECTION to phosphorus-copper anode surface is other color
（Other colors show phosphorus-copper anode film forming thickness not enough or film is fallen off）, stop plating, take out PCB substrate to be electroplated,
Hollow plate is inserted, continues to electroplate the film until COMPUTER DETECTION forms brownish black or black to phosphorus-copper anode surface, is inserted into and treats electricity
The PCB substrate of plating continues to electroplate as negative electrode, repeats the above steps until PCB substrate plates copper thickness and quality reaches requirement.
Embodiment 2
As shown in figure 1, a kind of method for studying phosphorus-copper anode film forming situation, observes and records phosphorus-copper anode using endoscopic system
Surface filming situation, the endoscopic system includes endoscope detecting device, computer, travel mechanism, wherein, the endoscope
Detection means includes industrial endoscope, camera lens, digital camera, light source, the computer and endoscope detecting device, travel mechanism
Connection, computer is provided with control terminal, and it is vertical and horizontal that control terminal controls endoscope detecting device to carry out by travel mechanism
Motion, methods described specifically includes following steps：
S1, phosphorus-copper anode is placed in the electrolyte of electro-coppering, electroplated, endoscope detecting device collection phosphorus-copper anode film forming
Image information, the film forming image information includes color, film forming speed and the thickness of phosphorus-copper anode film forming, by the image collected
Information transfer is to computer, and computer carries out the picture that processing obtains phosphorus-copper anode surface filming to image, while signal is anti-
Feed control terminal.In the present embodiment, endoscope detecting device includes industrial endoscope, camera lens, digital camera, light source, wherein
Industrial endoscope connects digital camera, the film forming image information collected is conducted into computer through camera lens, light source realizes illumination
It is easy to the film forming image information of collection apparent.
S2, control terminal are received after signal, indicate travel mechanism's motion, effect of the endoscope detecting device in travel mechanism
Under moved up and down near phosphorus-copper anode, collection phosphorus-copper anode film forming image information everywhere；
S3, repeat the above steps, realize the Real Time Observation and record to phosphorus-copper anode film forming situation.
By the above method be used for assess phosphorus-copper anode quality, by the above method obtain phosphorus-copper anode film forming color, into
Film speed and thickness, whether have film come off, film forming speed is faster, and film color is got over if also can detect in phosphorus-copper anode film forming procedure
Deep, thickness is bigger, and the film of deposition is more stable, then shows that phosphorus-copper anode quality is better.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic in example is applied all to be described, for the person of ordinary skill of the art,
On the premise of not departing from present inventive concept, various modifications and improvements can be made, these belong to protection scope of the present invention,
All it is considered to be the scope of this specification record.
Claims (8)
1. a kind of method for studying phosphorus-copper anode film forming situation, it is characterised in that phosphor-copper is observed and recorded using endoscopic system
Anode surface film forming situation.
2. method according to claim 1, it is characterised in that the endoscopic system includes endoscope detecting device, calculated
Machine, travel mechanism, wherein the computer is connected with endoscope detecting device, travel mechanism, computer is provided with control terminal, control
Terminal processed controls endoscope detecting device to carry out vertical and horizontal motion by travel mechanism.
3. method according to claim 2, it is characterised in that comprise the following steps：
S1, endoscope detecting device collection phosphorus-copper anode film forming image information, computer is transferred to by the image information collected,
Computer carries out the picture that processing obtains phosphorus-copper anode surface filming to image, while signal is fed back into control terminal；
S2, control terminal receive signal after, indicate travel mechanism motion, endoscope detecting device in the presence of travel mechanism
Moved up and down near phosphorus-copper anode, gather phosphorus-copper anode film forming image information everywhere；
S3, repeat the above steps, realize the Real Time Observation and record to phosphorus-copper anode film forming situation.
4. method according to claim 3, it is characterised in that the phosphorus-copper anode film forming image information include phosphorus-copper anode into
Color, film forming speed and the thickness of film.
5. method according to claim 1, it is characterised in that the endoscope detecting device include industrial endoscope, camera lens,
Digital camera, light source.
6. method according to claim 1, it is characterised in that the phosphorus content of the phosphorus-copper anode is 100~2000wtppm.
7. application of the claim 1-6 any claims methods described in PCB electroless coppers.
8. application of the claim 1-6 any claims methods described in phosphorus-copper anode quality is assessed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710390003.4A CN107217295A (en) | 2017-05-27 | 2017-05-27 | A kind of method for studying phosphorus-copper anode film forming situation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710390003.4A CN107217295A (en) | 2017-05-27 | 2017-05-27 | A kind of method for studying phosphorus-copper anode film forming situation |
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| CN107217295A true CN107217295A (en) | 2017-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710390003.4A Pending CN107217295A (en) | 2017-05-27 | 2017-05-27 | A kind of method for studying phosphorus-copper anode film forming situation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023447A (en) * | 2018-08-27 | 2018-12-18 | 江苏澳光电子有限公司 | A kind of preparation method of high-intensity and high-tenacity layered nano-structure copper |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159067A (en) * | 1983-03-02 | 1984-09-08 | Mitsubishi Electric Corp | Quality inspection of phosphor bronze |
| CN1421905A (en) * | 2001-11-28 | 2003-06-04 | 株式会社日立制作所 | Method of and apparatus for producing semiconductor device |
| CN1529774A (en) * | 2001-10-22 | 2004-09-15 | ��ʽ�������տ� | Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
| CN103741197A (en) * | 2013-12-14 | 2014-04-23 | 金川集团股份有限公司 | Production method of phosphor copper ball for electroplating |
-
2017
- 2017-05-27 CN CN201710390003.4A patent/CN107217295A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59159067A (en) * | 1983-03-02 | 1984-09-08 | Mitsubishi Electric Corp | Quality inspection of phosphor bronze |
| CN1529774A (en) * | 2001-10-22 | 2004-09-15 | ��ʽ�������տ� | Electrolytic copper plating method phosphorous cooper anode for electrolytic copper plating method said semiconductor wafer having low particle adhension plated with said method and anode |
| CN1421905A (en) * | 2001-11-28 | 2003-06-04 | 株式会社日立制作所 | Method of and apparatus for producing semiconductor device |
| CN103741197A (en) * | 2013-12-14 | 2014-04-23 | 金川集团股份有限公司 | Production method of phosphor copper ball for electroplating |
Non-Patent Citations (5)
| Title |
|---|
| 冯升平: "阳极磷铜的检验与判定", 《印制电路信息》 * |
| 张立伦: "酸性电镀铜用磷铜阳极探讨", 《印制电路信息》 * |
| 杨智勤 等: "PCB电镀阳极发展演变概述", 《印制电路信息》 * |
| 蒋金鸿: "根据磷铜阳极维护酸性光亮镀铜液中的氯离子", 《电镀与涂饰》 * |
| 陈世荣 等: "微晶磷铜阳极在高端PCB制造中的应用", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023447A (en) * | 2018-08-27 | 2018-12-18 | 江苏澳光电子有限公司 | A kind of preparation method of high-intensity and high-tenacity layered nano-structure copper |
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Application publication date: 20170929 |
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