CN107210247A - Processing method including stripping - Google Patents
Processing method including stripping Download PDFInfo
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- CN107210247A CN107210247A CN201580073210.6A CN201580073210A CN107210247A CN 107210247 A CN107210247 A CN 107210247A CN 201580073210 A CN201580073210 A CN 201580073210A CN 107210247 A CN107210247 A CN 107210247A
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- substrate
- flexible membrane
- surrounding edge
- main surface
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
Method includes processing first substrate, and the wherein main surface of the first of first substrate is removably coupled on the first main surface of second substrate.The method comprising the steps of (I)：Flexible membrane is attached on the second main surface of first substrate, wherein flexible membrane includes tongue piece, tongue piece stretches out from the preceding surrounding edge of first substrate.This method also includes step (II)：By the preceding surrounding edge for applying force to peel off first substrate from second substrate to tongue piece.
Description
The cross reference of related application
The application requires the U.S.Provisional Serial 62/ submitted on November 19th, 2014 under 35U.S.C. § 119
The rights and interests of 081,892 priority, disclosure of which is as foundation and is incorporated herein in entirety by reference.
Technical field
The disclosure relates generally to include the processing method peeled off, and more particularly, is related to including from the second base
The processing method for the step of plate peels off the preceding surrounding edge of first substrate, wherein at least one in substrate can include glass substrate
And/or silicon wafer.
Background technology
Attracted attention in the manufacture of flexible electronic or other devices using relatively thin flexible glass.Flexible glass can have
Manufacture or performance-relevant some beneficial characteristics with electronic installation, for example, liquid crystal display (LCD), electrophoretic display device (EPD)
(EPD), organic light emitting diode display (OLED), plasm display panel (PDP), touch sensing, photovoltaic device
Etc..Being using a kind of ability of flexible glass can be with sheet form rather than roll form operation glass.
In order to which flexible glass can be manipulated during processing flexibility glass, usually using polymeric binder by flexible glass
It is attached to rigid carrier substrate.Once being attached to carrier substrate, then the relative stiffness feature of carrier substrate and size allow in life
Combined structure is manipulated in production, without undeservedly bending flexible glass or flexible glass being caused damage.For example, film
Transistor (TFT) part can be attached in flexible glass in LCD production.
After the process, flexible glass is removed from carrier substrate.However, the slim and frahile property having by flexible glass
Matter, the power for being applied to flexible glass so that flexible glass to be separated from carrier substrate may damage flexible glass.Moreover, generally including
The separation process that utensil is inserted in into flexible glass-bearer interface may also often damage carrier substrate, so that carrier substrate
It is not used to the use in future.Thus, it there is the practical solution for needing to be used to separate relatively thin flexible glass from carrier substrate
Certainly scheme, the solution reduces infringement flexible glass or the possibility of carrier substrate.
The disclosure of invention
In order to provide the basic comprehension to some exemplary aspects described in embodiment, set forth below is this public affairs
The brief description opened.
The disclosure one side there is provided a kind of method for processing first substrate, wherein the first master of first substrate
Surface is removably coupled on the first main surface of second substrate.The method comprising the steps of (I)：Flexible membrane is attached to first
On second main surface of substrate, wherein flexible membrane includes tongue piece, and tongue piece stretches out from the preceding surrounding edge of first substrate.This method is also
Including step (II)：By the preceding surrounding edge for applying force to peel off first substrate from second substrate to tongue piece.
In an example of this aspect, first substrate includes being selected from following substrate：Glass substrate and silicon wafer.
In another example of this aspect, first substrate includes about 100 microns to about 300 microns of thickness.
In the another example of this aspect, second substrate includes carrier substrate, and carrier substrate includes about 300 microns to about
700 microns of thickness.
In another example of this aspect, second substrate includes carrier substrate, and carrier substrate is included more than first substrate
The footprint area of footprint area.
In another example of this aspect, before step (II), this method is additionally included in first substrate and is attached to second
The step of first substrate being processed when on substrate.In a particular example, the step of processing first substrate is sent out before step (I)
It is raw.
In the another example of this aspect, preceding surrounding edge includes being defined in the first side edge of first substrate and the second side
Length between edge, and step (I) causes flexible membrane including being attached to flexible membrane on the second main surface of first substrate
Substantially along the whole length extension of preceding surrounding edge.In a particular example, length of the step (II) along preceding surrounding edge
Spend to the uniformly applied power of tongue piece.In another particular example, whole length of the step (II) along preceding surrounding edge is substantially
The preceding surrounding edge of first substrate is peeled off from second substrate simultaneously.
In another example of this aspect, first substrate is removed completely after step (II), in addition to from second substrate
The step of.In a particular example, the step of removing first substrate completely from second substrate includes being completely exfoliated from second substrate
First substrate.
In another example of this aspect, this method also alternatively comprises the following steps：Preselect the minimum of first substrate
Bending radius and select flexible membrane come increase the effective rigidity of first substrate with from second substrate peel off first substrate when tie up
The bending radius for holding first substrate is higher than minimum bending radius.
In the another example of this aspect, this method is further comprising the steps of：When peeling off first substrate from second substrate
Control the bending radius of first substrate.
In another example of this aspect, step (I) combines flexible membrane to cover substantially whole the second of first substrate
Main surface.
In another example of this aspect, flexible membrane is attached to the second main surface of first substrate so that tongue by step (I)
Piece extends about 5cm to about 20cm distance from the preceding surrounding edge of first substrate.
In another example of this aspect, after step (II), this method also includes removing flexible membrane from first substrate
The step of.In a particular example, from first substrate remove flexible membrane the step of include make flexible membrane to ultraviolet light exposure with from
Second main surface release flexible membrane of first substrate.
In the another example of this aspect, step (II) includes tongue piece vacuum being attached in vacuum attachment member and right
Vacuum attachment member is utilized afterwards to tongue piece applying power.
In another example of this aspect, this method is further comprising the steps of：Based on the letter obtained during step (II)
Cease to determine the bond strength between the preceding surrounding edge and second substrate of first substrate.
These aspect can be executed separately or together with one in the example of aspect disclosed above or with
Any combinations are performed.
Brief description of the drawings
When refer to the attached drawing reads embodiment, these and other aspects will be better understood when, wherein:
Fig. 1 is the diagrammatic side view of exemplary stripping off device；
Fig. 2 is the front view of the peel-off device along the line 2-2 in Fig. 1；
Fig. 3 is the top view of the evacuated panel of the peel-off device along the line 3-3 in Fig. 2；
Fig. 4 is the vacuum attachment member and the bottom view of arm of the peel-off device along the line 4-4 in Fig. 2；
Fig. 5 is the diagrammatic side view of the peel-off device in the Fig. 1 for opening orientation；
Fig. 6 is the diagrammatic side view of the peel-off device in the Fig. 1 for opening orientation, is attached to vacuum on evacuated panel
Carrier substrate；
Fig. 7 is the diagrammatic side view of the peel-off device of Fig. 1 in closed orientation, and wherein carrier substrate vacuum is attached to very
On hollow plate and attachment member vacuum is attached to from the tongue piece of the preceding surrounding edge of first substrate stretching；
Fig. 8 schematically shows length of the power along preceding surrounding edge and is evenly applied on tongue piece；
Fig. 9 is the amplification partial section of the peel-off device along Fig. 8 line 9-9；
Figure 10 is Fig. 9 partial view, is shown by peeling off first substrate to tongue piece applying power from carrier substrate
The step of preceding surrounding edge；
The step of Figure 11 shows the bending radius of control first substrate when peeling off first substrate from carrier substrate；
Figure 12, which is shown from carrier substrate, is completely exfoliated first substrate；
Figure 13 is the diagrammatic side view of the peel-off device in the Fig. 1 for opening orientation, and wherein first substrate vacuum is attached to
On evacuated panel；
Figure 14 is the diagrammatic side view of the peel-off device of Fig. 1 in closed orientation, and wherein first substrate vacuum is attached to
On evacuated panel and attachment member vacuum is attached to from the tongue piece of the preceding surrounding edge of carrier substrate stretching；
The step of Figure 15 shows the bending radius of control carrier substrate when peeling off carrier substrate from first substrate；
Figure 16 is the diagrammatic side view of the peel-off device in the Fig. 1 for opening orientation, and wherein Second support substrate vacuum is attached
It is connected on evacuated panel；
Figure 17 is the diagrammatic side view of the peel-off device of Fig. 1 in closed orientation, and wherein Second support substrate vacuum is attached
On evacuated panel and attachment member vacuum is connected to be attached to from the tongue piece of the preceding surrounding edge stretching of first vector substrate；
Figure 18 shows control first vector base when from Intermediate substrate and Second support strippable substrate first vector substrate
The step of bending radius of plate；And
Figure 19 show for process first substrate method in exemplary step, the wherein main surface of the first of first substrate
It is removably coupled on the first main surface of second substrate.
Embodiment
Example now is described more fully with following by with reference to the accompanying drawing for showing exemplary embodiment.In any possibility
In the case of, same reference numerals are in whole accompanying drawings to indicate same or like part.However, aspect can be with many not
Embodied with form, and these aspects will not be seen as limited by the embodiment that describes herein.
The peel-off device of the disclosure can be for being easy to remove the first substrate having been incorporated on second substrate.In an example
In, peel-off device can be initial or be kept completely separate from carrier substrate in order to silicon wafer or glass substrate.For example, peel-off device can be fitted
For initially or glass substrate being completely exfoliated from carrier substrate, but in other example, carrier substrate can be initial or complete
It is complete to be peeled off from glass substrate and/or another carrier substrate.
Flexible glass piece be commonly used to manufacture liquid crystal display (LCD), electrophoretic display device (EPD) (EPD)), Organic Light Emitting Diode show
Show device (OLED), plasma display device (PDP), touch sensing, photovoltaic device, etc..It is soft in order to make during processing
Property glass can carry, flexible glass is attached to rigid carrier substrate usually using binding agent such as polymeric binder.Carry
Structure base board by glass, resin or can be resistant to process the substrate being removably coupled on carrier substrate (for example, glass base
Plate, silicon wafer etc.) during the other materials of condition be made.In some examples, carrier substrate and it is attached on carrier substrate
Substrate can respectively include being defined in thickness between the respective major surface of substrate.Carrier substrate is big alternately through thickness is provided
Desired degree of rigidity is introduced in the carrier substrate for the substrate thickness being removably coupled on carrier substrate.Moreover,
In some examples, the carrier substrate may be selected to be with certain thickness so that wherein carrier substrate and being attached to the base of carrier substrate
The gross thickness of plate with existing processing machine in the range of it can be used together, and existing processing machine is configured to process relative thick
Glass substrate, these glass substrates have in carrier substrate and the thickness being attached in the total thickness of the substrate of carrier substrate
Degree.
In some instances, first substrate may include glass substrate with about 100 microns to about 300 microns of thickness or
Silicon wafer.In other examples, carrier substrate may include about 300 microns to about 700 microns of thickness.In these examples, should
Carrier substrate may include certain thickness, and the thickness is more than the substrate for being attached to the carrier substrate (for example, glass substrate or silicon wafer
Piece) thickness.
The rigidity characteristics and size of the carrier substrate allow to manipulate bound sheet glass in production and without bending substantially,
The damage to flexible glass piece and/or the part for being attached to flexible glass piece may be caused originally by bending substantially.In processing (example
Such as, manipulate, increase component, disposal etc.) after, the peel-off device of present disclosure can be used for initially or fully by carrier
Substrate is peeled off from reference to substrate (for example, glass substrate or silicon wafer), or initially or fully will combine substrate from load
Structure base board is peeled off.
Fig. 1 and Fig. 2 is turned to, exemplary peel-off device 101 is shown, it is configured to shell first substrate from second substrate
From.Through present disclosure, first substrate may include silicon wafer, glass substrate (for example, thin, flexible glass substrate), or can
It is attached to other substrates of second substrate (such as carrier substrate) with removing.In other examples, second substrate may include silicon wafer
Piece, glass substrate, or it is removably coupled to include other substrates of the first substrate of carrier substrate.
Peel-off device 101 also includes evacuated panel 103, and it is configured to releasedly fasten one of substrate in place.For example,
Evacuated panel can vacuum be attached to the main surface of second substrate, second substrate is fastened with releasedly in place.Evacuated panel 103 includes
Length " L1 " (referring to Fig. 1) and width " W1 " (referring to Fig. 2).In illustrated example, length " L1 " is more than width " W1 ", although
Length and width can be substantially identical, or in other examples, width can be more than length.
As shown in figure 3, evacuated panel 103 may include one or more vacuum ports, such as on surface 303 (for example, substantially
Plane surface) the unlimited diagram in place multiple vacuum ports 301.Multiple vacuum ports 301 can be in fluid communication with vacuum source 104,
The vacuum source is such as vacuum tank, vavuum pump etc..As shown in Fig. 1 and Fig. 9, the vacuum pipe 901 of such as flexible hose can be carried
For the fluid communication between multiple vacuum ports 301 and vacuum source 104.In one example, as shown in figure 9, vacuum chamber
903 may be positioned such that and be in fluid communication with multiple vacuum ports 301 so that multiple vacuum ports 301 connect with the fluid of vacuum pipe 901
It is logical.
Although not shown, it is possible to provide one or more stand-ofves are to prevent the main surface of substrate and the surface of evacuated panel 103
Actual engagement between 303.These stand-ofves may include peripheral clearance device, the ring of such as external multiple vacuum ports 301.In addition
Or alternatively, stand-off may include to be distributed in the pillar for spreading all over the pattern of vacuum ports 301 between vacuum ports.Pillar may include respectively
Plant material, such as polymeric material.Stand-off may extend away about 1.6mm (for example, 1/16 inch) distance, although can show other
Other distances are used in example.
With reference to Fig. 1, evacuated panel 103 is optionally configured to along translated axis line 105 107a and second party in a first direction
Translated to one of 107b is upper, second direction 107b is opposite with first direction.For example, such as schematically illustrating, multiple bearings 109 can connect
The translation rail 111 received along the extension of translated axis line 105.In some instances, when bearing is slided along translation rail 111, evacuated panel
103 can freely translate in one of direction 107a, 107b.Alternatively, the locking component of all fixing screws as illustrated 113 can
Selectivity locks evacuated panel 103 relative to translation rail 111.In locking orientation, evacuated panel 103 can be prevented relative to translation rail
111 movements.Alternatively, in unblock orientation, evacuated panel 103 can be relative to translation rail 111 along one of direction 107a, 107b
Translation.Evacuated panel 103 optionally locks or unlocked to adapt to different stripping programs.Only cover answering for locking orientation wherein
In, translation mechanism can be abandoned completely.In these examples, evacuated panel 103 can relative at the top of such as floor, table, support
Support surface 115 or other support surfaces are fixedly mounted.
Peel-off device 101 also includes vacuum attachment member 117, and vacuum attachment member 117 is configured to relative to the first base
Releasedly vacuum is attached the preceding surrounding edge of plate.To promote vacuum to attach, vacuum attachment member may include one or more true
Dead end mouthful.For example, as shown in figure 4, one or more vacuum ports may include the (example of surface 403 in vacuum attachment member 117
Such as, substantially planar surface) the unlimited multiple vacuum ports 401 in place.In one example, multiple vacuum ports 401 can be with
Pattern is arranged so that width " W2 " distribution of the power along vacuum attachment member 117.
Multiple vacuum ports 401 can be in fluid communication with vacuum source 118, vacuum source position such as vacuum tank, vavuum pump etc..
As shown in Fig. 1 and Fig. 9, the vacuum pipe 905 of such as flexible hose can be provided between multiple vacuum ports 401 and vacuum source 118
Fluid communication.In one example, as shown in figure 9, vacuum chamber 907 may be positioned such that and multiple fluids of vacuum ports 401 company
It is logical, it is in fluid communication so as to obtain multiple vacuum ports 401 with vacuum pipe 905.
Vacuum attachment member 117 may also include stand-off, in some instances, and the stand-off can prevent vacuum attachment member
Actual engagement between 117 and substrate surface.If for example, the direct vacuum of vacuum attachment member 117 is attached to first substrate (example
Such as, glass substrate, silicon wafer, carrier substrate), then stand-off may act as buffer with protective glass surface from because vacuum is attached
Even damaged caused by the direct contact between component and first substrate.As Fig. 4 is schematically illustrated, an example stand-off is (if carry
For) it may include peripheral circular stand-off 405, its external multiple vacuum ports 401.Stand-off 405 may include such as polymeric material
The various materials of material, and in some instances, about 1.6mm can be extended (for example, 1/ from the surface 403 of vacuum attachment member 117
16 inches) distance.
With reference to Fig. 1 and Fig. 4, peel-off device 101 also includes arm 119, and it supports vacuum attachment member 117.As illustrated, arm
119 may include plate, although arm may include framework, beam or be configured to support the other structures of vacuum attachment member 117.At some
In example, arm 119 may also include length " L2 ", and it is more than the length " L1 " of evacuated panel 103.There is provided has relatively long length
The arm 119 of " L2 " can allow surface 303 of the vacuum attachment member 117 away from evacuated panel 103 in lateral spacing, and beyond vacuum
The leading edge 121 of plate.Vacuum can be allowed to attach in lateral spacing on surface 303 of the vacuum attachment member 117 away from evacuated panel 103
The vacuum of component 117 is attached to tongue piece, and tongue piece is attached to the surface 303 of evacuated panel 103 without vacuum.
Although not shown, in alternative exemplary, arm 119 can have length " L2 ", and it is equal to or less than evacuated panel 103
Length " L1 ".This configuration can allow the direct vacuum of vacuum attachment member 117 to be attached to the main surface of first substrate, and the second base
Plate vacuum is attached to evacuated panel 103.
Arm 119 is pivotally attached also relative to evacuated panel 103.For example, as shown in figure 1, the tail end 123 of evacuated panel 103 can
Tail end 125 relative to arm 119 is pivotally attached using hinge.In some instances, hinge may include floating hinge 127, but
Fixed hinge configuration can also be used for alternative exemplary.Floating hinge 127 may include joint pin 129, and joint pin 129 is configured to narrow
Translation and rotation in groove 131.Therefore, floating hinge 127 can allow the substrate stack that different-thickness is processed using peel-off device 101
It is folded.
As shown in figure 1, peel-off device 101 may also comprise actuator 133, actuator 133 is configured to attach structure to vacuum
The applying power of part 117 " F ", vacuum attachment member 117 is lifted and therefore causes arm 119 on direction 135 around floating hinge
127 pivot.Only in one example, power " F " can be applied by connecting rod 137, and connecting rod connection using hook 138 (for example, connected
Connect) arrive flexible filament 139 (for example, wire rod, cable etc.).For example, as shown in Fig. 2 one end 139a of filament 139 is attachable to
The the first pin 201a extended from the first side of vacuum attachment member 117, and the other end 139b of filament 139 is attachable to from vacuum
Second pin 201b of the second side extension of attachment member 117.By the applying power of connecting rod 137 " F " can cause to first pin 201a and
Second pin 201b applies pulling force " F1 ", " F2 ".In addition, as shown in figure 1, maximized around the moment arm of floating hinge 127, because
It is positioned at for pin 201a, 201b at the outermost front end of vacuum attachment member 117.As such, leverage can be able to maximize with more
Effectively applying power " F " carrys out the stripping of starting substrate.
Such as Fig. 1 and Fig. 2 further shows that peel-off device 101 may also include load cell 141, and it is configured to sensing
By crossing the power " F " that actuator 133 applies.Information from load cell 141 can send control back to via communication line 141a
Device 143 (for example, programmable logic controller).Control device 143 can be configured to for example, " being programmed for ", " being encoded to ",
" being designed as " and/or " being made as ") actuator 133 is controlled via communication line 133a, and via respective communication circuit
104a, 118a control vacuum source 104,118.
Now it will tentatively be described with reference to Figure 19 processing method.This method can be started using first substrate with step 1901, should
Step includes being removably coupled to the first of first substrate the main surface into the first main surface of second substrate.Through the application,
First substrate can be removably coupled to second substrate by polymeric binder or other materials, the polymeric binder or
Other materials can tolerate processing conditions allows substrate then to cut separation at least in part simultaneously.
In an example of step 1901, as shown in Fig. 6-Figure 12, this method can utilize the base of first substrate 601 and second
Plate 603 starts, and the first substrate includes glass substrate (for example, thin, flexible glass substrate) or silicon wafer, and the second substrate
Including carrier substrate (for example, glass carrier substrate).As shown in figure 9, in some instances, first substrate 601 may include
About 100 microns to about 300 microns of thickness T1 between the first main main surface 601b of surface 601a and second of one substrate 601.
As shown in Fig. 9 Jin mono- Walk, in some instances, second substrate 603 may include the first main surface 603a in second substrate 603 with
About 300 microns to about 700 microns of thickness T2 between second main surface 603b.As Fig. 9 further illustrated in, in some examples
In, the thickness T2 of second substrate 603 (for example, carrier substrate) can be more than the thickness T1 of first substrate 601.There is provided relatively thick
Carrier substrate can help to increase the effective rigidity of first substrate (for example, glass substrate or silicon wafer) to promote first substrate
Processing.Relatively thick carrier substrate can also contribute to significantly increase the effective firm of the first substrate for being attached to second substrate
Degree.
As illustrated in fig. 9, the first of first substrate 601 the main surface 601a can be removably coupled to second substrate 603
The first main surface 603a.In addition, as further illustrated in figure 9, second substrate 603 may include occupying more than first substrate 601
The footprint area of area.In fact, the preceding surrounding edge 909 of second substrate 603 extends beyond the preceding surrounding side of first substrate 601
Edge 911.In addition, the extensible tail surrounding edge 915 beyond first substrate 601 of the tail surrounding edge 913 of second substrate 603.It is real
On border, in some instances, all surrounding edges of second substrate 603 alternatively extend beyond the corresponding week of first substrate 601
The various distances of peripheral edge, such as beyond about 0.5mm to about 3mm.Have bigger footprint area than first substrate 601 second is provided
Substrate 603 can help to protect the relatively brittle surrounding edge of first substrate during processing from damaging.In fact, to institute
It would tend to occur at the surrounding edge that stretches out of second substrate 603 with reference to any impact at the edge of substrate, this is outside
Extension surrounding edge protects the relatively brittle periphery peripheral edge of first substrate 601 by working.
Although Fig. 6 into Figure 12 it is not shown, in other example, first substrate 601 and second substrate 603 are occupied
Area can be substantially identical.Manufacture can be simplified by providing the footprint area being substantially identical.For example, first substrate and the second base
Plate can be combined together first, and then they can be separated along common disjoint paths, and wherein substrate is therefore with base
This identical footprint area.
In another example, although Fig. 6 into Figure 12 it is not shown, first substrate can have to be accounted for more than second substrate
According to area so that one of periphery peripheral edge of first substrate or whole extend beyond second substrate.Alternatively, no matter occupy relatively
Size is how, although not shown, and the preceding surrounding edge 911 of first substrate alternatively includes the part (for example, tongue piece) that overhangs,
It extends beyond e.g., from about 50 microns to about 150 microns such as about 100 microns of the preceding surrounding edge 909 of second substrate.It is this kind of to show
Example can be beneficial to the preceding surrounding edge for helping to peel off first substrate from second substrate.
As Figure 19 is further illustrated, any method of the disclosure alternatively proceeds to following steps 1905 along arrow 1903：
When first substrate 601 is attached to second substrate 603, first substrate 601 is processed.First substrate 601 can be processed into for example including
Other electronic equipments in electronic equipment, colour filter, touch sensing, liquid crystal trap and display application.In another example, plus
Work may include etching glass or otherwise dispose glass substrate.When using silicon wafer, processing may include to cut silicon wafer
Smaller piece part is cut into, or is otherwise processed to silicon wafer to manufacture electronic unit.
As shown in by the arrow 1907 in Figure 19, after procedure of processing 1905, this method alternatively carries out following step
Rapid 1909：Flexible membrane is attached to the second main surface of first substrate, wherein flexible membrane includes being extended before first substrate
The tongue piece of surrounding edge.For example, as shown in Figure 9 and Figure 10, flexible membrane 917 is attached to the second main surface of first substrate 601
601b.Flexible membrane 917 can be with broad range of thickness, e.g., from about 75 microns to about 150 microns, although can be in other examples
Other thickness are provided.Flexible membrane can be manufactured by resin (for example, transparent resin), such as be manufactured by polymeric material.Show at one
In example, flexible membrane can be manufactured by polyimide material, and the polyimide material is configured to resistance high temperature and is configured to transformation
In the relatively high power of tension form.In particular example, flexible membrane can be by PVC, polyolefin, polyethylene or other materials system
Make.
Flexible membrane may also comprise contact adhesive, and it can provide notable intensity to promote stripping of the first substrate from second substrate
From process, while also allowing subsequently to remove without leaving residual materials on the first substrate.In one example, adhesive material
It can be decomposed by being exposed to ultraviolet light.The particular example of flexible material with UV sensitive adhesive materials may include to cut glue
Band, it is commonly used for the backing adhesive tape during silicon wafer is cut.
As shown in figure 8, the preceding surrounding edge 911 of first substrate 601 may include the first side for being defined in first substrate 601
Length " L3 " between edge 801a and second side edge 801b.As shown in FIG., length " L3 " is in the width with evacuated panel 103
" W1 " identical side is upwardly extended.Alternatively, it may include flexible membrane being attached to first substrate with reference to the step of flexible membrane 917
601 the second main surface 601b, to cause flexible membrane 917 along the substantially whole of the preceding surrounding edge 911 of first substrate 601
Length " L3 " extends.In other examples, flexible membrane 917 may extend away about the 70% to about 100% of length " L3 ", such as length
About 85% to about 100%, such as about 90% to about 100%, such as about the 95% to about 100% of " L3 ".Increase the edge of flexible membrane 917
The degree for length " L3 " extension can help to be evenly distributed power to reduce stress collection across the length " L3 " of preceding surrounding edge 911
In, and allow to peel off simultaneously along the whole length " L3 " of flexible membrane 917.
With reference to the step 1909 of flexible membrane 917 optionally in combination with flexible membrane 917 to cover the substantially whole of first substrate 601
Individual second main surface 601b.In fact, as shown in figure 9, flexible membrane 917 is all from the preceding surrounding edge 911 of first substrate 601 to tail
Peripheral edge 915 extends the whole length of first substrate 601.With reference to flexible membrane 917 to cover the substantially whole of first substrate 601
Second main surface 601b can help to the second main surface 601b of protection from damaging, and can also contribute to adjust first substrate 601
Overall effective rigidity.Although not showing, in other examples, flexible membrane 917 can be only across a second main surface 601b part
With reference to.For example, flexible membrane 917 can be from preceding surrounding edge 911 from the preceding surrounding edge 911 of first substrate 601 to side around tail
The side of edge 915 extends upwardly to few about 8cm (for example, about 3 inches) distance.Flexible membrane 917 is extended into the only second main surface
The second main surface 601b part can be exposed on 601b part to the open air and be attached to first substrate for processing, or even in flexible membrane 917
It is also such during 601 a second main surface 601b part.On the part that flexible membrane 917 is extended to the only second main surface 601b
Also material cost can be reduced, and the time that flexible membrane 917 is then removed from first substrate 601 can be reduced.When need not be reinforced
Flexible membrane 917 is extended only the when the possibility of one substrate 601 has the part for being used for the enough rigidity that particular procedure is applied
It is probably useful on two main surface 601b part.
As shown in Figure 10, flexible membrane 917 includes tongue piece 1001, and it is extended the preceding surrounding edge 911 of first substrate 601
Apart from D.Because the lower surface 1003 of tongue piece 1001 may include contact adhesive, thus the end of tongue piece can itself be folded down with
Contact adhesive is covered, and then prevents the unexpected adjacent part for being attached to second substrate 603 or peel-off device 101 of tongue piece 1001.
For example, in some instances, flexible membrane is extensible about apart from twice of D, and is then folded down and itself adhesion is to form
Folded flaps with coverage D.In some instances, tongue piece 1001 is extended the preceding surrounding edge of first substrate 601
911 can be in about 5cm (2 inches) to about 20 apart from D
In the range of cm (8 inches), although the tongue piece of other sizes can be provided in other examples.In addition, illustrated tongue piece can prolong
The whole length " L3 " of surrounding edge 911 before stretching.
As shown in by the arrow 1907 in Figure 19, it can be carried out with reference to step 1909 after the step 1905 of processing.
In other examples, as indicated by by arrow 1911, method can be directly to combination Walk rapid 1909.For example, this method can
Start at Walk rapid 1901, and procedure of processing has been carried out.For example, this method can be opened with the first substrate for being attached to second substrate
Begin, wherein first substrate has been worked upon, while first substrate is incorporated on second substrate.In these examples, this method can
Start at step 1901, and be directly to reference to step 1909.In another example, as previously mentioned, processing step
Rapid 1905 can be carried out after step 1909 is combined, as indicated by arrow 1913.The step order can be for example in flexible membrane
917 are carried out when not disturbing procedure of processing 1905.
As indicated by arrow 1915,1917, this method can finally proceed to following steps 1919：By being applied to tongue piece 1001
Reinforce " F ", the preceding surrounding edge 911 of first substrate 601 is peeled off from second substrate 603.As shown in figure 5, to prepare to peel off step
Rapid 119, arm 119 can be on direction 501 around the pivot of floating hinge 127 together with the vacuum attachment member 117 for the distal end portion for being attached to arm
Go to opening orientation.
Then, as shown in fig. 6, second substrate 603 is positioned on evacuated panel 103.Vacuum source 104 can applying vacuum, and
And then aspirated via multiple vacuum ports 301.Vacuum is attached to evacuated panel after second main surface 603b of second substrate 603
103 surface 303.Once vacuum is attached, second substrate 603 has solid shape.In illustrated example, second substrate
603 can be fixed into substantially planar flat shape, although may need other shapes in other examples.Solid shape can be helped
In second substrate 603 is firmly fastened in place to promote stripping process.
Before, during or after the vacuum of second substrate 603 is attached into evacuated panel 103, arm 119 attaches structure together with vacuum
Part 117 can be pivoted to around floating hinge 127 closed orientation shown in Fig. 7 on direction 605.In the closed orientation shown in Fig. 7,
Arm 119 is from the tail surrounding edge 915 of first substrate 601 to extending across first substrate 601 on the direction of preceding surrounding edge 911.
As further shown in Figure 7, joint pin 129 may be in response to arm closed in the gross thickness of first substrate and second substrate and along floating
The slit 131 of dynamic hinge 127 is travelled upwardly.
As shown in fig. 7, strip step 1919 may include following steps：The vacuum of tongue piece 1001 is attached to vacuum attachment member
117.In fact, vacuum source 118 applying vacuum and can be aspirated then via multiple vacuum ports 401, to cause tongue piece 1001 true
Sky is attached to the surface 403 of vacuum attachment member 117.Bao Li Walk rapid 1919 can be followed by vacuum attachment member 117 to tongue piece
1001 applying powers " F ".In fact, with reference to the 2nd figure, actuator 133 can applying power " F " in an upward direction, so as to cause pulling force
" F1 " and " F2 " is put on pin 201a, 201b of vacuum attachment member 117.
As shown in the power distribution schematically illustrated as the row parallel rows in Fig. 8, this method can be along first substrate 601
The length " L3 " of preceding surrounding edge 911 is to the uniformly applied pressure " F " of tongue piece 1001.Thus, stress can be in preceding surrounding edge 911
On be evenly distributed, to avoid the unnecessary high stress concentrations along preceding surrounding edge.As shown in Figure 10, because power put on from
Distance " D " place of preceding surrounding edge 911, so power can concentrate on preceding interface between surrounding edge 911 and second substrate 603
Place.Finally, the initially-separate before the stress at preceding surrounding edge 911 is produced between surrounding edge 911 and second substrate 603
1005.Initially-separate can start in an end of preceding surrounding edge.Alternatively, in some instances, Bao Li Walk suddenly can base
In sheet simultaneously along the whole length " L3 " of preceding surrounding edge 911 by the preceding surrounding edge 911 of first substrate 601 from the second base
Plate 603 is peeled off.Along the whole length " L3 " of preceding surrounding edge 911 while the whole length along preceding surrounding edge can be passed through by peeling off
The uniform of degree applies force to realize, and can help to reduce the unnecessary stress spike along the length, and this is unnecessary
Stress spike may damage first substrate originally.
In some time after the step 1919 of preceding surrounding edge 911 of first substrate 601 is peeled off, this method alternatively includes
Following steps 1921：The information obtained during based on Bao Li Walk rapid 1919, determines the preceding surrounding edge 1919 of first substrate 601
With the bond strength between second substrate 603.For example, the information (for example, strength measured value) from load cell 141 can pass through
Communication line 141a is transferred to control device 143.Control device 143 can be configured to monitor the letter from load cell 141
Breath, and can be further configured to recognize initially-separate 1005 due to the spike in information (such as, strength measured value) and occur
Time, the spike occur when initially-separate 1005.The letter provided by load cell 141 when initially-separate 1005
Breath can be used for determining that the combination between the preceding surrounding edge 1919 and second substrate 603 of (for example, calculating) first substrate 601 is strong
Degree.Bond strength can be used in a number of ways.For example, determining that bond strength can be used for assisting in being attached to second substrate
First substrate specification.This information is provided to supplier, and these suppliers may wish to this information and come to the first base
Plate carries out appropriate be processed further.Bond strength can also be provided as feedback to control device 143, will below for modification
First substrate from below second substrate separation subsequent process.In fact, it is related to the substrate with similar bond strength, can
Take a series of separable programmings.Thus, the feedback of bond strength can be used for helping trim process to improve the efficiency and effect of separation
Really (for example, reduce the time of initially-separate of realizing, maintain minimum bending radius etc. in separation).
Before stripping after the step 1919 of surrounding edge 911, this method can further comprising the steps of 1923：By the first base
Plate 601 is fully removed from second substrate 603.In another example, as is illustrated by figs. 11 and 12, by first substrate 601 from
The step 1923 that two substrates 603 are fully removed includes from second substrate fully peeling off first substrate.In fact, vacuum is attached
Even component 117 can be elevated, and wherein arm 119 is pivoted on direction 135 around floating hinge 127, to cause peel-off device 101 to realize
Open orientation.In the opening orientation shown in Figure 12, first substrate 601 is fully peeled off from second substrate 603, even if accompanying drawing shows
The outer corner for going out first substrate 601 shelves (without adhering to) in also such on the exterior section of second substrate 603.
In some instances, by first substrate from second substrate peel off (for example, initially peel off, partly peel off, it is complete
Peel off entirely) the step of during, this method also may include Yi Xia Walk rapid 1925：Control the bending radius " R " of first substrate 601
(referring to Figure 11).For example, it may be desirable to ensure first substrate 601 not in the way of bending radius is less than predetermined minimum bending radius
Peel off.Predetermined minimum bending radius can be safely bent for first substrate 601 without rupturing or otherwise being damaged
The radius of bad notable probability.In one example, control device 143 can control actuator 133 with initially-separate 1005 it
Predetermined variation power " F " is provided over time afterwards.Change power " F " with controlled way over time to be designed to ensure
Bending radius " R " does not decrease below predetermined minimum bending radius.In other examples, although not showing, proximity can be provided
Sensor, it senses the actual flexion radius of first substrate, and wherein control device 143 can be based on the feedback from proximity sense
It is appropriately modified the power " F " applied by actuator.
In other examples, in addition to preselected minimum bending radius, the step 1925 of control bending radius " R " can also be wrapped
Selection flexible membrane 917 is included to increase the effective rigidity of first substrate 601, so as to which first substrate is being peeled off into (example from second substrate
Such as, initially peel off, partly peel off, fully peel off) the step of during maintain the bending radius " R " of first substrate 601 big
In minimum bending radius.For example, may be selected dicing tape be used for flexible membrane 917, the dicing tape have it is sufficiently rigid with across
When whole second main surface 601b of first substrate 601 applies, effective rigidity of first substrate 601 is adjusted.First substrate 601
Rigidity can be by selecting the material and/or thickness of such as dicing tape (including backing and/or adhesive) to adjust.Increase by first
The rigidity of substrate 601 can help to first substrate resistance bending, and therefore contribute to by first substrate 601 from second substrate
During 603 strippings (for example, initially peel off, partly peel off, fully peel off), bending radius " R " is maintained more than predetermined minimum
Bending radius.
Once the step 1923 that first substrate 601 is fully removed from second substrate 603 is completed, this method can be in mistake
Terminate at any of journey, as indicated by arrow 1927,1929,1931 and 1933.Before the method is completed, show at one
In example, this method can further process the optional step 1935 of first substrate 601 to continue, as indicated by arrow 1937.Thing
In reality, other procedure of processings can be carried out, wherein flexible membrane 917 can provide protection to the second main surface 601b of first substrate 601.
In other examples, tongue piece 1001 processes first substrate (for example, manipulating first substrate) without clamping first available for help
Substrate, the clamping is possible to damage first substrate originally.
Before end, this method may also comprise following steps 1939：Flexible membrane 917 is removed from first substrate 601.It is desirable
Various removal technologies are certainly used in the characteristic of the adhesive for flexible membrane 917 to be attached to first substrate 601.Show at one
In example, the step 1939 that flexible membrane 917 is removed from first substrate 601 may include flexible membrane being exposed to ultraviolet light, with from the
Second main surface 601b releases flexible membrane 917 of one substrate 601, such as situation when the adhesive of flexible membrane is UV sensitiveness.
It can be carried out on Figure 19 and Fig. 1-Figure 12 methods described using broad range of substrate.Figure 13-Figure 15 is shown
Another example, unless otherwise specified, otherwise the example may include on being synchronised that figure 19 above and Fig. 1-Figure 12 are discussed
Rapid and/or equivalent step.However, in the example shown by Figure 13-Figure 15, first substrate 1301 includes carrier substrate, and
Second substrate 1302 (for example, glass substrate or silicon wafer) can vacuum be attached to evacuated panel 103.Similarly, as discussed above,
First substrate 1301 can peel off (for example, fully peeling off) from second substrate 1302, as shown in Figure 13 and Figure 15.
Figure 16-Figure 18 shows another example, unless otherwise specified, otherwise the example may include on figure 19 above and Fig. 1-
Same steps and/or equivalent step that Figure 15 is discussed.However, in the example shown by Figure 16-Figure 18, first substrate
1601a includes first vector substrate, and second substrate 1601b include can vacuum be attached to the Second support substrate of evacuated panel 103.
Intermediate substrate 1603 could be sandwiched between first vector substrate 1601a and Second support substrate 1601b, and be removably coupled to
These carrier substrates.Similarly, as discussed above, first substrate 1601a can by being peeled off from Intermediate substrate 1603 (for example,
Fully peel off) and peeled off (for example, fully peeling off) from second substrate 1601b.Once being completely exfoliated, Intermediate substrate 1603 is
It can be peeled off by one of method shown in the 5th figure-Figure 12 or Figure 13-Figure 15 from Second support substrate 1601b.Intermediate substrate can be by
One or more layers are made.For example, Intermediate substrate can be display panel, it include back plane substrate, lid substrate and be placed in them it
Between display module.
These are the several examples for the modification that apparatus described above and method are made.Can be without departing from claim
Spirit and scope in the case of make other various modifications and variations.
Claims (20)
1. a kind of method for processing first substrate, wherein the first main surface of the first substrate is removably coupled to
On first main surface of two substrates, it the described method comprises the following steps：
(I) flexible membrane is attached on the second main surface of the first substrate, wherein the flexible membrane includes tongue piece, the tongue
Piece stretches out from the preceding surrounding edge of the first substrate；And
(II) by applying force to the preceding surrounding edge from the second substrate stripping first substrate to the tongue piece.
2. according to the method described in claim 1, wherein, the first substrate include be selected from following substrate：Glass substrate and
Silicon wafer.
3. according to the method described in claim 1, wherein, the first substrate includes about 100 microns to about 300 microns of thickness
Degree.
4. according to the method described in claim 1, wherein, the second substrate includes carrier substrate, and the carrier substrate includes
About 300 microns to about 700 microns of thickness.
5. according to the method described in claim 1, wherein, the second substrate includes carrier substrate, and the carrier substrate includes
More than the footprint area of the footprint area of the first substrate.
6. method according to any one of claim 1 to 5, wherein, before step (II), it is additionally included in described first
The step of substrate processes the first substrate when being attached on the second substrate.
7. method according to claim 6, wherein, the step for processing the first substrate is sent out before step (I)
It is raw.
8. method according to any one of claim 1 to 5, wherein, the preceding surrounding edge includes being defined in described the
Length between the first side edge and second side edge of one substrate, and step (I) by the flexible membrane including being attached to institute
State and cause the flexible membrane substantially along the whole length of the preceding surrounding edge on the described second main surface of first substrate
Extension.
9. method according to claim 8, wherein, length of the step (II) along the preceding surrounding edge is to the tongue piece
Uniformly applied power.
10. method according to claim 8, wherein, whole length of the step (II) along the preceding surrounding edge is basic
The upper preceding surrounding edge for peeling off the first substrate from the second substrate simultaneously.
11. method according to any one of claim 1 to 5, wherein, after step (I I), in addition to from described
The step of two substrates remove the first substrate completely.
12. method according to claim 11, wherein, the step of removing the first substrate completely from the second substrate
Including the first substrate is completely exfoliated from the second substrate.
13. method according to any one of claim 1 to 5, further comprising the steps of：Preselect the first substrate most
Small-bend radius and select flexible membrane come increase the effective rigidity of the first substrate with from the second substrate peel off institute
The bending radius of the first substrate is maintained to be higher than the minimum bending radius when stating first substrate.
14. method according to any one of claim 1 to 5, further comprising the steps of：Peeled off from the second substrate
The bending radius of the first substrate is controlled during the first substrate.
15. method according to any one of claim 1 to 5, wherein, step (I) is with reference to the flexible membrane to cover
State the substantially whole second main surface of first substrate.
16. method according to any one of claim 1 to 5, wherein, the flexible membrane is attached to described by step (I)
Second main surface of first substrate causes the tongue piece to extend about 5cm to about from the preceding surrounding edge of the first substrate
20cm distance.
17. method according to any one of claim 1 to 5, wherein, after step (I I), in addition to from described
The step of one substrate removes the flexible membrane.
18. method according to claim 17, wherein the step of removing the flexible membrane from the first substrate includes making
The flexible membrane is to ultraviolet light exposure to discharge the flexible membrane from described the second of the first substrate the main surface.
19. method according to any one of claim 1 to 5, wherein, step (II) includes attaching the tongue piece vacuum
The vacuum attachment member is utilized on to vacuum attachment member and then to the tongue piece applying power.
20. method according to any one of claim 1 to 5, further comprising the steps of：Based on obtaining during the step (II)
Information determine the bond strength between the preceding surrounding edge of the first substrate and the second substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462081892P | 2014-11-19 | 2014-11-19 | |
| US62/081,892 | 2014-11-19 | ||
| PCT/US2015/060799 WO2016081337A1 (en) | 2014-11-19 | 2015-11-16 | Methods of processing including peeling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107210247A true CN107210247A (en) | 2017-09-26 |
Family
ID=56014415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580073210.6A Pending CN107210247A (en) | 2014-11-19 | 2015-11-16 | Processing method including stripping |
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| Country | Link |
|---|---|
| JP (1) | JP2017537857A (en) |
| KR (1) | KR20170086593A (en) |
| CN (1) | CN107210247A (en) |
| SG (1) | SG11201704108YA (en) |
| TW (1) | TW201628958A (en) |
| WO (1) | WO2016081337A1 (en) |
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| DE102017122879A1 (en) * | 2017-10-02 | 2019-04-04 | Bayerisches Zentrum für Angewandte Energieforschung e.V. | Device for sensor-based data acquisition |
| CN108155270B (en) * | 2017-12-13 | 2019-09-20 | 北京创昱科技有限公司 | A kind of separator and separation method of film and chip |
| TW202211363A (en) * | 2020-09-01 | 2022-03-16 | 美商伊路米納有限公司 | Fixtures and related systems and methods |
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|---|---|---|---|---|
| US6431623B1 (en) * | 1999-06-11 | 2002-08-13 | Honeywell International Inc. | Vacuum device for peeling off thin sheets |
| CN101661198A (en) * | 2008-08-26 | 2010-03-03 | 北京京东方光电科技有限公司 | Liquid crystal display array substrate and manufacturing method thereof |
| JP2010204264A (en) * | 2009-03-02 | 2010-09-16 | Dainippon Printing Co Ltd | Method for manufacturing photomask having patterns on both surfaces thereof |
| CN103972142A (en) * | 2013-01-25 | 2014-08-06 | 旭硝子株式会社 | Peeling device and peeling method of substrate, and manufacturing method of electronic device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4494753B2 (en) * | 2003-10-27 | 2010-06-30 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
| JP2006059861A (en) * | 2004-08-17 | 2006-03-02 | Lintec Corp | Transferring and bonding device of brittle member |
| US8137417B2 (en) * | 2006-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| JP2009154407A (en) * | 2007-12-27 | 2009-07-16 | Tdk Corp | Peeling apparatus, peeling method, and information recording medium manufacturing method |
-
2015
- 2015-11-16 SG SG11201704108YA patent/SG11201704108YA/en unknown
- 2015-11-16 JP JP2017526849A patent/JP2017537857A/en active Pending
- 2015-11-16 KR KR1020177016681A patent/KR20170086593A/en unknown
- 2015-11-16 WO PCT/US2015/060799 patent/WO2016081337A1/en active Application Filing
- 2015-11-16 CN CN201580073210.6A patent/CN107210247A/en active Pending
- 2015-11-19 TW TW104138342A patent/TW201628958A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6431623B1 (en) * | 1999-06-11 | 2002-08-13 | Honeywell International Inc. | Vacuum device for peeling off thin sheets |
| CN101661198A (en) * | 2008-08-26 | 2010-03-03 | 北京京东方光电科技有限公司 | Liquid crystal display array substrate and manufacturing method thereof |
| JP2010204264A (en) * | 2009-03-02 | 2010-09-16 | Dainippon Printing Co Ltd | Method for manufacturing photomask having patterns on both surfaces thereof |
| CN103972142A (en) * | 2013-01-25 | 2014-08-06 | 旭硝子株式会社 | Peeling device and peeling method of substrate, and manufacturing method of electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017537857A (en) | 2017-12-21 |
| KR20170086593A (en) | 2017-07-26 |
| TW201628958A (en) | 2016-08-16 |
| SG11201704108YA (en) | 2017-06-29 |
| WO2016081337A1 (en) | 2016-05-26 |
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