CN107186634A - Low-porosity resin base grinding tool and preparation method thereof - Google Patents

Low-porosity resin base grinding tool and preparation method thereof Download PDF

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Publication number
CN107186634A
CN107186634A CN201710481653.XA CN201710481653A CN107186634A CN 107186634 A CN107186634 A CN 107186634A CN 201710481653 A CN201710481653 A CN 201710481653A CN 107186634 A CN107186634 A CN 107186634A
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CN
China
Prior art keywords
resin
preparation
porosity
grinding tool
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710481653.XA
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Chinese (zh)
Inventor
任冬寅
高博
王伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUHU ZHEXIN NEW ENERGY CO Ltd
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WUHU ZHEXIN NEW ENERGY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201710481653.XA priority Critical patent/CN107186634A/en
Publication of CN107186634A publication Critical patent/CN107186634A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • B24D3/285Reaction products obtained from aldehydes or ketones
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention discloses a kind of low-porosity resin base grinding tool and preparation method thereof, wherein, the preparation method includes:1) pretreatment of resin:Resin material is subjected to micro-nano granules shaping cladding, the resin raw material after nodularization is made;2) preparation of compound:By step 1) in obtained resin raw material, abrasive material, dispersant and additive mixing after nodularization, compound is made;3) shaping hardening:By step 2) in after obtained compound suppressed, hardened, obtained low-porosity resin base grinding tool.Pass through above-mentioned technical proposal, the present invention carries out shaping by way of first using micro-nano granules shaping cladding to resin material, improve the sphericity of resin material and the bulk density of compound, then by the way that hardening is mixed and be molded to it, it is achieved thereby that reduction is molded the effect of the porosity of the grinding tool after hardening, and then grinding performance, operation stability and the service life of obtained low-porosity resin base grinding tool greatly improved.

Description

Low-porosity resin base grinding tool and preparation method thereof
Technical field
The present invention relates to the production and processing field of grinding tool, in particular it relates to low-porosity resin base grinding tool and its preparation side Method.
Background technology
Resin base grinding tool is a kind of conventional polishing, grinding and cutting tool, is widely used in machine-building, metal The industries such as processing, semiconductor, electronics.However, being influenceed by raw material, condition of molding and hardening process, the obtained resin base of production Often be present the problem of porosity is higher in grinding tool, this grinding performance for having had a strong impact on resin base grinding tool, operation stability and make Use the life-span.
Therefore it provides a kind of can make obtained grinding tool gas by the optimization and improvement to conditions such as raw material and production technologies Porosity is substantially reduced, and improves low-porosity resin base grinding tool and its preparation of its grinding performance, operation stability and service life The problem of method is urgent need to resolve of the present invention.
The content of the invention
For above-mentioned prior art, it is an object of the invention to overcome in the prior art by raw material, condition of molding and hardening Often there is the problem of porosity is higher in the influence of technique, the obtained resin base grinding tool of production, this has had a strong impact on resin base mill The problem of grinding performance of tool, operation stability and service life, can be by raw material and production technology etc. so as to provide one kind The optimization and improvement of condition, substantially reduce the obtained grinding tool porosity, improve its grinding performance, operation stability and use the longevity Low-porosity resin base grinding tool of life and preparation method thereof.
To achieve these goals, the invention provides a kind of preparation method of low-porosity resin base grinding tool, wherein, institute Stating preparation method includes:
1) pretreatment of resin:Resin material is subjected to micro-nano granules shaping cladding, the resinogen after nodularization is made Material;
2) preparation of compound:By step 1) in obtained resin raw material, abrasive material, dispersant and additive after nodularization Mixing, is made compound;
3) shaping hardening:By step 2) in after obtained compound suppressed, hardened, obtained low-porosity resin Base grinding tool.
Present invention also offers a kind of low-porosity resin base grinding tool according to made from preparation method described above.
By above-mentioned technical proposal, the present invention is carried out by way of first using micro-nano granules shaping cladding to resin material Shaping, improves the sphericity of resin material and the bulk density of compound, then by the way that hardening is mixed and be molded to it, It is achieved thereby that reduction is molded the effect of the porosity of the grinding tool after hardening, and then obtained low-porosity resin greatly improved Grinding performance, operation stability and the service life of base grinding tool.
Other features and advantages of the present invention will be described in detail in subsequent embodiment part.
Brief description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute a part for specification, with following tool Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is a kind of structural representation for micro-nano granules shaping coating equipment that the present invention is provided.
Description of reference numerals
1- feeding mouth 2- discharging openings
3- circulation canal 4- rotor blades.
Embodiment
The embodiment to the present invention is described in detail below.It should be appreciated that described herein specific Embodiment is merely to illustrate and explain the present invention, and is not intended to limit the invention.
The end points and any value of disclosed scope are not limited to the accurate scope or value herein, these scopes or Value should be understood to comprising the value close to these scopes or value.For number range, between the endpoint value of each scope, respectively It can be combined with each other between the endpoint value of individual scope and single point value, and individually between point value and obtain one or more New number range, these number ranges should be considered as specific open herein.
The invention provides a kind of preparation method of low-porosity resin base grinding tool, wherein, the preparation method includes:
1) pretreatment of resin:Resin material is subjected to micro-nano granules shaping cladding, the resinogen after nodularization is made Material;
2) preparation of compound:By step 1) in obtained resin raw material, abrasive material, dispersant and additive after nodularization Mixing, is made compound;
3) shaping hardening:By step 2) in after obtained compound suppressed, hardened, obtained low-porosity resin Base grinding tool.
Above-mentioned design, using shaping is carried out to resin material by way of micro-nano granules shaping cladding, improves resin first The sphericity of material and the bulk density of compound, then by the way that hardening is mixed and be molded to it, it is achieved thereby that reduction The effect of the porosity of grinding tool after shaping hardening, and then the grindability of obtained low-porosity resin base grinding tool greatly improved Energy, operation stability and service life.
Certainly, dispersant here can be Dispersant types commonly used in the art, as long as enabling it to adapt to mill Material, the scattered use of resin material.Those skilled in the art can be selected according to actual needs, seldom be gone to live in the household of one's in-laws on getting married herein State.
Certainly, the consumption of each raw material here can be adjusted according to actual needs, for example, in a kind of excellent of the present invention In the embodiment of choosing, relative to the resin material of 1000 parts by weight, the consumption of the abrasive material is 100-500 parts by weight, The consumption of the dispersant is 5-30 parts by weight, and the consumption of the additive is 10-60 parts by weight.
Step 1) in micro-nano granules shaping cladding process can be carried out according to this area usual manner, for example, step 1) micro-nano granules shaping cladding process is handled for resin material is placed in micro-nano granules shaping coating equipment in, example Such as, the structure of micro-nano granules shaping coating equipment here can be micro-nano granules shaping coating equipment as shown in Figure 1, The direction of arrow is the flow direction of resin material in figure, i.e., fed from feeding mouth 1, and after be recycled to through circulation canal 3 and be equipped with rotor Micro-nano granules shaping cladding is carried out in the cavity of blade 4, discharge, certainly, commercially available micro-nano are then carried out by discharging opening 2 again Rice grain shaping coating equipment can be used, and the invention is not limited in the micro-nano granules shaping coating equipment shown in Fig. 1 Structure.Process is coated by micro-nano granules shaping, and then spherical or subsphaeroidal resin particle is made.
In further preferred embodiment, step 1) in processing procedure micro-nano granules shaping coating equipment rotating speed 2000-8000r/min is could be arranged to, being placed in the time handled in micro-nano granules shaping coating equipment can select as 5- The discharge time can be further selected as 2-5min after 30min, processing.
Certainly, according to factors such as the sizes and raw material dosage of equipment, it is placed in every time in micro-nano granules shaping coating equipment The consumption of resin material can be according to being actually adjusted, for example, step 1) in the consumption of resin material be 0.5-5kg.When So, each consumption refers to the consumption being placed in every time in equipment here, and different equipment can carry out the different choice of consumption, this Invention is not limited thereto.
Similarly, the present invention a kind of embodiment being more highly preferred in, step 2) in mixing can be to be placed in batch mixing Mixed in machine, and incorporation time is 1-48h.Certainly, stirring condition (for example, rotating speed etc.) here can enter according to actual needs Row selection, is seldom repeated herein.
In further preferred embodiment, in order to further improve the performance of obtained compound, the batch mixer can With selected from V-type batch mixer and/or stirring at low speed type batch mixer.
In further preferred embodiment, step 3) in shaping hardening process can be for obtained compound be placed in into mould After being suppressed in tool, hardened, low-porosity resin base grinding tool is made.Certainly, compacting and hardening process here is according to this Field usual manner is operated, for example, compacting here can be opposite to mould for (for example, 80-250 DEG C) at a certain temperature Compound in tool, which gives certain pressure (for example, 0.5-10MPa), to be suppressed, and similarly, hardening can also be to be placed in one A period of time (for example, 5-6h) is hardened in the stove of constant temperature degree (for example, 400-450 DEG C).Here compacting and hardening be Skilled artisans appreciate that and the means that use, seldom repeat herein.
Here the resinous type for preparing resin base grinding tool that resin material be able to would generally be used selected from this area, For example, it is a kind of preferred embodiment in, in order to further improve the performance of obtained grinding tool, the resin material can be with It is further selected as including phenolic resin and polyimide resin.
In further preferred embodiment, on the basis of the gross weight of the resin material, the use of the phenolic resin Measure as 55-60 weight %, the consumption of the polyimide resin is 40-45 weight %.
In order to further improve in the performance of obtained grinding tool, a kind of embodiment being more highly preferred to, the resin The granularity of material can be further selected as 50-800 mesh.
Here abrasive material can be selected according to conventional, for example, can be natural abrasive (example commonly used in the art Such as Naxas emery), Alundum class abrasive material or carborundum class abrasive material etc., in a kind of embodiment party being more highly preferred to of the present invention In formula, the abrasive material can be selected as selected from bortz powder, schmigel, cubic boron nitride powder, nickel plating schmigel and silicon nitride powder In one or more.
In order to further improve the later stage performance and processing characteristics of obtained composite particles, the granularity of the abrasive material can To be further selected as 325-10000 mesh.
Here additive can be selected according to being actually needed, for example, it is a kind of preferred embodiment in, it is described to add Plus agent is selected from copper powder and/or aluminium powder.Certainly, it is not limited thereto here, those skilled in the art can give according to this basis Regulation, is seldom repeated herein.
In further preferred embodiment, the granularity of the additive can be further selected as 325-5000 mesh.
Present invention also offers a kind of low-porosity resin base grinding tool according to made from preparation method described above.
The present invention will be described in detail by way of examples below.
Embodiment 1
First by polyimides tree that phenolic resin particle and 600g granularity that 800g granularity is 325 mesh are 325 mesh In fat particle, input micro-nano granules shaping coating equipment, 10min, discharge (are reacted) in processing under 3000r/min rotating speed 3min, is made the resin raw material after nodularization;Then by the 1400g resin raw material after nodularization, 200g 2000 mesh Buddha's warrior attendants 1000 mesh copper powders of stone flour, 20g dispersant and 40g, which are fitted into V-type batch mixer, mixes 48h, and compound is made;Then, will be mixed Close material and 80 DEG C are slowly warming up under 1MPa pressure, be incubated 2h, be then slowly warming up to 180 DEG C of insulation 2h, be finally warming up to Go out mill after 250 DEG C, to be cooled to 80 DEG C, at 400 DEG C, be incubated 5h, be cooled to after room temperature, low-porosity resin base mill is made Has A1.Finally, the porosity for measuring low-porosity resin base grinding tool A1 is 3.0%.
Embodiment 2
First by polyimides tree that phenolic resin particle and 600g granularity that 800g granularity is 325 mesh are 325 mesh In fat particle, input micro-nano granules shaping coating equipment, 15min, discharge 3min are handled under 3000r/min rotating speed, is made Resin raw material that must be after nodularization;Then by the 1400g resin raw material after nodularization, 200g 2000 mesh bortz powders, 20g Dispersant and 40g 1000 mesh copper powders be fitted into V-type batch mixer and mix 48h, compound is made;Then, compound is existed It is slow under 1MPa pressure to be warming up to 80 DEG C, 2h is incubated, 180 DEG C of insulation 2h is then slowly warming up to, is finally warming up to 250 DEG C, Go out mill after to be cooled to 80 DEG C, at 400 DEG C, be incubated 6h, be cooled to after room temperature, low-porosity resin base grinding tool A2 is made. Finally, the porosity for measuring low-porosity resin base grinding tool A2 is 2.5%.
Embodiment 3
First by polyimide resin that phenolic resin particle and 600g granularity that 800g granularity is 325 mesh are 325 mesh In particle, input micro-nano granules shaping coating equipment, 10min, discharge 3min are handled under 3000r/min rotating speed, is made Resin raw material after nodularization;Then by the 1400g resin raw material after nodularization, 400g 2000 mesh white alundum powders, 20g Dispersant and 40g 1000 mesh copper powders, which are fitted into V-type batch mixer, mixes 48h, and compound is made;Then, by compound in 1MPa Pressure under it is slow be warming up to 80 DEG C, be incubated 2h, be then slowly warming up to 180 DEG C of insulation 2h, be finally warming up to 250 DEG C, treat cold But to mill is gone out after 80 DEG C, at 400 DEG C, 5h is incubated, is cooled to after room temperature, low-porosity resin base grinding tool A3 is made.Finally, The porosity for measuring low-porosity resin base grinding tool A3 is 3.1%.
Embodiment 4
It is prepared by the preparation method according to embodiment 1, unlike, the consumption of the phenolic resin is 770g, described The consumption of polyimide resin is 630g, and low-porosity resin base grinding tool A4 is made.Finally, low-porosity resin base grinding tool is measured The A4 porosity is 3.5%.
Embodiment 5
It is prepared by the preparation method according to embodiment 2, unlike, the copper powder is replaced with into aluminium powder, low gas is made Porosity resin base grinding tool A5.Finally, the porosity for measuring low-porosity resin base grinding tool A5 is 2.8%.
Comparative example 1
It is prepared by the preparation method according to embodiment 3, unlike, directly phenolic resin and polyimide resin are entered Row is used in mixed way, without micro-nano granules shaping coating equipment nodularization, and low-porosity resin base grinding tool D1 is made.Finally, measure The resin base grinding tool D1 porosity is 5.3%.
Comparative example 2
The resin base grinding tool prepared according to this area usual manner, for example, being 325 purposes first by 800g granularity Point of phenolic resin particle, the polyimide resin particle, 200g 2000 mesh bortz powders, 20g that 600g granularity is 325 mesh Powder and 40g 1000 mesh copper powders, which are fitted into V-type batch mixer, mixes 48h, and compound is made;Then, by compound in a constant temperature Degree and forming under the pressure hardening, are made resin base grinding tool D2.Finally, the porosity for measuring resin base grinding tool D2 is 4.9%.
To sum up find out, the gas of grinding tool made from obtained resin base grinding tool and this area usual manner outside the scope of the invention Porosity is above the porosity of grinding tool produced by the present invention.The present invention is by adjusting production method, so that obtained resin Base grinding tool has the lower porosity, substantially increases the performances such as grinding.
The preferred embodiment of the present invention described in detail above, still, the present invention are not limited in above-mentioned embodiment Detail, in the range of the technology design of the present invention, a variety of simple variants can be carried out to technical scheme, this A little simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally The thought of invention, it should equally be considered as content disclosed in this invention.

Claims (10)

1. a kind of preparation method of low-porosity resin base grinding tool, it is characterised in that the preparation method includes:
1) pretreatment of resin:Resin material is subjected to micro-nano granules shaping cladding, the resin raw material after nodularization is made;
2) preparation of compound:By step 1) in obtained resin raw material, abrasive material, dispersant and additive after nodularization it is mixed Close, compound is made;
3) shaping hardening:By step 2) in after obtained compound suppressed, hardened, low-porosity resin base be made and grinds Tool.
2. preparation method according to claim 1, wherein, relative to the resin material of 1000 parts by weight, the mill The consumption of material is 100-500 parts by weight, and the consumption of the dispersant is 5-30 parts by weight, and the consumption of the additive is 10-60 Parts by weight.
3. preparation method according to claim 1 or 2, wherein, step 1) in micro-nano granules shaping cladding process be will Resin material is placed in micro-nano granules shaping coating equipment and handled, and spherical or subsphaeroidal resin particle is made;
Preferably, step 1) in processing procedure the rotating speed of micro-nano granules shaping coating equipment be 2000-8000r/min, put The time handled in micro-nano granules shaping coating equipment is 5-30min, and the discharge time is 2-5min after processing;
It is further preferred that step 1) in resin material consumption be 0.5-5kg.
4. preparation method according to claim 1 or 2, wherein, step 2) in be mixed into be placed in batch mixer and mix, it is and mixed The conjunction time is 1-48h;
Preferably, the batch mixer is selected from V-type batch mixer and/or stirring at low speed type batch mixer.
5. preparation method according to claim 1 or 2, wherein, step 3) in shaping hardening process be by obtained mixing Material is placed in mould after compacting, is hardened, and low-porosity resin base grinding tool is made.
6. preparation method according to claim 1 or 2, wherein, the resin material includes phenolic resin and polyimides Resin;
Preferably, on the basis of the gross weight of the resin material, the consumption of the phenolic resin is 55-60 weight %, described The consumption of polyimide resin is 40-45 weight %;
It is further preferred that the granularity of the resin material is 50-800 mesh.
7. preparation method according to claim 1 or 2, wherein, the abrasive material is selected from bortz powder, schmigel, cube nitrogen Change the one or more in boron powder, nickel plating schmigel and silicon nitride powder;
Preferably, the granularity of the abrasive material is 325-10000 mesh.
8. preparation method according to claim 1 or 2, wherein, the additive is selected from copper powder and/or aluminium powder.
9. preparation method according to claim 1 or 2, wherein, the granularity of the additive is 325-5000 mesh.
10. low-porosity resin base grinding tool made from the preparation method in a kind of 1-9 according to claim described in any one.
CN201710481653.XA 2017-06-22 2017-06-22 Low-porosity resin base grinding tool and preparation method thereof Pending CN107186634A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518068A (en) * 1967-12-04 1970-06-30 Gen Electric Process for manufacturing grinding wheels containing coppercoated grains
JPH02180565A (en) * 1988-12-21 1990-07-13 Showa Denko Kk Carbon plate for semiconductor slice base and manufacture thereof
CN102951633A (en) * 2012-11-21 2013-03-06 芜湖浙鑫新能源有限公司 Graphite spheroidization method and production system thereby
CN103224346A (en) * 2013-05-22 2013-07-31 淄博泰玉广奕磨具有限公司 Resin grinding plate for ultraprecise processing of bearing balls and manufacturing method thereof
CN103273417A (en) * 2013-06-18 2013-09-04 山东泰广奕砂轮有限公司 Diamond resin grinding plate and manufacturing method thereof
CN103465179A (en) * 2013-09-05 2013-12-25 宁波大华砂轮有限公司 Resin rough grinding wheel and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518068A (en) * 1967-12-04 1970-06-30 Gen Electric Process for manufacturing grinding wheels containing coppercoated grains
JPH02180565A (en) * 1988-12-21 1990-07-13 Showa Denko Kk Carbon plate for semiconductor slice base and manufacture thereof
CN102951633A (en) * 2012-11-21 2013-03-06 芜湖浙鑫新能源有限公司 Graphite spheroidization method and production system thereby
CN103224346A (en) * 2013-05-22 2013-07-31 淄博泰玉广奕磨具有限公司 Resin grinding plate for ultraprecise processing of bearing balls and manufacturing method thereof
CN103273417A (en) * 2013-06-18 2013-09-04 山东泰广奕砂轮有限公司 Diamond resin grinding plate and manufacturing method thereof
CN103465179A (en) * 2013-09-05 2013-12-25 宁波大华砂轮有限公司 Resin rough grinding wheel and preparation method thereof

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