CN107177818B - Organic material vapor deposition uses mask plate - Google Patents
Organic material vapor deposition uses mask plate Download PDFInfo
- Publication number
- CN107177818B CN107177818B CN201710590235.4A CN201710590235A CN107177818B CN 107177818 B CN107177818 B CN 107177818B CN 201710590235 A CN201710590235 A CN 201710590235A CN 107177818 B CN107177818 B CN 107177818B
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- Prior art keywords
- frame
- mask plate
- heating device
- mask
- hollow structure
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
This application discloses a kind of organic material vapor deposition mask plates.The mask plate includes frame and at least one exposure mask for being fixed on frame；Frame forms a closed opening, and each exposure mask at least covering part is open, and fixes with frame welding；Frame is hollow structure, is provided with heating device in the hollow structure of frame, for improving the temperature of frame.The embodiment can improve the temperature of frame using heating device when cleaning mask plate, so as to accelerate to be attached to the dissolution of the various organic materials on mask plate, improve cleaning effect.
Description
Technical field
This application involves field of display technology, and in particular to organic material vapor deposition uses mask plate.
Background technique
Currently, existing OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) display panel
In, vacuum evaporation process is generallyd use to form each functional layer.During vapor deposition, generally require using mask plate.Mask plate
Effect be that material is deposited to corresponding position by aperture area, to form corresponding functional layer.
Specifically, as shown in Figure 1, adding OLED material to be deposited in crucible 11.In vacuum degree less than 10-5The ring of Pa
Under border, crucible 11 slowly heats up.After temperature reaches the sublimation temperature of OLED material, OLED material slowly becomes gaseous state distillation
Come up, gaseous state OLED material 12 as shown in Figure 1.Gaseous state OLED material 12 passes through the aperture of mask plate 13.Gaseous molecular exists
The surface of substrate 14 deposits, and cools down and condense into solid-state molecular.OLED material molecule is constantly accumulated on the substrate 14, finally slowly
Form the film layer of corresponding function.
However, existing mask plate is usually that exposure mask is welded on metal framework.Metal framework is often solid construction.
During vapor deposition, OLED material can be attached on mask plate.In order to avoid these attachment materials become subsequent vapor deposition when
Foreign matter also avoids influencing vapor deposition accuracy, it is therefore desirable to clean mask plate.But these attachment materials are difficult cleaning and do
Only, the material especially adhered in the gap of welding region.Therefore a kind of mask plate that can be heated is needed, to improve its cleaning
Effect.
Summary of the invention
In view of drawbacks described above in the prior art, this application provides a kind of improved organic material vapor deposition mask plate,
To solve the technical issues of background section above is mentioned.
The embodiment of the present application provides a kind of organic material vapor deposition mask plate, which includes frame and be fixed on frame
At least one exposure mask on frame；Frame forms a closed opening, and each exposure mask at least covering part is open, and and frame welding
It is fixed；Frame is hollow structure, is provided with heating device in the hollow structure of frame, for improving the temperature of frame.
In some embodiments, frame is monolithic construction.
In some embodiments, frame is fabricated structure.
In some embodiments, frame includes the upper half and lower half, is formed in the upper half towards the surface of lower half
First groove is formed with the second groove towards the surface of the upper half in lower half, and the first groove and the second groove match to be formed
Hollow structure.
In some embodiments, frame includes the upper half and lower half, is formed in the upper half towards the surface of lower half
Groove is formed with convex block towards the surface of the upper half in lower half, and groove and convex block match to form hollow structure.
In some embodiments, the cross-sectional shape of the inner surface and the outer surface of frame includes polygon or round, wherein
Inner surface is the surface that hollow structure is formed in frame, and outer surface is surface opposite with inner surface in frame.
In some embodiments, heating device includes heating wire or electrothermal tube；Sealed interface is provided on frame, for
Heating device transmits electric power.
In some embodiments, heating device is wire coil, for generating heat under magnetic fields.
In some embodiments, the material of frame is metal material, wherein heat of the metal material between 0 DEG C -350 DEG C
The coefficient of expansion is not more than 2.0 × 10-6/ DEG C, including stainless steel.
In some embodiments, the material of frame is nonmetallic materials, and in the outer surface of frame, solid with exposure mask welding
Fixed surface metal-plated membrane layer.
In some embodiments, thermal expansion coefficient of the nonmetallic materials between 0 DEG C -350 DEG C is not more than 2.0 × 10-6/
DEG C, including glass or ceramics；Thermal expansion coefficient of the metal material of metallic diaphragm between 0 DEG C -350 DEG C is used to form to be not more than
2.0×10-6/℃。
Organic material vapor deposition mask plate provided by the embodiments of the present application, by being by the Frame Design for being used to fix exposure mask
Hollow structure, and heating device is set in hollow structure.In this way when cleaning to mask plate, heating device can be passed through
It is heated, to improve the temperature of frame.Facilitate to be attached to the acceleration dissolution of the various organic materials on frame in this way, especially
It is the organic material in the gap of welding region, and then cleaning effect can be improved.It is also beneficial to extend making for mask plate simultaneously
With the service life, to reduce production cost.
Detailed description of the invention
By reading a detailed description of non-restrictive embodiments in the light of the attached drawings below, the application's is other
Feature, objects and advantages will become more apparent upon:
Fig. 1 is the schematic diagram of OLED material vacuum evaporation process；
Fig. 2 is the structural schematic diagram of one embodiment of mask plate provided by the present application；It is whole
Fig. 3 is the sectional structure chart of one embodiment of mask plate shown in Fig. 2；
Fig. 4 is the structural schematic diagram of one embodiment of frame；
Fig. 5 is the structural schematic diagram of another embodiment of frame；
Fig. 6 is the structural schematic diagram of the further embodiment of frame；
Fig. 7 is the structural schematic diagram of another embodiment of frame.
Specific embodiment
The principle of the application and feature are described in further detail with reference to the accompanying drawings and examples.It is understood that
It is that specific embodiment described herein is used only for explaining related invention, rather than the restriction to the invention.It further needs exist for
It is bright, part relevant to invention is illustrated only for ease of description, in attached drawing.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
Fig. 2 is referred to, it illustrates the structural schematic diagrams of one embodiment of mask plate provided by the present application.The present embodiment
In organic material vapor deposition mask plate may include frame and at least one exposure mask for being fixed on frame.Frame forms an envelope
The opening closed.Each exposure mask at least covering part is open, and fixes with frame welding.Frame is hollow structure, frame it is hollow
Heating device is provided in structure, for improving the temperature of frame.
As shown in Fig. 2, mask plate includes frame 21, exposure mask 22 and exposure mask 23.Frame 21 primarily serves fixed supporting role.
Frame 21 may include four frames.Four frames successively join end to end, to form the closing opening of rectangle, as thick in Fig. 2
Solid line area defined.Exposure mask 22 and exposure mask 23 are welded and fixed with frame 21, so being formed in 21 two sides of frame multiple
Pad 24.Exposure mask 22 can cover the top half of opening, and exposure mask 23 can then cover the lower half portion of opening.Meanwhile it covering
It could be formed with multiple apertures on film 22 and exposure mask 23, such as the aperture 221 and aperture 231 in Fig. 2.Carrying out organic material in this way
When vapor deposition, the gas molecule of organic material can pass through aperture 221 and aperture 231, to correspond to aperture 221 in substrate and open
Accumulation is condensed on the position in hole 231, and then forms organic film.
It is understood that during vapor deposition, organic material would also adhere to the frame 21 of mask plate, exposure mask 22 and cover
On film 23.But the organic material between different processes is often different, so the organic material of previous process attachment is under
For one process, it is likely that belong to unnecessary material, can even become the foreign matter of subsequent vapor deposition process sometimes.And with having
The adhesion amount of machine material is continuously increased, and will affect the size of the aperture 221 and aperture 231 on exposure mask 22 and exposure mask 23, Jin Erying
The positions and dimensions precision of organic film etc. after ringing vapor deposition.Therefore it needs as far as possible to clean the organic material on mask plate dry
Only.
In order to improve the cleaning effect of mask plate, the frame 21 in the present embodiment can be hollow structure, can specifically join
See Fig. 3, it illustrates mask plates shown in Fig. 2 along the sectional structure chart of N-N '.As shown in figure 3, hollow structure refers to frame 21
Inside be it is hollow.Heating device 25 can be set in hollow structure at this time.In this way when cleaning mask plate, it can use
Heating device 25 is heated, to improve the temperature of frame 21, thus accelerate the dissolution for the organic material being attached on mask plate,
And then by the more clean of mask plate cleaning, it can especially improve the cleaning effect around pad 24.Because at pad
Surface roughness it is larger, be easy the more organic material of accumulation, and the not easy cleaning of the organic material in weld seam.And by adding
The heating of thermal can be such that the cleaning of mask plate is more easier, and be conducive to shorten scavenging period, improve production efficiency.
The service life of mask plate can be extended simultaneously, lower production cost.
It should be noted that the quantity of exposure mask, the position of pad and quantity are only schematical in Fig. 2.Such as it covers
Diaphragm plate can only include an exposure mask, and the frame that is completely covered of this exposure mask is formed by opening.And four sides of exposure mask and frame
It is welded and fixed.In addition, the shape and material of frame and heating device are not intended to limit in this application.But frame is considered in design
The carrying support of frame and the temperature range of heating device.
In some optionally implementations of the present embodiment, frame can be monolithic construction.Monolithic construction refers to
Frame is made of a hollow device.And the frame of frame is formed by by carrying out bending to the hollow device.This
When frame head and the tail junction formed a weld seam.And frame 21 shown in Fig. 2 is respectively formed one in the junction of four frames
Weld seam.I.e. frame 21 is spliced to form by four hollow devices.That is, frame may be fabricated structure.Combination
Formula structure refers to that frame is made of multiple components.Specifically it may refer to Fig. 4 and Fig. 5, which respectively show fabricated structures
Frame two embodiments structural schematic diagram.
As shown in figure 4, frame may include the upper half 211 and lower half 212.Towards lower half 212 in the upper half 211
Surface is formed with the first groove A.And the second groove B is formed with towards the surface of the upper half 211 in lower half 212.First groove A
It matches to form hollow structure with the second groove B.
Herein, exposure mask can be fixed with the upper half 211, i.e., exposure mask is welded in the upper half 211 away from lower half 212
On surface.At this point, heating device can be set in the second groove B.In this way when needing replacing mask plate, frame can be only replaced
The upper half 211 being welded and fixed in frame with exposure mask reduces production cost to save the lower half 212 of heating device and frame.
As an example, exposure mask can also be fixed with lower half 212, and heating device then can be set in the first groove A.In addition, by
In on the different components that exposure mask and heating device are separately positioned on frame, in order to frame processing and assembling.
As can be known from Fig. 4, lower half 212 can be partially submerged into the first groove A, to keep the first groove A and second recessed
Slot B matches to form hollow structure.Certainly, it when lower half 212 is completely embedded into the first groove A, i.e., is carried on the back in lower half 212
The surface that the first groove A is formed in surface and the upper half 211 from the upper half 211 is in same level, can equally make
First groove A and the second groove B match to form hollow structure.As an example, can also be by at least partly embedding of the upper half 211
Enter in the second groove B, to form hollow structure.The concrete mode for forming hollow structure is not intended to limit in this application.On in addition,
Half portion 211 and lower half 212 can be fixed in several ways, such as be fitted close (interference or transition fit), welding
Or screw etc..It is understood that organic material can also be effectively prevented through upper half by way of being fitted close or welding
Gap between portion and lower half enters the inside of frame, increases cleaning difficulty.
Identical with frame shown in Fig. 4 to be with continued reference to Fig. 5, the frame in Fig. 5 equally may include the upper half 211
With lower half 212.And groove C is also formed with towards the surface of lower half 212 in the upper half 211.
Unlike frame shown in Fig. 4, towards the surface shape of the upper half 211 in the lower half 212 of the frame in Fig. 5
At there is convex block D.At this point, groove C and convex block D match to form hollow structure.As shown in figure 5, convex block D be embedded in groove C with
Form hollow structure.And it is of same size between the width between the two sidewalls of the upper half 211 and the two sidewalls of lower half 212.
At this point, convex block D can also be to the organic material gas for entering lower portion through the gap between the upper half 211 and lower half 212
Play certain barrier effect.Herein, exposure mask can (but being not limited to) and lower half 212 it is fixed, heating device then can (but
It is not limited to) it is set in groove C.
The frame shown in Fig. 2-Fig. 5 it is found that the cross-sectional shape of the inner surface and the outer surface of frame may include but
It is not limited to polygon or round.Wherein, inner surface is the surface that hollow structure is formed in frame.Outer surface be frame in interior table
The opposite surface in face.It is understood that the cross-sectional shape of inner surface mentioned here is when frame is fabricated structure
Refer to that the cross-sectional shape for the hollow structure that final combination is formed can be approximated to be polygon or round etc..And it is used to combine this hollow
The shape on the surface of structure, such as the typically non-envelope of surface shape of the first groove and the second groove in above-described embodiment
Close shape, such as broken line or curve.Similarly, when frame is fabricated structure, the cross-sectional shape of outer surface is also referred to finally
The cross-sectional shape for combining the outer surface of the frame formed can be approximated to be polygon or round etc..
It should be noted that a mask plate usually can carry out organic material vapor deposition, institute to multiple display panels simultaneously
Opening general (but being not limited to) is formed by with frame as rectangle.And the shape of the aperture on exposure mask and the display panel being specifically deposited
Shape is related with the shape of film layer, so the shape of aperture can be round, ellipse or polygon etc..
In addition, the heating device in the application can be the various components with heating function.Such as heating device can be with
To utilize electrically heated heating device, including heating wire or electrothermal tube etc..At this point, since heating device needs to be electrically connected with power supply
It connects, so the specific position that is arranged is not intended to limit as shown in fig. 6, interface 26 can be set on frame 21.Interface 26 is used for setting
The heating device transmission electric power being placed in inside frame 21.It is understood that in order to avoid in vapor deposition or cleaning process, gas
Or liquid enters the inside of frame through interface 26, interface 26 generallys use Seal Design, to play protective action.
In application scenes, the heating device in the application can also be the heating device for utilizing electromagnetism heat.This
When heating device can be wire coil, for generating heat under magnetic fields.Specifically, in the process of cleaning, it can incite somebody to action
Mask plate is placed in the environment of alternating magnetic field, wire coil cutting alternate magnetic force line and the electric current (be vortexed) for generating alternation.
Vortex can make the atom in wire coil do high speed random motion.Atom collides with each other, rubs and generates thermal energy in this way, from
And improve the temperature of frame.
In addition, it is necessary to illustrate, the material of the frame in the application can be metal material, or non-metallic material
Material.But should be noted that no matter which kind of material frame uses, and thermal expansion coefficient all cannot be too big.Otherwise in vapor deposition process
In, frame can generate larger deformation as the temperature rises, and then influence vapor deposition positions and dimensions precision etc..As an example,
If the material of frame be metal material, thermal expansion coefficient of the metal material between 0 DEG C -350 DEG C no more than 2.0 ×
10-6/℃.Herein, since the temperature of vapor deposition is usually between 200 DEG C -300 DEG C, so the thermal expansion coefficient of metal material can
To be the mean thermal expansion coefficients between 0 DEG C -350 DEG C, the average thermal expansion system that is also possible between 200 DEG C -300 DEG C
Number.In addition, chemical solvent may be used in vapor deposition or cleaning process, so material used by frame should also have
Corrosion resistant characteristic facilitates the service life for extending mask plate.It to sum up analyzes, which may include stainless steel, such as
Invar alloy.Invar alloy is also invar, and mean thermal expansion coefficients are generally 1.5 × 10-6/ DEG C, it is widely used in manufacturing
Accurate measurement element.
As an example, if the material of frame is nonmetallic materials, thermal expansion of the nonmetallic materials between 0 DEG C -350 DEG C
Coefficient equally no more than 2.0 × 10-6/℃.Nonmetallic materials may include (but being not limited to) glass or ceramics, to facilitate
It reduces production cost or reduces the weight of frame.At this point, in order to guarantee being welded and fixed for exposure mask and frame, in the outer surface of frame
In, the surface being at least welded and fixed with exposure mask can be with metal-plated membrane layer.As shown in fig. 7, in two be arranged oppositely of frame 21
The upper surface metal-plated membrane layer 27 of frame.And the metal material of metallic diaphragm 27 is used to form between 0 DEG C -350 DEG C
Thermal expansion coefficient also no more than 2.0 × 10-6/℃.Here thermal expansion coefficient can be the evenly heat between 0 DEG C -350 DEG C
The coefficient of expansion, the mean thermal expansion coefficients being also possible between 200 DEG C -300 DEG C.But it should be noted that swollen using heat
The close nonmetallic materials of swollen coefficient and metallic diaphragm make frame, can guarantee non-metallic material during vapor deposition in this way
Material is close with the deformation of metallic diaphragm, thus situations such as avoiding metallic diaphragm cracked or falling off, extend frame uses the longevity
Life.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art
Member is it should be appreciated that invention scope involved in the application, however it is not limited to technology made of the specific combination of above-mentioned technical characteristic
Scheme, while should also cover in the case where not departing from the inventive concept, it is carried out by above-mentioned technical characteristic or its equivalent feature
Any combination and the other technical solutions formed.Such as features described above has similar function with (but being not limited to) disclosed herein
Can technical characteristic replaced mutually and the technical solution that is formed.
Claims (7)
1. a kind of organic material vapor deposition mask plate, which is characterized in that the mask plate includes frame and is fixed on the frame
On at least one exposure mask；
The frame forms a closed opening, is open described in each exposure mask at least covering part, and welds with the frame
Connect fixation；
The frame is hollow structure, heating device is provided in the hollow structure of the frame, for improving the frame
Temperature；
The frame is fabricated structure；
The frame includes the upper half and lower half, and towards the surface of the lower half, to be formed with first recessed in the upper half
Slot is formed with the second groove, first groove and second groove towards the surface of the upper half in the lower half
It matches to form the hollow structure；Or in the upper half towards the lower half surface formed it is fluted, under described
It is formed with convex block towards the surface of the upper half in half portion, the groove and the convex block match to form the hollow knot
Structure.
2. mask plate according to claim 1, which is characterized in that the cross section shape of the inner surface and the outer surface of the frame
Shape includes polygon or round, wherein the inner surface is the surface that the hollow structure is formed in the frame, the appearance
Face is surface opposite with the inner surface in the frame.
3. mask plate according to claim 1, which is characterized in that the heating device includes heating wire or electrothermal tube；
It is provided with sealed interface on the frame, for transmitting electric power to the heating device.
4. mask plate according to claim 1, which is characterized in that the heating device is wire coil, in magnetic field
Effect is lower to generate heat.
5. mask plate described in one of -4 according to claim 1, which is characterized in that the material of the frame is metal material,
In, thermal expansion coefficient of the metal material between 0 DEG C -350 DEG C is not more than 2.0 × 10-6/ DEG C, including stainless steel.
6. mask plate described in one of -4 according to claim 1, which is characterized in that the material of the frame is nonmetallic materials,
And in the outer surface of the frame, the surface metal-plated membrane layer that is welded and fixed with the exposure mask.
7. mask plate according to claim 6, which is characterized in that heat of the nonmetallic materials between 0 DEG C -350 DEG C
The coefficient of expansion is not more than 2.0 × 10-6/ DEG C, including glass or ceramics；
Thermal expansion coefficient of the metal material of the metallic diaphragm between 0 DEG C -350 DEG C is used to form no more than 2.0 × 10-6/
℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590235.4A CN107177818B (en) | 2017-07-19 | 2017-07-19 | Organic material vapor deposition uses mask plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590235.4A CN107177818B (en) | 2017-07-19 | 2017-07-19 | Organic material vapor deposition uses mask plate |
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| CN107177818A CN107177818A (en) | 2017-09-19 |
| CN107177818B true CN107177818B (en) | 2019-05-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3967788A1 (en) * | 2020-09-11 | 2022-03-16 | Samsung Display Co., Ltd. | Deposition apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109182976A (en) * | 2018-10-23 | 2019-01-11 | 黄建宁 | A kind of deposition system and corresponding vapor deposition and mask plate cleaning method |
| CN109976088A (en) * | 2019-04-03 | 2019-07-05 | 深圳市华星光电半导体显示技术有限公司 | The thermal cleaning method of mask plate thermal cleaning device and mask plate |
| CN111809144B (en) * | 2019-04-12 | 2023-09-12 | 上海和辉光电股份有限公司 | Mask plate and manufacturing method thereof |
| CN111394693B (en) * | 2020-05-13 | 2023-07-04 | 杭州纤纳光电科技有限公司 | Mask plate, preparation method thereof and method for preparing photovoltaic module by using mask plate |
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| EP3967788A1 (en) * | 2020-09-11 | 2022-03-16 | Samsung Display Co., Ltd. | Deposition apparatus |
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| CN107177818A (en) | 2017-09-19 |
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