CN107177138A - It is a kind of for wire material of plug board and preparation method thereof - Google Patents
It is a kind of for wire material of plug board and preparation method thereof Download PDFInfo
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- CN107177138A CN107177138A CN201710563379.0A CN201710563379A CN107177138A CN 107177138 A CN107177138 A CN 107177138A CN 201710563379 A CN201710563379 A CN 201710563379A CN 107177138 A CN107177138 A CN 107177138A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/08—Polymer mixtures characterised by other features containing additives to improve the compatibility between two polymers
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Abstract
Present invention offer is a kind of to be related to wire cable material field for wire material of plug board and preparation method thereof, and the wire material for plug board includes the raw material of following parts by weight：Polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene, phenolic resin, octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, bis-pentamethylenethiuram tetrasulfide, trimethylol-propane trimethacrylate, ceramic fibre, graphite powder, nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer；Preparation method comprises the following steps：(1) raw material, (2) mixing granulation, (3) banburying, (4) mixing, (5) extruding, injection, shaping are weighed.The present invention solves the problem of existing wiring board wire has poor heat endurance, poor fire and poor toughness.
Description
Technical field
The invention belongs to wire cable material field, and in particular to a kind of for wire material of plug board and preparation method thereof.
Background technology
With the development of science and technology, existing electrical equipment species is more and more, and derivative wiring board species is also various therewith,
But existing wiring board generally existing many electrical equipment while wire on wiring board occurs when using for a long time by thermal softening, sternly
The phenomenon of fusing burning even occurs during weight, the life security of people is seriously threatened.
In addition, the problem of existing wiring board wire also has big hardness, poor toughness.
The content of the invention
In order to solve the problem of existing wiring board wire has poor heat endurance, poor fire and poor toughness, this hair
Bright purpose is to provide a kind of for wire material of plug board and preparation method thereof, and the obtained wire material for plug board has
The good advantage of good flame resistance, good toughness and heat endurance.
The invention provides following technical scheme：
A kind of wire material for plug board, includes the raw material of following parts by weight：100-120 parts of polyvinyl chloride, bicyclic penta
20-30 parts of diene, 20-24 parts of GNA type neoprenes, 24-30 parts of polysulfone resin, 15-23 parts of acetal resin, neoprene 16-
20 parts, 13-21 parts of phenolic resin, 11-15 parts of octyl ester of epoxy fatty acid, 5-7 parts of barium stearate, 3-4 parts of aluminium hydroxide, four vulcanization
Double 0.3-0.5 parts of pentamethylene thiurams, 0.2-0.6 parts of trimethylol-propane trimethacrylate, ceramic fibre 13-19
Part, 8-12 parts of graphite powder, 5-9 parts of nickel oxide, 11-15 parts of nanometer silicon carbide, 1-3 parts of fire retardant, 1-2 parts of antioxidant, compatilizer
0.6-1.2 parts of 0.7-2.9 parts, 0.8-1.2 parts of curing agent and light stabilizer.
Polysulfone resin is with the addition of in raw material, polysulfone resin has the good, good toughness of rigidity, heat-resisting quantity good and good insulating
Advantage.
It with the addition of acetal resin in raw material, acetal resin has that tensile strength height, good toughness, wearability be good, fatigue durability
Good, good and good impact resistance the advantage of heat endurance.
Neoprene is with the addition of in raw material, neoprene has the advantages that heat-resist, good flame resistance and high mechanical strength.
Phenolic resin is with the addition of in raw material, phenolic resin belongs to thermosetting resin, it has, and rigidity is big, hardness is high, bond
The good, high temperature resistant of property, nonflammable and low-smoke low-toxicity advantage.
It with the addition of ceramic fibre in raw material, ceramic fibre has that light weight, high temperature resistant, heat endurance are good, fire resistance is good, insulation
Thermal insulation is good and the characteristics of tension High anti bending strength.
Graphite powder is with the addition of in raw material, graphite powder has chemical property stabilization under normal temperature, fire resistance is good, wearability is good, profit
Slip is good, good toughness and the characteristics of good thermal shock.
Nickel oxide is with the addition of in raw material, nickel oxide has excellent fire resistance.
Nanometer silicon carbide is with the addition of in raw material, nanometer silicon carbide has high high temperature resistant, intensity, good impact resistance and fire resistance
Good advantage.
Preferably, the raw material of following parts by weight is included：110 parts of polyvinyl chloride, 25 parts of dicyclopentadiene, GNA type neoprene rubbers
22 parts of glue, 27 parts of polysulfone resin, 19 parts of acetal resin, 18 parts of neoprene, 17 parts of phenolic resin, octyl ester of epoxy fatty acid 13
Part, 6 parts of barium stearate, 3.5 parts of aluminium hydroxide, 0.4 part of bis-pentamethylenethiuram tetrasulfide, trimethylol propane trimethyl third
0.4 part of olefin(e) acid ester, 16 parts of ceramic fibre, 10 parts of graphite powder, 7 parts of nickel oxide, 13 parts of nanometer silicon carbide, 2 parts of fire retardant, antioxidant
0.9 part of 1.5 parts, 1.8 parts of compatilizer, 1.0 parts of curing agent and light stabilizer.
Preferably, the fire retardant is organic phosphates fire retardant, and it is more steady that organic phosphates fire retardant can produce structure when heated
On the one hand fixed crosslinking shape solid matter or carburization zone, the formation of carburization zone can prevent polymer from being further pyrolyzed, on the other hand
Thermal decomposition generation inside preventing enters gas phase and participates in combustion process.
Preferably, the antioxidant is diphenylamines, can delay or suppress the oxidation of the wire material for plug board prepared
Process, so as to extend its service life.
Preferably, the compatilizer is that maleic anhydride is grafted compatilizer, by intermolecular bonding force, promotes incompatible
Two kinds of polymer is combined together, and then reaches the purpose of stabilized blends.
Preferably, the curing agent is N- aminoethyl piperazines, is used for plug board after the solidification of N- aminoethyl piperazines
Wire material, its toughness, heat-resisting quantity and anti-flammability are strengthened.
Preferably, the light stabilizer is carbon black, can cover or reflect the material of ultraviolet, prevent light from penetrating wire
Material, reaches the purpose of the wire material for plug board prepared by protection.
A kind of preparation method of wire material for plug board, comprises the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for plug board；
(2) by polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene and phenol
Urea formaldehyde is well mixed to obtain major ingredient, and major ingredient is placed in single screw extrusion machine and is blended, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, banburying
Time is 3-5min, produces compound A；
(4) octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, ceramic fibre, stone are added into the compound A of preparation
Ink powder, nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer, rotating speed are 1000r/min
3-4min is stirred, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three
TRIM kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats batch mixing
It is expressed into completely after melting in injection machine, in 300 DEG C of injection moldings.
The beneficial effects of the invention are as follows：
1st, the present invention solves existing wiring board wire and there is asking for poor heat endurance, poor fire and poor toughness
Topic.
2nd, with the addition of polysulfone resin in raw material of the invention, polysulfone resin have the good, good toughness of rigidity, heat-resisting quantity good and
The advantage of good insulating.
3rd, acetal resin is with the addition of in raw material of the invention, acetal resin has tensile strength height, good toughness, wearability
Good, fatigue durability is good, good and good impact resistance the advantage of heat endurance.
4th, neoprene is with the addition of in raw material of the invention, neoprene has heat-resist, good flame resistance and machinery strong
The high advantage of degree.
5th, phenolic resin is with the addition of in raw material of the invention, phenolic resin belongs to thermosetting resin, it has rigidity big, hard
Spend height, good caking property, high temperature resistant, nonflammable and low-smoke low-toxicity advantage.
6th, ceramic fibre is with the addition of in raw material of the invention, ceramic fibre has light weight, high temperature resistant, heat endurance good, resistance to
Fire is good, heat insulation property is good and the characteristics of tension High anti bending strength.
7th, graphite powder is with the addition of in raw material of the invention, graphite powder has chemical property stabilization, fire resistance under normal temperature good, resistance to
Good, lubricity is good for mill property, good toughness and the characteristics of good thermal shock.
8th, nickel oxide is with the addition of in raw material of the invention, nickel oxide has excellent fire resistance.
9th, nanometer silicon carbide is with the addition of in raw material of the invention, nanometer silicon carbide has high temperature resistant, intensity height, impact resistance
The good and good advantage of fire resistance.
10th, heretofore described fire retardant is organic phosphates fire retardant, and organic phosphates fire retardant can produce structure when heated
On the one hand more stable crosslinking shape solid matter or carburization zone, the formation of carburization zone can prevent polymer from being further pyrolyzed, another
Aspect can prevent the thermal decomposition generation of inside from entering gas phase and participate in combustion process.
11st, heretofore described antioxidant is diphenylamines, can delay or suppress the wire material for plug board of preparation
Oxidation course, so as to extend its service life.
12nd, heretofore described compatilizer is that maleic anhydride is grafted compatilizer, by intermolecular bonding force, promotes not phase
The two kinds of polymer of appearance is combined together, and then reaches the purpose of stabilized blends.
13rd, heretofore described curing agent is N- aminoethyl piperazines, is used for plug-in after the solidification of N- aminoethyl piperazines
The wire material of plate, its toughness, heat-resisting quantity and anti-flammability are strengthened.
14th, heretofore described light stabilizer is carbon black, can cover or reflect the material of ultraviolet, prevent light from penetrating
Wire material, reaches the purpose of the wire material for plug board prepared by protection.
Embodiment
Embodiment 1
A kind of wire material for plug board, includes the raw material of following parts by weight：110 parts of polyvinyl chloride, dicyclopentadiene
25 parts, 22 parts of GNA types neoprene, 27 parts of polysulfone resin, 19 parts of acetal resin, 18 parts of neoprene, 17 parts of phenolic resin, ring
13 parts of oxygen aliphatic acid monooctyl ester, 6 parts of barium stearate, 3.5 parts of aluminium hydroxide, 0.4 part of bis-pentamethylenethiuram tetrasulfide, three hydroxyl first
0.4 part of base propane trimethyl acrylic ester, 16 parts of ceramic fibre, 10 parts of graphite powder, 7 parts of nickel oxide, 13 parts of nanometer silicon carbide, resistance
Fire 0.9 part of 2 parts of agent, 1.5 parts of antioxidant, 1.8 parts of compatilizer, 1.0 parts of curing agent and light stabilizer.
Polysulfone resin is with the addition of in raw material, polysulfone resin has the good, good toughness of rigidity, heat-resisting quantity good and good insulating
Advantage.
It with the addition of acetal resin in raw material, acetal resin has that tensile strength height, good toughness, wearability be good, fatigue durability
Good, good and good impact resistance the advantage of heat endurance.
Neoprene is with the addition of in raw material, neoprene has the advantages that heat-resist, good flame resistance and high mechanical strength.
Phenolic resin is with the addition of in raw material, phenolic resin belongs to thermosetting resin, it has, and rigidity is big, hardness is high, bond
The good, high temperature resistant of property, nonflammable and low-smoke low-toxicity advantage.
It with the addition of ceramic fibre in raw material, ceramic fibre has that light weight, high temperature resistant, heat endurance are good, fire resistance is good, insulation
Thermal insulation is good and the characteristics of tension High anti bending strength.
Graphite powder is with the addition of in raw material, graphite powder has chemical property stabilization under normal temperature, fire resistance is good, wearability is good, profit
Slip is good, good toughness and the characteristics of good thermal shock.
Nickel oxide is with the addition of in raw material, nickel oxide has excellent fire resistance.
Nanometer silicon carbide is with the addition of in raw material, nanometer silicon carbide has high high temperature resistant, intensity, good impact resistance and fire resistance
Good advantage.
Fire retardant is organic phosphates fire retardant, and organic phosphates fire retardant can produce the more stable crosslinking shape of structure and consolidate when heated
On the one hand body material or carburization zone, the formation of carburization zone can prevent polymer from being further pyrolyzed, on the other hand can prevent inside
Thermally decompose generation and enter gas phase participation combustion process.
Antioxidant is diphenylamines, can delay or suppress the oxidation course of the wire material for plug board prepared, so as to prolong
Its long service life.
Compatilizer is that maleic anhydride is grafted compatilizer, by intermolecular bonding force, promotes incompatible two kinds of polymer
It is combined together, and then reaches the purpose of stabilized blends.
Curing agent is N- aminoethyl piperazines, the wire material for plug board after the solidification of N- aminoethyl piperazines, and its is tough
Property, heat-resisting quantity and anti-flammability are strengthened.
Light stabilizer is carbon black, can cover or reflect the material of ultraviolet, prevents light from penetrating wire material, reaches protection
The purpose of the wire material for plug board prepared.
A kind of preparation method of wire material for plug board, comprises the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for plug board；
(2) by polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene and phenol
Urea formaldehyde is well mixed to obtain major ingredient, and major ingredient is placed in single screw extrusion machine and is blended, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, banburying
Time is 3-5min, produces compound A；
(4) octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, ceramic fibre, stone are added into the compound A of preparation
Ink powder, nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer, rotating speed are 1000r/min
3-4min is stirred, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three
TRIM kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats batch mixing
It is expressed into completely after melting in injection machine, in 300 DEG C of injection moldings.
Embodiment 2
A kind of wire material for plug board, includes the raw material of following parts by weight：100 parts of polyvinyl chloride, dicyclopentadiene
20 parts, 20 parts of GNA types neoprene, 24 parts of polysulfone resin, 15 parts of acetal resin, 16 parts of neoprene, 13 parts of phenolic resin, ring
11 parts of oxygen aliphatic acid monooctyl ester, 5 parts of barium stearate, 3 parts of aluminium hydroxide, 0.3 part of bis-pentamethylenethiuram tetrasulfide, trihydroxy methyl
It is 0.2 part of propane trimethyl acrylic ester, 13 parts of ceramic fibre, 8 parts of graphite powder, 5 parts of nickel oxide, 11 parts of nanometer silicon carbide, fire-retardant
0.6 part of 1 part of agent, 1 part of antioxidant, 0.7 part of compatilizer, 0.8 part of curing agent and light stabilizer.
Polysulfone resin is with the addition of in raw material, polysulfone resin has the good, good toughness of rigidity, heat-resisting quantity good and good insulating
Advantage.
It with the addition of acetal resin in raw material, acetal resin has that tensile strength height, good toughness, wearability be good, fatigue durability
Good, good and good impact resistance the advantage of heat endurance.
Neoprene is with the addition of in raw material, neoprene has the advantages that heat-resist, good flame resistance and high mechanical strength.
Phenolic resin is with the addition of in raw material, phenolic resin belongs to thermosetting resin, it has, and rigidity is big, hardness is high, bond
The good, high temperature resistant of property, nonflammable and low-smoke low-toxicity advantage.
It with the addition of ceramic fibre in raw material, ceramic fibre has that light weight, high temperature resistant, heat endurance are good, fire resistance is good, insulation
Thermal insulation is good and the characteristics of tension High anti bending strength.
Graphite powder is with the addition of in raw material, graphite powder has chemical property stabilization under normal temperature, fire resistance is good, wearability is good, profit
Slip is good, good toughness and the characteristics of good thermal shock.
Nickel oxide is with the addition of in raw material, nickel oxide has excellent fire resistance.
Nanometer silicon carbide is with the addition of in raw material, nanometer silicon carbide has high high temperature resistant, intensity, good impact resistance and fire resistance
Good advantage.
Fire retardant is organic phosphates fire retardant, and organic phosphates fire retardant can produce the more stable crosslinking shape of structure and consolidate when heated
On the one hand body material or carburization zone, the formation of carburization zone can prevent polymer from being further pyrolyzed, on the other hand can prevent inside
Thermally decompose generation and enter gas phase participation combustion process.
Antioxidant is diphenylamines, can delay or suppress the oxidation course of the wire material for plug board prepared, so as to prolong
Its long service life.
Compatilizer is that maleic anhydride is grafted compatilizer, by intermolecular bonding force, promotes incompatible two kinds of polymer
It is combined together, and then reaches the purpose of stabilized blends.
Curing agent is N- aminoethyl piperazines, the wire material for plug board after the solidification of N- aminoethyl piperazines, and its is tough
Property, heat-resisting quantity and anti-flammability are strengthened.
Light stabilizer is carbon black, can cover or reflect the material of ultraviolet, prevents light from penetrating wire material, reaches protection
The purpose of the wire material for plug board prepared.
A kind of preparation method of wire material for plug board, comprises the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for plug board；
(2) by polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene and phenol
Urea formaldehyde is well mixed to obtain major ingredient, and major ingredient is placed in single screw extrusion machine and is blended, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, banburying
Time is 3-5min, produces compound A；
(4) octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, ceramic fibre, stone are added into the compound A of preparation
Ink powder, nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer, rotating speed are 1000r/min
3-4min is stirred, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three
TRIM kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats batch mixing
It is expressed into completely after melting in injection machine, in 300 DEG C of injection moldings.
Embodiment 3
A kind of wire material for plug board, includes the raw material of following parts by weight：120 parts of polyvinyl chloride, dicyclopentadiene
30 parts, 24 parts of GNA types neoprene, 30 parts of polysulfone resin, 23 parts of acetal resin, 20 parts of neoprene, 21 parts of phenolic resin, ring
15 parts of oxygen aliphatic acid monooctyl ester, 7 parts of barium stearate, 4 parts of aluminium hydroxide, 0.5 part of bis-pentamethylenethiuram tetrasulfide, trihydroxy methyl
It is 0.6 part of propane trimethyl acrylic ester, 19 parts of ceramic fibre, 12 parts of graphite powder, 9 parts of nickel oxide, 15 parts of nanometer silicon carbide, fire-retardant
1.2 parts of 3 parts of agent, 2 parts of antioxidant, 2.9 parts of compatilizer, 1.2 parts of curing agent and light stabilizer.
Polysulfone resin is with the addition of in raw material, polysulfone resin has the good, good toughness of rigidity, heat-resisting quantity good and good insulating
Advantage.
It with the addition of acetal resin in raw material, acetal resin has that tensile strength height, good toughness, wearability be good, fatigue durability
Good, good and good impact resistance the advantage of heat endurance.
Neoprene is with the addition of in raw material, neoprene has the advantages that heat-resist, good flame resistance and high mechanical strength.
Phenolic resin is with the addition of in raw material, phenolic resin belongs to thermosetting resin, it has, and rigidity is big, hardness is high, bond
The good, high temperature resistant of property, nonflammable and low-smoke low-toxicity advantage.
It with the addition of ceramic fibre in raw material, ceramic fibre has that light weight, high temperature resistant, heat endurance are good, fire resistance is good, insulation
Thermal insulation is good and the characteristics of tension High anti bending strength.
Graphite powder is with the addition of in raw material, graphite powder has chemical property stabilization under normal temperature, fire resistance is good, wearability is good, profit
Slip is good, good toughness and the characteristics of good thermal shock.
Nickel oxide is with the addition of in raw material, nickel oxide has excellent fire resistance.
Nanometer silicon carbide is with the addition of in raw material, nanometer silicon carbide has high high temperature resistant, intensity, good impact resistance and fire resistance
Good advantage.
Fire retardant is organic phosphates fire retardant, and organic phosphates fire retardant can produce the more stable crosslinking shape of structure and consolidate when heated
On the one hand body material or carburization zone, the formation of carburization zone can prevent polymer from being further pyrolyzed, on the other hand can prevent inside
Thermally decompose generation and enter gas phase participation combustion process.
Antioxidant is diphenylamines, can delay or suppress the oxidation course of the wire material for plug board prepared, so as to prolong
Its long service life.
Compatilizer is that maleic anhydride is grafted compatilizer, by intermolecular bonding force, promotes incompatible two kinds of polymer
It is combined together, and then reaches the purpose of stabilized blends.
Curing agent is N- aminoethyl piperazines, the wire material for plug board after the solidification of N- aminoethyl piperazines, and its is tough
Property, heat-resisting quantity and anti-flammability are strengthened.
Light stabilizer is carbon black, can cover or reflect the material of ultraviolet, prevents light from penetrating wire material, reaches protection
The purpose of the wire material for plug board prepared.
A kind of preparation method of wire material for plug board, comprises the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for plug board；
(2) by polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene and phenol
Urea formaldehyde is well mixed to obtain major ingredient, and major ingredient is placed in single screw extrusion machine and is blended, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, banburying
Time is 3-5min, produces compound A；
(4) octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, ceramic fibre, stone are added into the compound A of preparation
Ink powder, nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer, rotating speed are 1000r/min
3-4min is stirred, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three
TRIM kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats batch mixing
It is expressed into completely after melting in injection machine, in 300 DEG C of injection moldings.
Comparative example 1
A kind of wire material for wiring board, includes the raw material of following parts by weight：115 parts of polyvinyl chloride, dicyclopentadiene
25 parts, 22.5 parts of GNA types neoprene, 12.5 parts of octyl ester of epoxy fatty acid, 6 parts of barium stearate, 3.5 parts of aluminium hydroxide, four sulphur
Change double 0.4 part of pentamethylene thiurams, 0.3 part of trimethylol-propane trimethacrylate, 1.5 parts of fire retardant and antioxidant
1.5 part.
A kind of preparation method of wire material for wiring board, comprises the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for wiring board；
(2) polyvinyl chloride, dicyclopentadiene and GNA types neoprene are well mixed and obtain major ingredient, major ingredient is placed in list
It is blended in screw extruder, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, banburying
Time is 3-4min, produces compound A；
(4) octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, fire retardant and antioxygen are added into the compound A of preparation
Agent, rotating speed is that 1000r/min stirs 3-4min, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three
TRIM kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats batch mixing
It is expressed into completely after melting in injection machine, in 300 DEG C of injection moldings.
It will be used for made from the obtained wire material and comparative example 1 for plug board of embodiment 1, embodiment 2 and embodiment 3
The wire material of wiring board carries out performance test, and test result is as shown in table 1：
| Index | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 |
| Tensile strength (MPa) | 39.8 | 37.5 | 34.4 | 24.1 |
| Elongation at break (%) | 25.2 | 22.4 | 19.2 | 10.6 |
| Heat distortion temperature (DEG C) | 165 | 151 | 142 | 90 |
| Oxygen index (OI) (%) | 45 | 43 | 40 | 35 |
From the data of table 1 compare as can be seen that it is an advantage of the invention that：
1st, it is a kind of for wire material of plug board and preparation method thereof, from the tensile strength measured as can be seen that embodiment
1-3 tensile strength is above comparative example 1, illustrates that the present invention is high for the tensile strength of the wire material of plug board.
2nd, it is a kind of for wire material of plug board and preparation method thereof, it can be seen that implementation from the elongation at break measured
Example 1-3 elongation at break is above comparative example 1, illustrates good toughness of the present invention for the wire material of plug board.
3rd, it is a kind of for wire material of plug board and preparation method thereof, it can be seen that implementation from the heat distortion temperature measured
Example 1-3 heat distortion temperature is above comparative example 1, illustrates that the present invention is good for the heat endurance of the wire material of plug board.
4th, it is a kind of for wire material of plug board and preparation method thereof, from the oxygen index (OI) measured as can be seen that embodiment 1-3
Oxygen index (OI) be above comparative example 1, illustrate the present invention for plug board wire material good flame resistance.
5th, it is a kind of for wire material of plug board and preparation method thereof, it can be seen that from the data of each index measured
Embodiment 1 is superior to embodiment 2, embodiment 3 and comparative example 1, illustrates composition of raw materials of the present invention for the wire material of plug board
With the reasonability of preparation method.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, although with reference to foregoing reality
Apply example the present invention is described in detail, for those skilled in the art, it still can be to foregoing each implementation
Technical scheme described in example is modified, or equivalent substitution, all essences in the present invention are carried out to which part technical characteristic
God is with principle, and any modification, equivalent substitution and improvements made etc. should be included in the scope of the protection.
Claims (8)
1. a kind of wire material for plug board, it is characterised in that include the raw material of following parts by weight：Polyvinyl chloride 100-120
Part, 20-30 parts of dicyclopentadiene, 20-24 parts of GNA type neoprenes, 24-30 parts of polysulfone resin, 15-23 parts of acetal resin, chlorine
16-20 parts of buna, 13-21 parts of phenolic resin, 11-15 parts of octyl ester of epoxy fatty acid, 5-7 parts of barium stearate, aluminium hydroxide 3-4
Part, 0.3-0.5 parts of bis-pentamethylenethiuram tetrasulfide, 0.2-0.6 parts of trimethylol-propane trimethacrylate, ceramics are fine
Dimension 13-19 parts, 8-12 parts of graphite powder, 5-9 parts of nickel oxide, 11-15 parts of nanometer silicon carbide, 1-3 parts of fire retardant, 1-2 parts of antioxidant,
0.6-1.2 parts of 0.7-2.9 parts of compatilizer, 0.8-1.2 parts of curing agent and light stabilizer.
2. the wire material according to claim 1 for plug board, it is characterised in that include the raw material of following parts by weight：
110 parts of polyvinyl chloride, 25 parts of dicyclopentadiene, 22 parts of GNA types neoprene, 27 parts of polysulfone resin, 19 parts of acetal resin, neoprene
18 parts of rubber, 17 parts of phenolic resin, 13 parts of octyl ester of epoxy fatty acid, 6 parts of barium stearate, 3.5 parts of aluminium hydroxide, tetra-sulfurized pair five
0.4 part of methylene thiuram, 0.4 part of trimethylol-propane trimethacrylate, 16 parts of ceramic fibre, 10 parts of graphite powder, oxygen
Change 7 parts of nickel, 13 parts of nanometer silicon carbide, 2 parts of fire retardant, 1.5 parts of antioxidant, 1.8 parts of compatilizer, 1.0 parts of curing agent and light stable
0.9 part of agent.
3. the wire material according to claim 1 for plug board, it is characterised in that：The fire retardant hinders for organic phosphates
Fire agent.
4. the wire material according to claim 1 for plug board, it is characterised in that：The antioxidant is diphenylamines.
5. the wire material according to claim 1 for plug board, it is characterised in that：The compatilizer connects for maleic anhydride
Branch compatilizer.
6. the wire material according to claim 1 for plug board, it is characterised in that：The curing agent is N- aminoethyl piperazines
Piperazine.
7. the wire material according to claim 1 for plug board, it is characterised in that：The light stabilizer is carbon black.
8. a kind of preparation method of wire material for plug board as described in claim 1-7 any one, its feature exists
In comprising the following steps：
(1) raw material is weighed according to the parts by weight of the wire material raw material for plug board；
(2) by polyvinyl chloride, dicyclopentadiene, GNA types neoprene, polysulfone resin, acetal resin, neoprene and phenolic aldehyde tree
Fat is well mixed to obtain major ingredient, and major ingredient is placed in single screw extrusion machine and is blended, granulation obtains base resin；
(3) open banbury and be preheated to 50-55 DEG C, then add base resin obtained by step (2) and carry out banburying, mixing time
For 3-5min, compound A is produced；
(4) into the compound A of preparation add octyl ester of epoxy fatty acid, barium stearate, aluminium hydroxide, ceramic fibre, graphite powder,
Nickel oxide, nanometer silicon carbide, fire retardant, antioxidant, compatilizer, curing agent and light stabilizer, rotating speed are that 1000r/min stirs 3-
4min, is well mixed, produces compound B；
(5) compound B obtained by step (4) is heated to 105-110 DEG C, adds bis-pentamethylenethiuram tetrasulfide and three hydroxyl first
Base propane trimethyl acrylic ester kneads 2-3min, is squeezed into molten condition subsequently into double screw extruder, treats that batch mixing is complete
It is expressed into after melting in injection machine, in 300 DEG C of injection moldings.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710563379.0A CN107177138A (en) | 2017-07-12 | 2017-07-12 | It is a kind of for wire material of plug board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710563379.0A CN107177138A (en) | 2017-07-12 | 2017-07-12 | It is a kind of for wire material of plug board and preparation method thereof |
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| CN107177138A true CN107177138A (en) | 2017-09-19 |
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ID=59837336
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| CN201710563379.0A Withdrawn CN107177138A (en) | 2017-07-12 | 2017-07-12 | It is a kind of for wire material of plug board and preparation method thereof |
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| CN105367884A (en) * | 2015-11-02 | 2016-03-02 | 陈薇 | Insulating fireproof radiation-resistant shielded cable material and preparation method thereof |
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Application publication date: 20170919 |