CN107171177A - A kind of laser and its assemble method of collection ETALON wave filters - Google Patents
A kind of laser and its assemble method of collection ETALON wave filters Download PDFInfo
- Publication number
- CN107171177A CN107171177A CN201710560697.1A CN201710560697A CN107171177A CN 107171177 A CN107171177 A CN 107171177A CN 201710560697 A CN201710560697 A CN 201710560697A CN 107171177 A CN107171177 A CN 107171177A
- Authority
- CN
- China
- Prior art keywords
- laser
- light splitting
- heat sink
- sink plate
- collection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention a kind of laser and its assemble method of collection ETALON wave filters, its laser include shell, substrate and are arranged at the chip of laser of the surface, the first heat sink plate, collimation lens, wave filter, light splitting piece, PD chips, the second heat sink plate；The chip of laser is arranged in first heat sink plate；The collimation lens, wave filter and light splitting piece are arranged in order distribution to realize irradiation of the laser by collimation lens to light splitting piece；The light splitting piece is used for laser reflection to PD chips；Second heat sink plate is arranged at the PD chip-sides.A kind of control of the laser of collection ETALON wave filters of the present invention to light path requires to reduce, light path can have 0.1mm deviation, reach the coupling deviation of optical fiber, method is simple, easily batch production, relatively conventional attachment process is first to mount light splitting piece, then for mounting PD detection chips, success rate lifting 50%.
Description
Technical field
The present invention relates to laser apparatus technical field, the laser of especially a kind of collection ETALON wave filters and its assembling
Method.
Background technology
Distributed Feedback Laser is due to itself chirp, and extinction ratio is low, is distributed between 3~6dB, and transmission range is short, only
10KM, adds wave filter such as behind Distributed Feedback Laser, by filtering the clutter of 0 level, the signal that 1 electricity of lifting is commented, so as to carry
Extinction ratio after High Extinction Ratio, plus wave filter can be lifted to 8~10dB, add transmission range, and transmission range is brought up to
40Km, compensate for the shortcoming of Distributed Feedback Laser short haul, while solve China is restricted hardly possible by EML chip of laser always
Topic, realizes low cost, it is long away from transmission.And the operating point of wave filter is the luminous power detection reflected and passed through by light splitting wave plate
Lock ripple is realized, how to mount light splitting wave plate to realize the light splitting ratio of luminous power, is the making collection filtering in whole industry
The technological difficulties of the laser of device, wave filter is integrated into laser, it is necessary to use lock wave technology adjust 0 and 1 ratio, with up to
To preferably applying wave filter, and lock wave technology be by wave filter behind the detection of 0 and 1 luminous power determine, this
Luminous power has a lower limit, if too small, and detection in circuit can be influenceed by noise, so how to obtain certain value
Detection power, it is necessary to necessarily cleverly be mounted to light splitting wave plate.
Use passive attachment in current industry, one of shortcoming is to need to be completely secured in light path design and technique according to setting
Photometric road premise can be only achieved suitable light splitting photoelectric current, if light path slightly deviation, light splitting electric current can not meet requirement, entirely
Device is scrapped, and the two of shortcoming is, requires extremely strict in technique, such cost can accordingly increase.
In consideration of it, being necessary to propose a kind of laser and its assemble method of new collection ETALON wave filters.
The content of the invention
In view of the technical problem present in background technology, it is an object of the invention to overcome the shortcoming of prior art there is provided
A kind of control to light path requires low, light splitting electric current can be detected in real time, greatly promoting the collection ETALON wave filters of attachment success rate
Laser and its assemble method.
In order to solve the above technical problems, present invention employs following technical measures：
A kind of laser of collection ETALON wave filters, including shell, substrate and the laser for being arranged at the surface
Chip, the first heat sink plate, collimation lens, wave filter, light splitting piece, PD chips, the second heat sink plate；The chip of laser is arranged at
In first heat sink plate；The collimation lens, wave filter and light splitting piece are arranged in order distribution to realize laser by collimation lens
To the irradiation of light splitting piece；The light splitting piece is used for laser reflection to PD chips；Second heat sink plate is arranged at the PD
Chip-side.
As a further improvement, define the collimation lens to the direction of the wave filter be first direction；Definition is described
The angular range between vertical plane on the placed angle of light splitting piece and the first direction is a, wherein a scope be 44 °~
46°。
As a further improvement, define the light splitting piece thickness range be d, wherein d scope be 0.12mm~
0.16mm；The light volume reflection for defining the reflecting piece accounts for the ratio for the light summation being irradiated in reflecting piece for b, wherein b scope
For 4.7%~5.3%.
It is used to detect whether photoelectric current reaches lock as a further improvement, the PD chips can further be connected with microampere meter
Ripple effect.
A kind of assemble method of the laser of collection ETALON wave filters, comprises the following steps：
S1：Chip of laser is assembled in the first heat sink plate, and the first heat sink plate is mounted on substrate；
S2：Collimation lens is coupled on substrate and ensures that the laser that chip of laser is sent can be by collimation lens；
S3：By wave filter attachment to the rear on collimation lens direction of illumination；
S4:By in PD chip attachment to the second heat sink plate, two gold threads are bound, then by overall attachment to substrate；
S5:The other end of two gold threads is connected with microampere meter；
S6:The pre- point UV glue on substrate, light splitting wave plate is placed on into drop in advance according to angle a value has on the substrate of UV glue；
S7：The detection photoelectric current of PD chips is observed by microampere meter, light splitting piece is gently stirred with instrument to adjust detection light
The value of electric current is more than 100 microamperes until photoelectric current is met；
S8：Pre-fixed using ultraviolet light irradiation UV glue, pass through a thermosetting adhesive curing；
S9：Shell is covered to be fixed.
As a further improvement, in the S4 steps, the PD chips and second heat sink plate and the substrate phase
It is vertically arranged.
As a further improvement, in the S6 steps, the instrument can be tweezers or thin bar.
Compared with prior art, the present invention has advantages below：
1st, a kind of laser of collection ETALON wave filters of the present invention strengthens lock using the structure of wave filter combination light splitting piece
Weave efficiency, so as to improve the extinction ratio of laser.
2nd, a kind of attaching method of the laser of collection ETALON wave filters of the present invention is pre- solid using UV glue during attachment
Determine the mode of light splitting piece, the current value of light splitting piece reflected light is changed in real time by observing the current value on PD chips, to meet
Require to be criterion more than 100 microamperes, control of the whole method to light path requires to reduce, and light path there can be 0.1mm deviation, can have
Effect reaches the coupling deviation of optical fiber and improves the lock weave efficiency of wave filter, and method is simple, easily batch production, will not introduce photoelectric current
Bad products, relatively conventional attachment process is first to mount light splitting piece, then for mounting PD detection chips, success rate lifting 50%.
Brief description of the drawings
Accompanying drawing 1 is a kind of internal structure schematic diagram of the laser of collection ETALON wave filters of the present invention.
Main element symbol description
Chip of laser 1
First heat sink plate 2
Substrate 3
Collimation lens 4
Wave filter 5
Light splitting piece 6
PD chips 7
Second heat sink plate 8
Embodiment
To make the purpose, technical scheme and advantage of embodiment of the present invention clearer, below in conjunction with present invention implementation
Accompanying drawing in mode, the technical scheme in embodiment of the present invention is clearly and completely described, it is clear that described reality
The mode of applying is a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ability
The every other embodiment that domain those of ordinary skill is obtained under the premise of creative work is not made, belongs to the present invention
The scope of protection.Therefore, the detailed description of embodiments of the present invention below to providing in the accompanying drawings, which is not intended to limit, wants
The scope of the present invention of protection is sought, but is merely representative of the selected embodiment of the present invention.Based on the embodiment in the present invention,
The every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, belongs to this
Invent the scope of protection.
In the description of the invention, it is to be understood that the orientation or position relationship of the instruction such as term " on ", " under " are base
In orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than indicate or imply
Signified equipment or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The limitation of invention.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect；Can be joined directly together, can also be indirectly connected to by intermediary, can be in two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings：
It refer in Fig. 1, embodiment, a kind of laser of collection ETALON wave filters 5, including shell, substrate 3 and be arranged at
Chip of laser 1, the first heat sink plate 2, collimation lens 4, wave filter 5, light splitting piece 6, the PD chips 7, second of the top of substrate 3
Heat sink plate 8, the substrate 3 is rectangle shape.
Specifically, the chip of laser 1 is arranged in first heat sink plate 2, first heat sink plate 2 is mounted on institute
State on substrate 3, first heat sink plate 2 is parallel with the substrate 3 to be set；The collimation lens 4, wave filter 5 and light splitting piece 6
It is arranged in order distribution to realize irradiation of the laser by collimation lens 4 to light splitting piece 6, i.e., described collimation lens 4, wave filter 5 and divides
Mating plate 6 is linearly distributed；The PD chips 7 are arranged in second heat sink plate 8, PD chips 7 and described second heat sink
The assembly of plate 8 and the perpendicular setting of the substrate 3.
It refer in Fig. 1, embodiment, the light splitting piece 6 is arranged on the rear of wave filter 5, and the light splitting piece 6 is used for will
On laser reflection to PD chips 7；I.e. described chip of laser 1, collimation lens 4, wave filter 5, light splitting piece 6 and PD chips 7 are overall
The L-shaped shape in position is set, and the PD chips 7, which can further be connected with microampere meter, to be used to detect whether photoelectric current reaches lock ripple effect
Really..
Further, the chip of laser 1 is by collimation lens 4 and wave filter 5, then is irradiated on light splitting wave plate, 5%
Light reflex on PD components 4,95% light projection is gone over, and is finally coupled in optical fiber, by adjust light splitting piece 6 angle and
Position, to reach certain photoelectric current, only 100 microns of PD photosurface, 300 microns of spot size, if only passing through attachment
Position is controlled, it is difficult to align, usually photoelectric current is inadequate, and it is anti-revisionist to have to, so the present invention first mounts PD, light splitting piece is adjusted afterwards
6, hot spot is snapped to PD photosensitive area, so reach enough photoelectric currents.
Specifically, defining the collimation lens 4 arrives the direction of the wave filter 5 for first direction；Define the light splitting piece 6
Placed angle and the first direction on vertical plane between angular range be a, wherein a scope be 44 °~46 °, it is excellent
Choosing, the value that a is chosen at the beginning is 45 ° and according to being subsequently that the photocurrent values of microampere meter are finely adjusted.
The thickness range for defining the light splitting piece 6 is d, and wherein d scope is 0.12mm~0.16mm；It is preferred that, it is thick
The value for spending d is 0.15mm；The light volume reflection for defining the reflecting piece accounts for the ratio for the light summation being irradiated in reflecting piece for b, its
Middle b scope is 4.7%~5.3%, the anti-reflection output light source arrived at optical fiber as last laser of light of remainder.
A kind of assemble method of the laser of collection ETALON wave filters 5, comprises the following steps：
S1：Chip of laser 1 is assembled in the first heat sink plate 2, and the first heat sink plate 2 is mounted on substrate 3；
S2：Collimation lens 4 is coupled on substrate 3 and ensures that the laser that chip of laser 1 is sent can be by collimation lens
4；
S3：Wave filter 5 is mounted into the rear on the direction of illumination of collimation lens 4；
S4:PD chips 7 are mounted onto the second heat sink plate 8, two gold threads are bound, then by overall attachment to substrate 3；
S5:The other end of two gold threads is connected with microampere meter；
S6:Pre- point UV glue on the substrate 3, light splitting wave plate is placed on to drip in advance according to angle a value to be had on the substrate 3 of UV glue；
S7：The detection photoelectric current of PD chips 7 is observed by microampere meter, light splitting piece 6 is gently stirred with instrument to adjust detection
The value of photoelectric current is more than 100 microamperes until photoelectric current is met；
S8：Pre-fixed using ultraviolet light irradiation UV glue, pass through a thermosetting adhesive curing；
S9：Shell is covered to be fixed.
The method is adapted to the attachment of the laser of all band filters 5, specifically, chip of laser 1 is assembled to first
In one heat sink plate 2, the first heat sink plate 2 is mounted on substrate 3, collimation lens 4 is coupled on substrate 3, and wave filter 5 is mounted
To behind collimation lens 4, then PD chips 7 are mounted onto the second heat sink plate 8, binding gold thread are carried out, then overall attachment is arrived
On substrate 3, it is connected by binding gold thread with outside microampere meter.
So complete after whole attachment, finally couple light splitting piece 6, point one drips UV glue on the substrate 3 first, then light splitting
Piece 6 is placed on UV glue according to 45 degree of directions, makes laser works, adjusts the output laser of chip of laser 1 in certain wavelength model
To meet the bandwidth requirement of wave filter 5 in enclosing, wave filter 5 is by filtered laser projection to light splitting piece 6, while observing microampere
Table, sees photocurrent values, if photocurrent values meet electric circuit inspection and required, UV curing, then concurrent heating solid glue, if photoelectric current is inclined
It is small, then light splitting piece 6 is gently fluctuated with tweezers, and observes the detection photoelectric current of PD chips 7 it is monitored, is required when photoelectric current is met
When, generally higher than 100uA will not mirror noise on such circuit and cause erroneous judgement, and will not introduce photoelectric current bad products,
Requirement to light path is suitably relaxed, and difficulty is reduced in technology controlling and process, and batch production can be achieved.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God is with principle, and any modification, equivalent substitution and improvements done etc. should be included within the scope of protection of the invention.
Claims (7)
1. a kind of laser of collection ETALON wave filters, it is characterised in that：Including shell, substrate and it is arranged at the surface
Chip of laser, the first heat sink plate, collimation lens, wave filter, light splitting piece, PD chips, the second heat sink plate；The laser core
Piece is arranged in first heat sink plate；The collimation lens, wave filter and light splitting piece be arranged in order distribution with realize laser by
Irradiation of the collimation lens to light splitting piece；The light splitting piece is used for laser reflection to PD chips；Second heat sink plate is set
In the PD chip-sides.
2. the laser of collection ETALON wave filters according to claim 1, it is characterised in that：The collimation lens is defined to arrive
The direction of the wave filter is first direction；Define the placed angle of the light splitting piece and the vertical plane on the first direction it
Between angular range be a, wherein a scope be 44 °~46 °.
3. the laser of collection ETALON wave filters according to claim 2, it is characterised in that：Define the thickness of the light splitting piece
Degree scope is d, and wherein d scope is 0.12mm~0.16mm；The light volume reflection for defining the reflecting piece accounts for and is irradiated to reflecting piece
On light summation ratio be b, wherein b scope be 4.7%~5.3%.
4. the laser of collection ETALON wave filters according to claim 1, it is characterised in that：The PD chips can be further
Being connected with microampere meter is used to detect whether photoelectric current reaches lock ripple effect.
5. a kind of assemble method of the laser of collection ETALON wave filters, it is characterised in that comprise the following steps：
S1：Chip of laser is assembled in the first heat sink plate, and the first heat sink plate is mounted on substrate；
S2：Collimation lens is coupled on substrate and ensures that the laser that chip of laser is sent can be by collimation lens；
S3：By wave filter attachment to the rear on collimation lens direction of illumination；
S4:By in PD chip attachment to the second heat sink plate, two gold threads are bound, then by overall attachment to substrate；
S5:The other end of two gold threads is connected with microampere meter；
S6:The pre- point UV glue on substrate, light splitting wave plate is placed on into drop in advance according to angle a value has on the substrate of UV glue；
S7：The detection photoelectric current of PD chips is observed by microampere meter, light splitting piece is gently stirred with instrument to adjust detection photoelectric current
Value until photoelectric current meet be more than 100 microamperes；
S8：Pre-fixed using ultraviolet light irradiation UV glue, pass through a thermosetting adhesive curing；
S9：Shell is covered to be fixed.
6. the assemble method of the laser of collection ETALON wave filters according to claim 5, it is characterised in that：In the S4
In step, the PD chips and second heat sink plate and the perpendicular setting of the substrate.
7. the assemble method of the laser of collection ETALON wave filters according to claim 5, it is characterised in that：In the S6
In step, the instrument can be tweezers or thin bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710560697.1A CN107171177A (en) | 2017-07-11 | 2017-07-11 | A kind of laser and its assemble method of collection ETALON wave filters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710560697.1A CN107171177A (en) | 2017-07-11 | 2017-07-11 | A kind of laser and its assemble method of collection ETALON wave filters |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107171177A true CN107171177A (en) | 2017-09-15 |
Family
ID=59823681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710560697.1A Pending CN107171177A (en) | 2017-07-11 | 2017-07-11 | A kind of laser and its assemble method of collection ETALON wave filters |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107171177A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430344Y (en) * | 2009-01-23 | 2010-03-24 | 惠州市华阳多媒体电子有限公司 | Laser device |
| CN103633551A (en) * | 2013-12-19 | 2014-03-12 | 武汉电信器件有限公司 | Method for encapsulating laser for on-chip optical interconnection |
| CN104917048A (en) * | 2015-07-06 | 2015-09-16 | 大连藏龙光电子科技有限公司 | Small packaged long-distance transmission DFB laser |
| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
-
2017
- 2017-07-11 CN CN201710560697.1A patent/CN107171177A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430344Y (en) * | 2009-01-23 | 2010-03-24 | 惠州市华阳多媒体电子有限公司 | Laser device |
| CN103633551A (en) * | 2013-12-19 | 2014-03-12 | 武汉电信器件有限公司 | Method for encapsulating laser for on-chip optical interconnection |
| CN104917048A (en) * | 2015-07-06 | 2015-09-16 | 大连藏龙光电子科技有限公司 | Small packaged long-distance transmission DFB laser |
| CN105259623A (en) * | 2015-10-30 | 2016-01-20 | 武汉电信器件有限公司 | Laser and grating coupler packaging structure and method |
Non-Patent Citations (1)
| Title |
|---|
| 罗荣辉 等: "《生物医学光子学》", 31 August 2008, 吉林大学出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102854582B (en) | Optical transmitting assembly, optical transceiver and manufacturing and applying method | |
| CN204721435U (en) | Security protection camera module | |
| CN205545575U (en) | Imaging module and electron device | |
| US9261362B2 (en) | Measuring device for distance measurement | |
| CN101761876B (en) | Optical fiber illumination system with optical feedback return circuit | |
| CN109632130A (en) | A kind of integrated fluorescence thermometric optical path modular device | |
| CN103091759A (en) | Narrow-band interference filter | |
| CN107357006B (en) | It is a kind of based on flat window type TO encapsulation Lens Coupling device, structures and methods | |
| CN112558243B (en) | Signal transmission optical module | |
| CN103392146B (en) | Light modulator | |
| CN108732574A (en) | A kind of multi-line laser radar light source and multi-line laser radar | |
| CN107430312A (en) | Coherent receiver | |
| CN107171177A (en) | A kind of laser and its assemble method of collection ETALON wave filters | |
| CN107193095A (en) | The method of adjustment of optical filter, apparatus and system | |
| CN106371177B (en) | A kind of assemble method of optical transceiver module | |
| CN204229009U (en) | A kind of optical filter of TO encapsulation | |
| CN107431080A (en) | Capturing element and filming apparatus | |
| CN208283555U (en) | A kind of multi-line laser radar light source and multi-line laser radar | |
| US11169336B2 (en) | Electro-optical circuit comprising an optical transmission path, electro-optical assembly for installation in such an electro-optical circuit and method for producing an optical interface of an electro-optical circuit | |
| CN209401635U (en) | Back incident-type photoelectric chip | |
| CN103701532B (en) | A kind of 10G PON OLT optical assembly structures | |
| CN209401634U (en) | Back incident-type coplanar electrodes photoelectric chip | |
| CN205666822U (en) | Optical module receiving circuit that compatible PIN and APD received | |
| CN209148940U (en) | A kind of optical lens that different directions optical path is imaged simultaneously | |
| CN209640543U (en) | A kind of light-receiving component with gold thread jumper connection element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170915 |