CN107167474B - Microstructure three-dimensional reconstruction system and method based on laser precision machining - Google Patents
Microstructure three-dimensional reconstruction system and method based on laser precision machining Download PDFInfo
- Publication number
- CN107167474B CN107167474B CN201710351798.8A CN201710351798A CN107167474B CN 107167474 B CN107167474 B CN 107167474B CN 201710351798 A CN201710351798 A CN 201710351798A CN 107167474 B CN107167474 B CN 107167474B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- processed
- microstructure
- laser
- dimensional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Laser Beam Processing (AREA)
- Numerical Control (AREA)
Abstract
The invention discloses a system and a method for three-dimensional reconstruction of a microstructure based on laser precision machining. Belongs to the field of laser precision machining, automatic control and material microstructure characterization, and is mainly applied to three-dimensional reconstruction of a metal material microstructure. Aiming at the three-dimensional space observation of the microstructure of the metal material, the invention provides a high-precision continuous slicing method based on laser precision machining, which controls the periodic reciprocating motion of a manipulator through programming, realizes the automation of the whole process of corrosion, drying and image acquisition, and greatly improves the efficiency of the preparation work of the metallographic phase of each layer of slices. The collected metallographic phase of each layer of slices can be used for the automatic three-dimensional model construction of a microstructure with high efficiency, large volume and high reliability. The invention solves the problems of low precision and low efficiency of the original continuous slicing technology, and finds a new processing method for microstructure characterization in the fields of material science and engineering.
Description
Technical Field
The invention relates to the field of laser precision machining, automatic control and material microstructure characterization, in particular to a microstructure three-dimensional reconstruction system and method based on laser precision machining.
Background
Three-dimensional observation and quantitative characterization of microscopic microstructure of materials are always the focus and difficulty in the fields of material science and engineering. Due to the fact that the material has numerous internal characteristic structures and complex spatial relationship, and the microstructure has diversity and variability, the spatial details of the microstructure cannot be effectively represented by adopting conventional metallographic observation. For this reason, the vast majority of materials scientists have mainly adopted the continuous slicing technique.
For metal materials, the three-dimensional reconstruction of the microstructure of the metal materials mostly adopts a continuous slicing technology, and the basic principle is to cut a three-dimensional object by using a series of imaginary parallel planes so as to obtain closed contour lines between the planes and the surface of the object, wherein the closed contour lines are used as the shape information of the object at different heights. And (3) obtaining topological appearances of continuous grinding and polishing sections of different microstructures and different layers, and connecting the obtained topological appearances of the two-dimensional accurate grinding sections by utilizing an upper computer image processing technology to obtain the three-dimensional spatial structure distribution of the microstructure. The technology has low price and high resolution, can accurately reproduce the internal structural characteristics of the material, and is widely applied to the three-dimensional reconstruction of material science.
However, the process of removing the tiny flakes of material layer by layer is very cumbersome, the study of the microstructure of the material can only be qualitatively observed on a two-dimensional ground plane, the accuracy of the measurement results is poor, the distance between the sliced layers is not well grasped, and can only depend to a large extent on the proficiency and subjective interpretation of the person and the measuring instrument used, and the enormous workload causes the person to have trouble and difficulty in obtaining three-dimensional overall information of the whole structure or surface.
Disclosure of Invention
The invention aims to solve the technical problem of providing a microstructure three-dimensional reconstruction system and a microstructure three-dimensional reconstruction method based on laser precision machining, which realize the automation of the whole processes of polishing, corrosion, drying and image acquisition by controlling the motion of a manipulator through an upper computer, greatly improve the efficiency of image acquisition work and are suitable for the construction of a microstructure three-dimensional model with high efficiency, large volume and high reliability.
The technical scheme for solving the technical problems is as follows:
a microstructure three-dimensional reconstruction system based on laser precision machining comprises a laser marking machine, a mechanical arm, a data acquisition card, an upper computer and an image acquisition device;
the manipulator is connected with the upper computer through a network cable, the laser marking machine is connected with the upper computer through the data acquisition card, and the image acquisition device is connected with the upper computer;
the laser marking machine is used for performing punching positioning and laser scanning on a workpiece to be processed according to a control signal of the upper computer and feeding a completion signal back to the upper computer;
the manipulator is used for clamping and moving a workpiece to be processed according to a control signal of the upper computer and feeding back a completion signal to the upper computer;
the image acquisition device is used for acquiring a slice image of the to-be-processed piece to be processed, analyzing and identifying the slice image to obtain a two-dimensional tissue structure information map and a slice layer thickness of the processed slice of the to-be-processed piece to be processed, and sending the two-dimensional tissue structure information map and the slice layer thickness to the upper computer;
the upper computer is used for sending control signals to the manipulator to control the manipulator to act; sending a control signal to the laser marking machine through the data acquisition card to control the action of the laser marking machine; and reconstructing a three-dimensional microstructure based on the two-dimensional tissue structure information map of the slice of the workpiece to be processed to be detected and the thickness of the slice layer.
The beneficial effect of this system is:
(1) the precision is high: the laser processing has the characteristics of high precision and strong controllability, and the interlayer spacing of the thinned surface can be accurately controlled by controlling laser processing parameters (power, walking speed, scanning times and the like) according to the material of the surface to be processed;
(2) the preparation efficiency is high: the rapid and efficient surface thinning can be realized through laser processing, the time for mechanical grinding, polishing and measuring in the traditional metallographic preparation process is reduced, and the metallographic preparation efficiency and precision are improved;
(3) the automation degree is high: through hardware control and software reconstruction of the system, efficient three-dimensional tissue automatic reconstruction is realized.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the device also comprises a drying device for drying the workpiece to be processed; the drying device is connected to the data acquisition card through a relay and used for the upper computer to send a control signal to the relay to control the action of the fan.
Further, the drying device is a fan.
The beneficial effect of adopting the further scheme is that: provides an efficient and controllable drying scheme.
Further, the image acquisition device is a CCD camera system and a desk-top metallographic microscope which are connected.
The beneficial effect of adopting the further scheme is that: the clear, high-resolution and automatic picture shooting is realized.
In addition, the invention also provides a microstructure three-dimensional reconstruction method based on laser precision machining, which comprises the following steps:
(1) fixing a workpiece to be processed, placing the workpiece on a workbench of a laser marking machine, and setting processing parameters of the laser marking machine;
(2) starting a laser marking machine to perform punching positioning and laser scanning so as to uniformly remove a thin layer material on the surface of a workpiece to be machined;
(3) clamping the scanned workpiece to be machined by the manipulator, moving the workpiece to be machined to a corrosion-resistant liquid tank, and putting the workpiece to be machined into a corrosion liquid for corrosion;
(4) the mechanical arm lifts out the corroded workpiece to be machined, moves to a cleaning workbench and is placed into an alcohol tank for cleaning;
(5) the mechanical arm moves the cleaned workpiece to be processed to a drying workbench, and a fan is started to dry the workpiece to be processed;
(6) the mechanical arm places the workpiece to be processed in the observation field of a metallographic microscope, and a microscope and a CCD camera are adopted for image acquisition;
(7) after the image acquisition is finished, the manipulator clamps the workpiece to be processed and resets the workpiece to the workbench of the laser marking machine, and the steps (1) to (6) are repeated until a two-dimensional position tissue image of the lamella meeting the test requirement is obtained;
(8) and the upper computer processes the image, corrects the position deviation of the image through the positioning hole, extracts the interlayer distance of the image information and the structure two-dimensional image information in the positioning hole calibration area, and reconstructs the three-dimensional image to obtain the three-dimensional structure of the microstructure.
The method has the beneficial effects that: the interlayer spacing of the two-dimensional microstructure obtained by the continuous slicing method is accurately controlled, the corrosion of the workpiece to be processed is accurately controlled, and the corrosion error between every two layers is reduced; the photo shooting position is positioned through laser drilling, so that the method is more accurate, and the method has transportability and strong universality.
Further, the processing parameters of the laser marking machine in the step (1) comprise laser power, laser walking speed, laser focal length and scanning times.
Further, the step (1) is preceded by the steps of: manufacturing a workpiece to be processed to obtain a flat, smooth and clean surface to be observed; and putting the observation surface of the workpiece to be processed, installing the workpiece to the fixing clamp and calibrating the workpiece by using the level meter.
Drawings
FIG. 1 is a system block diagram of the present invention.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
In view of the above problems of the existing three-dimensional reconstruction serial slicing technology for microscopic microstructures of materials, the invention aims to provide a new high-precision serial slicing method, and the automation of the whole process of polishing, corrosion, drying and image acquisition is realized by controlling the movement of a manipulator through an upper computer, so that the efficiency of the image acquisition work is greatly improved. The method can be suitable for the efficient, large-volume and high-reliability three-dimensional model construction of the microstructure.
As shown in fig. 1, a microstructure three-dimensional reconstruction system based on laser precision machining includes a laser marking machine, a manipulator, a drying device, a data acquisition card, an upper computer and an image acquisition device; the manipulator is connected with the upper computer through a network cable and receives and transmits signals based on a TCP/I P communication protocol; the laser marking machine is connected with an upper computer through a data acquisition card and receives signals; the fan is connected to the data acquisition card through the relay, is connected with the upper computer, and sends a signal through the data acquisition card to control the on/off of the fan; the microscope is connected with an upper computer through a CCD camera, collects two-dimensional tissue structure data of a to-be-processed piece section, analyzes and identifies the data, and is connected with the upper computer through a data line to automatically complete three-dimensional reconstruction of microscopic microstructures on line. The image acquisition device is a CCD camera and a microscope which are connected, and the drying device is a fan.
The laser standard-reaching machine is used for punching, positioning and laser scanning on a workpiece to be processed, the thinning precision of a submicron processed surface is guaranteed, and the processing efficiency is improved; the manipulator is used for clamping and moving the workpiece to be machined, the motion precision is high, a control signal can be output, automation of clamping, corroding and placing (shooting and thinning) of the workpiece to be machined by the manipulator is realized through programming, and the efficiency and the precision are improved; the fan is used for drying the workpiece to be processed; and the upper computer is used for controlling the movement of the manipulator and the action of the fan, analyzing and processing the two-dimensional tissue structure data of the slice of the workpiece to be processed, and reconstructing a three-dimensional microstructure based on the two-dimensional tissue structure information image of the slice and the slice thickness.
In addition, the invention also provides a microstructure three-dimensional reconstruction method based on laser precision machining, which comprises the following steps:
(1) manufacturing a workpiece to be processed to obtain a flat, smooth and clean surface to be observed;
(2) placing the observation surface of the workpiece to be processed, installing the workpiece to the fixed clamp and calibrating the workpiece by using a level meter;
(3) placing the fixed workpiece to be processed on a workbench of a laser marking machine, and setting processing parameters of the laser marking machine;
(4) starting a laser marking machine to perform punching positioning and laser scanning on the surface of the workpiece to be machined according to the set machining parameters to uniformly remove a thin layer material on the surface of the workpiece to be machined;
(5) clamping the scanned workpiece to be machined by the manipulator, moving the workpiece to be machined to a corrosion-resistant liquid tank, and putting the workpiece to be machined into a corrosion liquid for corrosion;
(6) the mechanical arm lifts out the corroded workpiece to be machined, moves to a cleaning workbench and is placed into an alcohol tank for cleaning;
(7) the mechanical arm moves the cleaned workpiece to be processed to a drying workbench, and the workpiece to be processed is air-dried by a fan;
(8) placing the air-dried workpiece to be processed in an observation field of a metallographic microscope by a manipulator, and collecting images by using the microscope and a CCD camera;
(9) after the image acquisition is finished, the manipulator clamps the workpiece to be processed and resets the workpiece to the workbench of the laser marking machine, and the steps (3) to (8) are repeated until a two-dimensional position tissue image of the lamella meeting the test requirement is obtained;
(10) and processing the image by using an upper computer, correcting the position deviation of the image through the positioning hole, extracting the interlayer distance of the image information and the structural two-dimensional image information in the positioning hole calibration area, and reconstructing the three-dimensional image to obtain the three-dimensional structure of the microstructure.
The method adopts laser precision processing to realize continuous slicing of the workpiece to be processed, accurately removes the thickness of surface materials (micron or submicron grade, and is selected according to the minimum characteristic dimension of a microstructure), realizes the control of the thickness of each layer of slices, improves the surface smoothness, and reduces the workload of metallographic phase grinding and polishing; meanwhile, laser drilling is used, accurate positioning is achieved, the follow-up photos are guaranteed to be in the same visual field, and the image processing precision and difficulty are improved.
The upper computer controls the mechanical arm to grab, move and corrode the sliced workpiece to be machined, the realization process is automatic and controllable, the corrosion time is accurate, and the corrosion effect of each layer is ensured to be consistent;
and finally, reconstructing the three-dimensional microstructure of the metal material based on the two-dimensional microstructure information map of the slice and the slice layer thickness.
Compared with the method for three-dimensional reconstruction by the traditional continuous slicing technology, the method has the following advantages:
1. the accuracy of the surface to be observed is guaranteed.
2. The interlayer spacing of the two-dimensional microstructure obtained by the continuous slicing method is accurately controlled.
3. The test process is accurate and controllable, and the automation degree is high.
4. The corrosion of the workpiece to be processed is accurately controlled, and the corrosion error between every two layers is reduced.
5. The photo shooting position is positioned through laser drilling, and the method is more accurate.
6. The technology has the advantages of portability and strong universality.
Example one
The equipment adopted in the embodiment is as follows: laser marking machine, manipulator, corrosion-resistant liquid groove, small-size fan, desktop metallographic microscope, CCD camera.
In the embodiment, a high-temperature nickel-based alloy i ncone l 690 with the thickness of 4mm is adopted to be processed.
The experimental parameters used in this example were: the laser removes the surface of the workpiece to be processed to a depth of 4 μm.
The three-dimensional reconstruction of the microstructure by adopting the materials and the test parameters is as follows:
(1) cutting the workpiece to be machined into a workpiece to be machined with a proper size by using electric spark cutting equipment, and obtaining a flat, smooth (polished) surface to be observed by a standard metallographic preparation process;
(2) placing the observation surface of the workpiece to be processed, installing the workpiece to the fixed clamp and calibrating the workpiece by using a level meter;
(3) operating a manipulator to clamp and place a well-fixed workpiece to be machined on a station of a laser marking machine, sending a signal to an upper computer and waiting, and starting the laser marking machine (setting relevant parameters of the laser marking machine) by the upper computer through a data acquisition card transmission signal;
(4) the laser marking machine is operated, punching and positioning are carried out on the surface of the workpiece to be machined, laser surface scanning is carried out, a layer of material with the thickness of 4 mu m on the surface of the workpiece to be machined is uniformly removed, and a signal is sent to an upper computer after the actions are finished;
(5) the upper computer receives an action completion signal of the marking machine, sends a signal through a network cable to start the mechanical arm to clamp the processed workpiece, moves the workpiece to a metallographic etching station, puts the workpiece to be processed into etching liquid for etching, waits, controls etching time by the upper computer timer, and sends an etching action completion signal;
(6) after the manipulator receives the action completion signal, the to-be-processed piece is lifted out of the corrosive liquid, moved to a station for cleaning, put into an alcohol tank for cleaning, and waits, the soaking time is controlled by an upper computer timer, and a cleaning action completion signal is sent out;
(7) the manipulator receives an action completion signal, the manipulator moves the sample to a drying station to be dried by the fan in operation, sends the action completion signal and waits, the upper computer receives the manipulator signal, the relay is controlled by the data acquisition card, the fan is started to dry the surface of the sample to be processed, the air drying time is controlled by the upper computer timer, the completion signal is sent, the fan is controlled by the relay to be closed, and then the upper computer sends a signal for starting the next operation of the manipulator;
(8) the manipulator receives the operation signal, starts to place the workpiece to be processed at a station of a metallographic microscope observation field of view, and waits;
(9) adopting a microscope and a CCD camera to carry out image acquisition: adjusting the magnification and the focal length, photographing the workpiece to be processed by using a CCD camera, and storing the photographed image in an upper computer;
(10) after the image acquisition is finished, inputting a finishing signal on an upper computer, sending an operation signal by the upper computer through a network cable, clamping a workpiece to be machined after a manipulator receives the signal, resetting the workpiece to the position of a station laser marking machine, and circulating the steps until enough lamella two-dimensional position organization images meeting the test requirement are obtained;
(11) and (3) automatically processing the image on line by using an upper computer, correcting the position deviation of the image through the positioning hole, extracting the image information in the positioning hole calibration area, and the interlayer distance of the two-dimensional image information of the structure, reconstructing the three-dimensional image, and finally obtaining the three-dimensional structure of the microstructure with high reliability.
Through the test steps, the three-dimensional reconstruction of the microscopic microstructure of the material is completed, the efficiency and the accuracy are obviously improved, and the method can be popularized and applied.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A microstructure three-dimensional reconstruction system based on laser precision machining is characterized by comprising a laser marking machine, a mechanical arm, a data acquisition card, an upper computer and an image acquisition device;
the manipulator is connected with the upper computer through a network cable, the laser marking machine is connected with the upper computer through the data acquisition card, and the image acquisition device is connected with the upper computer;
the laser marking machine is used for performing punching positioning and laser scanning on a workpiece to be processed according to a control signal of the upper computer and feeding a completion signal back to the upper computer;
the manipulator is used for clamping and moving a workpiece to be processed according to a control signal of the upper computer and feeding back a completion signal to the upper computer;
the image acquisition device is used for acquiring a slice image of the to-be-processed piece to be processed, analyzing and identifying the slice image to obtain a two-dimensional tissue structure information map and a slice layer thickness of the processed slice of the to-be-processed piece to be processed, and sending the two-dimensional tissue structure information map and the slice layer thickness to the upper computer;
the upper computer is used for sending control signals to the manipulator to control the manipulator to act; sending a control signal to the laser marking machine through the data acquisition card to control the action of the laser marking machine; reconstructing a three-dimensional microstructure based on the two-dimensional tissue structure information image of the slice of the workpiece to be processed to be detected and the thickness of the slice layer;
the device also comprises a drying device used for drying the workpiece to be processed; the drying device is connected to the data acquisition card through a relay and used for the upper computer to send a control signal to the relay to control the action of the fan.
2. The laser precision machining-based three-dimensional reconstruction system of a microstructure according to claim 1, wherein the drying device is a fan.
3. The laser precision machining-based microstructure three-dimensional reconstruction system according to claim 1, wherein the image acquisition device is a CCD camera system and a desktop metallographic microscope which are connected.
4. A microstructure three-dimensional reconstruction method based on laser precision machining is characterized by comprising the following steps:
(1) fixing a workpiece to be processed, placing the workpiece on a workbench of a laser marking machine, and setting processing parameters of the laser marking machine;
(2) starting a laser marking machine to perform punching positioning and laser scanning so as to uniformly remove a thin layer material on the surface of a workpiece to be machined;
(3) clamping the scanned workpiece to be machined by the manipulator, moving the workpiece to be machined to a corrosion-resistant liquid tank, and putting the workpiece to be machined into a corrosion liquid for corrosion;
(4) the mechanical arm lifts out the corroded workpiece to be machined, moves to a cleaning workbench and is placed into an alcohol tank for cleaning;
(5) the mechanical arm moves the cleaned workpiece to be processed to a drying workbench, and a fan is started to dry the workpiece to be processed;
(6) the mechanical arm places the workpiece to be processed in the observation field of a metallographic microscope, and a microscope and a CCD camera are adopted for image acquisition;
(7) after the image acquisition is finished, the manipulator clamps the workpiece to be processed and resets the workpiece to the workbench of the laser marking machine, and the steps (1) to (6) are repeated until a two-dimensional position tissue image of the lamella meeting the test requirement is obtained;
(8) and the upper computer processes the image, corrects the position deviation of the image through the positioning hole, extracts the interlayer distance of the image information and the structure two-dimensional image information in the positioning hole calibration area, and reconstructs the three-dimensional image to obtain the three-dimensional structure of the microstructure.
5. The method for three-dimensional reconstruction of microstructure based on laser precision machining according to claim 4, wherein the machining parameters of the laser marking machine of step (1) include laser power, laser walking speed, laser focal length and scanning times.
6. The method for three-dimensional reconstruction of microstructure based on laser precision machining according to claim 4, characterized in that said step (1) is preceded by the steps of: manufacturing a workpiece to be processed to obtain a flat, smooth and clean surface to be observed; and putting the observation surface of the workpiece to be processed, installing the workpiece to the fixing clamp and calibrating the workpiece by using the level meter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710351798.8A CN107167474B (en) | 2017-05-18 | 2017-05-18 | Microstructure three-dimensional reconstruction system and method based on laser precision machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710351798.8A CN107167474B (en) | 2017-05-18 | 2017-05-18 | Microstructure three-dimensional reconstruction system and method based on laser precision machining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107167474A CN107167474A (en) | 2017-09-15 |
| CN107167474B true CN107167474B (en) | 2020-04-21 |
Family
ID=59815231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710351798.8A Active CN107167474B (en) | 2017-05-18 | 2017-05-18 | Microstructure three-dimensional reconstruction system and method based on laser precision machining |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107167474B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109434644A (en) * | 2018-12-04 | 2019-03-08 | 奥士康科技股份有限公司 | A kind of auto slice grinding system |
| CN109596618B (en) * | 2018-12-26 | 2021-02-26 | 太原理工大学 | Three-dimensional modeling measurement method for micro multi-phase structure based on section profile sequence |
| CN109884104B (en) | 2019-03-14 | 2020-05-15 | 钢研纳克检测技术股份有限公司 | Three-dimensional reconstruction equipment and method for large-size high-throughput quantitative representation of material organizational structure |
| CN113138145A (en) * | 2021-04-28 | 2021-07-20 | 辽宁忠旺集团有限公司 | Large-diameter aluminum alloy ingot casting grain size inspection device and automatic inspection method |
| CN116148293B (en) * | 2023-04-24 | 2023-08-15 | 钢研纳克检测技术股份有限公司 | Material microstructure three-dimensional reconstruction method based on glow sputtering preparation |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319915B1 (en) * | 2003-04-04 | 2008-01-15 | The United States Of America As Represented By The Secretary Of The Air Force | High speed and repeatability serial sectioning device for 3-D reconstruction of microstructures |
| CN104318620A (en) * | 2014-10-21 | 2015-01-28 | 南京钢铁股份有限公司 | Three-dimensional reconstruction method of specimen surface by confocal microscope |
| CN104562129A (en) * | 2013-10-17 | 2015-04-29 | 富鼎电子科技(嘉善)有限公司 | Metallic matrix surface processing method |
| CN104764647A (en) * | 2015-03-25 | 2015-07-08 | 上海交通大学 | Heavy casting and forging macrosegregation simple three-dimensional reconstruction method |
-
2017
- 2017-05-18 CN CN201710351798.8A patent/CN107167474B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7319915B1 (en) * | 2003-04-04 | 2008-01-15 | The United States Of America As Represented By The Secretary Of The Air Force | High speed and repeatability serial sectioning device for 3-D reconstruction of microstructures |
| CN104562129A (en) * | 2013-10-17 | 2015-04-29 | 富鼎电子科技(嘉善)有限公司 | Metallic matrix surface processing method |
| CN104318620A (en) * | 2014-10-21 | 2015-01-28 | 南京钢铁股份有限公司 | Three-dimensional reconstruction method of specimen surface by confocal microscope |
| CN104764647A (en) * | 2015-03-25 | 2015-07-08 | 上海交通大学 | Heavy casting and forging macrosegregation simple three-dimensional reconstruction method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107167474A (en) | 2017-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107167474B (en) | Microstructure three-dimensional reconstruction system and method based on laser precision machining | |
| EP2920724B1 (en) | Automated high speed metallographic system | |
| CN110370286B (en) | Method for identifying rigid body space position of dead axle motion based on industrial robot and monocular camera | |
| US7317964B1 (en) | High speed and repeatability serial sectioning method for 3-D reconstruction of microstructures | |
| US10473558B2 (en) | Automated high speed metallographic system | |
| EP3535098B1 (en) | Automated high speed metallographic system | |
| KR20090057426A (en) | Offset correction methods and arrangement for positioning and inspecting substrates | |
| KR20090064443A (en) | Offset correction techniques for positioning substrates | |
| CN208780144U (en) | A kind of online vision detection system of connecting hole | |
| CN106271419A (en) | The most superoleophobic titanium alloy and the preparation method of aluminum alloy surface | |
| CN112096454A (en) | Tunnel lining crack repairing device | |
| Roy et al. | A semi-automated positioning system for contact-mode atomic force microscopy (AFM) | |
| CN102607880B (en) | Piezoelectric micro-dissection system, dissection depth positioning method and dissection method | |
| CN204065545U (en) | Based on microscopical digital slices scanning laser focusing device | |
| CN107314928B (en) | Device and method for efficiently reconstructing three-dimensional tissue morphology of material | |
| CN107009029B (en) | Broaching tool cutter tooth cross-scale surface pattern intelligence preparation method and device | |
| CN217332180U (en) | Novel full-automatic three-dimensional slicing platform | |
| CN109841549B (en) | Method for lossless transfer of self-supporting low-dimensional material | |
| CN217616539U (en) | Intelligent laser residual glue removing system for coating surface of airplane flap | |
| CN116124047A (en) | Roughness anisotropic parameter measurement method based on normal vector statistical characteristics | |
| CN113670205B (en) | System and method for three-dimensional detection of geometric parameters of film hole of aero-engine blade based on zoom microscopy | |
| CN115164751A (en) | Riveting aperture size detection system and method | |
| CN115096902A (en) | Motion control method and detection system for middle frame defects | |
| CN110455797B (en) | Matrix normalization correction method for metallographic microscope | |
| CN208171717U (en) | A kind of laser scanning guidance is lower for cutting the device of irregular biological tissue in parallel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |