CN107163547A - A kind of solid-solid phase change thermal interfacial material and preparation method thereof - Google Patents

A kind of solid-solid phase change thermal interfacial material and preparation method thereof Download PDF

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CN107163547A
CN107163547A CN201710346748.0A CN201710346748A CN107163547A CN 107163547 A CN107163547 A CN 107163547A CN 201710346748 A CN201710346748 A CN 201710346748A CN 107163547 A CN107163547 A CN 107163547A
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phase
solid
change thermal
strand
block polymers
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张杨飞
李安然
张聪
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Peking University
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6633Compounds of group C08G18/42
    • C08G18/6637Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/664Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666Compounds of group C08G18/48 or C08G18/52
    • C08G18/667Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38
    • C08G18/6674Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02Materials undergoing a change of physical state when used
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
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Abstract

The invention discloses a kind of solid-solid phase change thermal interfacial material and preparation method thereof.The phase-change thermal interface material includes at least one block polymers of polyurethane as matrix material, and is dispersed at least one of matrix material heat conductive filler;The block polymers of polyurethane includes soft segment strand and hard section strand, and after temperature exceedes phase transition temperature, soft segment strand is changed into amorphous state from crystalline state, and the thermal interfacial material occurs from a kind of solid-state phase to the transformation of another solid-state phase.The phase-change thermal interface material of the present invention no liquid and gas in phase transition process are produced, have the advantages that pliability is good, effect of impregnation is strong, heat transference efficiency is high, storing heat is big, suitable phase transition temperature, convenient formation, Volume Changes are small, performance is stable and service life is long, for the heat transference efficiency of device can be improved in heater members, the normal work of heater members is ensured, extends device lifetime.

Description

A kind of solid-solid phase-change thermal interfacial material and preparation method thereof
Technical field
The present invention relates to phase-change thermal interface material, more particularly to a kind of solid-solid phase-change thermal interfacial material and preparation method thereof.
Background technology
Information technology, the development of microelectric technique make electronic device show miniaturization, high-performance, high integration and many The development trend of function, device size develops from micron order to nanoscale, and power is sent out from the small scale integration of hundreds of milliwatts The large scale integrated circuit of hectowatt is opened up, causes the caloric value on unit volume/area to steeply rise.With stacking number Lifting, the raising of device integration, space is become extremely difficult by huge limitation, heat transfer, and issue of ASIC thermal failure is more protruded.
Thermal interfacial material is that one kind can bond two interfaces, the high heat conduction material with good heat conductive ability and wetability Material, it is most important during solving issue of ASIC thermal failure, accelerating heat transfer.Due between heater members surface and radiator There is imperceptible rough space, when two Studies On Contacts of Rough Surfaces, actual contact area is less than 1%, and remaining is equal For air void.The thermal conductivity of air is very low, causes the thermal contact resistance between heater members and radiator very big, heat without Method is rapidly delivered to radiator from heater members, and the refrigerating function of radiator can not be played completely, and heater members are due to warm Amount accumulation, temperature are too high, and hydraulic performance decline, service life will be caused to shorten, failure is even damaged.Use the hot interface of high thermal conductivity Hole between material filling interface, excludes air therein, sets up fast and effectively hot between electronic component and radiator Conduction pathway, can be greatly lowered thermal contact resistance, the effect of radiator is fully played, and ensure heater members just Often work.
Being currently being widely used thermal interfacial material mainly has heat-conducting silicone grease, phase-change material etc..Heat-conducting silicone grease is a kind of paste Thermal interfacial material, only need to apply last layer, it is not necessary to solidify when using in interface, but use after certain time, due to silicone grease Occur to degenerate, suction out or parch and solvent the reason such as volatilization aging, heat conductivility will decline to a great extent.Phase-change material is a kind of Heat transfer efficiency very high hot interface, usually solid-state, heat absorption is melt into liquid during more than certain temperature, prevents from continuing to heat up, and Fully wetting heat transfer interface, reaches the effect of augmentation of heat transfer.But traditional phase-change thermal interface is located under chip operating temperature In liquid phase, due to the mobility of liquid, cause the stability of faying face to decline, easily occur flowing spillover.
The content of the invention
It is an object of the invention to provide a kind of solid-solid phase-change thermal interfacial material, in heater members, to improve device Heat transference efficiency, ensures the normal work of heater members, extends device lifetime.
The phase-change thermal interface material that the present invention is provided includes:At least one block polymers of polyurethane as matrix material, Be dispersed at least one of matrix material heat conductive filler;The block polymers of polyurethane includes soft segment strand and hard Segment molecule chain, after temperature exceedes phase transition temperature, soft segment strand is changed into amorphous state from crystalline state, and the thermal interfacial material occurs From a kind of solid-state phase to the transformation of another solid-state phase.
In the solid-solid phase-change thermal interfacial material of the present invention, the block polymers of polyurethane accounts for the hot boundary by weight The 5%-99.99% of facestock material;The heat conductive filler accounts for the 0.01%-95% of the thermal interfacial material by weight.
The solid-solid phase-change temperature range of thermal interfacial material of the present invention is big, is 30-120 DEG C, between soft segment melt temperature and firmly Between section melt temperature, hard section ratio is higher, and phase transition temperature is higher.Less than soft segment melt temperature, the thermal interfacial material is solid-state; After hard section melt temperature, the thermal interfacial material is liquid.
Phase transformation is adjusted by the control of the species of soft segment in block polymers of polyurethane and hard section, molecular weight and its ratio Temperature:Soft segment part is made up of submissive regular strand, is easier to crystallize in temperature change and is melted, phase transition temperature is relatively low; Hard section is made up of the stronger strand of polarity, hydrogen bond is easily formed between the moieties group, cohesive energy is larger, crystallization temperature compared with Height, is difficult to melt, phase transition temperature is higher in temperature change;After the phase transition temperature for reaching soft segment, soft segment changes from crystalline solid state For amorphous state, locally there is mobility, surface wettability obtains essential lifting, thermal conductivity can be greatly enhanced and connect Contacting surface is accumulated, and now hard section remains as crystalline state, limits the flowing of soft segment, material is occurred without macroscopical flowing, keeps on the whole Solid forms, so as to realize the solid-solid phase-change at hot interface.
It is preferred that, the soft segment of the block polymers of polyurethane is poly-dihydric alcohol and/or polyvalent alcohol strand, described hard The strand that section obtains for isocyanates and chain extender reaction.According to soft and hard segments ratio demand, it polymerize isocyanates used and poly- The molar ratio of two (many) first alcohol is 5:95 to 95:Within the scope of 5.Wherein described chain extender is alcohols chain extender, for example Isosorbide-5-Nitrae one Butanediol, neopentyl glycol, 1,6-HD, glycerine, trimethylolpropane, diethylene glycol (DEG), triethylene glycol etc..
The heat conductive filler is the material of the forms such as the particle, fiber, thin slice of high heat conductance, preferably thermal conductivity be more than etc. Can be ceramics, such as zinc oxide, aluminum oxide, boron nitride, aluminium nitride, magnesia ceramic material in 10W/ (mK) material; Can also be metal, such as aluminium, copper, silver;Can also be carbon materials, such as graphene, CNT, carbon black, graphite flakes, carbon Fiber etc.;And their compositions.
Present invention also offers the preparation method of the solid-solid phase-change thermal interfacial material, referring to Fig. 1, comprise the following steps:
1) by the poly-dihydric alcohol and/or polyvalent alcohol organic solvent diluting of one or more molecular weight 100~100000, Obtain mixed solution;
2) in step 1) binary isocyanates and/or multicomponent isocyanate are added in obtained mixed solution, reaction is formed Performed polymer;
3) alcohols chain extender is added in performed polymer, chain extending reaction is carried out;
4) one or more heat conductive fillers are added in the reactant solution that chain extending reaction is completed, and add corresponding phase Hold agent, make solution dispersed;
5) by step 4) heating of obtained solution carries out polymerization curing reaction, while being dried in vacuo, until becoming completely For solid-state, block polymers of polyurethane based composites are obtained;
6) by step 5) obtained block polymers of polyurethane based composites heating and melting, hot pressing film forming obtains solid-solid Phase-change thermal interface material.
Above-mentioned steps 1) in, poly- two (many) first alcohol used are for example:Polyethylene glycol, polytetramethylene glycol, polypropylene glycol, polyethylene Alcohol, PTMG, polyester-diol etc..It is preferred that first that (many) the first alcohol of one or more poly- two are dry in 60-120 DEG C of vacuum It is blended after dry, is then added in organic solvent and dilutes, mechanical agitation is uniform, until poly- two (many) first alcohol are completely dissolved, is mixed Close solution.The organic solvent is preferably dimethylformamide, acetone, tetrahydrofuran etc., and its consumption by mass is poly- two 10~20 times of (many) member alcohol.
Above-mentioned steps 2) in, used two (many) first isocyanates are for example:Methyl diphenylene diisocyanate, toluene diisocyanate Acid esters, dimethyl diphenyl diisocyanate, hexamethylene diisocyanate, isoflurane chalcone diisocyanate, phenylene diisocyanate, Naphthalene diisocyanate etc..Added in mixed solution after two (many) first isocyanates, the sustained response preferably at a temperature of 50-100 DEG C 1-2 hours, form performed polymer.Isocyanates provides hard section strand, poly- two with chain extender reaction for block polymers of polyurethane (many) member alcohol provide soft segment strand for block polymers of polyurethane, according to soft and hard segments ratio demand, isocyanates and poly- two The molar ratio of (many) member alcohol is 5:95 to 95:Within the scope of 5.
Above-mentioned steps 3) in, the alcohols chain extender is for example:1,4 1 butanediols, neopentyl glycol, 1,6-HD, glycerine, Trimethylolpropane, diethylene glycol (DEG), triethylene glycol etc..It is preferably heated to 50-120 DEG C and carries out chain extending reaction 1-2 hours.Alcohols chain extender Addition by di-n-butylamine titrate isocyano method calculate obtain.
Above-mentioned steps 4) in, the heat conductive filler can be particle, fiber, thin slice of one or more high heat conductance etc. The filler of shape.According to the species of isocyanates, poly- two (many) first alcohol and heat conductive filler, corresponding thereto compatible is added Agent, carrying out mechanical agitation, sonic oscillation makes solution dispersed.
Above-mentioned steps 5) polymerization curing reaction is carried out preferably at a temperature of 50-100 DEG C.
Above-mentioned steps 6) 0.001~1mm film can be turned into hot pressing, cut into the size matched with heater members Using.
The solid-solid thermal interfacial material of the present invention when installing first, as shown in Fig. 2 being first to heat to higher than solid-solid phase alternating temperature 0-50 DEG C of degree, after after its softening, is pasted onto between heater members and radiator, and gradually pressure is applied to opposite side along side, It is expelled from air;Stop after heating, using natural cooling, eliminate the residual stress of thermal interfacial material, enhancing thermal interfacial material with The combination interface of heater members and radiator;After phase transition temperature, soft segment is recrystallized, and thermal interfacial material turns into shape invariance Solid, and keep combining closely with heater members and radiator.
The solid-solid phase-change thermal interfacial material that the present invention is provided is using block polymers of polyurethane as matrix, with high heat conductance The material of the forms such as grain, fiber, thin slice is filler, after heater members operating temperature exceedes phase transition temperature, and hot interface occurs From a kind of solid-state phase to the transformation of another solid-state phase, heat transference efficiency it is original it is higher on the basis of occur it is essential significantly Lifting, with the outstanding advantage that contact area is big, heat transfer efficiency is high, phase transition temperature modification scope is big.The solid-solid phase heating interface Material is due to the addition of high heat conductance filler, and itself has higher thermal conductivity;After solid-solid phase-change temperature, soft segment from Crystalline state is changed into amorphous state, and mobility strengthens, and thermal conductivity is further enhanced, and effectively can adhere to and infiltrate several On the surface of any shape and roughness, micro-pore is filled up, air is supplanted, contact area is greatly enhanced, reduces boundary The temperature difference between face;There is higher enthalpy of phase change simultaneously, heat is absorbed when helping to undergo phase transition.
To sum up, no liquid and gas are produced in solid-solid phase-change thermal interfacial material of the invention, phase transition process, with flexible Good, effect of impregnation is strong, heat transference efficiency is high, storing heat is big for property, suitable phase transition temperature, convenient formation, Volume Changes are small, performance The advantages of stable and service life is long.
Brief description of the drawings
The preparation method flow chart of Fig. 1 solid-solid phase-change thermal interfacial materials of the present invention.
Fig. 2 are installed and operation principle schematic diagram at solid-solid phase heating interface of the present invention first.
Embodiment
Below in conjunction with the accompanying drawings, the present invention, the model of but do not limit the invention in any way are expanded on further by embodiment Enclose.
Referring to Fig. 1, solid-solid phase-change thermal interfacial material is prepared by following step:
1st, the poly-dihydric alcohol of molecular weight 6000 is dried in vacuo 3 hours at 110 DEG C, is weighed 7.68g, is added to the two of 100mL Diluted in NMF solvent, mechanical agitation is uniform, until poly-dihydric alcohol is completely dissolved, obtains mixed solution.
2nd, 1.79g methyl diphenylene diisocyanates are slowly added in mixed solution, the sustained response 2 at a temperature of 60 DEG C Hour, form performed polymer.
3rd, 0.53g BDO chain extender is added in performed polymer, 70 DEG C is heated to and carries out chain extending reaction 2 hours. The method that the addition of chain extender titrates isocyano by di-n-butylamine, which is calculated, to be obtained.
4th, in the reactant solution that chain extending reaction is completed, 0.5g graphenes are added, silane coupler is added and it is carried out Surface is modified, and mechanical agitation, sonic oscillation make solution dispersed afterwards.
5th, solution heating carries out heating polymerization curing reaction at a temperature of 80 DEG C, while being dried in vacuo, until complete It is changed into solid-state, obtains the enhanced block polymers of polyurethane base composite wood of high heat conductance filler that can occur solid-solid phase-change Material:Content of soft segmer is 81%, 75-85 DEG C of solid-solid phase-change temperature, and thermal conductivity is more than 1W/ (mK).
6th, by composite heating and melting, the film that thickness is 0.1mm thickness is hot pressed into, cuts into and is matched with heater members Size, obtain solid-solid phase-change thermal interfacial material.
7th, thermal interfacial material is first to heat to 90 DEG C when installing first, after after its softening, is pasted onto heater members and radiating Between device, gradually apply pressure to opposite side along side, be expelled from air.Stop after heating, using natural cooling, eliminate heat The residual stress of boundary material, enhancing thermal interfacial material and heater members and the combination interface of radiator.After phase transition temperature, Soft segment is recrystallized, thermal interfacial material turns into the solid of shape invariance, and keeps combining closely with heater members and radiator.

Claims (10)

1. it is solid-solid phase-change thermal interfacial material a kind of phase-change thermal interface material, including at least one block polymers of polyurethane is made For matrix material, and it is dispersed at least one of matrix material heat conductive filler;The block polymers of polyurethane includes Soft segment strand and hard section strand, after temperature exceedes phase transition temperature, soft segment strand is changed into amorphous state from crystalline state, should Thermal interfacial material occurs from a kind of solid-state phase to the transformation of another solid-state phase.
2. phase-change thermal interface material as claimed in claim 1, it is characterised in that in the phase-change thermal interface material, by weight Gauge, the block polymers of polyurethane accounts for 5%-99.99%, and the heat conductive filler accounts for 0.01%-95%.
3. phase-change thermal interface material as claimed in claim 1, it is characterised in that its solid-solid phase-change temperature is 30-120 DEG C.
4. phase-change thermal interface material as claimed in claim 1, it is characterised in that the soft segment of the block polymers of polyurethane point Subchain is poly-dihydric alcohol and/or polyvalent alcohol strand, and the hard section strand is what isocyanates was obtained with chain extender reaction Strand.
5. the preparation method of any phase-change thermal interface material of Claims 1 to 4, comprises the following steps:
1) by the poly-dihydric alcohol and/or polyvalent alcohol organic solvent diluting of one or more molecular weight 100~100000, obtain Mixed solution;
2) in step 1) binary isocyanates and/or multicomponent isocyanate are added in obtained mixed solution, reaction forms pre-polymerization Body;
3) alcohols chain extender is added in performed polymer, chain extending reaction is carried out;
4) one or more heat conductive fillers are added in the reactant solution that chain extending reaction is completed, and are added corresponding compatible Agent, makes solution dispersed;
5) by step 4) heating of obtained solution carries out polymerization curing reaction, while being dried in vacuo, until being changed into consolidating completely State, obtains block polymers of polyurethane based composites;
6) by step 5) obtained block polymers of polyurethane based composites heating and melting, hot pressing film forming obtains solid-solid phase-change Thermal interfacial material.
6. preparation method as claimed in claim 5, it is characterised in that step 1) described in poly-dihydric alcohol and/or polyvalent alcohol One or more in following material:Polyethylene glycol, polytetramethylene glycol, polypropylene glycol, polyvinyl alcohol, PTMG two Alcohol and polyester-diol.
7. preparation method as claimed in claim 5, it is characterised in that step 2) described in binary isocyanates and/or polynary One or more of the isocyanates in following material:Methyl diphenylene diisocyanate, toluene di-isocyanate(TDI), dimethyl Biphenyl diisocyanate, hexamethylene diisocyanate, isoflurane chalcone diisocyanate, phenylene diisocyanate and the isocyanic acid of naphthalene two Ester.
8. preparation method as claimed in claim 5, it is characterised in that step 3) described in alcohols chain extender be selected from following chemical combination One or more in thing:1,4 1 butanediols, neopentyl glycol, 1,6-HD, glycerine, trimethylolpropane, diethylene glycol (DEG) and three Glycol.
9. preparation method as claimed in claim 5, it is characterised in that step 2) added by binary isocyanates and/or polynary different Cyanate and step 1) used in poly-dihydric alcohol and/or polyvalent alcohol mol ratio 5:95 to 95:In the range of 5.
10. preparation method as claimed in claim 5, it is characterised in that step 4) described in heat conductive filler be a kind of or many Plant the filler of the particle, fiber and/or chip shape of high heat conductance.
CN201710346748.0A 2017-05-17 2017-05-17 A kind of solid-solid phase change thermal interfacial material and preparation method thereof Pending CN107163547A (en)

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CN108383968A (en) * 2018-02-08 2018-08-10 中国工程物理研究院化工材料研究所 High heat conduction polyurethane solid-solid phase transition material and preparation method thereof
CN108424503A (en) * 2018-04-08 2018-08-21 李维治 A kind of high-effect composite polyurethane phase-change material and preparation method thereof
CN108624296A (en) * 2018-07-11 2018-10-09 桂林电子科技大学 A kind of composite solid-solid phase-change and preparation method thereof of boron nitride enhancing heat conduction
CN108751801A (en) * 2018-06-26 2018-11-06 长安大学 A kind of polyurethane/carbon black composite solid-solid phase-change modified asphalt mixture and preparation method thereof
CN109703127A (en) * 2019-01-09 2019-05-03 于洪海 A kind of composite board and its processing method
CN109749408A (en) * 2018-12-25 2019-05-14 苏州赛伍应用技术股份有限公司 A kind of heat-conducting interface material and its preparation method and application
CN109762130A (en) * 2019-01-21 2019-05-17 温州医科大学附属第二医院、温州医科大学附属育英儿童医院 One kind can be recycled defervescence plaster used
CN109913181A (en) * 2019-03-29 2019-06-21 上海亘多材料科技有限公司 Encapsulate the polyurethane wall material microcapsules and preparation method thereof of phase-change material
CN110964174A (en) * 2019-12-16 2020-04-07 长安大学 Solid-solid phase change material for actively cooling asphalt pavement, preparation method and application
CN111479837A (en) * 2017-10-25 2020-07-31 陶氏环球技术有限责任公司 Flexible packaging material for preserving food freshness

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Application publication date: 20170915