CN107163278A - A kind of preparation method for the inorganic hard plastic film material for adding organosilicon - Google Patents
A kind of preparation method for the inorganic hard plastic film material for adding organosilicon Download PDFInfo
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Abstract
The invention discloses a kind of preparation method for the inorganic hard plastic film material for adding organosilicon, the technology utilization MTES, dimethyldiethoxysilane, tetraethyl orthosilicate isoreactivity organic silicon solution are coated modification to polyester plastic material；By butylated amino resin, Amino resin, melamine phosphate, etc. raw material condense together, the performance of composite is improved by muffle furnace heating and calcining, addition coupling agent, defoamer, curing agent, the composition such as toughener, then solidified by membrane, surface activation process, coating, suspension levelling, obtain composite plastics material after the sequence of operations such as Drying and cooling.The plastic film material being prepared from, its transparency is high, heat-resisting, anti-corrosion, with preferable application prospect.The application as plastic film material made from the preparation method in the fields such as optics wearing layer, heat-resistant anticorrosive coating is also disclosed simultaneously.
Description
Technical field
The present invention relates to this technical field of plastic material, a kind of inorganic hard film for adding organosilicon is related specifically to
The preparation method of plastic material.
Background technology
Polyester plastic material has the advantages that small density, impact resistance, easy processing shaping, cheap, thus is increasingly subject to
Pay attention to, be now widely used for the fields such as optical instrument, aviation, building, traffic.But the weatherability of polyester plastic material is bad,
Hardness is low, not scratch resistant, and surface is easily scratched in use, declines the transparency of material, decorative effect deterioration, limitation
It uses scope.Therefore, while the one side of plastic, transparent superior performance is played, in order to improve the wear-resisting of polymeric substrate
Property, it is necessary to research and develop the organic/inorganic hybridization material of clear hard.Polysiloxane is the one kind being most widely used
Hybrid clear hard thin-film material, the hardness number for being present to ensure that film of Si-O keys is between silica and simple polymerisation
Between thing material, and the presence of chain alkyl then ensures the pliability of film and the binding ability with substrate.Polysiloxane
Half organic half inorganic molecule structures shape its excellent physical and chemical performance, especially in terms of heat resistance and insulating properties,
But have the shortcomings that bad with other polymer compatibilities.
Inorganic/organic Hybrid Materials have the performance advantage that conventional polymer is incomparable as a kind of new material.
The characteristics of due to nano-particle, material can be made in sides such as chemical property, mechanical performance and reason characteristics using its cooperative effect
Face obtains optimal overall performance.When polymer has functional effect in itself, nano-particle is combined therewith can produce newly again
Performance.Dissaving polymer has the performance advantage that linear polymer is incomparable as a kind of new material.Same dendroid
Polymer phase ratio, its synthesis technique is simple, cost is relatively low, but same again similar with dendritic in some performances, therefore
Dissaving polymer has very wide industrial applications prospect.It is traditional with most attention of the people to environmental protection
Curing technology is restricted greatly because of the volatile organic solvent using more pollution border, photocuring technology with its solidification temperature it is low,
Speed is fast, pollutes the remarkable advantage such as small and enjoys favor.
The content of the invention
In order to solve the above technical problems, the present invention provides a kind of system for the inorganic hard plastic film material for adding organosilicon
Preparation Method, technology utilization MTES, dimethyldiethoxysilane, tetraethyl orthosilicate, the tetraethyl orthosilicate etc.
Active organosilicon solution is coated modification to polyester plastic material；By butylated amino resin, Amino resin, trimerization
The raw material such as double (4- hydroxy-3-methyls phenyl) propane, the tetraethyl orthocarbonates of cyanamide phosphate, polyester, acetate fiber, 2,2- gather
It is combined, composite is improved by compositions such as muffle furnace heating and calcining, addition coupling agent, defoamer, curing agent, toughener
Performance, then solidified by membrane, surface activation process, coating, suspension levelling, obtained after the sequence of operations such as Drying and cooling
Composite plastics material.The inorganic hard plastic film material for the addition organosilicon being prepared from, its transparency is high, heat-resisting, anti-corrosion,
With preferable application prospect.The inorganic hard plastic film as adding organosilicon made from the preparation method is also disclosed simultaneously
Application of the material in the fields such as optics wearing layer, heat-resistant anticorrosive coating.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of preparation method for the inorganic hard plastic film material for adding organosilicon, is comprised the steps of：
(1) by 2-4 parts of MTES, 3-6 parts of dimethyldiethoxysilane, 4-7 parts of tetraethyl orthosilicate, silicon
Sour tetra-ethyl ester 3-7 parts are added in reactor and are reacted, 150-250 revs/min of mixing speed, and stirring is dripped successively after 10 minutes
The acetum 50ml for plus 4.5%, aqueous isopropanol 30ml, room temperature persistently stirs 60-90min, and then room temperature places 3h, obtains
Active organosilicon solution；
(2) by 5-8 parts of butylated amino resin, 1-3 parts of Amino resin, 2-4 parts of melamine phosphate, polyester
1-4 parts, 2-5 parts of acetate fiber, double (4- hydroxy-3-methyls phenyl) 2-4 part of the propane of 2,2-, 1-3 parts of tetraethyl orthocarbonates mix
Add in Muffle furnace and calcine after uniform, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 1-4 parts of coupling agent, curing agent 1-
4 parts and 2-3 part of toughener, temperature, which is heated, rises to 270-320 DEG C, reaction time 4-5h, and then temperature naturally cools to 160
DEG C, add 1-3 parts of defoamer, insulation reaction 30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 1-2 parts of curing agent is added again, after stirring, note
Enter progress thin-film material membrane in film balance, film balance cutting speed：55-60m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 80-100m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
Preferably, coupling agent is selected from VTES, (the 'beta '-methoxy second of vinyl three in the step (2)
Epoxide) silane, γ-aminopropyl trimethoxysilane, the one or more in 3- aminopropyl trimethoxysilanes.
Preferably, curing agent is selected from ethylenediamine, diethylenetriamine, meta-xylene, diamino-diphenyl in the step (2)
One or more in sulfone.
Preferably, toughener is selected from methyl methacrylate, styrene-butadiene, second in the step (2)
One or more in alkene-vinyl acetate co-polymer, acrylonitrile.
Preferably, defoamer is selected from higher alcohols, benzyl carbinol oleate, Laurate alcohol ester phenylacetate, diformazan in the step (2)
One or more in base silicone oil.
Preferably, the composition of surfactant is 5 parts of sodium n-alkylbenzenesulfonate, fatty alcohol polyoxy in the step (4)
3 parts of ethene ether sodium sulfate, 2 parts of neopelex, 1 part of p toluene sulfonamalde formalde hyde resin, cumyl hydroperoxide 4
Part, 3 parts of terpinyl acetate, 2 parts of 1- phenyl cyclopentane-carboxylic acid, 3 parts of trichloroacetaldehyde, 15 parts of deionized water
Exist present invention also offers the inorganic hard plastic film material of the addition organosilicon obtained by above-mentioned preparation method
Application in the fields such as optics wearing layer, heat-resistant anticorrosive coating.
Compared with prior art, its advantage is the present invention：
(1) a kind of preparation method of the inorganic hard plastic film material of addition organosilicon of the invention utilizes the second of methyl three
TMOS, dimethyldiethoxysilane, tetraethyl orthosilicate, tetraethyl orthosilicate isoreactivity organic silicon solution are to polyester plastics material
Material is coated modification；By butylated amino resin, Amino resin, melamine phosphate, polyester, acetate fiber,
The raw material such as 2,2- double (4- hydroxy-3-methyls phenyl) propane, tetraethyl orthocarbonates condense together, and are forged by muffle furnace heating
Burn, add the performance that the compositions such as coupling agent, defoamer, curing agent, toughener improve composite, then solidified by membrane,
Composite plastics material is obtained after the sequence of operations such as surface activation process, coating, suspension levelling, Drying and cooling.It is prepared from
The inorganic hard plastic film material of organosilicon is added, its transparency is high, heat-resisting, anti-corrosion, with preferable application prospect.
(2) the inorganic hard plastic film material feedstock of addition organosilicon of the invention be easy to get, technique it is simple, suitable for advising greatly
Mould industrialization is used, practical.
Embodiment
The technical scheme of invention is described in detail with reference to specific embodiment.
Embodiment 1
(1) by 2 parts of MTES, 3 parts of dimethyldiethoxysilane, 4 parts of tetraethyl orthosilicate, silicic acid tetrem
3 parts of ester, which is added in reactor, to be reacted, 150 revs/min of mixing speed, and 4.5% vinegar is added dropwise in stirring successively after 10 minutes
Acid solution 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 60min, and then room temperature places 3h, obtains active organosilicon molten
Liquid；
(2) by 5 parts of butylated amino resin, 1 part of Amino resin, 2 parts of melamine phosphate, 1 part of polyester, vinegar
Muffle is added after double (4- hydroxy-3-methyls phenyl) 2 parts of the propane of sour 2 parts of fiber, 2,2-, 1 part of tetraethyl orthocarbonate are well mixed
In stove calcine, heating-up temperature to 95 DEG C preheating, after stirring, add 1 part of VTES, 1 part of ethylenediamine and
2 parts of methyl methacrylate, temperature heating rises to 270 DEG C, reaction time 4h, and then temperature naturally cools to 160 DEG C, addition
1 part of higher alcohols, insulation reaction 30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 1 part of ethylenediamine is added again, after stirring, injection
Thin-film material membrane, film balance cutting speed are carried out in film balance：55m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 80m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
Embodiment 2
(1) by 3 parts of MTES, 4 parts of dimethyldiethoxysilane, 5 parts of tetraethyl orthosilicate, silicic acid tetrem
4 parts of ester, which is added in reactor, to be reacted, 180 revs/min of mixing speed, and 4.5% vinegar is added dropwise in stirring successively after 10 minutes
Acid solution 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 70min, and then room temperature places 3h, obtains active organosilicon molten
Liquid；
(2) by 6 parts of butylated amino resin, 2 parts of Amino resin, 3 parts of melamine phosphate, 2 parts of polyester, vinegar
Muffle is added after double (4- hydroxy-3-methyls phenyl) 2 parts of the propane of sour 3 parts of fiber, 2,2-, 2 parts of tetraethyl orthocarbonate are well mixed
Calcined in stove, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 2 parts of vinyl three ('beta '-methoxy ethyoxyl) silane, two
2 parts of 2 parts of ethene triamine and styrene-butadiene, temperature heating rise to 290 DEG C, reaction time 4.3h, then temperature
160 DEG C are naturally cooled to, 2 parts of benzyl carbinol oleate, insulation reaction 30min is added；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 1 part of diethylenetriamine is added again, after stirring,
Inject and thin-film material membrane is carried out in film balance, film balance cutting speed：57m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 90m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
Embodiment 3
(1) by 3 parts of MTES, 5 parts of dimethyldiethoxysilane, 6 parts of tetraethyl orthosilicate, silicic acid tetrem
6 parts of ester, which is added in reactor, to be reacted, 220 revs/min of mixing speed, and 4.5% vinegar is added dropwise in stirring successively after 10 minutes
Acid solution 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 80min, and then room temperature places 3h, obtains active organosilicon molten
Liquid；
(2) by 7 parts of butylated amino resin, 2 parts of Amino resin, 3 parts of melamine phosphate, 3 parts of polyester, vinegar
Muffle is added after double (4- hydroxy-3-methyls phenyl) 3 parts of the propane of sour 4 parts of fiber, 2,2-, 2 parts of tetraethyl orthocarbonate are well mixed
Calcined in stove, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 3 parts of γ-aminopropyl trimethoxysilane, meta-xylene
3 parts and 3 parts of ethylene-vinyl acetate copolymer, temperature heating rise to 305 DEG C, reaction time 4.8h, and then temperature is naturally cold
But to 160 DEG C, 2 parts of Laurate alcohol ester phenylacetate, insulation reaction 30min are added；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 2 parts of meta-xylene is added again, after stirring, note
Enter progress thin-film material membrane in film balance, film balance cutting speed：59m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 95m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
Embodiment 4
(1) by 4 parts of MTES, 6 parts of dimethyldiethoxysilane, 7 parts of tetraethyl orthosilicate, silicic acid tetrem
7 parts of ester, which is added in reactor, to be reacted, 250 revs/min of mixing speed, and 4.5% vinegar is added dropwise in stirring successively after 10 minutes
Acid solution 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 90min, and then room temperature places 3h, obtains active organosilicon molten
Liquid；
(2) by 8 parts of butylated amino resin, 3 parts of Amino resin, 4 parts of melamine phosphate, 4 parts of polyester, vinegar
Muffle is added after double (4- hydroxy-3-methyls phenyl) 4 parts of the propane of sour 5 parts of fiber, 2,2-, 3 parts of tetraethyl orthocarbonate are well mixed
Calcined in stove, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 4 parts of 3- aminopropyl trimethoxysilanes, diaminourea hexichol
3 parts of 4 parts of base sulfone and acrylonitrile, temperature heating rise to 320 DEG C, reaction time 5h, and then temperature naturally cools to 160 DEG C, plus
Enter 3 parts of dimethicone, insulation reaction 30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 2 parts of diamino diphenyl sulfone is added again, is stirred
Afterwards, thin-film material membrane, film balance cutting speed are carried out in injection film balance：60m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 100m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
Comparative example 1
(1) 2 parts of MTES, 3 parts of dimethyldiethoxysilane, 4 parts of tetraethyl orthosilicate are added to instead
Answer in kettle and reacted, 4.5% acetum 50ml is added dropwise in 150 revs/min of mixing speed, stirring successively after 10 minutes, different
Propanol solution 30ml, room temperature persistently stirs 60min, and then room temperature places 3h, obtains active organosilicon solution；
(2) it is 5 parts of butylated amino resin, 2 parts of melamine phosphate, 1 part of polyester, 2 parts of acetate fiber, 2,2- is double
Add in Muffle furnace and calcine after (4- hydroxy-3-methyls phenyl) 2 parts of propane, 1 part of tetraethyl orthocarbonate are well mixed, heating-up temperature
To 95 DEG C of preheatings, after stirring, 2 parts of 1 part of VTES, 1 part of ethylenediamine and methyl methacrylate are added,
Temperature heating rises to 270 DEG C, reaction time 4h, and then temperature naturally cools to 160 DEG C, adds 1 part of higher alcohols, insulation reaction
30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 1 part of ethylenediamine is added again, after stirring, injection
Thin-film material membrane, film balance cutting speed are carried out in film balance：55m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 80m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
Comparative example 2
(1) by 4 parts of MTES, 6 parts of dimethyldiethoxysilane, 7 parts of tetraethyl orthosilicate, silicic acid tetrem
7 parts of ester, which is added in reactor, to be reacted, 250 revs/min of mixing speed, and 4.5% vinegar is added dropwise in stirring successively after 10 minutes
Acid solution 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 90min, and then room temperature places 3h, obtains active organosilicon molten
Liquid；
(2) by 8 parts of butylated amino resin, 3 parts of Amino resin, 4 parts of melamine phosphate, 4 parts of polyester, vinegar
Muffle is added after double (4- hydroxy-3-methyls phenyl) 4 parts of the propane of sour 5 parts of fiber, 2,2-, 3 parts of tetraethyl orthocarbonate are well mixed
Calcined in stove, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 4 parts of 3- aminopropyl trimethoxysilanes, diaminourea hexichol
3 parts of 4 parts of base sulfone and acrylonitrile, temperature heating rise to 320 DEG C, reaction time 5h, and then temperature naturally cools to 160 DEG C, plus
Enter 3 parts of dimethicone, insulation reaction 30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 2 parts of diamino diphenyl sulfone is added again, is stirred
Afterwards, thin-film material membrane, film balance cutting speed are carried out in injection film balance：60m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed
For 100m/min；
(5) thin-film material that step (4) is coated with into organic silicon solution hangs levelling, first heats 15min in 60 DEG C of baking ovens,
85 DEG C of heating 20min are then heated to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
The performance test results of the inorganic hard plastic film material of obtained addition organosilicon are as shown in table 1.
The inorganic hard plastic film material of embodiment 1-4 and comparative example 1-2 obtained addition organosilicon is entered respectively
Row light transmittance, resistance to thermal degradation temperature, this several performance tests of adhesive force.
Table 1
| Light transmittance % | Resistance to thermal degradation temperature DEG C | Adhesive force/level | |
| Embodiment 1 | 91.2 | 395 | 1 |
| Embodiment 2 | 90.5 | 403 | 1 |
| Embodiment 3 | 90.9 | 397 | 1 |
| Embodiment 4 | 91.1 | 401 | 1 |
| Comparative example 1 | 85.2 | 347 | 2 |
| Comparative example 2 | 61.3 | 183 | 3 |
A kind of preparation method of the inorganic hard plastic film material of addition organosilicon of the present invention utilizes the ethoxy of methyl three
Base silane, dimethyldiethoxysilane, tetraethyl orthosilicate, tetraethyl orthosilicate isoreactivity organic silicon solution are to polyester plastic material
It is coated modification；By butylated amino resin, Amino resin, melamine phosphate, polyester, acetate fiber, 2,
The raw material such as double (4- hydroxy-3-methyls phenyl) propane, the tetraethyl orthocarbonates of 2- condense together, and are forged by muffle furnace heating
Burn, add the performance that the compositions such as coupling agent, defoamer, curing agent, toughener improve composite, then solidified by membrane,
Composite plastics material is obtained after the sequence of operations such as surface activation process, coating, suspension levelling, Drying and cooling.It is prepared from
The inorganic hard plastic film material of organosilicon is added, its transparency is high, heat-resisting, anti-corrosion, with preferable application prospect.This hair
The inorganic hard plastic film material feedstock of bright addition organosilicon is easy to get, technique simple, is used suitable for heavy industrialization, real
It is strong with property.
Embodiments of the invention are the foregoing is only, are not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright description is made, or directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (7)
1. a kind of preparation method for the inorganic hard plastic film material for adding organosilicon, it is characterised in that by following steps group
Into：
(1) by 2-4 parts of MTES, 3-6 parts of dimethyldiethoxysilane, 4-7 parts of tetraethyl orthosilicate, silicic acid four
3-7 parts of ethyl ester, which is added in reactor, to be reacted, 150-250 revs/min of mixing speed, and stirring is added dropwise successively after 10 minutes
4.5% acetum 50ml, aqueous isopropanol 30ml, room temperature persistently stirs 60-90min, and then room temperature places 3h, is lived
Property organic silicon solution；
(2) by 5-8 parts of butylated amino resin, 1-3 parts of Amino resin, 2-4 parts of melamine phosphate, polyester 1-4
Part, double (4- hydroxy-3-methyls phenyl) 2-4 parts of the propane of 2-5 parts of acetate fiber, 2,2-, 1-3 parts of tetraethyl orthocarbonate are well mixed
Add in Muffle furnace and calcine afterwards, heating-up temperature is to 95 DEG C of preheatings, after stirring, and adds 1-4 parts of coupling agent, 1-4 parts of curing agent
With 2-3 parts of toughener, temperature heating rises to 270-320 DEG C, reaction time 4-5h, and then temperature naturally cools to 160 DEG C, plus
Enter 1-3 parts of defoamer, insulation reaction 30min；
(3) reaction solution of step (2) is naturally cooled to 95 DEG C, 1-2 parts of curing agent is added again, after stirring, injection is drawn
Thin-film material membrane, film balance cutting speed are carried out in film machine：55-60m/min, then cold curing 24h；
(4) thin-film material of step (3) is put into surfactant and handled, soak 60min, then drying at room temperature；
(5) thin-film material of step (4) is put into the active organosilicon solution of step (1) and enters coating, Coating Speed is 80-
100m/min；
(6) thin-film material that step (5) is coated with into organic silicon solution hangs levelling, 15min is first heated in 60 DEG C of baking ovens, then
85 DEG C of heating 20min are warming up to, finally heated to 120 DEG C isothermal curing 3h, natural cooling is got product.
2. the preparation method of the inorganic hard plastic film material of addition organosilicon according to claim 1, its feature exists
In, in the step (2) coupling agent be selected from VTES, vinyl three ('beta '-methoxy ethyoxyl) silane,
One or more in γ-aminopropyl trimethoxysilane, 3- aminopropyl trimethoxysilanes.
3. the preparation method of the inorganic hard plastic film material of addition organosilicon according to claim 1, its feature exists
In, in the step (2) one kind in ethylenediamine, diethylenetriamine, meta-xylene, diamino diphenyl sulfone of curing agent or
It is several.
4. the preparation method of the inorganic hard plastic film material of addition organosilicon according to claim 1, its feature exists
In toughener is selected from methyl methacrylate, styrene-butadiene, ethylene-vinyl acetate in the step (2)
One or more in copolymer, acrylonitrile.
5. the preparation method of the inorganic hard plastic film material of addition organosilicon according to claim 1, its feature exists
In, in the step (2) defoamer in higher alcohols, benzyl carbinol oleate, Laurate alcohol ester phenylacetate, dimethicone one
Plant or several.
6. the preparation method of the inorganic hard plastic film material of addition organosilicon according to claim 1, its feature exists
In the composition of surfactant is 5 parts of sodium n-alkylbenzenesulfonate, sodium sulfate of polyethenoxy ether of fatty alcohol 3 in the step (4)
Part, 2 parts of neopelex, 1 part of p toluene sulfonamalde formalde hyde resin, 4 parts of cumyl hydroperoxide, terpinyl acetate
3 parts, 2 parts of 1- phenyl cyclopentane-carboxylic acid, 3 parts of trichloroacetaldehyde, 15 parts of deionized water.
7. the inorganic hard plastic film material of the addition organosilicon obtained according to any one of the claim 1-6 preparation methods
Application in the fields such as optics wearing layer, heat-resistant anticorrosive coating.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111621176A (en) * | 2020-06-05 | 2020-09-04 | 韦尔狄(广州)生物工程科技有限公司 | Preparation method of efficient nano self-cleaning protective coating |
| CN112512289A (en) * | 2020-11-23 | 2021-03-16 | 江苏展宝新材料有限公司 | Polyaryl oxadiazole shielding film and preparation method thereof |
| CN112659705A (en) * | 2020-10-10 | 2021-04-16 | 江苏双星彩塑新材料股份有限公司 | Base material for window film |
| CN112959781A (en) * | 2020-10-09 | 2021-06-15 | 江苏双星彩塑新材料股份有限公司 | Optical film substrate and preparation method thereof |
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2017
- 2017-05-23 CN CN201710367267.8A patent/CN107163278A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111621176A (en) * | 2020-06-05 | 2020-09-04 | 韦尔狄(广州)生物工程科技有限公司 | Preparation method of efficient nano self-cleaning protective coating |
| CN112959781A (en) * | 2020-10-09 | 2021-06-15 | 江苏双星彩塑新材料股份有限公司 | Optical film substrate and preparation method thereof |
| CN112959781B (en) * | 2020-10-09 | 2022-01-11 | 江苏双星彩塑新材料股份有限公司 | Optical film substrate and preparation method thereof |
| CN112659705A (en) * | 2020-10-10 | 2021-04-16 | 江苏双星彩塑新材料股份有限公司 | Base material for window film |
| CN112659705B (en) * | 2020-10-10 | 2022-01-18 | 江苏双星彩塑新材料股份有限公司 | Base material for window film |
| CN112512289A (en) * | 2020-11-23 | 2021-03-16 | 江苏展宝新材料有限公司 | Polyaryl oxadiazole shielding film and preparation method thereof |
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Application publication date: 20170915 |