CN107157309A - Electromagnetic oven cooker - Google Patents
Electromagnetic oven cooker Download PDFInfo
- Publication number
- CN107157309A CN107157309A CN201710527012.3A CN201710527012A CN107157309A CN 107157309 A CN107157309 A CN 107157309A CN 201710527012 A CN201710527012 A CN 201710527012A CN 107157309 A CN107157309 A CN 107157309A
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- mcu
- wafers
- temperature
- electromagnetic oven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims description 199
- 230000006698 induction Effects 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J27/00—Cooking-vessels
- A47J27/002—Construction of cooking-vessels; Methods or processes of manufacturing specially adapted for cooking-vessels
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J45/00—Devices for fastening or gripping kitchen utensils or crockery
- A47J45/06—Handles for hollow-ware articles
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J2202/00—Devices having temperature indicating means
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Electric Ovens (AREA)
Abstract
The embodiment of the invention provides a cooker of an induction cooker, which comprises: the pot body (10) and the handle (20), wherein the handle (20) is internally provided with a temperature-collecting communication chip (21); the temperature collection communication chip (21) includes: the radio frequency wafer (213) and the MCU wafer (212) are arranged in the substrate (211), and the MCU wafer (212) and the radio frequency wafer (213) are electrically connected on the substrate (211); the MCU wafer (212) is used for collecting the temperature of the induction cooker pot and outputting the temperature to the radio frequency wafer (213); and the radio frequency wafer (213) is used for inputting the temperature output by the MCU wafer (212) and sending the temperature to the induction cooker. The temperature-collecting communication chip formed by the embodiment has the temperature-collecting function and the radio frequency function, so that one chip integrates the functions of two chips in the prior art, and compared with the two chips, the chip is small in size, so that the occupied size of the chip in the electromagnetic oven cooker is small, and the cost is reduced.
Description
Technical field
The present embodiments relate to family's electro-technical field, more particularly to a kind of electromagnetic oven cooker.
Background technology
At present, electromagnetic oven is heated by Electromagnetic Heating to the food materials in electromagnetic oven cooker, in order to accurately control electricity
Magnetic stove is provided with two chips, a chip is adopts warm chip, separately to the heating process of electromagnetic oven cooker in electromagnetic oven cooker
One chip is radio frequency chip, adopts the temperature that warm chip is used to gather electromagnetic oven cooker, and sends the temperature to radio frequency chip,
The radio frequency chip is used to the temperature received being sent to electromagnetic oven, and electromagnetic oven receives the temperature of electromagnetic oven cooker, and in real time
According to heating process of the temperature control electromagnetic oven of electromagnetic oven cooker to electromagnetic oven cooker.But, such scheme in the prior art
Two chips are needed to complete, the two chips are big in the volume that electromagnetic oven cooker takes, and cost is also high.
The content of the invention
The embodiment of the present invention provides a kind of electromagnetic oven cooker, for reducing the volume that chip takes in electromagnetic oven cooker, drop
Low cost.
The embodiment of the present invention provides a kind of electromagnetic oven cooker, including：Pot and handle, wherein, it is provided with and adopts in the handle
Warm communication chip；
It is described to adopt warm communication chip and include：Substrate and the micro-control unit being arranged in the substrate
(Microcontroller Unit, MCU) wafer and radio frequency wafer, the MCU wafers and the radio frequency wafer are connected electrically in institute
State on substrate；
The MCU wafers, the temperature for gathering the electromagnetic oven cooker, and the temperature is exported brilliant to the radio frequency
Circle；
The radio frequency wafer, for inputting the temperature of the MCU wafers output, and is sent to electromagnetism by the temperature
Stove.
In the present embodiment, by the way that MCU wafers and radio frequency wafer are set on the same substrate, so as to form a Cai Wentong
Believe chip, this, which is adopted warm communication chip and both had, adopts temperature function or with radio-frequency enabled, therefore, integrated chip prior art
In two chips function, and a chip is compared with two chips, small volume, therefore it takes in electromagnetic oven cooker
Volume is also small, also reduces cost.
Alternatively, the communication interface of the MCU wafers and the communication interface of the radio frequency wafer are electrically connected in the substrate
Connect；
The MCU wafers, specifically for the temperature is exported to the radio frequency by the communication interface of the MCU wafers
Wafer；
The radio frequency wafer, specifically for inputting the temperature by the communication interface of the radio frequency wafer.
Compared with prior art, the encapsulation of the communication interface of MCU wafers is saved, the communication for also saving MCU wafers connects
The encapsulation of mouth, saves the partial encapsulation expense of chip, reduces cost.
Alternatively, the communication interface of the MCU wafers is input and output (Input Output IO) interface or serial outer
If interface (Serial Peripheral Interface, SPI) interface.
Alternatively, the communication interface of the radio frequency wafer is I/O interface or SPI interface.
Alternatively, the MCU wafers are electrically connected with the radio frequency wafer by chip internal cabling.So as to effectively reduce
Electromagnetic interference, and chip chamber cabling interference, improve the communication success rate between MCU wafers and the radio frequency wafer,
Reduce the communication delay between MCU wafers and the radio frequency wafer.
Alternatively, the MCU wafers, specifically for：Pass through simulation numeral (the Analog to of the MCU wafers
Digital, AD) analog signal of the temperature of electromagnetic oven cooker described in port processing, and the analog signal of the temperature is changed
For the data signal of the temperature, then the data signal of the temperature exported to the radio frequency wafer；
The radio frequency wafer, specifically for：The data signal of the temperature is inputted, and the data signal of the temperature is sent out
Give the electromagnetic oven.
Alternatively, the MCU wafers are connected on same GND pin with the radio frequency wafer, therefore, it can save power supply
GND pin encapsulation number, reduce encapsulation overhead.Or, the MCU wafers are connected to difference with the radio frequency wafer
GND pin on.
Alternatively, the MCU wafers are connected on same VDD pins with the radio frequency wafer, therefore, it can save power supply
VDD pins encapsulation number, reduce encapsulation overhead.Or, the MCU wafers are connected to difference with the radio frequency wafer
VDD pins on.
Alternatively, the radio frequency wafer, is additionally operable to receive the feedback information for the temperature that the electromagnetic oven is sent, and will
The feedback information is exported to the MCU wafers；
The MCU wafers, are additionally operable to input the feedback information of the radio frequency wafer output.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are this hairs
Some bright embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to these accompanying drawings.
The structural representation for the electromagnetic oven cooker that Fig. 1 provides for one embodiment of the invention；
The structural representation for the electromagnetic oven cooker that Fig. 2 provides for another embodiment of the present invention；
The structural representation for the electromagnetic oven cooker that Fig. 3 provides for yet another embodiment of the invention；
The structural representation of collection communication chip in the electromagnetic oven cooker that Fig. 4 provides for one embodiment of the invention.
Description of reference numerals：
10：Pot；
20：Handle；
21：Adopt warm communication chip；
211：Substrate；
212：MCU wafers；
212a：Communication interface；
212b：AD ports；
213：Radio frequency wafer；
213a：Communication interface.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The structural representation for the electromagnetic oven cooker that Fig. 1 provides for one embodiment of the invention, as shown in figure 1, the present embodiment
Electromagnetic oven cooker, including：Pot 10 and handle 20.Pot 10 can contain food materials, be placed in electromagnetic oven cooker on electromagnetic oven
When, electromagnetic oven is heated by Electromagnetic Heating to the food materials in pot 10, such as frying boiling.Wherein, handle 20 and pot
10 connections, handle 20 can be used for user and facilitate ground terminal to play pot 10.In order to solve to adopt Wen Xin in the prior art in the present embodiment
Piece occupies the larger defect of volume with radio frequency chip, and the present embodiment is provided with handle 20 and adopts warm communication chip 21, the Cai Wentong
It is chip to believe chip 21, and this, which is adopted warm communication chip 21 and both had, adopts temperature function or with radio-frequency enabled.
Wherein, the described of the present embodiment adopts warm communication chip 21 and included：Substrate 211, MCU wafers 212 and radio frequency wafer
213, MCU wafers 212 and radio frequency wafer 213 are arranged in substrate 211, and MCU wafers 212 and radio frequency wafer 213 electricity
It is connected on the substrate 211.Wherein, the MCU wafers 212 in the present embodiment are electrically connected with radio frequency wafer 213 so that MCU wafers
It can be communicated with the radio frequency wafer 213, because MCU wafers 212 and radio frequency wafer 213 are arranged in substrate 211, the MCU
Wafer 212 is electrically connected with radio frequency wafer 213 in the substrate 211.
Wherein, MCU wafers 212, the temperature for gathering the electromagnetic oven cooker, and the temperature is exported penetrated to described
Frequency wafer 213.The radio frequency wafer 213, for inputting the temperature of the output of MCU wafers 212, and the temperature is sent to
Electromagnetic oven.
The MCU wafers 212 of the present embodiment gather the temperature of electromagnetic oven cooker, and by the temperature of the electromagnetic oven cooker collected
Export to radio frequency wafer 213, the said temperature of the output of the input MCU of radio frequency wafer 213 wafers 212, radio frequency wafer 213 is by the temperature
It is sent to electromagnetic oven.
Alternatively, the radio frequency wafer 213, is additionally operable to receive the feedback information for the temperature that the electromagnetic oven is sent,
And export the feedback information to the MCU wafers 212.The MCU wafers 212, are additionally operable to input the radio frequency wafer 213
The feedback information of output.In the present embodiment, electromagnetic oven is received after the said temperature of the transmission of radio frequency wafer 213, also to penetrating
Frequency wafer 213 sends the feedback information of temperature, and radio frequency wafer 213 receives after the feedback information, the feedback information is exported
To MCU wafers 212, MCU wafers 212 input the feedback information of radio frequency wafer output.Therefore, the present embodiment can also be realized
In same chip, the two-way communication of MCU wafers 212 and radio frequency wafer 213.
In the present embodiment, by the way that MCU wafers and radio frequency wafer are set on the same substrate, so as to form a Cai Wentong
Believe chip, this, which is adopted warm communication chip and both had, adopts temperature function or with radio-frequency enabled, therefore, integrated chip prior art
In two chips function, and a chip is compared with two chips, small volume, therefore it takes in electromagnetic oven cooker
Volume is also small, also reduces cost.
Alternatively, the MCU wafers 212 are electrically connected with the radio frequency wafer 213 by chip internal cabling.So as to effectively
Reduce electromagnetic interference, and chip chamber cabling interference, improve logical between MCU wafers 212 and the radio frequency wafer 213
Believe success rate, also reduce the communication delay between MCU wafers 212 and the radio frequency wafer 213.
Wherein, radio frequency wafer 213 can be 315M wafer, or, radio frequency wafer 213 can also be 2.4G wifi or
Bluetooth wafer.
The structural representation for the electromagnetic oven cooker that Fig. 2 provides for another embodiment of the present invention, as shown in Fig. 2 the present embodiment
Electromagnetic oven cooker on the basis of the electromagnetic oven cooker shown in Fig. 1, MCU wafers 212 include communication interface 212a, radio frequency wafer
213 include communication interface 213a, moreover, the communication interface 212a of MCU wafers 212 and radio frequency wafer 213 communication interface 213a
Electrical connection so that MCU wafers can be electrically connected with the radio frequency wafer 213, because MCU wafers 212 and radio frequency wafer 213 are all provided with
Put in substrate 211, the communication interface 212a of the MCU wafers 212 is electrically connected together with the communication interface 213a of radio frequency wafer 213
When, the communication interface of the MCU wafers 212 is electrically connected with the communication interface of the radio frequency wafer in the substrate.
The MCU wafers 212, specifically for the temperature is exported by the communication interface 212a of the MCU wafers 212
To the radio frequency wafer 213；The radio frequency wafer 213, it is defeated specifically for the communication interface 213a by the radio frequency wafer 213
Enter the temperature that the MCU wafers 212 are exported, and the temperature is sent to electromagnetic oven.In the present embodiment, MCU wafers 212
The temperature of electromagnetic oven cooker is gathered, and the temperature of the electromagnetic oven cooker collected is exported into the communication interface to MCU wafers 212
212a, because the communication interface 212a of MCU wafers 212 is electrically connected with the communication interface 213a of radio frequency wafer 213, therefore MCU is brilliant
The communication interface 212a of circle 212 exports temperature the communication interface 213a to radio frequency wafer 213, and radio frequency wafer 213 passes through communication
Interface 213a inputs the temperature, and the temperature is sent to electromagnetic oven by radio frequency wafer 213.
Because the communication interface 212a of the MCU wafers 212 in the present embodiment and the communication interface 213a of radio frequency wafer 213 exist
Electrically connected in substrate 211, compared with prior art, save the encapsulation of the communication interface of MCU wafers, also save MCU wafers
Communication interface encapsulation, save the partial encapsulation expense of chip, reduce cost.
Alternatively, the communication interface 212a of the MCU wafers 212 and the radio frequency wafer 213 communication interface 213a lead to
Cross the electrical connection of chip internal cabling.So as to effectively reduce electromagnetic interference, and chip chamber cabling interference, improve MCU brilliant
Communication success rate between the communication interface 212a of circle 212 and the communication interface 213a of the radio frequency wafer 213, is also reduced
Communication delay between the communication interface 213a of the communication interface 212a of MCU wafers 212 and the radio frequency wafer 213.
Alternatively, in the first possible implementation, the communication interface of the MCU wafers is I/O interface, described to penetrate
The communication interface of frequency wafer is I/O interface.
Alternatively, in second of possible implementation, the communication interface of the MCU wafers is I/O interface, described to penetrate
The communication interface of frequency wafer is SPI interface.
Alternatively, in the third possible implementation, the communication interface of the MCU wafers is SPI interface, described to penetrate
The communication interface of frequency wafer is I/O interface.
Alternatively, in the 4th kind of possible implementation, the communication interface of the MCU wafers is SPI interface, described to penetrate
The communication interface of frequency wafer is SPI interface.
The structural representation for the electromagnetic oven cooker that Fig. 3 provides for yet another embodiment of the invention, as shown in figure 3, the present embodiment
Electromagnetic oven cooker on the basis of any of the above-described embodiment, the MCU wafers 212 include AD ports 212b.The MCU wafers
212 specifically for：The analog signal of the temperature of the electromagnetic oven cooker is gathered by the AD ports 212b of the MCU wafers 212,
And the analog signal of the temperature is converted to the data signal of the temperature, then the data signal of the temperature is exported to institute
State radio frequency wafer 213.The radio frequency wafer 213, specifically for：Input the data signal of the temperature, and by the temperature
Data signal is sent to the electromagnetic oven.
In the present embodiment, MCU wafers 212 gather the temperature of electromagnetic oven cooker by the AD ports 212b of MCU wafers 212
Analog signal, the analog signal is used for the temperature for indicating electromagnetic oven cooker, and the electromagnetic oven cooker that AD ports 212b is collected
The analog signal of temperature be converted to data signal, then the data signal is exported to radio frequency wafer 213.Radio frequency wafer 213 is defeated
Enter the data signal of MCU wafers input, and the data signal is sent to electromagnetic oven.
Alternatively, in the first possible implementation, the MCU wafers 212 connect respectively with the radio frequency wafer 213
It is connected on different GND pins, the MCU wafers 212 are connected to from the radio frequency wafer 213 on different VDD pins.
In second of possible implementation, the MCU wafers 212 are connected to not with the radio frequency wafer 213
On same GND pin, the MCU wafers 212 are connected on same VDD pins with the radio frequency wafer 213.Therefore, may be used
With the encapsulation number for the VDD pins for saving power supply, encapsulation overhead is reduced.
In the third possible implementation, the MCU wafers 212 are connected to same GND with the radio frequency wafer 213
On pin, the MCU wafers 212 are connected to from the radio frequency wafer 213 on different VDD pins.It therefore, it can save
The encapsulation number of the GND pin of power supply, reduces encapsulation overhead.
In the 4th kind of possible implementation, the MCU wafers 212 are connected to same GND with the radio frequency wafer 213
On pin, the MCU wafers 212 are connected on same VDD pins with the radio frequency wafer 213.It therefore, it can save power supply
The encapsulation number of VDD pins and GND pin, reduces encapsulation overhead.
As shown in figure 4, showing that the MCU wafers 212 are connected to same GND pin with the radio frequency wafer 213 in Fig. 4
On, the MCU wafers 212 are connected on same VDD pins with the radio frequency wafer 213.Wherein, it also show in Fig. 4 described
The internal structure of MCU wafers 212 and the radio frequency wafer 213.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (9)
1. a kind of electromagnetic oven cooker, including：Pot (10) and handle (20), it is characterised in that be provided with and adopt in the handle (20)
Warm communication chip (21)；
The warm communication chip (21) of adopting includes：Substrate (211) and the MCU wafers being arranged in the substrate (211)
(212) and radio frequency wafer (213), the MCU wafers (212) and the radio frequency wafer (213) are connected electrically in the substrate (211)
On；
The MCU wafers (212), the temperature for gathering the electromagnetic oven cooker, and the temperature is exported to the radio frequency
Wafer (213)；
The radio frequency wafer (213), for inputting the temperature of MCU wafers (212) output, and the temperature is sent
To electromagnetic oven.
2. electromagnetic oven cooker according to claim 1, it is characterised in that the communication interface of the MCU wafers (212)
(212a) is electrically connected with the communication interface (213a) of the radio frequency wafer (213) in the substrate (211)；
The MCU wafers (212), specifically for the temperature is defeated by the communication interface (212a) of the MCU wafers (213)
Go out to the radio frequency wafer (213)；
The radio frequency wafer (213), specifically for inputting the temperature by the communication interface (213a) of the radio frequency wafer (213)
Degree.
3. electromagnetic oven cooker according to claim 2, it is characterised in that the communication interface of the MCU wafers (212)
(212a) is I/O interface or SPI interface.
4. electromagnetic oven cooker according to claim 2, it is characterised in that the communication interface of the radio frequency wafer (213)
(213a) is I/O interface or SPI interface.
5. the electromagnetic oven cooker according to claim 1-4 any one, it is characterised in that the MCU wafers (212) and institute
Radio frequency wafer (213) is stated to electrically connect by chip internal cabling.
6. the electromagnetic oven cooker according to claim 1-4 any one, it is characterised in that the MCU wafers (212), tool
Body is used for：The analog signal of the temperature of the electromagnetic oven cooker is gathered by the AD ports (212b) of the MCU wafers (212),
And the analog signal of the temperature is converted to the data signal of the temperature, then the data signal of the temperature is exported to institute
State radio frequency wafer (213)；
The radio frequency wafer (213), specifically for：Input the data signal of the temperature, and by the data signal of the temperature
It is sent to the electromagnetic oven.
7. the electromagnetic oven cooker according to claim 1-4 any one, it is characterised in that the MCU wafers (212) and institute
Radio frequency wafer (213) is stated to be connected on same GND pin, or, the MCU wafers (212) and the radio frequency wafer (213) point
It is not connected on different GND pins.
8. the electromagnetic oven cooker according to claim 1-4 any one, it is characterised in that the MCU wafers (212) and institute
Radio frequency wafer (213) is stated to be connected on same VDD pins, or, the MCU wafers (212) and the radio frequency wafer (213) point
It is not connected on different VDD pins.
9. the electromagnetic oven cooker according to claim 1-4 any one, it is characterised in that the radio frequency wafer (213), also
For receiving the feedback information for the temperature that the electromagnetic oven is sent, and the feedback information is exported to the MCU wafers
(212)；
The MCU wafers (212), are additionally operable to input the feedback information of radio frequency wafer (213) output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710527012.3A CN107157309A (en) | 2017-06-30 | 2017-06-30 | Electromagnetic oven cooker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710527012.3A CN107157309A (en) | 2017-06-30 | 2017-06-30 | Electromagnetic oven cooker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107157309A true CN107157309A (en) | 2017-09-15 |
Family
ID=59826988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710527012.3A Pending CN107157309A (en) | 2017-06-30 | 2017-06-30 | Electromagnetic oven cooker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107157309A (en) |
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| CN102175341A (en) * | 2010-11-11 | 2011-09-07 | 浙江图维电力科技有限公司 | Accurate temperature measurement technology and device thereof for cable connector based on radio frequency technology |
| CN103453998A (en) * | 2013-08-09 | 2013-12-18 | 国家电网公司 | Self-energy-taking wireless temperature sensor and achieving method thereof |
| CN103720338A (en) * | 2012-10-16 | 2014-04-16 | 广东新功电器有限公司 | Intelligent sensing cookware powered through wireless induction |
| CN106845603A (en) * | 2015-12-04 | 2017-06-13 | 陈芒 | Cold chain article electronic label |
| CN207604766U (en) * | 2017-06-30 | 2018-07-13 | 浙江绍兴苏泊尔生活电器有限公司 | Electromagnetic oven cooker |
-
2017
- 2017-06-30 CN CN201710527012.3A patent/CN107157309A/en active Pending
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| CN102123531A (en) * | 2010-01-08 | 2011-07-13 | 上海酒店设备工程成套南翔厂有限公司 | Method for detecting whether a stove on electromagnetic oven |
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| CN103720338A (en) * | 2012-10-16 | 2014-04-16 | 广东新功电器有限公司 | Intelligent sensing cookware powered through wireless induction |
| CN103453998A (en) * | 2013-08-09 | 2013-12-18 | 国家电网公司 | Self-energy-taking wireless temperature sensor and achieving method thereof |
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Application publication date: 20170915 |
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