CN107153302A - The preparation method of reflector plate, backlight module and reflector plate - Google Patents
The preparation method of reflector plate, backlight module and reflector plate Download PDFInfo
- Publication number
- CN107153302A CN107153302A CN201710500703.4A CN201710500703A CN107153302A CN 107153302 A CN107153302 A CN 107153302A CN 201710500703 A CN201710500703 A CN 201710500703A CN 107153302 A CN107153302 A CN 107153302A
- Authority
- CN
- China
- Prior art keywords
- layer
- reflector plate
- heat dissipating
- reflecting
- reflecting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 66
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 21
- 230000005855 radiation Effects 0.000 claims description 21
- 239000004332 silver Substances 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 21
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 15
- 238000001704 evaporation Methods 0.000 claims description 13
- 230000008020 evaporation Effects 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 32
- 230000017525 heat dissipation Effects 0.000 abstract description 27
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 239000007769 metal material Substances 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 13
- 230000011514 reflex Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000007770 graphite material Substances 0.000 description 4
- 230000003760 hair shine Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
Abstract
The present invention relates to a kind of reflector plate, the reflector plate includes reflecting layer and heat dissipating layer, the reflecting layer includes reflecting surface and the back side relative to the reflecting surface, the heat dissipating layer is located at the back side in the reflecting layer, the reflector plate is fixed on the backboard of a backlight module and in the receiving space of backboard formation, the reflecting surface of the reflector plate is towards the light emission side of the backlight module, and the heat dissipating layer of the reflector plate contacts with the backboard.The preparation method that the present invention also provides a kind of backlight module and reflector plate.The reflector plate of the present invention includes reflecting layer and heat dissipating layer, the direct contact heating source of heat dissipating layer can be made, good heat dissipation effect, reflector plate with heat dissipating layer is arranged in backlight module, can be without pasting heat dissipation film on handset front case, so that display module and the distance of handset front case are widened, display effect is effectively lifted.
Description
Technical field
The present invention relates to display technology field, especially with regard to the making side of a kind of reflector plate, backlight module and reflector plate
Method.
Background technology
Smart mobile phone, refers to as PC, with independent operating system and independent running space, Ke Yiyou
User voluntarily installs the program of the third party service providers such as software, game, navigation offer, it is possible to by mobile communication network come real
Existing wireless network accesses the general name of type of cell phone.With electronic product towards light, thin, miniaturization fast-developing, existing intelligence
Mobile phone is nearly all used as display panel with liquid crystal display (Liquid Crystal Display, LCD).
Liquid crystal display module (Liquid Crystal Module, LCM) is the important composition part of liquid crystal display.Fig. 1
For a kind of planar structure schematic diagram of liquid crystal display module of the prior art.Liquid crystal display module 110 includes liquid crystal panel 11
With backlight module 12, backlight module 12 is mainly by backboard 121, light source 122, reflecting plate 123, light guide plate 124, optical diaphragm group
125 and the grade part of glue frame 126 assemble, light source 122, reflecting plate 123, light guide plate 124, optical diaphragm group 125 and glue frame 126
Be housed in backboard 121 formation receiving space in, then by liquid crystal panel 11 by black and white glue 13 paste be fixed to backlight module
On 12.As can be seen here, because liquid crystal does not light in itself, thus liquid crystal display needs configuration light source to be shown to realize picture, and
This also causes the heating part of mobile phone screen to be concentrated mainly on the light source assembly part of backlight module.
Cell-phone heating causes thermal source position thermal sensation strong, influences the comfort used, and excessive heating also results in chip
Frequency is reduced, or even burns out hardware, more likely causes fire when charging.Current mobile phone radiating mode is in fore shell
One layer of heat dissipation film is directly attached at upper position corresponding with liquid crystal display module, mobile phone is run to the heat produced and led by back
Go out, be not directly to be contacted with pyrotoxin yet with heat dissipation film, heat-conducting effect is poor, and the setting of heat dissipation film causes liquid crystal display mode
Gap between group and fore shell diminishes, and screen water ripples and hickie problem is occurred, influences display effect.
The content of the invention
It is an object of the invention to provide the preparation method of a kind of reflector plate, backlight module and reflector plate, good heat dissipation effect,
And display effect can be improved.
The present invention provides a kind of reflector plate, and the reflector plate includes reflecting layer and heat dissipating layer, and the reflecting layer includes reflection
Face and the back side relative to the reflecting surface, the heat dissipating layer are located at the back side in the reflecting layer, and the reflector plate is fixed on
On the backboard of one backlight module and in the receiving space of backboard formation, the reflecting surface of the reflector plate is towards the back of the body
The light emission side of optical mode group, the heat dissipating layer of the reflector plate is contacted with the backboard.
Further, the heat dissipating layer is the heat radiation material layer at the back side for being formed at the reflecting layer.
Further, the heat dissipating layer includes basalis and is formed at the heat radiation material layer of the substrate surface.
Further, the basalis is PET.
Further, the heat radiation material layer is made up of graphite or copper, aluminium, silver.
Further, the reflecting layer includes basalis and is formed at the layer of reflective material of the substrate surface.
Further, the layer of reflective material is constituted by silver or containing silver alloy.
The present invention also provides a kind of backlight module, including backboard and reflector plate as described above, and the reflector plate is fixed on
On the backboard and in the receiving space of backboard formation, the reflecting surface of the reflector plate is towards the backlight module
Light emission side, the heat dissipating layer of the reflector plate is contacted with the backboard.
The present invention also provides a kind of preparation method of reflector plate, including：
A base material is provided as basalis；
Layer of reflective material is formed on the basalis to obtain reflecting layer, the reflecting layer includes reflecting surface and relative
In the back side of the reflecting surface；
Heat dissipating layer is formed at the back side in the reflecting layer.
Further, the step of back side in the reflecting layer forms heat dissipating layer includes：
By way of laminating, coating, evaporation, sputter the heat dissipating layer is formed at the back side in the reflecting layer.
The reflector plate of the present invention includes reflecting layer and heat dissipating layer, can make the direct contact heating source of heat dissipating layer, good heat dissipation effect,
In addition, the reflector plate with heat dissipating layer is arranged in backlight module by the present invention, it can make without pasting heat dissipation film on handset front case
The distance for obtaining display module and handset front case is widened, and effectively lifts display effect.
Brief description of the drawings
Fig. 1 is a kind of existing structural representation of liquid crystal display module.
The structural representation for the reflector plate that Fig. 2 provides for first embodiment of the invention.
The structural representation for the reflector plate that Fig. 3 provides for second embodiment of the invention.
The structural representation for the reflector plate that Fig. 4 provides for third embodiment of the invention.
The structural representation for the backlight module that Fig. 5 provides for fourth embodiment of the invention.
The schematic flow sheet of the preparation method for the reflector plate that Fig. 6 provides for fifth embodiment of the invention.
Embodiment
Further to illustrate the present invention to reach the technological means and effect that predetermined goal of the invention is taken, below in conjunction with
Accompanying drawing and preferred embodiment, to embodiment, structure, feature and its effect of the present invention, are described in detail as after.
It should be noted that " coating " as described below refers to paste polymer, molten polymer or polymerization thing liquid
Paper, cloth, the method that composite (film) is made on plastic sheeting are coated on, " evaporation " refers to material to be filmed being placed in vacuum
In be evaporated or distil, be allowed to workpiece or substrate surface precipitation process, " sputter " refers under vacuum conditions, be passed through suitable
When inert gas as medium, by inert gas accelerating impact target, be knocked out target material surface atom, and in workpiece
Or the method for substrate surface formation plated film, " laminating " refers to forming two layers of film body into integral mistake by way of gum or hot pressing
Journey.Laminating, coating, evaporation, the technical process of sputter know for those skilled in the art, repeat no more herein.
First embodiment
The structural representation for the reflector plate that Fig. 2 provides for first embodiment of the invention.As shown in Fig. 2 the embodiment of the present invention
Reflector plate include reflecting layer 21 and heat dissipating layer 22.
Reflecting layer 21 is used to the light of reflective backlight improve the utilization rate of light source.
Specifically, reflecting layer 21 can be metallic reflector, full dielectric reflecting layer or inter metal dielectric reflecting layer, reflection
The reflection mode of layer 21 can be front reflex type (front-surfaced reflection) or back reflective (back-
Surfaced reflection), wherein, front reflex type refers to the mode that light direct irradiation is reflected on reflecting layer 21,
Back reflective refers to that light shines the mode on reflecting layer 21 through transparent medium again, it is preferred that the reflecting layer 21 of the present embodiment
Using the metallic reflector of front reflex type.
Specifically, reflecting layer 21 includes basalis 212 with forming the layer of reflective material 211 in the side surface of basalis 212 1,
Layer of reflective material 211 is not limited to by silver or constituted containing silver alloy, such as can also the high electrical conductivity as gold, aluminium, copper metal material
Material is constituted.
Reflecting layer 21 includes reflecting surface 213 and the back side relative to reflecting surface, and reflecting surface 213 is the formation in reflecting layer 21
There is a side surface of layer of reflective material 211, namely possess good reflection performance by silver or containing what the metal materials such as silver alloy were constituted
A side surface.It is appreciated that reflecting layer 21 could be arranged to one side by silver or containing silver alloy constitute or be set to it is two-sided by
Silver is constituted and reflecting effect is consistent containing silver alloy, is constituted for two-sided by silver or containing silver alloy and that reflecting effect is consistent is anti-
Layer 21 is penetrated, because surface is easily scratched in process, can protect a side surface as reflecting surface 213 by another side surface
It is used as the back side.
In an embodiment of the present invention, can also after reflecting layer 21 is made, reflecting surface 213 attach diaphragm with
The scratch surface in successive process is avoided, reflecting effect is influenceed.
Heat dissipating layer 22 is used for heat conduction and heat radiation, and it can play a part of isolation thermal source and component along both direction uniform heat conduction,
Namely also provide and be thermally isolated in terms of thickness while Homogeneouslly-radiating.
Heat dissipating layer 22 is located at the back side in reflecting layer 21.Specifically, in the present embodiment, heat dissipating layer 22 be be coated with, evaporation,
The modes such as sputter are formed directly into the heat radiation material layer at the back side in reflecting layer 21, and heat dissipating layer 22 is not limited to by graphite or metal material
Constitute, constituted such as the metal material by copper, aluminium, silver, it is preferred that the heat sink material that the heat dissipating layer 22 in the present embodiment is used for
Graphite.
Further, reflector plate is fixed on the backboard of a backlight module and in the receiving space of the formation of backboard 23,
Wherein, the reflecting surface 213 of reflector plate towards backlight module light emission side, namely towards backboard 23 formation receiving space opening
Side, the heat dissipating layer 22 of reflector plate contacts to transfer heat to outside with backboard 23.
Existing heat dissipation film generally includes base material, heat dissipating layer, gum and the mould release membrance set gradually, and wherein mould release membrance is in patch
Removed during attached heat dissipation film so that heat dissipation film is attached on handset front case by gum, because existing heat dissipation film includes multilayer knot
Structure so that the thickness of film body in itself is larger, and be to keep the reliable gap between liquid crystal display module and handset front case to ensure
The display effect of mobile phone screen, the integral thickness for causing mobile phone is increased.The present embodiment by heat sink material by directly passing through painting
The modes such as cloth, evaporation, sputter form the back side in reflecting layer 21 to form heat dissipating layer 22, regard reflecting layer 21 as heat dissipating layer 22
Base material and one layer of base material can be saved, and because reflector plate can be without being attached in backlight module by gum, thus can save
Go the gum structure of original heat dissipation film, thus reflecting layer 21 and heat dissipating layer 22 are set it is into a single integrated structure after, overall thickness
Less than the thickness sum of original reflector plate and heat dissipation film.Meanwhile, heat dissipating layer 22 is arranged on reflecting layer 21 and can directly be contacted
Pyrotoxin, radiating effect more preferably, and need not paste heat dissipation film on handset front case again so that display module and the distance of handset front case
Widen, effectively lift display effect.
The reflector plate of the present embodiment includes reflecting layer and heat dissipating layer, can make the direct contact heating source of heat dissipating layer, radiating effect
It is good, in addition, can be set directly in backlight module after heat dissipating layer is integrally formed on reflecting layer, without in handset front case
Upper patch heat dissipation film so that the distance of liquid crystal display module and handset front case is widened, and effectively lifts display effect.
Second embodiment
The structural representation for the reflector plate that Fig. 3 provides for second embodiment of the invention.As shown in figure 3, the embodiment of the present invention
Reflector plate include reflecting layer 31 and heat dissipating layer 32.
Reflecting layer 31 is used to the light of reflective backlight improve the utilization rate of light source.
Specifically, reflecting layer 31 can be metallic reflector, full dielectric reflecting layer or inter metal dielectric reflecting layer, reflection
Layer 31 reflection mode can be front reflex type or back reflective, wherein, front reflex type refers to light direct irradiation in reflecting layer
The mode reflected on 31, back reflective refers to that light shines the mode on reflecting layer 31 through transparent medium again, it is preferred that
The reflecting layer 31 of the present embodiment uses the metallic reflector of front reflex type.
In the present embodiment, reflecting layer 31 is anti-on heat dissipating layer 32 to be formed directly into the mode such as coating, evaporation, sputter
Penetrate material layer, reflecting layer 31 is not limited to constitute by silver or containing silver alloy, such as can also the high electrical conductivity as gold, aluminium and copper gold
Belong to material to constitute.
Reflecting layer 31 includes reflecting surface 311 and the back side relative to reflecting surface, and reflecting surface 311 namely reflecting layer 31 are dorsad
One side surface of heat dissipating layer 32, can also attach diaphragm (not shown) to avoid scratching in successive process on reflecting surface 311
Surface, influences reflecting effect.
Heat dissipating layer 32 is used for heat conduction and heat radiation, and it can play a part of isolation thermal source and component along both direction uniform heat conduction,
Namely also provide and be thermally isolated in terms of thickness while Homogeneouslly-radiating.
Heat dissipating layer 32 is located at the back side in reflecting layer 31.Specifically, in the present embodiment, heat dissipating layer 32 includes basalis 321
Heat radiation material layer 322 with being formed at the surface of basalis 321, heat radiation material layer 322 is formed in the mode such as coating, evaporation, sputter
On basalis 321, heat radiation material layer 322 is not limited to be made up of graphite or metal material, such as the metal material as copper, aluminium, silver
Material is constituted, it is preferred that the heat sink material that the heat radiation material layer 322 in the present embodiment is used is graphite, and basalis 321 is PET (poly-
Ethylene glycol terephthalate).
Further, reflector plate is fixed on the backboard of a backlight module and in the receiving space of backboard formation, its
In, the reflecting surface 311 of reflector plate towards backlight module light emission side, namely the receiving space towards backboard formation open side,
The heat dissipating layer 32 of reflector plate contacts to transfer heat to outside (set-up mode of reflector plate can join Fig. 2) with backboard.
The reflector plate of the present embodiment includes reflecting layer and heat dissipating layer, can make the direct contact heating source of heat dissipating layer, radiating effect
It is good, in addition, can be set directly in backlight module after heat dissipating layer is integrally formed on reflecting layer, without in handset front case
Upper patch heat dissipation film so that the distance of liquid crystal display module and handset front case is widened, and effectively lifts display effect.
3rd embodiment
The structural representation for the reflector plate that Fig. 4 provides for third embodiment of the invention.As shown in figure 4, the embodiment of the present invention
Reflector plate include reflecting layer 41, heat dissipating layer 42 and gum 43.
Reflecting layer 41 is used to the light of reflective backlight improve the utilization rate of light source.
Specifically, reflecting layer 41 can be metallic reflector, full dielectric reflecting layer or inter metal dielectric reflecting layer, reflection
The reflection mode of layer 41 can be front reflex type (front-surfaced reflection) or back reflective (back-
Surfaced reflection), wherein, front reflex type refers to the mode that light direct irradiation is reflected on reflecting layer 41,
Back reflective refers to that light shines the mode on reflecting layer 41 through transparent medium again, it is preferred that the reflecting layer 41 of the present embodiment
Using the metallic reflector of front reflex type.
Specifically, reflecting layer 41 includes basalis 412 with forming the layer of reflective material 411 in the side surface of basalis 412 1,
Layer of reflective material 411 is not limited to by silver or constituted containing silver alloy, such as can also the high electrical conductivity as gold, aluminium, copper metal material
Material is constituted.
Reflecting layer 41 includes reflecting surface 413 and the back side relative to reflecting surface, and reflecting surface 413 is the formation in reflecting layer 41
There is a side surface of layer of reflective material 411, namely possess good reflection performance by silver or containing what the metal materials such as silver alloy were constituted
A side surface.It is appreciated that reflecting layer 41 could be arranged to one side by silver or containing silver alloy constitute or be set to it is two-sided by
Silver is constituted and reflecting effect is consistent containing silver alloy, is constituted for two-sided by silver or containing silver alloy and that reflecting effect is consistent is anti-
Layer 41 is penetrated, because surface is easily scratched in process, can protect a side surface as reflecting surface 413 by another side surface
It is used as the back side.
In an embodiment of the present invention, can also after reflecting layer 41 is made, reflecting surface 413 attach diaphragm with
The scratch surface in successive process is avoided, reflecting effect is influenceed.
Heat dissipating layer 42 is used for heat conduction and heat radiation, and it can play a part of isolation thermal source and component along both direction uniform heat conduction,
Namely also provide and be thermally isolated in terms of thickness while Homogeneouslly-radiating.
Heat dissipating layer 42 is located at the back side in reflecting layer 41.Specifically, in the present embodiment, heat dissipating layer 42 includes basalis 421
Heat radiation material layer 422 with being formed at the surface of basalis 421, heat radiation material layer 422 is formed in the mode such as coating, evaporation, sputter
On basalis 421, heat radiation material layer 422 is not limited to be made up of graphite or metal material, such as the metal material as copper, aluminium, silver
Material is constituted, it is preferred that the heat sink material that the heat radiation material layer 422 in the present embodiment is used is graphite, and basalis 421 is PET (poly-
Ethylene glycol terephthalate).
The back side (side of basalis 412) in reflecting layer 41 is fitted between the basalis 421 of heat dissipating layer 42 by gum 43,
That is, the two is fitted again after reflecting layer 41 and heat dissipating layer 42 has been fabricated separately.By reflecting layer 41 by the way of laminating
Set and be integrated with heat dissipating layer 42, the optical property of reflector plate can be advantageously ensured that respectively using reflectance coating and heat dissipation film finished product.
Further, reflector plate is fixed on the backboard of a backlight module and in the receiving space of backboard formation, its
In, the reflecting surface 413 of reflector plate towards backlight module light emission side, namely the receiving space towards backboard formation open side,
The heat dissipating layer 42 of reflector plate contacts to transfer heat to outside (set-up mode of reflector plate can join Fig. 2) with backboard.
The reflector plate of the present embodiment includes reflecting layer and heat dissipating layer, can make the direct contact heating source of heat dissipating layer, radiating effect
It is good, in addition, can be set directly in backlight module after heat dissipating layer is integrally formed on reflecting layer, without in handset front case
Upper patch heat dissipation film so that the distance of liquid crystal display module and handset front case is widened, and effectively lifts display effect.
Fourth embodiment
The structural representation for the backlight module that Fig. 5 provides for fourth embodiment of the invention.As shown in figure 5, the present invention is implemented
The backlight module of example includes backboard 51, light source 52, reflector plate 53, light guide plate 54, optical diaphragm group 55 and glue frame 56.
Specifically, light source 52, reflector plate 53, light guide plate 54, optical diaphragm group 55 and glue frame 56 are housed in the shape of backboard 51
Into receiving space in, glue frame 56 is arranged between the side wall of backboard 51 and light guide plate 54, and optical diaphragm group 55 is arranged on leaded light
On plate 54.
Light source 52 is preferably provided at the side of light guide plate 54 to reduce the integral thickness of backlight module, and light source 52 is preferred to use
LED/light source, but be also not necessarily limited to use EL (Electro Luminesence, cold light), CCFL (Cold Cathode
Fluorescent Lamp, cathode fluorescent tube), OELD (Organic Light-Emitting Diode, organic light emission two
Pole pipe) etc. other light sources.
Reflector plate 53 includes reflecting layer 531 and heat dissipating layer 532, is not limited to first embodiment, second embodiment or the 3rd
The reflector plate that embodiment is provided.Specifically, reflecting layer 531 includes reflecting surface and the back side relative to reflecting surface, reflecting layer 531
Reflecting surface towards backlight module light emission side, it is namely relative with light guide plate 54, so as to be escaped from light guide plate 54
Light be reflected back light guide plate 54, improve the utilization rate of light source, heat dissipating layer 532 is located at the back side in reflecting layer 531 and connect with backboard 51
The heat for touching to produce light source 52 is exported to outside, and the back of the body is may be provided at due to heat dissipating layer 532 is formed on reflecting layer 531
In optical mode group so that the direct contact heat source of heat dissipating layer 532, good heat dissipation effect.In addition, heat dissipating layer 532 is formed in reflecting layer 531
Go up and be arranged in backlight module, can be without heat dissipation film be pasted on handset front case again so that display module and handset front case away from
From widening, display effect is effectively lifted.
Light guide plate 54 is used to conduct light so that the light of backlight module outgoing has suitable brightness and uniformity.Specifically
Ground, light guide plate 54 towards a side surface of reflector plate 53 be etched surface, with the light guiding points by chemical etching, and close to light
The size of the light guiding points in source 52 is more than the size of the light guiding points away from light source 52, a side surface of the back-reflection piece 53 of light guide plate 54
Make luminous energy uniform from front export for flour milling.Light guide plate 54 is made of optical grade acryl plates, utilizes optical grade Asia gram
Power sheet material makes the light that light source 52 is issued in the superficial residence of light guide plate 54, when light is mapped to each light guiding points, reflected light meeting
Toward all angles diffusion to destroy conditioned reflex, light is set to be projected by the front of light guide plate 54, by being configured on light guide plate 54
Density, light guiding points not of uniform size, can make the uniformly light-emitting of light guide plate 54.
Optical diaphragm group 55 includes multiple blooming pieces, and these blooming pieces are for example including diffusion sheet (Diffuser
Sheet), lin eyeglasses (prism sheet) etc., are modified to obtain for the direction of propagation to the light from the outgoing of light guide plate 54
To the light source for the optical characteristics for meeting liquid crystal display requirement.
Glue frame 56 is used for the other elements for supporting and fixing in backlight module, and plays closing light and the work of reflection light
With.Wherein, reflector plate 53 can be fixed by glue frame 56 without being fitted using gum, thus heat dissipating layer 532 is set
The gum that original heat dissipation film is used can be saved on reflecting layer 531 by putting, and the integral thickness of reflector plate 53 is less than original reflection
The thickness sum of piece and heat dissipation film, and assemble more convenient.
The backlight module of the present embodiment include with heat dissipating layer reflector plate so that heat dissipating layer can with direct contact heat source,
The heat that backlight is produced can be conducted by the heat dissipating layer on reflecting layer, good heat dissipation effect, meanwhile, by heat dissipating layer one
Body formation can be set directly in backlight module on reflecting layer, without pasting heat dissipation film on handset front case so that display mould
Group and the distance of handset front case are widened, and effectively lift display effect.
5th embodiment
The schematic flow sheet of the preparation method for the reflector plate that Fig. 6 provides for fifth embodiment of the invention.As shown in fig. 6, this
The preparation method of the reflector plate of embodiment includes making reflecting layer and heat dissipating layer, specifically may include：
Step 61 is used as basalis there is provided a base material.
Step 62, layer of reflective material is formed on the base layer to obtain reflecting layer, and reflecting layer includes reflecting surface and relative
In the back side of reflecting surface.
Specifically, reflecting layer includes basalis with forming the layer of reflective material in a basalis at least side surface, reflecting material
The bed of material is not limited to by silver or constituted containing silver alloy, such as can also the metal material of high electrical conductivity by gold, aluminium, copper constitute.It is excellent
Choosing, layer of reflective material is constituted by silver or containing silver alloy, and basalis is PET (polyethylene terephthalate).
, can be on basalis at least a side surface by way of coating, evaporation, sputter in an embodiment of the present invention
Form layer of reflective material and obtain reflecting layer to make, after layer of reflective material is formed, meet reflection is required one in reflecting layer
Side surface attaches diaphragm to avoid scratching reflecting surface in successive process.
Step 63, heat dissipating layer is formed at the back side in reflecting layer.
In an embodiment of the present invention, heat dissipating layer includes basalis and is formed at the heat radiation material layer of substrate surface
(Fig. 3 or Fig. 4 can be joined).
In an embodiment of the present invention, heat dissipating layer can also be the heat radiation material layer for being formed directly into the reflecting layer back side
(Fig. 2 can be joined).
Specifically, heat radiation material layer is not limited to be made up of graphite or metal material, such as the metal material as copper, aluminium, silver
Constitute.
When heat sink material uses graphite, heat sink material first can be coated with a base material (PET) and be made heat dissipating layer, then by base
Fitted between material and the back side in reflecting layer, heat dissipating layer is integrally formed with reflecting layer.In addition, also can reflecting layer the back side
Heat sink material is directly coated with to form heat dissipating layer.Wherein, the processing procedure for making heat dissipating layer can be with the processing procedure difference for making reflecting layer
Carry out, be not limited to while carrying out or successively carrying out.
When heat sink material is using metal materials such as copper, aluminium, silver, be able to will be radiated material by way of coating, evaporation, sputter
Material forms on a base material (PET) that heat dissipating layer is made, then will be fitted between base material and the back side in reflecting layer, makes heat dissipating layer
It is integrally formed with reflecting layer.In addition, also heat sink material can be formed directly into reflecting layer coating, evaporation, by way of sputter
The back side to form heat dissipating layer.
In manufacturing process, the reflector plate that large scale reflection sheet obtains required size by cutting again can be first made.
The preparation method of the reflector plate of the present embodiment, by reflecting layer with dissipating by way of laminating, coating, evaporation, sputter
Thermosphere formation integral structure so that heat dissipating layer can be with direct contact heat source, and the heat that backlight is produced can be by positioned at reflection
Heat dissipating layer on layer is conducted, good heat dissipation effect, meanwhile, heat dissipating layer, which is integrally formed on reflecting layer, can be set directly at the back of the body
In optical mode group, without pasting heat dissipation film on handset front case so that display module and the distance of handset front case are widened, effectively lifting
Display effect.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability is included, so that process, method, article or device including a series of key elements not only will including those
Element, but also other key elements including being not expressly set out, or also include being this process, method, article or device
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or device including key element.
The above described is only a preferred embodiment of the present invention, any formal limitation not is made to the present invention, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any to be familiar with this professional technology people
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, as long as being the technical spirit pair according to the present invention without departing from technical solution of the present invention content
Any simple modification, equivalent variations and modification that above example is made, in the range of still falling within technical solution of the present invention.
Claims (10)
1. a kind of reflector plate, it is characterised in that the reflector plate includes reflecting layer and heat dissipating layer, the reflecting layer includes reflecting surface
And relative to the back side of the reflecting surface, the heat dissipating layer is located at the back side in the reflecting layer, and the reflector plate is fixed on one
On the backboard of backlight module and in the receiving space of backboard formation, the reflecting surface of the reflector plate is towards the backlight
The light emission side of module, the heat dissipating layer of the reflector plate is contacted with the backboard.
2. reflector plate as claimed in claim 1, it is characterised in that the heat dissipating layer is the back side for being formed at the reflecting layer
Heat radiation material layer.
3. reflector plate as claimed in claim 1, it is characterised in that the heat dissipating layer includes basalis and is formed at the substrate
The heat radiation material layer of layer surface.
4. reflector plate as claimed in claim 3, it is characterised in that the basalis is PET.
5. reflector plate as claimed in claim 2 or claim 3, it is characterised in that the heat radiation material layer is by graphite or copper, aluminium, silver-colored structure
Into.
6. reflector plate as claimed in claim 1, it is characterised in that the reflecting layer includes basalis and is formed at the substrate
The layer of reflective material of layer surface.
7. reflector plate as claimed in claim 6, it is characterised in that the layer of reflective material is constituted by silver or containing silver alloy.
8. a kind of backlight module, it is characterised in that the reflector plate including backboard and as any one of claim 1 to 7, institute
State reflector plate to be fixed on the backboard and in the receiving space of backboard formation, the reflecting surface direction of the reflector plate
The light emission side of the backlight module, the heat dissipating layer of the reflector plate is contacted with the backboard.
9. a kind of preparation method of reflector plate, it is characterised in that including：
A base material is provided as basalis；
Layer of reflective material is formed on the basalis to obtain reflecting layer, the reflecting layer includes reflecting surface and relative to institute
State the back side of reflecting surface；
Heat dissipating layer is formed at the back side in the reflecting layer.
10. the preparation method of reflector plate as claimed in claim 9, it is characterised in that the back side shape in the reflecting layer
The step of into heat dissipating layer, includes：
By way of laminating, coating, evaporation, sputter the heat dissipating layer is formed at the back side in the reflecting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710500703.4A CN107153302A (en) | 2017-06-27 | 2017-06-27 | The preparation method of reflector plate, backlight module and reflector plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710500703.4A CN107153302A (en) | 2017-06-27 | 2017-06-27 | The preparation method of reflector plate, backlight module and reflector plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107153302A true CN107153302A (en) | 2017-09-12 |
Family
ID=59795150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710500703.4A Pending CN107153302A (en) | 2017-06-27 | 2017-06-27 | The preparation method of reflector plate, backlight module and reflector plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107153302A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979959A (en) * | 2017-12-20 | 2018-05-01 | 苏州佳值电子工业有限公司 | A kind of thermal diffusivity reflector plate |
| CN110488403A (en) * | 2019-09-04 | 2019-11-22 | 东莞市利锦电子有限公司 | A kind of reflector plate and its processing technology of stainless steel high reflectance |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1448766A (en) * | 2002-04-04 | 2003-10-15 | 精工爱普生株式会社 | Heat radiating component, lighting apparatus, photoelectric apparatus and electronic apparatus |
| CN1534355A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Assembly for lighting device, lighting device, back side lighting device and display |
| CN2646823Y (en) * | 2003-10-09 | 2004-10-06 | 友达光电股份有限公司 | Light source device |
| US20070057619A1 (en) * | 2005-09-14 | 2007-03-15 | Industrial Technology Research Institute | Field emission luminescent device |
| US20070109788A1 (en) * | 2005-11-11 | 2007-05-17 | Pan Bor-Jyh | Backlight module |
| CN201097047Y (en) * | 2007-08-08 | 2008-08-06 | 群康科技(深圳)有限公司 | Backlight module assembly and LCD |
| CN101354493A (en) * | 2007-07-26 | 2009-01-28 | 北京京东方光电科技有限公司 | Backlight source structure |
| CN202056681U (en) * | 2011-04-18 | 2011-11-30 | 昆山龙腾光电有限公司 | Back light module |
| CN104913243A (en) * | 2015-05-27 | 2015-09-16 | 武汉华星光电技术有限公司 | Backlight module |
| CN207198513U (en) * | 2017-06-27 | 2018-04-06 | 上海传英信息技术有限公司 | Reflector plate and backlight module |
-
2017
- 2017-06-27 CN CN201710500703.4A patent/CN107153302A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1448766A (en) * | 2002-04-04 | 2003-10-15 | 精工爱普生株式会社 | Heat radiating component, lighting apparatus, photoelectric apparatus and electronic apparatus |
| CN1534355A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Assembly for lighting device, lighting device, back side lighting device and display |
| CN2646823Y (en) * | 2003-10-09 | 2004-10-06 | 友达光电股份有限公司 | Light source device |
| US20070057619A1 (en) * | 2005-09-14 | 2007-03-15 | Industrial Technology Research Institute | Field emission luminescent device |
| US20070109788A1 (en) * | 2005-11-11 | 2007-05-17 | Pan Bor-Jyh | Backlight module |
| CN101354493A (en) * | 2007-07-26 | 2009-01-28 | 北京京东方光电科技有限公司 | Backlight source structure |
| CN201097047Y (en) * | 2007-08-08 | 2008-08-06 | 群康科技(深圳)有限公司 | Backlight module assembly and LCD |
| CN202056681U (en) * | 2011-04-18 | 2011-11-30 | 昆山龙腾光电有限公司 | Back light module |
| CN104913243A (en) * | 2015-05-27 | 2015-09-16 | 武汉华星光电技术有限公司 | Backlight module |
| CN207198513U (en) * | 2017-06-27 | 2018-04-06 | 上海传英信息技术有限公司 | Reflector plate and backlight module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979959A (en) * | 2017-12-20 | 2018-05-01 | 苏州佳值电子工业有限公司 | A kind of thermal diffusivity reflector plate |
| CN110488403A (en) * | 2019-09-04 | 2019-11-22 | 东莞市利锦电子有限公司 | A kind of reflector plate and its processing technology of stainless steel high reflectance |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207198513U (en) | Reflector plate and backlight module | |
| US7101055B2 (en) | Direct back light unit with heat exchange | |
| US9806283B2 (en) | Organic electroluminescent display panel, fabrication method thereof and display device | |
| CN100510894C (en) | Display panel and light source device used thereof | |
| KR102349395B1 (en) | Top substrate for ultra-small LED components, ultra-small LED components, and ultra-small LED display devices | |
| KR20020065893A (en) | Organic light emitting diode having spherical shaped patterns | |
| CN107153302A (en) | The preparation method of reflector plate, backlight module and reflector plate | |
| US20080211992A1 (en) | Diode substrate of LCD | |
| CN206164624U (en) | Mobile terminal mesochite and mobile terminal | |
| TWM277949U (en) | Backlight module | |
| CN208752346U (en) | A kind of side entrance back module and its display | |
| CN206741021U (en) | A kind of cell phone back light source of High Efficiency Luminescence | |
| CN102955194B (en) | Method for manufacturing light guide plate | |
| CN213545027U (en) | LCD projector light valve heat abstractor | |
| KR20060082468A (en) | Radiant heat sheet and backlight unit and liquid crystal display comprising the same | |
| CN101303474A (en) | Backlight module, LCD device and method for manufacturing LCD device | |
| CN202209603U (en) | Backlight module | |
| US20130058125A1 (en) | Backlight Module Having Housing Provided with Groove Structure | |
| TWI230299B (en) | Hollowed backlight module | |
| CN114624810B (en) | Backlight unit light source inclined touch screen | |
| CN114624811B (en) | Production method of display screen backlight module | |
| CN102927543A (en) | Heat sink and backlight module with same | |
| CN114217473B (en) | Direct type LED vehicle-mounted backlight module and display device | |
| CN205897070U (en) | Cell -phone is with straight following formula LED backlight | |
| CN106412162A (en) | Shell in mobile terminal and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170912 |
|
| RJ01 | Rejection of invention patent application after publication |