CN107148208B - Shielding cover, substrate assembly and electronic equipment - Google Patents

Shielding cover, substrate assembly and electronic equipment Download PDF

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Publication number
CN107148208B
CN107148208B CN201710474897.5A CN201710474897A CN107148208B CN 107148208 B CN107148208 B CN 107148208B CN 201710474897 A CN201710474897 A CN 201710474897A CN 107148208 B CN107148208 B CN 107148208B
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China
Prior art keywords
gasket
substrate
area
fixing holes
spacer
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CN201710474897.5A
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Chinese (zh)
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CN107148208A (en
Inventor
曾元清
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201710474897.5A priority Critical patent/CN107148208B/en
Publication of CN107148208A publication Critical patent/CN107148208A/en
Application granted granted Critical
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB

Abstract

The invention discloses a shielding cover, a substrate assembly and electronic equipment. The shielding cover is used for covering the device of the substrate, and comprises a main body and a gasket arranged on the main body, wherein the gasket is provided with an auxiliary fixing hole matched with the substrate, and the gasket can be fixed on the substrate through the matching of a fixing piece and the auxiliary fixing hole. According to the invention, the fixing piece can be made into a corresponding size structure according to other fixing structures, and meanwhile, the thickness of the gasket is correspondingly changed, so that the substrate can be assembled by adopting the same fixing structure, the assembly time of the substrate is saved, and the assembly efficiency and the accuracy of the substrate are improved.

Description

Shielding cover, substrate assembly and electronic equipment
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a shielding cover, a substrate assembly and electronic equipment.
Background
With the development of network technology and the improvement of the intelligent degree of electronic equipment, users can realize more and more functions through the electronic equipment, such as taking pictures by using a camera, and then listening to music at a mobile phone terminal by using the plug-in connection of a headset and a mobile phone terminal headset base.
The camera, the earphone seat and other devices can be directly integrated on the printed circuit board of the electronic equipment, and the printed circuit board is screwed and fixed on the shell of the electronic equipment by adopting screws with different specifications due to the fact that all parts of the printed circuit board are matched with other devices. In the actual production process, the screw is easy to be installed wrongly, and the installation time of the circuit board is increased.
Disclosure of Invention
The embodiment of the invention provides a shielding cover, a substrate assembly and electronic equipment, which can save the assembly time of a circuit board.
In a first aspect, an embodiment of the present invention provides a shielding cover, configured to be covered on a device of a substrate, where the shielding cover includes a main body and a gasket disposed on the main body, where the gasket is provided with an auxiliary fixing hole matched with the substrate, and the gasket may be fixed on the substrate by matching a fixing piece with the auxiliary fixing hole.
In a second aspect, an embodiment of the present invention further provides a substrate assembly, where the substrate assembly includes a substrate and a spacer, the substrate includes a first area and a second area, the spacer is disposed in the first area, the second area is provided with a retaining wall layer, the substrate is provided with a plurality of fixing holes with the same size, including a main fixing hole located in the first area, the remaining plurality of fixing holes are located in the second area, and the plurality of fixing holes located in the second area penetrate through the retaining wall layer; the gasket is provided with auxiliary fixing holes, the main fixing holes correspond to the auxiliary fixing holes, and the gasket can be respectively fixed on the substrate through the matching of a fixing piece and the auxiliary fixing holes and the main fixing holes.
In a third aspect, an embodiment of the present invention further provides an electronic device, the electronic device housing and a substrate assembly disposed in the housing, where the substrate assembly is a base assembly as described above.
The main body in the shielding cover is covered on the device of the substrate, the gasket in the shielding cover is provided with the auxiliary fixing hole to be matched with the substrate, and the gasket in the shielding cover can be fixed on the substrate through the matching of a fixing piece and the auxiliary fixing hole. The thickness of base plate in gasket position department can be increased in gasket and base plate cooperation for the effective fixed part of mounting changes according to the thickness of gasket, when carrying out the assembly with other fixed knot constructs with the base plate, can make corresponding size structure with the mounting according to other fixed knot constructs, makes corresponding change with the thickness of gasket simultaneously, makes the base plate can adopt the same fixed knot structure to assemble, saves the assembly time of base plate, promotes the assembly efficiency and the correct rate of base plate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Fig. 2 is an exploded view of the electronic device shown in fig. 1.
Fig. 3 is a schematic structural diagram of a substrate assembly according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a substrate according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a gasket according to an embodiment of the present invention.
Fig. 6 is another schematic structural diagram of a gasket according to an embodiment of the present invention.
Fig. 7 is a schematic view of another structure of a gasket according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of another structure of a substrate assembly according to an embodiment of the invention.
Fig. 9 is a schematic structural diagram of a shielding cover according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The embodiment of the invention provides a shielding cover, a substrate assembly and electronic equipment. Each of which will be described in detail below.
In the present embodiment, the description will be made from the perspective of a substrate assembly, and the base assembly may be specifically provided in an electronic device such as a mobile phone, a tablet computer, a palm computer (PDA, personal Digital Assistant), or the like.
Referring to fig. 1 and 2, an electronic device 10 includes a cover 13, a display 11, a substrate assembly 110, a battery 14, and a housing 12.
Wherein a cover plate 13 is mounted to the display screen 11 to cover the display screen 11. The cover 13 may be a transparent glass cover. In some embodiments, the cover 13 may be a glass cover made of a material such as sapphire. The cover 13 includes a display area 131 and a non-display area 132. The display area 131 may be used to display a screen of the terminal or for a user to perform touch manipulation or the like. The top area of the non-display area 132 is provided with openings for conducting sound and light, and the bottom of the non-display area 132 can be provided with functional components such as a fingerprint module, a touch key and the like.
The display 11 is mounted under the cover 13. To form a display surface of the electronic device 10.
The substrate assembly 110 is mounted inside the housing 12. The substrate assembly 110 may include a printed circuit board, which may be the motherboard of the electronic device 10. The printed circuit board can be integrated with functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, a processor and the like. Meanwhile, the display screen 11 is electrically connected to the printed circuit board.
The battery 14 is mounted in the housing 12 and is electrically connected to the printed circuit board to provide power to the electronic terminal 10.
The rear cover 12 and the cover plate 13 may be combined to form a housing having a closed space formed by the rear cover 12 and the cover plate 13.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a substrate assembly provided in an embodiment of the present invention, the substrate assembly 100 includes a substrate 110 and a spacer 122, and the substrate 110 may be a printed circuit board, and it should be noted that the substrate 110 in the embodiment of the present invention is illustrated by taking the printed circuit board as an example, and the substrate 110 in the embodiment of the present invention is not limited to the printed circuit board but may be other boards.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a substrate according to an embodiment of the invention, in some embodiments, a substrate 110 includes a first region 111 and a second region 112, a spacer 122 is disposed in the first region 111, the second region 112 is provided with a retaining wall layer 114, the substrate 110 is provided with a plurality of fixing holes 113 with the same size, including a main fixing hole 1131 located in the first region 111, the remaining plurality of fixing holes 113 are located in the second region 112, and the plurality of fixing holes 113 located in the second region 112 penetrate through the retaining wall layer 114.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a spacer according to an embodiment of the present invention, the spacer 122 is provided with an auxiliary fixing hole 1223, and the main fixing hole 1131 corresponds to the auxiliary fixing hole 1223, and the spacer 122 can be fixed on the substrate 110 by matching a fixing member 130 with the auxiliary fixing hole 1223 and the main fixing hole 1131, respectively.
The assembly of the first region 111 of the substrate 110 is achieved by a fixing member 130 that is cooperatively fixed with the main fixing hole 1131 of the substrate 110 through the auxiliary fixing hole 1223 of the spacer 122. The spacer 122 is fitted at the position of the first region 111 of the substrate 110, and the auxiliary fixing hole 1223 and the main fixing hole 1131 correspond to each other, to be cooperatively fixed with the fixing member 130, and the spacer 122 increases the thickness around the main fixing hole 1131 in the first region 111, so that the effective fixing portion of the fixing member increases. When assembling other fixing structures with the second region 112 of the substrate 110, the fixing member 130 can be made to have a corresponding size structure according to the other fixing structures, and meanwhile, the thickness of the gasket 122 is changed correspondingly, so that the first region 111 and the second region 112 of the substrate 11 can be assembled by adopting the same fixing structure, the assembly time of the substrate 110 is saved, and the assembly efficiency and the accuracy of the substrate 110 are improved.
In the actual assembly process, the plurality of fixing holes 113 located in the second region 112 on the substrate 110 may be assembled through a fixing structure, and specifically, the embodiment of the present invention adopts the fixing member 130 to assemble, and the plurality of fixing members 130 are respectively fixed with the fixing holes 113 on the substrate 110 through the retaining wall layer 114 in a matching manner, so as to realize the assembly of the second region 112 on the substrate 110.
Further, the thickness of the spacer 122 is the same as the thickness of the retaining wall layer 114. Specifically, the sum of the hole depth of the main fixing hole 1131 in the first region 111 and the hole depth of the auxiliary fixing hole 1223 of the spacer 122 is equal to the sum of the hole depth of the fixing hole 113 in the second region and the thickness of the retaining wall layer 114 around the fixing hole 113. Wherein the thickness of the retaining wall layer 114 around the fixing hole 113 in the second region 112 is the penetration depth of the fixing hole penetrating through the portion of the retaining wall layer 114. It should be noted that the thickness of the spacer 122 and the thickness of the retaining wall layer 114 may be within an error range. Further, the thickness of the spacer 122 is slightly greater than the thickness of the retaining wall 114, and the spacer 122 is generally made of a soft material, such as: the pad 122 is made of silica gel, rubber or foam. The spacer 122 is less compressed when fastened by the fixing member 130, and the error between the thickness of the spacer 122 and the thickness of the retaining wall layer 114 is within the range of the compression deformation degree generated when the spacer 122 is compressed by the fixing member 130.
As can be seen from the above description, the spacer 122 according to the embodiment of the present invention can increase the thickness around the main fixing hole 1131 in the first region 111 of the substrate 110, so that the fixing hole 113 in the second region 112 of the substrate 110 adopts the same fixing piece 130 as the fixing piece 130 in the first region 111, and thus the substrate 110 can be assembled by adopting the fixing piece 130 with the same specification, so as to prevent the assembly error caused by different specifications of the fixing pieces during the assembly process, further save the assembly time of the substrate 110, and improve the assembly efficiency and accuracy of the substrate 110.
The fixing member 130 may be a screw or a bolt, which should be noted that the fixing member according to the embodiment of the invention is not limited thereto.
Referring to fig. 6, fig. 6 is a schematic diagram of another structure of a gasket according to an embodiment of the present invention, where the gasket 122 includes a first gasket portion 1221 and a second gasket portion 1222 stacked on each other, and a secondary fixing hole 1223 penetrates the first gasket portion 1221 and the second gasket portion 1222.
In the actual production process, the spacer 122 may be directly processed to have the same thickness as the thickness of the retaining wall layer 114, or the thickness of the spacer 122 may be made thinner, specifically, half the thickness of the retaining wall layer 114, and the spacer 122 is bent near the middle portion to form the first spacer portion 1221 and the second spacer portion 1222, and the spacer 122 is overlapped along the bending position, so that the first spacer portion 1221 and the second spacer portion 1222 overlap. Further, the first gasket part 1221 forms a through hole, the second gasket part 1222 forms a through hole, and when the first gasket part 1221 and the second gasket part 1222 are overlapped, the through hole in the first gasket part 1221 and the through hole in the second gasket part 1222 overlap each other to form the auxiliary fixing hole.
It should be noted that, the multi-layer formed gasket according to the embodiment of the present invention is not limited to this, for example, the gasket is bent at two positions to form three portions, and the three portions are overlapped with each other at two bending positions.
Referring to fig. 7, fig. 7 is a schematic diagram of another structure of a gasket according to an embodiment of the present invention, the gasket is provided with openings 1224, 1224 communicating with auxiliary fixing holes 1223, and the openings 1224 are provided to save materials and increase the elasticity of the gasket 122.
It should be noted that, the substrate 110 has devices integrated thereon, wherein one device 115 is close to the main fixing hole 1131, and the substrate assembly 100 further includes a shielding cover 120, and the shielding cover 120 covers the device 115 close to the main fixing hole 1131 to shield the device 115.
It should be noted that the spacer 122 may be disposed on the first region 111 of the substrate 110 alone, or may be disposed on the first region 111 in other manners, for example, disposing the spacer 122 on the shielding cover 120, which is specifically as follows:
referring to fig. 8, fig. 8 is another schematic structural diagram of a substrate assembly 100 according to an embodiment of the present invention, and fig. 8 is a modification of fig. 3, wherein the marks in fig. 8 are the same as those in fig. 3, and the differences between fig. 8 and fig. 3 are that: a gasket 122 is provided on the shield cover 120. Note that, the same structure as that of fig. 8 and fig. 3 is not described here again.
Referring to fig. 9 together, fig. 9 is a schematic structural diagram of a shielding cover according to an embodiment of the invention, in some embodiments, a shielding cover 120 includes a main body 121 fixedly connected to a spacer 122, and the main body 121 covers a device 115 of a substrate 110. The body 121 and the pad 122 may be directly integrally formed, or fixedly connected together by hot melting, or fixedly connected in a detachable manner.
As can be seen from the above description, the main body 121 of the shielding cover 120 and the gasket 122 are fixedly connected, so that the gasket 122 can be assembled to the substrate 110 while the shielding cover 120 is assembled, the process of individually assembling the gasket 122 is omitted, and the process of individually producing the gasket is also omitted. When the gasket is assembled independently, the assembly is easy to forget, and the fixing piece and the substrate are directly adopted for assembly, so that errors occur in the assembly process. Therefore, in the process of assembling the substrate, the embodiment of the invention not only can adopt the fixing pieces with the same specification, but also can save working procedures and improve the assembling accuracy and efficiency.
In some embodiments, the shielding cover 120 further includes a connection portion 123, the gasket 122 is fixedly connected to the main body 121 through the connection portion 122, and the gasket 122 and the main body 121 can be elastically deformed through the connection portion 123. Specifically, the connection portion 123 is made of silica gel, rubber or foam, so that the connection portion deforms, thereby facilitating the covering of the main body 121 onto the device 115, and the gasket 122 is mated with the substrate 110.
More specifically, the width of the connection portion 123 is smaller than the width of the pad 122, and the thickness of the connection portion 123 is smaller than the thickness of the pad 122, so that the connection portion is deformed and materials are saved. Further, the pad 122, the connecting portion 123 and the body 121 are integrally formed.
In some embodiments, the gasket 122 may further include a first gasket portion 1221, a second gasket portion 1222, and an opening, which are not described herein.
In some embodiments, the body 121 is provided with a first through hole 1211 and a second through hole 1212, where the first through hole 1211 has a crisscross structure and the second through hole 1212 has a circular shape. The edge of the main body 121 is provided with a convex edge 1213, the connecting part 123 is connected to the edge of the main body 121, and the convex edge 1213 is connected with the connecting part 123.
Those skilled in the art will appreciate that the configuration of the electronic device 10 shown in fig. 1 and 2 does not constitute a limitation of the electronic device 10. The electronic device 10 may include more or fewer components than shown, or may combine certain components, or may have a different arrangement of components. The electronic device 10 may also include a processor, memory, bluetooth module, etc., which are not described in detail herein.
The shielding cover, the substrate assembly and the electronic device provided by the embodiments of the present invention are described in detail, and specific examples are applied herein to illustrate the principles and embodiments of the present invention, and the description of the above examples is only for aiding in understanding the present invention. Meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.

Claims (16)

1. The shielding cover is used for covering a device of the substrate, and is characterized in that the substrate comprises a first area and a second area, and the substrate is provided with a plurality of fixing holes with the same size, including a main fixing hole positioned in the first area and a plurality of other fixing holes positioned in the second area;
the shielding cover comprises a main body and a gasket arranged on the main body, wherein the gasket is provided with an auxiliary fixing hole matched with the base plate, the gasket can be fixed on the base plate through the matching of a fixing piece, the auxiliary fixing hole and the main fixing hole, and the gasket also fixes the base plate on the shell through the matching of the fixing piece, the auxiliary fixing hole and the main fixing hole;
the second area is provided with a retaining wall layer, a plurality of fixing holes in the second area penetrate through the retaining wall layer, the plurality of fixing holes in the second area fix the substrate on the shell through matching with a plurality of fixing pieces, and the thickness of the gasket is the same as that of the retaining wall layer.
2. The shield cover according to claim 1, further comprising a connection portion, wherein the gasket is fixedly connected to the main body through the connection portion, and wherein the gasket and the main body are elastically deformable through the connection portion.
3. The shield cover according to claim 2, wherein the gasket, the connecting portion, and the main body are integrally formed.
4. The shield cover according to claim 2, wherein the width of the connection portion is smaller than the width of the spacer, and the thickness of the connection portion is smaller than the thickness of the spacer.
5. The shield cover according to claim 1, wherein the gasket includes first and second gasket portions superimposed on each other, the auxiliary fixing hole penetrating the first and second gasket portions.
6. The shield cover according to claim 1, wherein the gasket is provided with an opening, the opening communicating with the auxiliary fixing hole.
7. The shielding cover according to any one of claims 1 to 6, wherein the shielding cover is made of silica gel, rubber or foam.
8. The substrate assembly is characterized in that the substrate assembly is applied to electronic equipment, the electronic equipment comprises a shell, the substrate assembly comprises a substrate and a gasket, the substrate comprises a first area and a second area, the gasket is arranged in the first area, a retaining wall layer is arranged in the second area, the substrate is provided with a plurality of fixing holes with the same size, the fixing holes comprise main fixing holes located in the first area, the rest fixing holes are located in the second area, and the fixing holes located in the second area penetrate through the retaining wall layer; the gasket is provided with auxiliary fixing holes, the main fixing holes correspond to the auxiliary fixing holes, the gasket can be respectively matched with the auxiliary fixing holes and the main fixing holes through a fixing piece to be fixed on the substrate, and the gasket can be respectively matched with the auxiliary fixing holes and the main fixing holes through the fixing piece to fix the substrate on the shell;
the thickness of the gasket is the same as that of the retaining wall layer, and the plurality of fixing holes in the second area can fix the substrate to the shell through the cooperation of the plurality of fixing pieces.
9. The substrate assembly of claim 8, further comprising a shield cover including a body fixedly coupled to the spacer, the body covering a device of the substrate, the device adjacent the primary attachment hole.
10. The substrate assembly of claim 9, wherein the shield cover further comprises a connection portion through which the gasket is fixedly connected to the main body, the gasket and the main body being elastically deformable through the connection portion.
11. The substrate assembly of claim 10, wherein the gasket, the connecting portion, and the body are integrally formed.
12. The substrate assembly of claim 10, wherein the connecting portion has a width less than a width of the spacer, and wherein the connecting portion has a thickness less than a thickness of the spacer.
13. The substrate assembly of claim 8, wherein the spacer includes first and second spacer portions that overlap each other, the secondary securing holes extending through the first and second spacer portions.
14. The substrate assembly of claim 8, wherein the spacer is provided with an opening, the opening communicating with the secondary securing hole.
15. The substrate assembly of any one of claims 10 to 12, wherein the spacer, the body and the connection portion are all made of silicone, rubber or foam.
16. An electronic device characterized by a housing of the electronic device and a substrate assembly provided in the housing, the substrate assembly being as claimed in any one of claims 8 to 15.
CN201710474897.5A 2017-06-20 2017-06-20 Shielding cover, substrate assembly and electronic equipment Active CN107148208B (en)

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CN112930070B (en) * 2021-01-21 2022-08-23 北京字节跳动网络技术有限公司 Electronic device

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Publication number Priority date Publication date Assignee Title
CN203086915U (en) * 2012-12-25 2013-07-24 比亚迪股份有限公司 Coupling assembly of shielding cover and mobile terminal thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203086915U (en) * 2012-12-25 2013-07-24 比亚迪股份有限公司 Coupling assembly of shielding cover and mobile terminal thereof

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