CN107147758A - A kind of modularization mainboard - Google Patents
A kind of modularization mainboard Download PDFInfo
- Publication number
- CN107147758A CN107147758A CN201710308456.8A CN201710308456A CN107147758A CN 107147758 A CN107147758 A CN 107147758A CN 201710308456 A CN201710308456 A CN 201710308456A CN 107147758 A CN107147758 A CN 107147758A
- Authority
- CN
- China
- Prior art keywords
- module
- mainboard
- modularization
- modules
- mobile phone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
The present invention relates to communication technical field, more particularly to a kind of modularization mainboard.Comprising with lower module：Mainboard I/O modules, CPU module, memory modules, power supply module, audio-frequency module and Anneta module, the mainboard I/O modules, CPU module, memory modules, power supply module, audio-frequency module and Anneta module are communicated；The modularization mainboard is provided with one or more interfaces for being used to connect peripheral components.One aspect of the present invention can shorten research and development of products and manufacturing cycle, increase product line, improve product quality, quickly tackle turn of the market；On the other hand, it is possible to reduce or elimination is to the adverse effect of environment, conveniently dismounting, recovery and the processing after reuse, upgrading, maintenance and product abandonment.The present invention can reduce the built-in space of cell phone mainboard, develop the compact small handsets of fuselage, to meet the greater demand of consumer by modularized design.
Description
Technical field
The present invention relates to communication technical field, more particularly to a kind of modularization mainboard.
Background technology
At present, a PCBA (Printed Circuit Board Assembly, printed circuit-board assembly) is by a LCM
(Liquid Crystal Display Module, liquid crystal display module) and fixed peripheral components composition.And PCBA and LCM two
, it is both to determine essential different core between each money mobile phone, is also to influence the key factor of mobile phone sales status.If desired
According to the market demand, production development difference style, the mobile phone of function then need to change the accuracy of mobile phone, primary is exactly mobile phone
PCBA board will be changed therewith.And if PCBA is changed, this will result directly in R＆D cycle lengthening and the rising of R＆D costs.Cause
This, is sought after a kind of mobile phone with modularization motherboard design of exploitation.
The content of the invention
The problem to be solved in the present invention is to provide a kind of modularization mainboard, it is possible to reduce or elimination is to the unfavorable shadow of environment
Sound, conveniently dismounting, recovery and the processing after reuse, upgrading, maintenance and product abandonment.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is：A kind of modularization mainboard, includes following mould
Block：Mainboard I/O modules, CPU module, memory modules, power supply module, audio-frequency module and Anneta module, the mainboard I/O moulds
Block, CPU module, memory modules, power supply module, audio-frequency module and Anneta module are communicated；On the modularization mainboard
Provided with one or more interfaces for being used to connect peripheral components.
Further, the peripheral components are affixed by metal frame and the modularization mainboard.
Further, the modularization mainboard also includes SIM card module, bluetooth module.
Further, the present invention also protects the mobile phone for being provided with above-mentioned modularization mainboard.
Further, the mobile phone in above-mentioned is the mobile phone of touch screen.
Modularized design of the present invention is one of Green Design, is changed into more ripe design method from theory.
Green design thought is combined with modular design method, the functional attributes and environment attribute of product can be met simultaneously,
On the one hand research and development of products and manufacturing cycle can be shortened, increase product line, product quality is improved, quickly tackle turn of the market；
On the other hand, it is possible to reduce or eliminate to the adverse effect of environment, it is convenient reuse, upgrading, the dismounting after maintenance and product abandonment,
Reclaim and handle.The present invention can reduce the built-in space of cell phone mainboard by modularized design, develop compact small of fuselage
Type mobile phone, to meet the greater demand of consumer.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention.
Embodiment
Elaborated below according to Fig. 1.
As shown in figure 1, a kind of modularization mainboard, comprising with lower module：Mainboard I/O modules 1, CPU module 2, memory modules
3rd, power supply module 4, audio-frequency module 5 and Anneta module 6, the mainboard I/O modules 1, CPU module 2, memory modules 3, power supply mould
Block 4, audio-frequency module 5 and Anneta module 6 are communicated.On connection between the external world for convenience, the modularization mainboard
Provided with an interface 7 for being used to connect peripheral components.
Peripheral components 71 in above-mentioned are affixed by metal frame 72 and the modularization mainboard, realize the stabilization of connection.For reality
The variation of existing function, the modularization mainboard also includes SIM card module 8, bluetooth module 9, and implementation above function is a variety of, realizes
Diverse operations.
Later stage HardwareUpgring of the invention can realize mobile phone upgrading renewal by changing a certain module, improve the mobile phone life-span,
Can more effectively it economize on resources, environmental protection.The present invention can apply above-mentioned mainboard module on mobile phone, interior of mobile phone member
Part modularization, whole mainboard disassembles into above-mentioned classification, and all classification are carried out into modularized processing, based on special mainboard structure
Disk, realizes the modularization of whole mainboard.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (5)
1. a kind of modularization mainboard, it is characterised in that：Comprising with lower module：Mainboard I/O modules, CPU module, memory modules, confession
Electric module, audio-frequency module and Anneta module, the mainboard I/O modules, CPU module, memory modules, power supply module, audio mould
Block and Anneta module are communicated；The modularization mainboard is used to connect connecing for peripheral components provided with one or more
Mouthful.
2. a kind of modularization mainboard as claimed in claim 1, it is characterised in that the peripheral components pass through metal frame and the mould
Block mainboard is affixed.
3. a kind of modularization mainboard as claimed in claim 1, it is characterised in that the modularization mainboard also includes SIM card mould
Block, bluetooth module.
4. a kind of mobile phone, it is characterised in that it carries modularization mainboard as claimed in claim 1.
5. mobile phone as claimed in claim 4, it is characterised in that the mobile phone is touch screen mobile phone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710308456.8A CN107147758A (en) | 2017-05-04 | 2017-05-04 | A kind of modularization mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710308456.8A CN107147758A (en) | 2017-05-04 | 2017-05-04 | A kind of modularization mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107147758A true CN107147758A (en) | 2017-09-08 |
Family
ID=59774414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710308456.8A Pending CN107147758A (en) | 2017-05-04 | 2017-05-04 | A kind of modularization mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107147758A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108833637A (en) * | 2018-09-07 | 2018-11-16 | 贵州新蒲几米电子科技有限公司 | A kind of cell phone mainboard module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1949903A (en) * | 2006-08-28 | 2007-04-18 | 海信集团有限公司 | Cell phone mainboard compatible with various appearance structure |
| CN201548867U (en) * | 2009-07-21 | 2010-08-11 | 上海研祥智能科技有限公司 | Reinforced vehicle-mounted industrial computer capable of realizing four-path video surveillance |
| EP2942930A2 (en) * | 2014-05-09 | 2015-11-11 | Samsung Electronics Co., Ltd | Sensor module and device including the same |
-
2017
- 2017-05-04 CN CN201710308456.8A patent/CN107147758A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1949903A (en) * | 2006-08-28 | 2007-04-18 | 海信集团有限公司 | Cell phone mainboard compatible with various appearance structure |
| CN201548867U (en) * | 2009-07-21 | 2010-08-11 | 上海研祥智能科技有限公司 | Reinforced vehicle-mounted industrial computer capable of realizing four-path video surveillance |
| EP2942930A2 (en) * | 2014-05-09 | 2015-11-11 | Samsung Electronics Co., Ltd | Sensor module and device including the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108833637A (en) * | 2018-09-07 | 2018-11-16 | 贵州新蒲几米电子科技有限公司 | A kind of cell phone mainboard module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170908 |
|
| RJ01 | Rejection of invention patent application after publication |