CN204968240U - Printed circuit board circuit - Google Patents
Printed circuit board circuit Download PDFInfo
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- CN204968240U CN204968240U CN201520734823.7U CN201520734823U CN204968240U CN 204968240 U CN204968240 U CN 204968240U CN 201520734823 U CN201520734823 U CN 201520734823U CN 204968240 U CN204968240 U CN 204968240U
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Abstract
The utility model provides a printed circuit board circuit, be in including printed circuit board and setting the last electronic components of printed circuit board, printed circuit board is L shape, printed circuit board's the number of piles is 6 layers, and the glue that adopts first thickness between the first layer and the second floor, between third layer and the fourth layer and between the 5th layer and the 6th layer carries out the adhesion as the filler, between the second floor and the third layer and fourth layer with the 5th layer between the adoption thickness glue that is first thickness twice be connected, electronic components include main CPU and with the peripheral module that main CPU links to each other. The utility model discloses each component parts with the circuit board, for example the standard is unified to each item attribute of panel, components and parts to the configuration of unified concrete interface, the demand that makes the printed circuit board that designs can cater to designer better is in order to provide a printed circuit board general as far as possible.
Description
Technical field
The utility model relates to circuit design field, particularly relates to a kind of printed board circuit.
Background technology
In usual PCB design, the parameter such as thickness, size, materials of printed circuit board (PCB) has a variety of selection space; The encapsulation of each components and parts, position can according to different demands, different design environments and be designed to diverse form; The shape of printed circuit board circuitry is also had nothing in common with each other.Design rationality, electric property etc. that above-mentioned various variable factor causes often kind of design are different.
Based on above-mentioned shortcoming, someone proposes and provides public version scheme and as the method for design reference, but due to the detailed programs demand of each project different, so its practical application has certain limitation.
There is the different designs of various components and parts, via hole, silk-screen again, if more reasonably design layout, just can meet the designing requirement different separately of different technologies personnel better.
Utility model content
An object of the present utility model to provide a kind of printed circuit board (PCB), and the attribute of specification printed circuit board (PCB), circuit interface and each electronic devices and components and position, can meet the different designs demand of user.
In order to solve the problems of the technologies described above, the utility model provides a kind of printed board circuit, the electronic devices and components comprising printed circuit board (PCB) and arrange on the printed circuit board, described printed circuit board (PCB) is L-shaped, the number of plies of described printed circuit board (PCB) is six layers, comprise ground floor to layer 6, between ground floor and the second layer, between third layer and the 4th layer and adopt the glue of the first thickness to carry out adhesion as filler between layer 5 and layer 6, between the second layer with third layer and the 4th layer be that the glue of the first thickness twice is connected with adopting thickness between layer 5, the peripheral module that described electronic devices and components comprise host CPU and are connected with described host CPU, wherein said peripheral module comprises front camera, rear camera, audio process, video processor, gravity sensor, acceleration transducer, touch-screen, debugging interface and crystal oscillator unit.
For technique scheme, inventor also has further optimal enforcement scheme.
Preferably, described host CPU is provided with multiple external-connected port, and described multiple external-connected port comprises CIF interface, I2C3 interface, LCDC1RGB interface, I2S interface, I2C0 interface, I2C2 interface, UART2 interface and OSC interface;
Wherein, described CIF interface is connected described front camera and described rear camera with described I2C3 interface, described LCDC1RGB interface is connected described audio process and described video processor with described I2S interface, described I2C0 interface connects described gravity sensor and described acceleration transducer, described I2C2 interface connects described touch-screen, described UART2 interface connects described debugging interface, and described OSC interface connects described crystal oscillator unit.
Preferably, described peripheral module also comprises Flash flash memory, DDR internal memory and SD card, is provided with Flash interface, ddr interface and SDI00 interface accordingly at described host CPU place, for docking described Flash flash memory, DDR internal memory and SD card.
Further, described peripheral module also comprises WiFi+BT recombiner unit, ZigBee Transmit-Receive Unit, physical button and infrared receiving/transmission unit, described host CPU is provided with SDI01 interface, UART1 interface, GPIO & AD interface, IrDAIn/Out interface, accordingly, described SDI01 interface connects the radio communication that described WiFi+BT recombiner unit carries out data, described UART1 interface connects described ZigBee Transmit-Receive Unit, described GPIO & AD interface connects described physical button, and described IrDAIn/Out interface connects described infrared receiving/transmission unit.
Preferably, the maximum length of described printed circuit board (PCB) is 189.0mm, and Breadth Maximum is 104.0mm.
Further, the thickness after described printed circuit board (PCB) pressing is 0.8mm, thickness deviation +/-10%; The copper thickness of ground floor and layer 6 is 0.5Oz; Described first thickness is 0.076mm, and between ground floor and the second layer, between third layer and the 4th layer, between layer 5 and layer 6, the thickness deviation of filler is +/-10%, and dielectric constant is 4.2; Between the second layer and third layer, between the 4th layer and layer 5, the thickness deviation of filler is similarly +/-10%, and dielectric constant is 4.2.
In the layout designs of printed circuit board (PCB) of the present invention, due to each part by circuit board, such as every attribute of sheet material, components and parts gives unified standard, and unified physical interface configuration, make the printed circuit board (PCB) designed can cater to the demand of designer better, to provide a printed circuit board (PCB) general as far as possible.
According to hereafter by reference to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present utility model with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the shape assumption diagram of the printed circuit board (PCB) according to the utility model embodiment;
Fig. 2 is the correspondence principle block diagram of printed board circuit according to the utility model embodiment;
Fig. 3 is the layer structure schematic diagram of printed circuit board (PCB) according to the utility model embodiment.
Embodiment
A kind of printed board circuit described by the present embodiment, the electronic devices and components generally including printed circuit board (PCB) and arrange on the printed circuit board, as shown in Figure 1, described printed circuit board (PCB) is L-shaped, the number of plies of described printed circuit board (PCB) is 6 layers, comprise ground floor to layer 6, between ground floor and the second layer, between third layer and the 4th layer and adopt the glue of the first thickness to carry out adhesion as filler between layer 5 and layer 6, between the second layer with third layer and the 4th layer be that the glue of the first thickness twice is connected with adopting thickness between layer 5, other peripheral modules that described electronic devices and components comprise host CPU 22 and are connected with described host CPU 22, wherein peripheral module comprises front/rear camera 4, audio/video processor 5, gravity/acceleration transducer 8, touch-screen 9, debugging interface 10 and crystal oscillator unit 16.Described audio/video processor 5 and 7 cun of outside IPS liquid crystal display screens 6, and one or more in Mike/speaker/earpiece 7 are connected.
As shown in Figure 3, the maximum length of described printed circuit board (PCB) is 189.0mm, and Breadth Maximum is 104.0mm.The number of plies of described printed circuit board (PCB) is 6 layers, and the thickness after pressing is 0.8mm, thickness deviation +/-10%; The copper thickness of ground floor and layer 6 is 0.5Oz; Thickness between ground floor and the second layer, between third layer and the 4th layer, between layer 5 and layer 6 after filler is 0.076mm, and thickness deviation is +/-10%, and dielectric constant Er is 4.2; Thickness between the second layer and third layer, between the 4th layer and layer 5 after filler is 0.152mm, and thickness deviation is +/-10%, and dielectric constant Er is 4.2.
With reference to the correspondence principle block diagram that Fig. 2, Fig. 2 are printed circuit board (PCB) described in the embodiment of the present invention.The schematic diagram that this printed circuit board (PCB) is corresponding is for core with the RK3188 of Rui Xinwei company, as host CPU 22, periphery, except the Flash flash memory 1 of core system, DDR internal memory 2 and all kinds of crystal oscillator 16, is also provided with front/rear camera 4, audio/video processor 5 (comprise for the liquid crystal display screen of output display information and for inputting, the interface such as Mike, loudspeaker, earphone of output audio information), the peripheral equipment such as gravity/acceleration transducer 8, touch-screen 9, Power Management Unit 14, infrared receiving/transmission unit 21, Zigbee Transmit-Receive Unit 18, WiFi/ bluetooth recombiner unit 17.
Concrete, host CPU is provided with several external-connected ports, and several external-connected ports described comprise CIF interface, I2C3 interface, LCDC1RGB interface, I2S interface, I2C0 interface, I2C2 interface, UART2 interface, OSC interface,
Wherein, described CIF interface, I2C3 interface connect front/rear camera 4 (i.e. front camera and rear camera), described LCDC1RGB interface, I2S interface connect audio/video processor 5 (i.e. audio process and video processor), described I2C0 interface connects gravity/acceleration transducer 8 (i.e. gravity sensor and acceleration transducer), described I2C2 interface connects touch-screen 9, described UART2 interface connects external debug interface 10, and described OSC interface connects described crystal oscillator unit 16.
Described peripheral module also comprises Flash flash memory 1, DDR internal memory 2 and SD card 3, is provided with above-mentioned three peripheral modules of Flash interface, ddr interface and SDI00 interface docking at described host CPU place accordingly.
Electronic devices and components on printed circuit board (PCB) also comprise external interactive unit, described external interactive unit comprises the WiFi+BT recombiner unit 17 in peripheral module, ZigBee Transmit-Receive Unit 18, usb 19, physical button 20 and infrared receiving/transmission unit 21, described host CPU 22 is provided with SDI01 interface, UART1 interface, USBOTG2.0 interface, GPIO & AD interface, IrDAIn/Out interface, accordingly, described SDI01 interface connects the radio communication that WiFi+BT recombiner unit 17 carries out data, described UART1 interface connects described ZigBee Transmit-Receive Unit 18, described USBOTG2.0 interface connects usb 19 for transfer of data, described GPIO & AD interface connects physical button 20, described IrDAIn/Out interface connects infrared receiving/transmission unit 21.
At this block of power supply management, lithium battery 15 is adopted to provide operating voltage for described printed board circuit, the output of lithium battery 15 accesses T2C1 interface, the PWRSupply interface of host CPU by Power Management Unit 14, input connects outside direct current 5V/2A and inputs 11, and described direct current 5V/2A inputs 11 to carry out charging or directly for printed board circuit provides operating voltage to lithium battery through charging/power supply selector switch 12, Coulomb meter 13.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present utility model is illustrate and described herein detailed, but, when not departing from the utility model spirit and scope, still can directly determine or derive other modification many or amendment of meeting the utility model principle according to content disclosed in the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or amendments.
Claims (6)
1. a printed board circuit, the electronic devices and components comprising printed circuit board (PCB) and arrange on the printed circuit board, it is characterized in that, described printed circuit board (PCB) is L-shaped, the number of plies of described printed circuit board (PCB) is six layers, comprise ground floor to layer 6, between ground floor and the second layer, between third layer and the 4th layer and adopt the glue of the first thickness to carry out adhesion as filler between layer 5 and layer 6, between the second layer with third layer and the 4th layer be that the glue of the first thickness twice is connected with adopting thickness between layer 5; The peripheral module that described electronic devices and components comprise host CPU and are connected with described host CPU, wherein said peripheral module comprises front camera, rear camera, audio process, video processor, gravity sensor, acceleration transducer, touch-screen, debugging interface and crystal oscillator unit.
2. printed board circuit according to claim 1, it is characterized in that, described host CPU is provided with multiple external-connected port, and described multiple external-connected port comprises CIF interface, I2C3 interface, LCDC1RGB interface, I2S interface, I2C0 interface, I2C2 interface, UART2 interface and OSC interface;
Wherein, described CIF interface is connected described front camera and described rear camera with described I2C3 interface, described LCDC1RGB interface is connected described audio process and described video processor with described I2S interface, described I2C0 interface connects described gravity sensor and described acceleration transducer, described I2C2 interface connects described touch-screen, described UART2 interface connects described debugging interface, and described OSC interface connects described crystal oscillator unit.
3. printed board circuit according to claim 1, it is characterized in that, described peripheral module also comprises Flash flash memory, DDR internal memory and SD card, Flash interface, ddr interface and SDI00 interface is provided with accordingly, for docking described Flash flash memory, DDR internal memory and SD card at described host CPU place.
4. the printed board circuit according to claims 1 to 3 any one, it is characterized in that, described peripheral module also comprises WiFi+BT recombiner unit, ZigBee Transmit-Receive Unit, physical button and infrared receiving/transmission unit, described host CPU is provided with SDI01 interface, UART1 interface, GPIO & AD interface, IrDAIn/Out interface, accordingly, described SDI01 interface connects the radio communication that described WiFi+BT recombiner unit carries out data, described UART1 interface connects described ZigBee Transmit-Receive Unit, described GPIO & AD interface connects described physical button, described IrDAIn/Out interface connects described infrared receiving/transmission unit.
5. printed board circuit according to claim 1, is characterized in that, the maximum length of described printed circuit board (PCB) is 189.0mm, and Breadth Maximum is 104.0mm.
6. printed board circuit according to claim 1, is characterized in that, the thickness after described printed circuit board (PCB) pressing is 0.8mm, thickness deviation +/-10%; The copper thickness of ground floor and layer 6 is 0.5Oz; Described first thickness is 0.076mm, and between ground floor and the second layer, between third layer and the 4th layer, between layer 5 and layer 6, the thickness deviation of filler is +/-10%, and dielectric constant is 4.2; Between the second layer and third layer, between the 4th layer and layer 5, the thickness deviation of filler is similarly +/-10%, and dielectric constant is 4.2.
Priority Applications (1)
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CN201520734823.7U CN204968240U (en) | 2015-09-21 | 2015-09-21 | Printed circuit board circuit |
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CN201520734823.7U CN204968240U (en) | 2015-09-21 | 2015-09-21 | Printed circuit board circuit |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112057881A (en) * | 2020-09-08 | 2020-12-11 | 深圳市达米恩科技有限公司 | Novel PCB circuit control board |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112057881A (en) * | 2020-09-08 | 2020-12-11 | 深圳市达米恩科技有限公司 | Novel PCB circuit control board |
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TR01 | Transfer of patent right |
Effective date of registration: 20170526 Address after: 310051 Jiangling Road, Hangzhou, Zhejiang, No. 1760, No. Patentee after: Zhejiang Geely Holding Group Co., Ltd. Address before: 100083 Haidian District, Zhichun Road, No. 6, layer 1, 605, Patentee before: BEIJING GEEDEEN TECHNOLOGY CO., LTD. |