CN107130100A - The control method of laser peening device - Google Patents

The control method of laser peening device Download PDF

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Publication number
CN107130100A
CN107130100A CN201710067794.7A CN201710067794A CN107130100A CN 107130100 A CN107130100 A CN 107130100A CN 201710067794 A CN201710067794 A CN 201710067794A CN 107130100 A CN107130100 A CN 107130100A
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CN
China
Prior art keywords
laser peening
laser
control method
peening device
magnetic head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710067794.7A
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Chinese (zh)
Inventor
朴光洙
韩元进
李原劤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Heavy Industries and Construction Co Ltd
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Doosan Heavy Industries and Construction Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160023654A external-priority patent/KR101790140B1/en
Priority claimed from KR1020160023659A external-priority patent/KR20170101017A/en
Application filed by Doosan Heavy Industries and Construction Co Ltd filed Critical Doosan Heavy Industries and Construction Co Ltd
Priority to CN202010828620.XA priority Critical patent/CN111778389A/en
Publication of CN107130100A publication Critical patent/CN107130100A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D10/00Modifying the physical properties by methods other than heat treatment or deformation
    • C21D10/005Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D11/00Process control or regulation for heat treatments
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/50Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for welded joints

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

A kind of control method of laser peening device is disclosed, according to an embodiment of the invention in the control method (100) of laser peening device, laser oscillator of the laser peening device including generation laser beam, the operation magnetic head that the laser beam is irradiated to Seeding location, the executor and three-dimensional scanner for transmitting the laser beam of the laser oscillator to the operation magnetic head, the control method of the laser peening device include:A) 3-D scanning step (S110), is scanned to obtain the profile of laser peening object surface using the three-dimensional scanner to laser peening object surface;B) filtration step (S120), the information of the field of operation needed for being needed after filtering the profile of the acquisition;C) working path calculation procedure (S130), calculates optimal laser peening working path based on the information of the profile of the acquisition and field of operation;And d) drive control step (S140), the laser peening device is driven according to the working path of the calculating.

Description

The control method of laser peening device
Technical field
The present invention relates to a kind of control method of laser peening device, a kind of laser peening device is related in more detail Control method, it not only accurately and can stably accomplish the shot-peening operation of the mouth inner face for tube shape, can also complete pin To the shot-peening operation around uneven weld part and weld part.
Background technology
Because laser beam has higher energy density and continuous (coherence) characteristic, thus it is wide in many fields It is general to use.In the nuclear reactor of nuclear power station, laser application technique also serves as the hand of inspection, preventative maintenance, maintenance etc. Duan Shiyong.
For example, having laser overlaying welding (laser build-up welding) or laser peening (laser peening) etc., institute State laser overlaying welding to rebuild the slight crack of structure etc., the laser peening prevents that the stress of structure etc. in nuclear reactor is rotten Erosion cracking.
Laser peening is the preventative maintenance technology using Nd, YAG (neodymium, metallurgy) laser.Laser peening is that one kind passes through Laser beam is assembled and exposes to the surface of material so as to produce plasma by camera lens etc., by the shock wave of plasma by remnants The method that stress is implanted into material.Although if stress corrosion cracking will be occurred by possessing material, environment, three conditions of stress, It is that tensile stress state can will be drawn by laser peening or relatively low compression stress becomes higher compressing stress state, so as to anti- Only stress corrosion cracking occurs for timber or weld part.
Laser peening device can be divided into according to the method for transmission laser beam is configured at hollow lead by mirror (mirror) So as to transmit the device of light and the device of light is transmitted using optical fiber inside light pipe.The laser peening device of nuclear reactor An example have disclosure in Korean Patent Publication 2012-0048692.
The part irradiated for common laser peening device due to laser beam and machined surface are vertical, therefore laser beam Irradiated along with machined surface vertical direction.The plasma produced on machined surface is possible to cause to damage to laser peening device Wound, or because Plasma-Laser beam may be cut off.
On the other hand, for the laser peening device according to prior art, for uneven weld part and weld part Periphery, operating personnel must directly specify laser work magnetic head (head) working path.Further, since by manpower butt welding The shapes and sizes of socket part carry out weighing the working path so as to assignment magnetic head, thus consume more in shot-peening operation Time, and the accuracy reduction of operation, it is impossible to complete effective shot-peening operation.
Therefore, the problem of being can solve the problem that in the urgent need to a kind of technology caused by prior art.
【Look-ahead technique document Prior Art】
【Patent document】
Korean registered patent the 10-1401902nd (05 month 2014 25Day registration)
The content of the invention
It is an object of the invention to provide a kind of control method of laser peening device, it not only can accurately and stably The shot-peening operation of the inner face for tube shape mouth is performed, be can also carry out for around uneven weld part and weld part Shot-peening operation.
It is described to swash for the control method for the laser peening device according to a side of the invention for realizing the purpose Light shot-blast unit includes the laser oscillator, the operation magnetic head that the laser beam is irradiated to Seeding location, general for generating laser beam Executor and three-dimensional scanner that the laser beam of the laser oscillator is transmitted to the operation magnetic head, the laser peening dress The control method put may include:A) 3-D scanning step, it is carried out using the three-dimensional scanner to laser peening object surface Scanning is so as to obtain the profile (profile) of laser peening object surface;B) filtration step, it is described in filtering (filtering) The information of operating area needed for being obtained after the profile of acquisition;C) working path calculation procedure, its with the profile of the acquisition and Optimal laser peening working path is calculated based on the information of operating area;And d) drive control step, it is according to described The working path of calculating is driven to the laser peening device.
In one embodiment of the invention, the filtration step may include:From the profile of the laser peening object surface The step of extracting the three dimensional surface data of the laser peening object surface;Welded from the contours extract of the laser peening object surface The step of three dimensional surface data in portion;And described in the contours extract from the laser peening object surface around weld part three The step of tieing up surface data.
In addition, the filtration step, which may also include operating area data, obtains step, to the weld part and weld part The three dimensional surface data of surrounding carries out mutually fusion to obtain the data of operating area.
In one embodiment of the invention, the working path calculation procedure may include:Step is simplified in path, passes through Straight line or curve are handled all paths about the operating area;Path deriving step, to can be from processing The path of many situations advanced to his end of one end in path exported;And Path selection step, to derived Displacement most short path is selected in many paths.
In one embodiment of the invention, the drive control step may include:Operation magnetic head control step, in laser Shot-peening operation is when carrying out in order to keep certain focal length and incident angle.The operation magnetic head of the laser peening device is entered Row control.
In addition, the drive control step may also include:Rate-determining steps are changed in position, to the first master of the operation magnetic head Body portion, the second main part, move horizontally portion, the 3rd main part and laser beam irradiation mouth the anglec of rotation so that position change distance It is controlled.
In one embodiment of the invention, the drive control step may include:Peripheral device rate-determining steps, to described Laser oscillator, executor, the driving of operation magnetic head and three-dimensional scanner are controlled.
In addition, the control method of the laser peening device may also include:Monitoring step, is swashed using supervising device to described Light shot-blast unit is monitored with state.
In addition, the monitoring step may include:Emergency stopping step, by the supervising device in the operation magnetic head Driving stops the laser peening device when can not correctly perform.
In addition, the monitoring step may include:Real-time error correction step, by the supervising device in the operation magnetic The mistake of the laser peening device is corrected in real time when the driving of head can not be performed correctly.
As described above, being included according to the control method of the laser peening device of the present invention:3-D scanning step, filtering step Suddenly, working path calculation procedure and drive control step, therefore, not only can accurately and stably be performed for tube shape mouth The shot-peening operation of inner face, can also carry out for the shot-peening operation around uneven weld part and weld part.
In addition, being included according to the control method of the laser peening device of the present invention:Extract the three-dimensional of laser peening object surface Three dimensional surface data around the step of the step of surface data, three dimensional surface data of extraction weld part and extraction weld part The step of, it therefore, it can extract the accurate three dimensional surface data about uneven Seeding location.
In addition, being included according to the control method of the laser peening device of the present invention:Simplify step, path export step in path Rapid and Path selection step, therefore, it can laser peening working path and operation pattern data that export is optimized.
In addition, can be with the laser peening working path of optimization according to the control method of the laser peening device of the present invention And the driving of operation magnetic head and peripheral device is control effectively based on operation pattern data, thus laser can be maximized The efficiency of shot-peening operation.
In addition, being included according to the control method of the laser peening device of the present invention:Monitoring step, emergency stopping step and reality When error correction step, therefore, user can easily monitor the correct operation of laser peening device, it is possible to hold in real time Row emergent stopping or error correction operation, as a result can maximize the efficiency of laser peening operation.
Brief description of the drawings
Fig. 1 is the flow chart for the control method for showing laser peening device according to an embodiment of the invention.
Fig. 2 is the flow chart for showing the filtration step shown in Fig. 1 in more detail.
Fig. 3 is the flow chart for showing the working path calculation procedure shown in Fig. 1 in more detail.
Fig. 4 is the flow chart for showing the control actuation step shown in Fig. 1 in more detail.
Fig. 5 is the flow chart for showing the monitoring step shown in Fig. 1 in more detail.
Fig. 6 is the stereogram for showing laser peening device according to an embodiment of the invention.
Fig. 7 is the stereogram for showing the operation magnetic head shown in Fig. 6.
Fig. 8 is the stereogram for the operation magnetic head for showing the laser peening device according to still another embodiment of the present invention.
Fig. 9 is the front perspective view for showing the pattern that the inside of the operation magnetic head insertion mouth shown in Fig. 8 is used.
Embodiment
Referring to the drawings to a preferred embodiment of the present invention will be described in detail.Before this, it is impossible to by this specification And the meaning that the term or word used in claims are defined on general or dictionary is explained, and it should explain For the meaning or concept of the technological thought for meeting the present invention.
In this specification, when record certain part be located at miscellaneous part it " on " when, its not only include certain part It is connected in the situation of miscellaneous part, and is included between two parts and there is a situation where other miscellaneous part.In this specification In full text, when recording certain part " comprising " inscape, as long as without especially opposite record, it means that not by it He forecloses at inscape, but may also include other inscapes.
The flow for the control method for showing laser peening device according to an embodiment of the invention is illustrated in Fig. 1 Figure, the flow chart for showing each step shown in Fig. 1 in more detail is illustrated in Fig. 2 into Fig. 5.
In addition, the figure for showing laser peening device according to an embodiment of the invention is illustrated into Fig. 9 in Fig. 6.
If with reference to above-mentioned accompanying drawing, according to the control method S100 of the laser peening device of the present invention be to Fig. 6 into Fig. 9 The method that shown laser peening device 100 is used and controlled.
First, reference picture 6 is illustrated to the composition about the laser peening device 100 according to the present embodiment to Fig. 9.
As shown in FIG. 6 and 7, it may include according to the laser peening device 100 of the present embodiment:Laser oscillator 110, manipulation Device (manipulator) 120, operation magnetic head 130, three-dimensional scanner 140 and control unit 150.
Specifically, laser oscillator 110 can generate laser beam and be sent to operation magnetic head by executor 120.
Executor 120 is installed on a sidepiece of laser oscillator 110 in the form of extending certain length, and one end is provided with Operation magnetic head 130, and the laser beam received from laser oscillator 110 can be sent to operation magnetic head 130.
Operation magnetic head 130 rotary configured is installed on executor by more than two in the form of rotatable certain angle 120 one end, and the laser beam received from executor 120 can be exposed to Seeding location.
Three-dimensional scanner 140 is installed on operation magnetic head 130, to around weld part and weld part carry out 3-D scanning from And the working path data office operation pattern data of operation magnetic head 130 can be calculated.
In addition, control unit 150 is installed on inside laser peening device 100, working path is received from three-dimensional scanner 140 Data and operation pattern data, are controlled so as to the driving to operation magnetic head 130.
As shown in figure 1, may include according to the control method S100 of the laser peening device of the present embodiment:3-D scanning step S110, filtration step S120, working path calculation procedure S130, control actuation step S140 and monitoring step S150.
Specifically, 3-D scanning step S110 is that laser peening object surface is scanned using three-dimensional scanner 100 So that the step of obtaining profile (profile) of laser peening object surface.
In 3-D scanning step S110, laser peening object is entered using the three-dimensional scanner 140 shown in Fig. 7 Row scanning.
Complete after 3-D scanning step S110, the outline data of acquisition can be processed by filtration step S120.
Specifically, filtration step S120 is filtered after (filtering) to required operation as the profile to acquisition The step of information in region is obtained, it may include following steps:From the contours extract laser peening pair of laser peening object surface As the three dimensional surface data S121 in face;From the three dimensional surface data of the contours extract of laser peening object surface about weld part S122;And from the three dimensional surface data S123 around the relevant weld part of contours extract of laser peening object surface.In addition, mistake Filter step S120 may include that operating area data obtain step S124, to the three-dimensional around the relevant weld part and weld part Surface data carries out mutually fusion to obtain the data about operating area.
Therefore, comprised the following steps according to the control method S100 of the laser peening device of the present invention:Extract laser peening The three dimensional surface data S121 of object surface;Extract the three dimensional surface data S122 about weld part;Extract the week about weld part The three dimensional surface data enclosed;And operating area data S124 is obtained, therefore, it can extract the accurate of uneven Seeding location Three dimensional surface data.
The step of filtration step S120 is as the data for working path calculation procedure S130 are extracted, completes filtration step Working path calculation procedure S130 is performed after S120.
Working path calculation procedure S130 is calculated most preferably as based on the information of the profile of acquisition and operating area The step of laser peening working path, its composition may include as follows:Step S131 is simplified in path, passes through straight line or curve All paths of operating area are handled;Path deriving step S132, to can from the one end in the path of processing to he The path for many situations that end is advanced is exported;And Path selection step S133, it in derived many paths to moving Dynamic distance most short path is selected.
The path of many situations can be exported in the path deriving step S132 mentioned, and benchmark side can be set To so as to be exported to the path of many situations.For example, can be from left side to right side or from top to bottom by direction setting Direction., can be according to exporting path clockwise or counterclockwise in addition, the situation of circular or elliptical path.
In addition, the path selected in Path selection step S133, may be selected path most short in derived many paths, The most short path may include all paths gone out with unicursal.
Therefore, according to the control method S100 of the laser peening device of the present embodiment, it includes:Simplify step in path S131, path deriving step S132 and Path selection step S133, so as to export optimization laser peening working path and Operation pattern data.
The step that control actuation step S140 is driven as the working path according to calculating to laser peening device 100 Suddenly, it may include:Operation magnetic head control step S141, position change rate-determining steps S142 and peripheral device rate-determining steps S143.
Specifically, operation magnetic head control step S141 be when carrying out laser peening operation in order to keep certain focus away from From and incident angle, the step of being controlled to the operation magnetic head 130 of laser peening device 100.Drive control step S140 is To the first main part 131 of operation magnetic head 130, the second main part 132, move horizontally portion 134, the 3rd main part 133 and laser The step of anglec of rotation of beam irradiation mouth (nozzle) 135 or even position change distance are controlled.In addition, peripheral device is controlled Step S143 is that the driving to laser oscillator 110, executor 120, operation magnetic head 130 and three-dimensional scanner 140 is controlled Processed the step of.
It can be performed according to the control method S100 of the laser peening device of the present embodiment by using laser peening device 100 Effective laser peening operation, the laser peening device 100 can be set along multiple directions to laser beam direction of illumination.
When performing the laser peening operation for tubular-type mouth, using the operation magnetic head of the tube shape shown in Fig. 8 and Fig. 9 130.Now, the operation magnetic head 130 of the tube shape shown in Fig. 8 and Fig. 9 can replace with the laser beam irradiation mouth 135 shown in Fig. 7 and make With.In the case of described, as shown in figure 9, the inside that operation magnetic head 130 can be inserted into mouth is used.
Monitoring step S150 to the use state of laser peening device 100 as being monitored using supervising device 160 Step, it may include emergency stopping step S151 and real-time error correction step S152.
Specifically, emergency stopping step S151 is that driving by supervising device 160 in operation magnetic head 130 can not correctly be held Make the step of laser peening device 100 stops during row.In addition, error correction step S152 is existed by supervising device 160 in real time When the driving of operation magnetic head 130 can not be performed correctly to laser peening device 100 mistake corrected in real time the step of.
Therefore, monitoring step S150 is included according to the control method S100 of the laser peening device of the present embodiment, promptly stopped Halt rapid S151 and real-time error correction step S152 so that user can easily to laser peening device it is correct operate into Row monitoring, and emergent stopping or error correction operation can be performed in real time, its result makes the efficiency of laser peening operation maximum Change.
Only the specific embodiments according to it are described in the detailed description of the invention described above.However, it should be understood that The specific form for being not limited to be previously mentioned in describing in detail for the present invention, is construed as including being wanted by appended right on the contrary Cover the form of deformations all within the spirit and scope of the present invention, equivalent and sub defined in asking.
In other words, the present invention is not limited to above-mentioned specific embodiment and explanation, as long as do not depart from claims Required idea of the invention, the technical staff for possessing usual knowledge if in the technical field of the invention, anyone Various deformation can be carried out, same deformation is within protection scope of the present invention.
Label declaration
S100, the control method of laser peening device
S110,3-D scanning step
S120, filtration step
S121, the step of extracting the three dimensional surface data of laser peening object surface
S122, the step of extracting the three dimensional surface data of weld part
S123, the step of extracting the three dimensional surface data around weld part
S124, operating area data obtain step
S130, working path calculation procedure
Simplify step in S131, path
S132, path deriving step
S133, Path selection step
S140, drive control step
S141, operation magnetic head control step
S142, position change rate-determining steps
S143, peripheral device rate-determining steps
S150, monitoring step
S151, emergency stopping step
S152, real-time error correction step
100, laser peening device
110, laser oscillator
120, executor
121, lower-upper length changing unit
130, operation magnetic head
131, the first main part
132, the second main part
133, the 3rd main part
134, move horizontally portion
135, laser beam irradiation mouth
136, extension portion
137, laser beam irradiation spray portion
140, three-dimensional scanner
150, control unit
160, supervising device

Claims (10)

1. a kind of control method (S100) of laser peening device, the laser that the laser peening device includes generation laser beam shakes Swing device, the operation magnetic head that the laser beam is irradiated to Seeding location, by the laser beam of the laser oscillator to the operation The executor and three-dimensional scanner of magnetic head transmission, the control method of the laser peening device is characterised by, including:
A) 3-D scanning step (S110), it is scanned to obtain using the three-dimensional scanner to laser peening object surface Obtain the profile of laser peening object surface;
B) filtration step (S120), the information of the operating area needed for being obtained after filtering the profile of the acquisition;
C) working path calculation procedure (S130), is calculated most preferably based on the information of the profile of the acquisition and operating area Laser peening working path;And
D) drive control step (S140), is driven according to the working path of the calculating to the laser peening device.
2. the control method of laser peening device according to claim 1, it is characterised in that
The filtration step (S120) comprises the following steps:
The three dimensional surface data (S121) of laser peening object surface described in contours extract from the laser peening object surface;
From the three dimensional surface data (S122) of the contours extract weld part of the laser peening object surface;And
Three dimensional surface data (S123) described in contours extract from the laser peening object surface around weld part.
3. the control method of laser peening device according to claim 2, it is characterised in that
The filtration step (S120) also includes:
Operating area data obtain step (S124), and phase is carried out to the three dimensional surface data around the weld part and weld part Mutually fusion is so as to obtain the data about operating area.
4. the control method of the laser peening device described in any one in claims 1 to 3, it is characterised in that
The working path calculation procedure (S130) includes:
Step (S131) is simplified in path, and all paths of the operating area are handled by straight line or curve;
Path deriving step (S132), to the path for many situations that can be advanced from the one end in the path of processing to his end Exported;And
Path selection step (S133), is selected the most short path of displacement in derived many paths.
5. the control method of laser peening device according to claim 1, it is characterised in that
The drive control step (S140) includes:
Operation magnetic head control step (S141), when laser peening operation is carried out in order to keep certain focal length and incidence angle Degree, is controlled to the operation magnetic head of the laser peening device.
6. the control method of laser peening device according to claim 5, it is characterised in that
The control actuation step (S140) also includes:
Position change rate-determining steps (S142), to the first main part of the operation magnetic head, the second main part, move horizontally portion, The anglec of rotation or even position change distance of 3rd main part and laser beam irradiation mouth are controlled.
7. the control method of the laser peening device according to claim 5 or 6, it is characterised in that
The control actuation step (S140) includes:
Peripheral device rate-determining steps (S143), the drive to the laser oscillator, executor, operation magnetic head and three-dimensional scanner It is dynamic to be controlled.
8. the control method of laser peening device according to claim 1, it is characterised in that also include:
Monitoring step (S150), utilizes supervising device being monitored with state to the laser peening device.
9. the control method of laser peening device according to claim 8, it is characterised in that
The monitoring step (S150) includes:
Emergency stopping step (S151), makes institute by the supervising device when the driving of the operation magnetic head can not be performed correctly State the stopping of laser peening device.
10. the control method of laser peening device according to claim 8 or claim 9, it is characterised in that
The monitoring step (S150) includes:
Real-time error correction step (S152), by the supervising device when the driving of the operation magnetic head can not be performed correctly Mistake to the laser peening device is corrected in real time.
CN201710067794.7A 2016-02-26 2017-02-07 The control method of laser peening device Pending CN107130100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010828620.XA CN111778389A (en) 2016-02-26 2017-02-07 Control method of laser shot blasting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2016-0023659 2016-02-26
KR10-2016-0023654 2016-02-26
KR1020160023654A KR101790140B1 (en) 2016-02-26 2016-02-26 Control Method of Laser Peening Apparatus
KR1020160023659A KR20170101017A (en) 2016-02-26 2016-02-26 Laser Peening Apparatus

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110732778A (en) * 2019-10-18 2020-01-31 扬州镭奔激光科技有限公司 laser peening process light path accessibility inspection method based on 3D printing

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Publication number Priority date Publication date Assignee Title
CN1695873A (en) * 2005-05-20 2005-11-16 江苏大学 Method and equipment for forming plate of moderate thickness through laser shot blast
CN101011777A (en) * 2006-12-11 2007-08-08 江苏大学 Method and apparatus of forming cut deal laser prestress composite shot blasting
CN101694584A (en) * 2009-10-23 2010-04-14 大连海事大学 Aero-engine labyrinth disc hot list processing thickness information extraction system
CN101759139A (en) * 2009-12-10 2010-06-30 江苏大学 Surface modification processing method and device of MEMS microcomponent
CN203440403U (en) * 2013-08-09 2014-02-19 苏州柯莱得激光科技有限公司 Movable laser mould surface strengthening machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1695873A (en) * 2005-05-20 2005-11-16 江苏大学 Method and equipment for forming plate of moderate thickness through laser shot blast
CN101011777A (en) * 2006-12-11 2007-08-08 江苏大学 Method and apparatus of forming cut deal laser prestress composite shot blasting
CN101694584A (en) * 2009-10-23 2010-04-14 大连海事大学 Aero-engine labyrinth disc hot list processing thickness information extraction system
CN101759139A (en) * 2009-12-10 2010-06-30 江苏大学 Surface modification processing method and device of MEMS microcomponent
CN203440403U (en) * 2013-08-09 2014-02-19 苏州柯莱得激光科技有限公司 Movable laser mould surface strengthening machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110732778A (en) * 2019-10-18 2020-01-31 扬州镭奔激光科技有限公司 laser peening process light path accessibility inspection method based on 3D printing
CN110732778B (en) * 2019-10-18 2022-07-12 扬州镭奔激光科技有限公司 3D printing-based laser shot blasting process light path accessibility inspection method

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