CN107127679B - For installing the device of polishing pad - Google Patents
For installing the device of polishing pad Download PDFInfo
- Publication number
- CN107127679B CN107127679B CN201710363911.4A CN201710363911A CN107127679B CN 107127679 B CN107127679 B CN 107127679B CN 201710363911 A CN201710363911 A CN 201710363911A CN 107127679 B CN107127679 B CN 107127679B
- Authority
- CN
- China
- Prior art keywords
- chassis
- polishing pad
- slide unit
- installing
- unit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a kind of for installing the device of polishing pad, comprising: chassis；At least two regulating positioning devices, the regulating positioning device is installed on the side wall on the chassis and is located at same periphery, the regulating positioning device includes: slide unit component, the relatively described chassis radial direction of the slide unit component is removable, by adjusting the position on the relatively described chassis of slide unit component to limit the installation region of the polishing pad, so that the polishing pad is arranged concentrically on the mounting surface on the chassis.The device according to an embodiment of the present invention for being used to install polishing pad, at least two regulating positioning devices are set on the side wall on chassis, by adjusting position of the slide unit component with respect to chassis to limit the installation region of polishing pad, so that polishing pad is arranged concentrically on the mounting surface on chassis, the technological effect to polishing wafer is improved.
Description
Technical field
It is the invention belongs to technical field of semiconductors, in particular to a kind of for installing the device of polishing pad.
Background technique
Before being polished to wafer, it is necessary first to polishing pad is installed on chassis, usually manually by polishing pad
It lies in a horizontal plane on chassis, then the plastic protective layer on polishing pad is torn.Since chassis diameter dimension is larger, and polishing pad ruler
It is very little different, therefore, it is impossible to guarantee that polishing pad is arranged concentrically with chassis, and contact face of the polishing pad with chassis during the installation process
It is also easy to produce bubble, influences technological effect.
Summary of the invention
The present invention is directed to solve one of above-mentioned technical problem at least to a certain extent.
For this purpose, the present invention proposes a kind of for installing the device of polishing pad, which can be quasi-
Standby positioning polishing pad improves the process effect of polishing pad so that polishing pad is arranged concentrically with chassis.
It is according to an embodiment of the present invention for install the device of polishing pad to include: chassis；At least two regulating positioning devices,
The regulating positioning device is installed on the side wall on the chassis and is located at same periphery, and the regulating positioning device includes:
Slide unit component, the relatively described chassis radial direction of the slide unit component is removable, relatively described by adjusting the slide unit component
The position on chassis is to limit the installation region of the polishing pad, so that the polishing pad is arranged concentrically in the peace on the chassis
On dress face.
The device according to an embodiment of the present invention for being used to install polishing pad is arranged at least two on the side wall on chassis and adjusts
Positioning device, by adjusting position of the slide unit component with respect to chassis so that the installation region of polishing pad is limited, so that polishing pad
It is arranged concentrically on the mounting surface on chassis, improves the technological effect to polishing wafer.
In addition, it is according to an embodiment of the present invention for installing the device of polishing pad, there can also be following additional technology
Feature:
According to one embodiment of present invention, the regulating positioning device further comprises: positioning component, the positioning group
Part includes arc positioning plate and horizontal location plate, the arc positioning plate fitting be set to the side wall on the chassis and with the bottom
Disk is arranged concentrically, and the horizontal location plate is tangential on the lower part of the arc positioning plate, and the slide unit component is vertically installed in institute
State horizontal location plate；Top panel, the top panel are set to slide unit component top surface, and the top panel has towards the bottom
The open location hole in disk direction, the location hole is for installing locating rod.
According to one embodiment of present invention, the side wall on the chassis is equipped at least two mounting holes, two peaces
Dress hole is located on same periphery and two mounting holes and the center of circle are wired to right angle, and the arc positioning plate passes through fastening
The side wall on the chassis is fixed in part and mounting hole cooperation.
According to one embodiment of present invention, the top on the chassis has inclined surface, and the inclined surface is along the installation
The periphery in face tilts down extension outward.
According to one embodiment of present invention, the lower end of locating rod is not higher than the mounting surface on the chassis, the locating rod
Upper end be higher than the chassis mounting surface.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is according to an embodiment of the invention for installing the top view of the device of polishing pad；
Fig. 2 is the cross-sectional view in Fig. 1 along line A-A；
Fig. 3 is the enlarged drawing in Fig. 2 at B.
Appended drawing reference:
For installing the device 100 of polishing pad；
Chassis 10；Mounting surface 11；Inclined surface 12；
Regulating positioning device 20；Slide unit component 21；Positioning component 22；Arc positioning plate 221；Horizontal location plate 222；Above
Plate 23；Locating rod 24.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
It is described referring to Fig. 1-3 according to an embodiment of the present invention for installing the device 100 of polishing pad.
Specifically, the device 100 for installing polishing pad may include: chassis 10 and at least two regulating positioning devices
20.As shown in Figure 1 with Figure 2, chassis 10 has the mounting surface 11 for installing polishing pad.
At least two regulating positioning devices 20 are installed on the side wall on chassis 10 and are located at same periphery.That is,
Two or more regulating positioning devices 20 can be set in the side wall on chassis 10.
The regulating positioning device 20 includes slide unit component 21, and slide unit component 21 is removable with respect to 10 radial direction of chassis, is led to
The installation region that slide unit component 21 limits polishing pad with respect to the position on chassis 10 is overregulated, so that polishing pad is arranged concentrically
In on the mounting surface 11 on chassis 10.
When polishing pad and 10 size of chassis are inconsistent, while adjusting position of two regulating positioning devices 20 with respect to chassis 10
It sets, so that slide unit component 21 is along the radial direction on chassis 10, direction is moved from the inside to the outside, or makes slide unit component 21
Along the radial direction on chassis 10, direction is moved from the outside to the inside, wherein and two 20 regulated quantitys of regulating positioning device are identical, from
And the installation region suitable for polishing pad size is limited, guarantee that polishing pad is arranged concentrically with chassis 10.
It is according to an embodiment of the present invention for installing the device 100 of polishing pad as a result, be arranged on the side wall on chassis 10 to
Few two regulating positioning devices 20, by adjusting position of the slide unit component 21 with respect to chassis 10 to limit the installation of polishing pad
The technological effect to polishing wafer is improved so that polishing pad is arranged concentrically on the mounting surface 11 on chassis 10 in region.
In some embodiments of the invention, as shown in connection with fig. 2 such as Fig. 3, regulating positioning device 20 further comprises: positioning
Component 22 and top panel 23.Wherein, positioning component 22 includes arc positioning plate 221 and horizontal location plate 222, arc positioning plate
221 fittings are set to the side wall on chassis 10 and are arranged concentrically with chassis 10, and horizontal location plate 222 is tangential on arc positioning plate 221
Lower part, slide unit component 21 is vertically installed in horizontal location plate 222.Top panel 23 is set to 21 top surface of slide unit component, top panel
23 have towards the open location hole in 10 direction of chassis, and location hole is for installing locating rod 24.
In this way, when installing polishing pad, operator can by polishing pad wherein side periphery along two locating rods 24
Circumferential surface slide downward, to guarantee that polishing pad is accurately fallen into the installation region of the restriction of slide unit component 21, then tiling is entire is thrown
Light pad is fully drained the bubble between polishing pad and chassis 10, finally tears the protective film on polishing pad, thus complete
At the installation of polishing pad.
In some alternative embodiments, the side wall on chassis 10 is equipped at least two mounting holes, and two mounting holes are located at same
On periphery and two mounting holes and the center of circle is wired to right angle, and arc positioning plate 221 is solid by fastener and mounting hole cooperation
Due to the side wall on chassis 10.Wherein, fastener can be screw or bolt.It is, of course, understood that above-described embodiment is only
It schematically, is not limiting the scope of the invention, the line in two mounting holes and the center of circle may be other angles,
Such as 30 °, 60 ° or 120 ° etc., as long as guaranteeing that the center of circle of circle where two mounting holes is overlapped with the center of circle on chassis 10.
In further optional example, as shown in connection with fig. 2 such as Fig. 3, the top on chassis 10 has inclined surface 12,12 edge of inclined surface
The periphery of mounting surface 11 tilts down extension outward.In this way, can make locating rod 24 that there is bigger moving range, thus into one
Step effectively adjusts the relative position of polishing pad and chassis 10, guarantees that polishing pad is arranged concentrically with chassis 10.
Furthermore, it is necessary to which polishing pad can be removed from inclined surface 12 when replacing polishing pad.Consequently facilitating the replacement of polishing pad
And installation.
Wherein, the diameter of polishing pad is D, and the diameter on chassis 10 is d, regulated quantity L, L=| D-d |/2, and it is polished placing
Before pad, regulated quantity can be first calculated, so that radial direction of the slide unit component 21 along chassis 10 moves the regulated quantity precalculated,
To guarantee that polishing pad can be arranged concentrically with chassis 10.
In further alternative embodiment, as shown in connection with fig. 2 such as Fig. 3, the lower end of locating rod 24 is not higher than the installation on chassis 10
Face 11, the upper end of locating rod 24 are higher than the mounting surface 11 on chassis 10.That is, the lower end of locating rod 24 is lower than the peace on chassis 10
Dress face 11 or the lower end of locating rod 24 are concordant with the mounting surface 11 on chassis 10.In this way, polishing pad can be made to be accurately positioned
In in the installation region that slide unit component 21 limits, guarantee polishing pad is arranged concentrically with chassis 10.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (4)
1. a kind of for installing the device of polishing pad characterized by comprising
Chassis；
At least two regulating positioning devices, the regulating positioning device are installed on the side wall on the chassis and are located at same circumference
Face, the regulating positioning device include:
Slide unit component, the relatively described chassis radial direction of the slide unit component is removable, opposite by adjusting the slide unit component
The position on the chassis is to limit the installation region of the polishing pad, so that the polishing pad is arranged concentrically in the chassis
Mounting surface on；
Positioning component, the positioning component include arc positioning plate and horizontal location plate, and the arc positioning plate fitting is set to
It the side wall on the chassis and being arranged concentrically with the chassis, the horizontal location plate is tangential on the lower part of the arc positioning plate,
The slide unit component is vertically installed in the horizontal location plate；
Top panel, the top panel are set to slide unit component top surface, and the top panel has spacious towards the chassis direction
The location hole opened, the location hole is for installing locating rod.
2. according to claim 1 for installing the device of polishing pad, which is characterized in that the side wall on the chassis is equipped with
At least two mounting holes, two mounting holes be located on same periphery and two mounting holes and the center of circle be wired to it is straight
Angle, the arc positioning plate are fixed on the side wall on the chassis by fastener and mounting hole cooperation.
3. according to claim 1 for installing the device of polishing pad, which is characterized in that the top on the chassis, which has, inclines
Inclined-plane, the inclined surface tilt down extension along the periphery of the mounting surface outward.
4. according to claim 1 for installing the device of polishing pad, which is characterized in that the lower end of locating rod is not higher than institute
The mounting surface on chassis is stated, the upper end of the locating rod is higher than the mounting surface on the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710363911.4A CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710363911.4A CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107127679A CN107127679A (en) | 2017-09-05 |
| CN107127679B true CN107127679B (en) | 2019-09-03 |
Family
ID=59732498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710363911.4A Expired - Fee Related CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107127679B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110394729B (en) * | 2019-07-23 | 2021-09-10 | 西安奕斯伟硅片技术有限公司 | Positioning structure of grinding pad, grinding equipment and positioning method |
| CN111975422B (en) * | 2020-08-24 | 2021-08-27 | 中国工程物理研究院化工材料研究所 | Vacuum-driven radial automatic positioning device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514123B1 (en) * | 2000-11-21 | 2003-02-04 | Agere Systems Inc. | Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
| CN2586563Y (en) * | 2002-10-30 | 2003-11-19 | 邝钜津 | Polishing disc of non-ferrous metal bar polishing machine |
| CN201002223Y (en) * | 2007-02-05 | 2008-01-09 | 薄夫军 | Flange cushion mounting locator |
| CN102275124A (en) * | 2011-06-02 | 2011-12-14 | 友达光电（苏州）有限公司 | Grinding platform and grinding method |
| CN105817992A (en) * | 2016-05-30 | 2016-08-03 | 上海华力微电子有限公司 | Polishing pad mounting fixture device used on CMP (chemical mechanical planarization) equipment and use method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7300338B2 (en) * | 2005-09-22 | 2007-11-27 | Abrasive Technology, Inc. | CMP diamond conditioning disk |
-
2017
- 2017-05-22 CN CN201710363911.4A patent/CN107127679B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514123B1 (en) * | 2000-11-21 | 2003-02-04 | Agere Systems Inc. | Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
| CN2586563Y (en) * | 2002-10-30 | 2003-11-19 | 邝钜津 | Polishing disc of non-ferrous metal bar polishing machine |
| CN201002223Y (en) * | 2007-02-05 | 2008-01-09 | 薄夫军 | Flange cushion mounting locator |
| CN102275124A (en) * | 2011-06-02 | 2011-12-14 | 友达光电（苏州）有限公司 | Grinding platform and grinding method |
| CN105817992A (en) * | 2016-05-30 | 2016-08-03 | 上海华力微电子有限公司 | Polishing pad mounting fixture device used on CMP (chemical mechanical planarization) equipment and use method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107127679A (en) | 2017-09-05 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190903 Termination date: 20210522 |
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| CF01 | Termination of patent right due to non-payment of annual fee |