Summary of the invention
The present invention is directed to solve one of above-mentioned technical problem at least to a certain extent.
For this purpose, the present invention proposes a kind of for installing the device of polishing pad, which can be quasi-
Standby positioning polishing pad improves the process effect of polishing pad so that polishing pad is arranged concentrically with chassis.
It is according to an embodiment of the present invention for install the device of polishing pad to include: chassis;At least two regulating positioning devices,
The regulating positioning device is installed on the side wall on the chassis and is located at same periphery, and the regulating positioning device includes:
Slide unit component, the relatively described chassis radial direction of the slide unit component is removable, relatively described by adjusting the slide unit component
The position on chassis is to limit the installation region of the polishing pad, so that the polishing pad is arranged concentrically in the peace on the chassis
On dress face.
The device according to an embodiment of the present invention for being used to install polishing pad is arranged at least two on the side wall on chassis and adjusts
Positioning device, by adjusting position of the slide unit component with respect to chassis so that the installation region of polishing pad is limited, so that polishing pad
It is arranged concentrically on the mounting surface on chassis, improves the technological effect to polishing wafer.
In addition, it is according to an embodiment of the present invention for installing the device of polishing pad, there can also be following additional technology
Feature:
According to one embodiment of present invention, the regulating positioning device further comprises: positioning component, the positioning group
Part includes arc positioning plate and horizontal location plate, the arc positioning plate fitting be set to the side wall on the chassis and with the bottom
Disk is arranged concentrically, and the horizontal location plate is tangential on the lower part of the arc positioning plate, and the slide unit component is vertically installed in institute
State horizontal location plate;Top panel, the top panel are set to slide unit component top surface, and the top panel has towards the bottom
The open location hole in disk direction, the location hole is for installing locating rod.
According to one embodiment of present invention, the side wall on the chassis is equipped at least two mounting holes, two peaces
Dress hole is located on same periphery and two mounting holes and the center of circle are wired to right angle, and the arc positioning plate passes through fastening
The side wall on the chassis is fixed in part and mounting hole cooperation.
According to one embodiment of present invention, the top on the chassis has inclined surface, and the inclined surface is along the installation
The periphery in face tilts down extension outward.
According to one embodiment of present invention, the lower end of locating rod is not higher than the mounting surface on the chassis, the locating rod
Upper end be higher than the chassis mounting surface.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
It is described referring to Fig. 1-3 according to an embodiment of the present invention for installing the device 100 of polishing pad.
Specifically, the device 100 for installing polishing pad may include: chassis 10 and at least two regulating positioning devices
20.As shown in Figure 1 with Figure 2, chassis 10 has the mounting surface 11 for installing polishing pad.
At least two regulating positioning devices 20 are installed on the side wall on chassis 10 and are located at same periphery.That is,
Two or more regulating positioning devices 20 can be set in the side wall on chassis 10.
The regulating positioning device 20 includes slide unit component 21, and slide unit component 21 is removable with respect to 10 radial direction of chassis, is led to
The installation region that slide unit component 21 limits polishing pad with respect to the position on chassis 10 is overregulated, so that polishing pad is arranged concentrically
In on the mounting surface 11 on chassis 10.
When polishing pad and 10 size of chassis are inconsistent, while adjusting position of two regulating positioning devices 20 with respect to chassis 10
It sets, so that slide unit component 21 is along the radial direction on chassis 10, direction is moved from the inside to the outside, or makes slide unit component 21
Along the radial direction on chassis 10, direction is moved from the outside to the inside, wherein and two 20 regulated quantitys of regulating positioning device are identical, from
And the installation region suitable for polishing pad size is limited, guarantee that polishing pad is arranged concentrically with chassis 10.
It is according to an embodiment of the present invention for installing the device 100 of polishing pad as a result, be arranged on the side wall on chassis 10 to
Few two regulating positioning devices 20, by adjusting position of the slide unit component 21 with respect to chassis 10 to limit the installation of polishing pad
The technological effect to polishing wafer is improved so that polishing pad is arranged concentrically on the mounting surface 11 on chassis 10 in region.
In some embodiments of the invention, as shown in connection with fig. 2 such as Fig. 3, regulating positioning device 20 further comprises: positioning
Component 22 and top panel 23.Wherein, positioning component 22 includes arc positioning plate 221 and horizontal location plate 222, arc positioning plate
221 fittings are set to the side wall on chassis 10 and are arranged concentrically with chassis 10, and horizontal location plate 222 is tangential on arc positioning plate 221
Lower part, slide unit component 21 is vertically installed in horizontal location plate 222.Top panel 23 is set to 21 top surface of slide unit component, top panel
23 have towards the open location hole in 10 direction of chassis, and location hole is for installing locating rod 24.
In this way, when installing polishing pad, operator can by polishing pad wherein side periphery along two locating rods 24
Circumferential surface slide downward, to guarantee that polishing pad is accurately fallen into the installation region of the restriction of slide unit component 21, then tiling is entire is thrown
Light pad is fully drained the bubble between polishing pad and chassis 10, finally tears the protective film on polishing pad, thus complete
At the installation of polishing pad.
In some alternative embodiments, the side wall on chassis 10 is equipped at least two mounting holes, and two mounting holes are located at same
On periphery and two mounting holes and the center of circle is wired to right angle, and arc positioning plate 221 is solid by fastener and mounting hole cooperation
Due to the side wall on chassis 10.Wherein, fastener can be screw or bolt.It is, of course, understood that above-described embodiment is only
It schematically, is not limiting the scope of the invention, the line in two mounting holes and the center of circle may be other angles,
Such as 30 °, 60 ° or 120 ° etc., as long as guaranteeing that the center of circle of circle where two mounting holes is overlapped with the center of circle on chassis 10.
In further optional example, as shown in connection with fig. 2 such as Fig. 3, the top on chassis 10 has inclined surface 12,12 edge of inclined surface
The periphery of mounting surface 11 tilts down extension outward.In this way, can make locating rod 24 that there is bigger moving range, thus into one
Step effectively adjusts the relative position of polishing pad and chassis 10, guarantees that polishing pad is arranged concentrically with chassis 10.
Furthermore, it is necessary to which polishing pad can be removed from inclined surface 12 when replacing polishing pad.Consequently facilitating the replacement of polishing pad
And installation.
Wherein, the diameter of polishing pad is D, and the diameter on chassis 10 is d, regulated quantity L, L=| D-d |/2, and it is polished placing
Before pad, regulated quantity can be first calculated, so that radial direction of the slide unit component 21 along chassis 10 moves the regulated quantity precalculated,
To guarantee that polishing pad can be arranged concentrically with chassis 10.
In further alternative embodiment, as shown in connection with fig. 2 such as Fig. 3, the lower end of locating rod 24 is not higher than the installation on chassis 10
Face 11, the upper end of locating rod 24 are higher than the mounting surface 11 on chassis 10.That is, the lower end of locating rod 24 is lower than the peace on chassis 10
Dress face 11 or the lower end of locating rod 24 are concordant with the mounting surface 11 on chassis 10.In this way, polishing pad can be made to be accurately positioned
In in the installation region that slide unit component 21 limits, guarantee polishing pad is arranged concentrically with chassis 10.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.