CN107127679A - Device for installing polishing pad - Google Patents
Device for installing polishing pad Download PDFInfo
- Publication number
- CN107127679A CN107127679A CN201710363911.4A CN201710363911A CN107127679A CN 107127679 A CN107127679 A CN 107127679A CN 201710363911 A CN201710363911 A CN 201710363911A CN 107127679 A CN107127679 A CN 107127679A
- Authority
- CN
- China
- Prior art keywords
- chassis
- polishing pad
- slide unit
- unit component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a kind of device for being used to install polishing pad, including：Chassis；At least two regulating positioning devices, the regulating positioning device is installed on the side wall on the chassis and positioned at same periphery, and the regulating positioning device includes：Slide unit component, the relatively described chassis radial direction of the slide unit component may move, by adjusting the position on the relatively described chassis of the slide unit component so as to limit the installation region of the polishing pad so that the polishing pad is arranged concentrically on the mounting surface on the chassis.The device for being used to install polishing pad according to embodiments of the present invention, at least two regulating positioning devices are set on the side wall on chassis, by adjusting slide unit component with respect to the position on chassis so as to limit the installation region of polishing pad, so that polishing pad is arranged concentrically on the mounting surface on chassis, the technological effect to polishing wafer is improved.
Description
Technical field
The invention belongs to technical field of semiconductors, more particularly to a kind of device for being used to install polishing pad.
Background technology
It is typically manually by polishing pad before being polished to wafer, it is necessary first to which polishing pad is installed on chassis
Lie in a horizontal plane on chassis, then the plastic protective layer on polishing pad is torn.Because chassis diameter dimension is larger, and polishing pad chi
It is very little to differ, therefore, it is impossible to ensure that polishing pad is arranged concentrically with chassis, and contact face of the polishing pad with chassis in installation process
Bubble is also easy to produce, technological effect is influenceed.
The content of the invention
It is contemplated that at least solving one of above-mentioned technical problem to a certain extent.
Therefore, the present invention proposes a kind of device for being used to install polishing pad, the device for being used to install polishing pad can be accurate
Standby positioning polishing pad so that polishing pad is arranged concentrically with chassis, improves the PROCESS FOR TREATMENT effect of polishing pad.
The device for being used to install polishing pad according to embodiments of the present invention includes：Chassis；At least two regulating positioning devices,
The regulating positioning device is installed on the side wall on the chassis and positioned at same periphery, and the regulating positioning device includes：
Slide unit component, the relatively described chassis radial direction of the slide unit component may move, relatively described by adjusting the slide unit component
The position on chassis is so as to limit the installation region of the polishing pad so that the polishing pad is arranged concentrically in the peace on the chassis
On dress face.
The device for being used to install polishing pad according to embodiments of the present invention, sets at least two to adjust on the side wall on chassis
Positioner, by adjusting slide unit component with respect to the position on chassis so as to limit the installation region of polishing pad so that polishing pad
It is arranged concentrically on the mounting surface on chassis, improves the technological effect to polishing wafer.
In addition, the device for being used to install polishing pad according to embodiments of the present invention, can also have technology additional as follows
Feature：
According to one embodiment of present invention, the regulating positioning device further comprises：Positioning component, the positioning group
Part includes arc location-plate and horizontal location plate, arc location-plate laminating be arranged at the side wall on the chassis and with the bottom
Disk is arranged concentrically, and the horizontal location plate is tangential on the bottom of the arc location-plate, and the slide unit component is vertically installed in institute
State horizontal location plate；Top panel, the top panel is arranged at the slide unit component top surface, and the top panel has towards the bottom
The unlimited positioning hole in disk direction, the positioning hole is used to install locating rod.
According to one embodiment of present invention, the side wall on the chassis is provided with least two mounting holes, two peaces
Hole position is filled on same periphery and two mounting holes and the line in the center of circle are at a right angle, the arc location-plate passes through fastening
Part coordinates the side wall for being fixed on the chassis with the mounting hole.
According to one embodiment of present invention, the top on the chassis has inclined plane, and the inclined plane is installed along described
The periphery in face outwards tilts down extension.
According to one embodiment of present invention, the lower end of locating rod is not higher than the mounting surface on the chassis, the locating rod
Upper end be higher than the chassis mounting surface.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become from description of the accompanying drawings below to embodiment is combined
Substantially and be readily appreciated that, wherein：
Fig. 1 is the top view according to an embodiment of the invention for being used to install the device of polishing pad；
Fig. 2 is the sectional view along line A-A in Fig. 1；
Fig. 3 is the enlarged drawing at B in Fig. 2.
Reference：
Device 100 for installing polishing pad；
Chassis 10；Mounting surface 11；Inclined plane 12；
Regulating positioning device 20；Slide unit component 21；Positioning component 22；Arc location-plate 221；Horizontal location plate 222；Above
Plate 23；Locating rod 24.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
The device 100 for being used to install polishing pad according to embodiments of the present invention is described referring to Fig. 1-3.
Specifically, it can include for installing the device 100 of polishing pad：The regulating positioning device of chassis 10 and at least two
20.As shown in Figure 1 with Figure 2, chassis 10 has the mounting surface 11 for being used for installing polishing pad.
At least two regulating positioning devices 20 are installed on the side wall on chassis 10 and positioned at same periphery.That is,
The side wall on chassis 10 can set two or more regulating positioning devices 20.
The regulating positioning device 20 includes slide unit component 21, and slide unit component 21 may move with respect to the radial direction of chassis 10, lead to
Overregulate slide unit component 21 with respect to the position on chassis 10 to limit the installation region of polishing pad so that polishing pad is arranged concentrically
In on the mounting surface 11 on chassis 10.
When polishing pad and the size of chassis 10 are inconsistent, while position of two regulating positioning devices 20 of regulation with respect to chassis 10
Put so that radial direction of the slide unit component 21 along chassis 10 is moved by Inside To Outside direction, or cause slide unit component 21
Along the radial direction on chassis 10 from outside to inward side to moving, wherein, two regulated quantitys of regulating positioning device 20 are identical, from
And limiting the installation region suitable for polishing pad size, it is ensured that polishing pad is arranged concentrically with chassis 10.
Thus, the device 100 for being used to install polishing pad according to embodiments of the present invention, set on the side wall on chassis 10 to
Few two regulating positioning devices 20, by adjusting slide unit component 21 with respect to the position on chassis 10 so as to limit the installation of polishing pad
Region so that polishing pad is arranged concentrically on the mounting surface 11 on chassis 10, improves the technological effect to polishing wafer.
In some embodiments of the invention, as shown in Fig. 3 combinations Fig. 2, regulating positioning device 20 further comprises：Positioning
Component 22 and top panel 23.Wherein, positioning component 22 includes arc location-plate 221 and horizontal location plate 222, arc location-plate
221 laminatings are arranged at the side wall on chassis 10 and are arranged concentrically with chassis 10, and horizontal location plate 222 is tangential on arc location-plate 221
Bottom, slide unit component 21 is vertically installed in horizontal location plate 222.Top panel 23 is arranged at the top surface of slide unit component 21, top panel
23 have the positioning hole opened wide towards the direction of chassis 10, and positioning hole is used to install locating rod 24.
So, when installing polishing pad, operating personnel can be by polishing pad wherein side periphery along two locating rods 24
Side face slide downward, so that ensure that polishing pad is accurately fallen into the installation region of the restriction of slide unit component 21, whole throw of then tiling
Light pad causes the bubble between polishing pad and chassis 10 to be fully drained, and finally tears the diaphragm on polishing pad, so that complete
Into the installation of polishing pad.
In some alternative embodiments, the side wall on chassis 10 is provided with least two mounting holes, and two mounting hole sites are in same
On periphery and two mounting holes and the line in the center of circle are at a right angle, arc location-plate 221 coordinates solid by fastener and mounting hole
Due to the side wall on chassis 10.Wherein, fastener can be screw or bolt.It is, of course, understood that above-described embodiment is only
Schematically, it is not limiting the scope of the invention, the line in two mounting holes and the center of circle can also be other angles,
Such as 30 °, 60 ° or 120 °, as long as ensureing that the center of circle of circle where two mounting holes is overlapped with the center of circle on chassis 10.
In further optional example, as shown in Fig. 3 combinations Fig. 2, the top on chassis 10 has inclined plane 12, the edge of inclined plane 12
The periphery of mounting surface 11 outwards tilts down extension.So, it can cause locating rod 24 that there is bigger moving range, so as to enter one
Step effectively regulation polishing pad and the relative position on chassis 10, it is ensured that polishing pad is arranged concentrically with chassis 10.
Furthermore, it is necessary to which when changing polishing pad, polishing pad can be removed at inclined plane 12.Consequently facilitating the replacing of polishing pad
And installation.
Wherein, a diameter of D of polishing pad, a diameter of d on chassis 10, regulated quantity is L, L=| D-d |/2, placing polishing
Before pad, regulated quantity can be first calculated so that radial direction of the slide unit component 21 along chassis 10 moves the regulated quantity precalculated,
So as to ensure that polishing pad can be arranged concentrically with chassis 10.
In further alternative embodiment, as shown in Fig. 3 combinations Fig. 2, the lower end of locating rod 24 is not higher than the installation on chassis 10
Face 11, the upper end of locating rod 24 is higher than the mounting surface 11 on chassis 10.That is, the lower end of locating rod 24 is less than the peace on chassis 10
Dress face 11, or the lower end of locating rod 24 and the mounting surface 11 on chassis 10 it is concordant.So, polishing pad can be accurately positioned
In in the installation region that slide unit component 21 is limited, it is ensured that polishing pad is arranged concentrically with chassis 10.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means to combine specific features, the knot that the embodiment or example are described
Structure, material or feature are contained at least one embodiment of the present invention or example.In this manual, to above-mentioned term
Schematic representation is not necessarily referring to identical embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner be combined in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (5)
1. a kind of device for being used to install polishing pad, it is characterised in that including：
Chassis；
At least two regulating positioning devices, the regulating positioning device is installed on the side wall on the chassis and positioned at same circumference
Face, the regulating positioning device includes：
Slide unit component, the relatively described chassis radial direction of the slide unit component may move, relative by adjusting the slide unit component
The position on the chassis is so as to limit the installation region of the polishing pad so that the polishing pad is arranged concentrically in the chassis
Mounting surface on.
2. the device according to claim 1 for being used to install polishing pad, it is characterised in that the regulating positioning device enters one
Step includes：
Positioning component, the positioning component includes arc location-plate and horizontal location plate, and the arc location-plate laminating is arranged at
The side wall on the chassis and it is arranged concentrically with the chassis, the horizontal location plate is tangential on the bottom of the arc location-plate,
The slide unit component is vertically installed in the horizontal location plate；
Top panel, the top panel is arranged at the slide unit component top surface, and the top panel has spacious towards the chassis direction
The positioning hole opened, the positioning hole is used to install locating rod.
3. the device according to claim 2 for being used to install polishing pad, it is characterised in that the side wall on the chassis is provided with
At least two mounting holes, two mounting hole sites are straight in being wired to on same periphery and two mounting holes and the center of circle
Angle, the arc location-plate coordinates the side wall for being fixed on the chassis by fastener and the mounting hole.
4. the device according to claim 2 for being used to install polishing pad, it is characterised in that the top on the chassis, which has, inclines
Inclined-plane, periphery of the inclined plane along the mounting surface outwards tilts down extension.
5. the device according to claim 2 for being used to install polishing pad, it is characterised in that the lower end of locating rod is not higher than institute
The mounting surface on chassis is stated, the upper end of the locating rod is higher than the mounting surface on the chassis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710363911.4A CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710363911.4A CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107127679A true CN107127679A (en) | 2017-09-05 |
| CN107127679B CN107127679B (en) | 2019-09-03 |
Family
ID=59732498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710363911.4A Expired - Fee Related CN107127679B (en) | 2017-05-22 | 2017-05-22 | For installing the device of polishing pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107127679B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110394729A (en) * | 2019-07-23 | 2019-11-01 | 西安奕斯伟硅片技术有限公司 | A kind of location structure of grinding pad, milling apparatus and localization method |
| CN111975422A (en) * | 2020-08-24 | 2020-11-24 | 中国工程物理研究院化工材料研究所 | Vacuum-driven radial automatic positioning device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514123B1 (en) * | 2000-11-21 | 2003-02-04 | Agere Systems Inc. | Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
| CN2586563Y (en) * | 2002-10-30 | 2003-11-19 | 邝钜津 | Polishing disc of non-ferrous metal bar polishing machine |
| US20070066194A1 (en) * | 2005-09-22 | 2007-03-22 | Wielonski Roy F | CMP diamond conditioning disk |
| CN201002223Y (en) * | 2007-02-05 | 2008-01-09 | 薄夫军 | Flange cushion mounting locator |
| CN102275124A (en) * | 2011-06-02 | 2011-12-14 | 友达光电（苏州）有限公司 | Grinding platform and grinding method |
| CN105817992A (en) * | 2016-05-30 | 2016-08-03 | 上海华力微电子有限公司 | Polishing pad mounting fixture device used on CMP (chemical mechanical planarization) equipment and use method |
-
2017
- 2017-05-22 CN CN201710363911.4A patent/CN107127679B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6514123B1 (en) * | 2000-11-21 | 2003-02-04 | Agere Systems Inc. | Semiconductor polishing pad alignment device for a polishing apparatus and method of use |
| CN2586563Y (en) * | 2002-10-30 | 2003-11-19 | 邝钜津 | Polishing disc of non-ferrous metal bar polishing machine |
| US20070066194A1 (en) * | 2005-09-22 | 2007-03-22 | Wielonski Roy F | CMP diamond conditioning disk |
| CN201002223Y (en) * | 2007-02-05 | 2008-01-09 | 薄夫军 | Flange cushion mounting locator |
| CN102275124A (en) * | 2011-06-02 | 2011-12-14 | 友达光电（苏州）有限公司 | Grinding platform and grinding method |
| CN105817992A (en) * | 2016-05-30 | 2016-08-03 | 上海华力微电子有限公司 | Polishing pad mounting fixture device used on CMP (chemical mechanical planarization) equipment and use method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110394729A (en) * | 2019-07-23 | 2019-11-01 | 西安奕斯伟硅片技术有限公司 | A kind of location structure of grinding pad, milling apparatus and localization method |
| CN111975422A (en) * | 2020-08-24 | 2020-11-24 | 中国工程物理研究院化工材料研究所 | Vacuum-driven radial automatic positioning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107127679B (en) | 2019-09-03 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190903 Termination date: 20210522 |