Heat radiation system of universal power amplifier module
Technical Field
The invention relates to the field of electronics, in particular to a heat dissipation system of a universal power amplifier module.
Background
A general power amplifier is an important component of a transmitting device in a communication system. The universal power amplifier is used in the final stage of the transmitter to amplify the power of the modulated wave signal to meet the requirement of transmitting power, and then to radiate the modulated wave signal to the space via the antenna, so as to ensure that the receiver in a certain area can receive satisfactory signal level and does not interfere with the communication of adjacent channels. The narrow-band high-frequency power amplifier is divided into a narrow-band high-frequency power amplifier and a wide-band high-frequency power amplifier according to the width of the working frequency band, and the narrow-band high-frequency power amplifier usually takes a frequency selection circuit with a frequency selection filtering function as an output loop, so the narrow-band high-frequency power amplifier is also called a tuning power amplifier or a resonance power amplifier; the output circuit of the wideband high frequency power amplifier is a transmission line transformer or other wideband matching circuit, and is also called a non-tuned power amplifier.
general power amplifier is because output is higher, and the heat that its produced is great, if not carry out the heat dissipation to general power amplifier and handle, and the heat that constantly accumulates probably can lead to general power amplifier's circuit or device to damage, among the prior art, general power amplifier adopts metal casing to dispel the heat usually, and the metal casing surface is provided with unevenness's paster to realize increasing heat radiating area and dispel the heat. However, in the actual use process, the number of the universal power amplifiers is more than one, and other devices are closely arranged around the universal power amplifiers, so that heat in a small space still exists around the universal power amplifiers, and the heat dissipation effect is not good.
Disclosure of Invention
The invention aims to solve the technical problem that the heat dissipation effect of a patch in the prior art is poor, and aims to provide a heat dissipation system of a universal power amplifier module, which can effectively dissipate the heat of a universal power amplifier and reduce the working temperature of the universal power amplifier.
The invention is realized by the following technical scheme:
The heat dissipation system of the universal power amplifier module comprises a universal power amplifier, and further comprises a lower-layer water channel, shell heat dissipation iron sheets, a water flow circulating device and a shell, wherein the universal power amplifier is covered and wrapped by the shell, the shell heat dissipation iron sheets are arranged on the surface of the shell, the shell heat dissipation iron sheets are vertically arranged on the surface of the shell and are arranged in order, and gaps are reserved between the adjacent shell heat dissipation iron sheets; the lower-layer water channel covers the surface of the shell, uniform bulges are reserved on the lower side of the lower-layer water channel, and the positions of the bulges are matched with gaps among the radiating iron sheets of the shell; an upper-layer water channel is arranged on the upper side of the lower-layer water channel and covers the surface of the lower-layer water channel; and two ends of the upper-layer water channel and two ends of the lower-layer water channel are correspondingly communicated through a water flow circulating device respectively.
In the prior art, the heat dissipation area is increased by arranging the shell heat dissipation iron sheet, the upper-layer water channel and the lower-layer water channel are arranged on the surface of the shell heat dissipation iron sheet, and the upper-layer water channel and the lower-layer water channel are communicated through the water flow circulating device, so that a water flow circulating channel can be formed. When two rivers circulating device during operation, the water in upper water passageway and the lower floor's water passageway flows, water and shell and the shell heat dissipation iron sheet in the lower floor's water passageway in close contact with, rivers are taken away the temperature in shell and the shell heat dissipation iron sheet, the temperature degree in the lower floor's water passageway risees, the upper water passageway can absorb the temperature of a part lower floor's water passageway through the area with the contact of lower floor's water passageway, simultaneously rivers circulating device can flow into the upper water passageway with the water in the lower floor's water passageway, dispel the heat in the upper water passageway, the low temperature water in the upper water passageway before gets into the lower floor's water passageway and absorbs the heat. The specific heat capacity of the water is large, so that the absorbed heat is much, the heat can stay in the water for a short time, the heat around the general power amplifier can be conveniently transferred to a large space, and the heat dissipation of the general power amplifier is facilitated.
Furthermore, the lower water channel and the shell radiating iron sheet are mutually fixed by clamping through the bulges and the gaps. The caliper is carried out through the bulges and the gaps, so that the water channel and the shell of the universal power amplifier can not be damaged.
Further, the upper-layer water channel and the lower-layer water channel are made of hard glass, and the thickness between two surfaces of the upper-layer water channel is twice as large as the narrowest thickness between two surfaces of the lower-layer water channel. The volume of the upper water channel is larger than that of the lower water channel, so that high-temperature water can stay in the upper water channel for a long time, and heat in the high-temperature water can be dissipated conveniently.
Further, the water current circulating device adopts small propellers, and the driving directions of the two small propellers are simultaneously driven along the clockwise direction or the anticlockwise direction.
further, the water circulation device adopts a small water pump.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. The invention utilizes the large specific heat capacity of water and the large amount of heat absorbed by the water, so that the heat can stay in the water for a short time, the heat around the general power amplifier can be conveniently transferred to a large space, and the heat dissipation of the general power amplifier is facilitated;
2. The volume of the upper-layer water channel is larger than that of the lower-layer water channel, so that high-temperature water can stay in the upper-layer water channel for a long time, and heat in the high-temperature water can be dissipated conveniently.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
Fig. 2 is a schematic diagram of a general power amplifier housing according to the present invention.
Reference numbers and corresponding part names in the drawings:
11-upper water channel, 12-lower water channel, 2-shell heat dissipation iron sheet, 3-water circulation device, and 4-shell.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
as shown in fig. 1 and 2, the heat dissipation system of the general power amplifier module includes a general power amplifier, and further includes a lower water channel 12, a case heat dissipation iron sheet 2, a water flow circulation device 3, and a case 4, the outside of the general power amplifier is covered and wrapped by the case 4, the case 4 surface is provided with the case heat dissipation iron sheet 2, the case heat dissipation iron sheets are vertically arranged on the case surface and are arranged in order, and a gap is left between adjacent case heat dissipation iron sheets 2; the lower-layer water channel 12 covers the surface of the shell 4, uniform bulges are reserved on the lower side of the lower-layer water channel 12, and the bulged parts are matched with gaps among the shell radiating iron sheets 2; an upper-layer water channel 11 is arranged on the upper side of the lower-layer water channel 12, and the upper-layer water channel 11 covers the surface of the lower-layer water channel 12; and two ends of the upper-layer water channel 11 and two ends of the lower-layer water channel 12 are correspondingly communicated through a water flow circulating device 3 respectively.
The lower water channel 12 and the shell radiating iron sheet 2 are mutually fixed by clamping through bulges and gaps.
The upper water passage 11 and the lower water passage 12 are made of hard glass, and the thickness between the two surfaces of the upper water passage 11 is twice as large as the narrowest thickness between the two surfaces of the lower water passage 12.
The water circulation device 3 adopts small propellers, and the driving directions of the two small propellers are simultaneously driven along the clockwise direction or the anticlockwise direction.
Example 2
The present embodiment is different from embodiment 1 in that a small water pump is used as the water circulation device 3.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.